L1F2-U400100007001 - Lumileds

GENERAL ILLUMINATION

RoHS

COMPLIANT

LUXEON FlipChip UV is the smallest and highest power density (W/cm2)

ultraviolet with FlipChip Technology in a chip-scale package LED can

be reowed onto a substrate with a standard surface mount (SMT)

equipment and process. LUXEON FlipChip UV LED enables tighter beam

control and high packing density of LEDs on a chip-on-board solution

and completely eliminates wire bonds in the system. LUXEON FlipChip UV

is the ideal choice for cost sensitive applications to achieve high

irradiance at high current density, maximizing W/$ by taking the

advantage of lowest thermal resistance of a chip-scale package device.

LUXEON FlipChip UV

Chip-scale package for maximum

design exibility in UV applications

FEATURES AND BENEFITS PRIMARY APPLICATIONS

Ultraviolet wavelength range of 380–410nm for a range of options Specialty Lighting

Micro sized CSP: 1.0mm2 package for design exibility and packing density

No wire bonds allows for direct attach and reow

5-sided emitter with batwing radiation pattern enables wide viewing angles

Low thermal resistance for leading system level lm/$

Maximum drive current of 1A for delivers superior lumens for reduced

LED count

Table of Contents

General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Part Number Nomenclature.....................................................................2

Environmental Compliance .....................................................................2

Product Characteristics ............................................................................3

Product Selection ..............................................................................3

Optical Characteristics..........................................................................3

Electrical Characteristics........................................................................3

Absolute Maximum Ratings ........................................................................4

Typical Performance Graphs .......................................................................5

Binning Denitions & Labeling......................................................................9

Radiometric Flux Bins .............................................................................9

Forward Voltage Bins ............................................................................10

Peak Wavelength Bins ............................................................................10

Reow Soldering Guidelines (Based Upon SAC Solder) .............................................. 11

JEDEC Moisture Sensitivity .................................................................... 11

Solder Pad Design ............................................................................12

Assembly Precautions .........................................................................12

Mechanical & Packaging Dimensions ..............................................................13

Mechanical Dimensions .......................................................................13

Packaging – Reel Dimensions..................................................................15

General Information

Part Number Nomenclature

LUXEON FlipChip UV are specied and binned at 500mA and Tj=25°C.

The alphanumerical part number designations for the LUXEON FlipChip UV are explained as follows:

L x F 2 – U y y y 1 0 0 0 z z z z 1

Where:

x — designates level (0 for die on blue bin tape, 1 for die on tape and reel)

U — designates for Ultraviolet color

yyy — designates minimum peak wavelength bin (390 for 390 nm minimum wavelength bin)

1000 — designates die dimension (1000 for 1.000 mm2)

zzzz — designates minimum radiometric power at test conditions (0500 for 500mW power bin)

Environmental Compliance

Lumileds is committed to providing environmentally friendly products to the solid-state lighting market. LUXEON

FlipChip White is compliant to the European Union directives on the restriction of hazardous substances in

electronics equipment, namely the RoHS and REACH directives. Lumileds will not intentionally add the following

restricted material to the LUXEON HIGH: lead, mercury, cadmium, hexavalent chromium, polybrominated biphyenyls

(PBB) or polybrominated diphenyl ethers (PBDE).

Product Characteristics (Tjunction = 25°C)

Product Selection

Table 1. LUXEON FlipChip UV Typical Performance

Peak Wavelength

(500mA)

Typical Radiometric Power [1, 2] (mW) Typical Vf (V)

Part Number

500mA 1000mA 500mA 1000mA

380-390nm

250

350

450

473

662

852

3.2

3.3

LxF2-U380100002001

LxF2-U380100003001

LxF2-U380100004001

390-400nm

450

550

650

852

1042

1234

3.1

3.2

LxF2-U390100004001

LxF2-U390100005001

LxF2-U390100006001

400-410nm

550

650

750

1042

1232

1432

3.0

3.1

LxF2-U400100005001

LxF2-U400100006001

LxF2-U400100007001

Notes:

1. Lumileds maintains a tolerance of ±10% on ux measurements.

2. Radiometric power value is based upon mounted die on highly reective surface at Tj=25°C.

Optical Characteristics

Table 2. LUXEON FlipChip UV Wavelength and Spectrum (at 500mA)

Part Number Wavelength Bin

Peak Wavelength [1] (nm) Typical Spectra

Half-Width (nm)

Typical Temperature

Coecient of Peak

Wavelength [2] (nm/°C)

Minimum Maximum

LxF2-U38010000xxxx1 380-390 nm 380 390 23 0.05

LxF2-U39010000xxxx1 390-400 nm 390 400 23 0.05

LxF2-U40010000xxxx1 400-410 nm 400 410 23 0.05

Notes for Table 2:

1. Lumileds maintains a tolerance of ±2nm on peak wavelength measurements.

2. Measured between 25°C and 85°C at 500mA.

Electrical Characteristics

Table 3. LUXEON FlipChip UV Forward Voltage and Typical Thermal Resistance at 500mA

Part Number Peak Wavelength

Forward Voltages [1] (V) Typical Temperature

Coecient of Forward

Voltage (mV/°C)

Typical Thermal Resistance

Junction to Solder Pad [2]

(°C/W)Minimum Typical Maximum

LxF2-U38010000xxxx1 380-390 nm 2.8 3.2 3.4 -2 to -3 2.0

LxF2-U39010000xxxx1 390-400 nm 2.8 3.1 3.4 -2 to -3 2.0

LxF2-U40010000xxxx1 400-410 nm 2.8 3.0 3.4 -2 to -3 2.0

Notes for Table 3:

1. Lumileds maintains a tolerance of ±0.06V on forward voltage measurements.

2. Measured between Tj = 25°C and Tj = 85°C for coecient of Vf .

Absolute Maximum Ratings

Table 4. LUXEON FlipChip UV Operating Condition and Ratings

Parameter Maximum Ratings

DC Forward Current [1,2] 1000mA

Peak Pulsed Forward Current [1,3] 1200mA

ESD Sensitivity [4] ≤ 200V Human Body Model (HBM) Class 3A, JESD22-A114-E

LED Junction Temperature [1] (DC & pulse) 135°C

LED Operating Case Temperature [1] 105°C

Storage Temperature -40°C - 135°C

Soldering Temperature 300 ±3°C (<30 second)

Allowable Reow Cycles 3

Reserve Voltage (Vreverse) LUXEON FlipChip UV LEDs are not designed to be driven in reverse bias

Notes for Table 4:

1. Proper current derating must be observed to maintain junction temperature below the maximum.

2. Residual periodic variations due to power conversion from alternating current (AC) to direct current (DC), also called “ripple”, with frequencies ≥100Hz and amplitude ≤ 150mA are acceptable,

assuming the average current throughout each cycle does not exceed the maximum allowable DC Forward Current at the corresponding maximum junction temperature.

3. Pulsed operation with a peak drive current equal to the stated Peak Pulsed Forward Current is acceptable if the pulse on-time is ≤ 5 ms per cycle and the duty cycle is ≤ 50%.

4. See LUXEON FlipChip Application Brief for additional information on ESD Protection

Typical Performance Graphs

Power Output (Test Current= 500mA)

Power Output (Tjunction=25°C)

Figure 1. Typical radiometric power vs. Tjunction .

Figure 2. Typical radiometric power vs. forward current.

Wavelength Shift (Tjunction=25°C)

Wavelength Shift (Test Current =500mA)

Figure 3. Typical peak wavelength shift vs. forward current.

Figure 4. Typical peak wavelength shift vs. Tjunction .

Forward Current (Tjunction=25°C)

Spectral Distribution vs. Wavelength Characteristics

(Tjunction=25°C, Test Current =500mA)

Figure 5. Forward current vs. Vf .

Figure 6. Spectral distribution vs. wavelength.

Spatial Radiation Patterns (Tjunction=25°C, Test Current =500mA)

Figure 7. Intensity vs. angle.

Figure 8. Angle vs. intensity.

Binning Denitions & Labeling

Purpose of Product Binning

In the manufacturing of semiconductor products, there are variations in performance around the average values given

in the technical datasheets. For this reason, Lumileds bins the LED components for radiometric power and forward

voltage, peak wavelength.

Decoding Product Bin Labeling

LUXEON FlipChip UV emitters are labeled using a four-digit alphanumeric CAT code following the format below:

ABCD

Where:

A — Flux/Radiometric Bin (Z, A, B, C, etc.)

B & C — Wavelength Bin (Ax, Bx, Cx, Dx, etc.)

D — Vforward (8, 9, 0, 1, 2 etc.)

Radiometric Flux Bins

Table 5.

Bin Code

Radiometric Flux (mW)

Minimum Maximum

Z200 250

A 250 300

B 300 350

C 350 400

D 400 450

E 450 500

F 500 550

G 550 600

H600 650

I650 700

J 700 750

K 750 800

Forward Voltage Bins

Table 6.

Bin Code

Forward Voltage (V)

Minimum Maximum

8 2.8 2.9

9 2.9 3.0

03.0 3.1

13.1 3.2

2 3.2 3.3

3 3.3 3.4

43.4 3.5

Peak Wavelength Bins

Table 7.

Bin Code

Peak Wavelength (nm)

Minimum Maximum

Ax 380 385

Bx 385 390

Cx 390 395

Dx 395 400

Ex 400 405

Fx 405 410

Gx 410 415

Reow Soldering Guidelines (Based Upon SAC Solder)

Table 8. (Based upon SAC solder)

Prole Feature Lead Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3°C / second max

Preheat Temperature Min (Tsmin ) 150°C

Preheat Temperature Max (Tsmax ) 200°C

Preheat Time (ts) from Tsmin to Tsmax 60 – 180 seconds

Temperature ( TL ) 217°C

Time Maintained Above Temperature (tL ) 60 -150 seconds

Peak / Classication Temperature (Tp ) 260°C

Time within 5°C of Actual Temperature (tp ) 20 – 40 seconds

Ramp-Down Rate 6°C / second max

Time 25°C to Peak Temperature 8

min

utes max

Notes for Table 8:

1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.

JEDEC Moisture Sensitivity

Table 9.

Level Floor Life

Soak Requirements

Standard

Time Conditions Time Conditions

1 unlimited [ 30°C / 85% RH 168 Hrs. + 5 / -0 Hrs. 85°C / 85% RH

Solder Pad Design

Notes for Figure 9:

1. The drawing shows the recommended LUXEON FlipChip UV layout on Printed Circuit Board (PCB).

2. All dimensions are in millimeters.

Assembly Precautions

**Refer to Assembly Precautions and Material Safety documents

Figure 9. Solder pad layout of LxF2-Uzzz1000yyyy1.



Mechanical & Packaging Dimensions

Mechanical Dimensions

Notes for Figure 10:

1. Drawings are not scale.

2. All dimensions are in millimeters.

Figure 10. Mechanical dimensions for LxF2-Uxxx1000yyyy1.

Packaging – Pocket Tape Dimensions

Figure 11. Emitter pocket tape packaging.

Packaging – Reel Dimensions

Figure 12. Emitter reel packaging.

DS137 LUXEON FlipChip UV

Product Datasheet 20150217

LUXEON is a registered trademark of the Lumileds Holding B.V.

in the United States and other countries.

www.lumileds.com

Neither Lumileds Holding B.V. nor its aliates shall be liable for any kind of loss of data or

any other damages, direct, indirect or consequential, resulting from the use of the provided

information and data. Although Lumileds Holding B.V. and/or its aliates have attempted to

provide the most accurate information and data, the materials and services information and data

are provided “as is,” and neither Lumileds Holding B.V. nor its aliates warrants or guarantees

the contents and correctness of the provided information and data. Lumileds Holding B.V. and its

aliates reserve the right to make changes without notice. You as user agree to this disclaimer

and user agreement with the download or use of the provided materials, information and data.

About Lumileds

Lumileds is the light engine leader, delivering innovation, quality, and reliability.

For 100 years, Lumileds commitment to innovation has helped customers pioneer breakthrough products in the automotive,

consumer and illumination markets.

Lumileds is shaping the future of light with our LEDs and automotive lamps, and helping our customers illuminate how people

see the world around them.

To learn more about our portfolio of light engines visit www.lumileds.com.

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L1F2-U400100007001 L1F2-U390100006001 L1F2-U400100006001 L1F2-U380100002001 L1F2-U380100003001

L1F2-U390100004001 L1F2-U380100004001 L1F2-U400100005001 L1F2-U390100005001