MMBTA55/MMBTA56
Document number: DS30054 Rev. 13 - 2
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MMBTA55 / MMBTA56
PNP SMALL SIGNAL TRANSISTOR IN SOT23
Features
Epitaxial Planar Die Construction
Ideal for Low Power Amplification and Switching
Complementary NPN Type: MMBTA05 / MMBTA06
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data
Case: SOT-23
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish-Matte Tin Plated Leads.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (Approximate)
Ordering Information (Notes 4 & 5)
Part Number
Compliance
Marking
Reel size (inches)
Tape width (mm)
Quantity per reel
MMBTA55-7-F
AEC-Q101
K2G
7
8
3,000
MMBTA56-7-F
AEC-Q101
K2G
7
8
3,000
MMBTA56Q-7-F
Automotive
K2G
7
8
3,000
MMBTA56Q-13-F
Automotive
K2G
13
8
10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
Code
C
D
E
F
G
H
I
J
K
L
M
N
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Top View
Device Symbol
Symbolhematic
SOT23
Top View
Pin-Out
Symbolhematic
K2G = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: C = 2015)
M = Month (ex: 9 = September)
C
E
B
C
E
B
SOT23
YM
K2G
MMBTA55/MMBTA56
Document number: DS30054 Rev. 13 - 2
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September 2015
© Diodes Incorporated
MMBTA55 / MMBTA56
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
MMBTA55
MMBTA56
Unit
Collector-Base Voltage
VCBO
-60
-80
V
Collector-Emitter Voltage
VCEO
-60
-80
V
Emitter-Base Voltage
VEBO
-4.0
V
Collector Current - Continuous
IC
-500
mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
(Note 6)
PD
310
mW
(Note 7)
350
Thermal Resistance, Junction to Ambient
(Note 6)
RθJA
403
°C/W
(Note 7)
357
Thermal Resistance, Junction to Leads
(Note 8)
RθJL
350
°C/W
Operating and Storage Temperature Range
TJ,TSTG
-55 to +150
°C
ESD Ratings (Note 9)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
400
V
C
Notes: 6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB; device is measured under still air
conditions whilst operating in a steady-state.
7. Same as Note 6, except the device is mounted on 15 mm x 15mm 1oz copper.
8. Thermal resistance from junction to solder-point (at the end of the leads).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
MMBTA55/MMBTA56
Document number: DS30054 Rev. 13 - 2
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MMBTA55 / MMBTA56
Thermal Characteristics and Derating Information
025 50 75 100 125 150
0.0
0.1
0.2
0.3
0.4
Derating Curve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 110 100 1k
0
50
100
150
200
250
300
350
400
Transient Thermal Impedance
D=0.5
D=0.2 D=0.1 Single Pulse
D=0.05
Thermal Resistance (°C/W)
Pulse Width (s)
10m 100m 110 100 1k
0.1
1
10 Single Pulse. Tamb=25°C
Pulse Power Dissipation
Pulse Width (s)
Max Power Dissipation (W)
MMBTA55/MMBTA56
Document number: DS30054 Rev. 13 - 2
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September 2015
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MMBTA55 / MMBTA56
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 10)
Collector-Base Breakdown Voltage
MMBTA55
MMBTA56
BVCBO
-60
-80
V
IC = -100µA, IE = 0
Collector-Emitter Breakdown Voltage
MMBTA55
MMBTA56
BVCEO
-60
-80
V
IC = -1.0mA, IB = 0
Emitter-Base Breakdown Voltage
BVEBO
-5.0
-4.0
IE = -100µA, IC = 0
Collector Cut-Off Current
MMBTA55
MMBTA56
ICBO
-100
nA
VCB = -60V, IE = 0
VCB = -80V, IE = 0
Collector Cut-Off Current
ICEX
-100
nA
VCE = -60V, IBO = 0V
VCE = -80V, IBO = 0V
ON CHARACTERISTICS (Note 10)
DC Current Gain
hFE
100
IC = -10mA, VCE = -1.0V
IC = -100mA, VCE = -1.0V
Collector-Emitter Saturation Voltage
VCE(SAT)
-0.25
V
IC = -100mA, IB = -10mA
Base-Emitter Saturation Voltage
VBE(SAT)
-1.2
V
IC = -100mA, VCE = -1.0V
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
fT
50
MHz
VCE = -1.0V, IC = -100mA,
f = 100MHz
Note: 10. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.
MMBTA55/MMBTA56
Document number: DS30054 Rev. 13 - 2
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September 2015
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MMBTA55 / MMBTA56
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03
0.915
F
0.45
0.60
0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013
0.10
0.05
K
0.890
1.00
0.975
K1
0.903
1.10
1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085
0.150
0.110
a
8°
All Dimensions in mm
Dimensions
Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
XE
Y
C
Z
J
K1 K
L1
GAUGE PLANE
0.25
H
L
M
All 7°
A
CB
D
G
F
a
MMBTA55/MMBTA56
Document number: DS30054 Rev. 13 - 2
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September 2015
© Diodes Incorporated
MMBTA55 / MMBTA56
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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