1
Rectifier Device Data
The SWITCHMODE Power Rectifier employs the Schottky Barrier principle in
a large area metal–to–silicon power diode. State–of–the–art geometry features
epitaxial construction with oxide passivation and metal overlay contact. Ideally
suited for use as rectifiers in very low–voltage, high–frequency switching power
supplies, free wheeling diodes and polarity protection diodes.
•Highly Stable Oxide Passivated Junction
•Very Low Forward Voltage Drop
•High Junction Temperature Capability
•High dv/dt Capability
•Excellent Ability to Withstand Reverse Avalanche Energy
Transients
•Guardring for Stress Protection
•Epoxy Meets UL94, VO at 1/8″
•Electrically Isolated. No Isolation Hardware Required.
•UL Recognized File #E69369(1)
Mechanical Characteristics
•Case: Epoxy, Molded
•Weight: 1.9 grams (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes: 260°C Max. for 10
Seconds
•Shipped 50 units per plastic tube
•Marking: B745
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
45 Volts
Average Rectified Forward Current (Rated VR), TC = 105°C IF(AV) 7.5 Amps
Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 105°C IFRM 15 Amps
Non–repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 1.0 Amp
Operating Junction and Storage Temperature TJ, Tstg – 65 to +150 °C
Voltage Rate of Change (Rated VR) dv/dt 10000 V/µs
RMS Isolation Voltage (t = 1 second, R.H. ≤ 30%, TA = 25°C)(2) Per Figure 3
Per Figure 4(1)
Per Figure 5
Viso1
Viso2
Viso3
4500
3500
1500
Volts
THERMAL CHARACTERISTICS
Maximum Thermal Resistance, Junction to Case RθJC 4.2 °C/W
Lead Temperature for Soldering
Purposes: 1/8″ from Case for 5 Seconds TL260 °C
(1) UL Recognized mounting method is per Figure 4.
(2) Proper strike and creepage distance must be provided.
SWITCHMODE is a trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola, Inc. 1996
Order this document
by MBRF745/D
SEMICONDUCTOR TECHNICAL DATA
12
SCHOTTKY BARRIER
RECTIFIER
7.5 AMPERES
45 VOLTS
CASE 221E–01
ISOLATED TO–220
Motorola Preferred Device
1
2
Rev 1
MBRF745
2Rectifier Device Data
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Max Unit
Maximum Instantaneous Forward Voltage (3)
(iF = 15 Amp, TC = 25°C)
(iF = 15 Amp, TC = 125°C)
(iF = 7.5 Amp, TC = 125°C)
vF0.84
0.72
0.57
Volts
Maximum Instantaneous Reverse Current (3)
(Rated DC Voltage, TC = 25°C)
(Rated DC Voltage, TC = 125°C)
iR0.1
15
mA
(3) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%
0.7
Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current
VR, REVERSE VOLTAGE (VOLTS)
IR, REVERSE CURRENT (mA)
iF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
iF, INSTANTANEOUS FORW ARD CURRENT (AMPS)
7
50
30
20
10
5
3
2
1
0.5 1.210.80.6 0.001 100
0.40.2 20 30 40 50
0.01
0.1
1
10
100
25
°
C
TJ = 125
°
CTJ = 150
°
C
75
°
C
25
°
C
75
°
C100
°
C
125
°
C
MBRF745
3
Rectifier Device Data
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110
″
MIN
Figure 3. Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together.
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP 0.107
″
MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107
″
MIN
Figure 4. Clip Mounting Position
for Isolation Test Number 2 Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4–40 SCREW
PLAIN W ASHER
HEATSINK
COMPRESSION W ASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in .lbs is sufficient to provide
maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in .lbs will cause the plastic to crack around the mounting
hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in .lbs without adversely affecting the package. However, in order to positively ensure
the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in .lbs of mounting torque under any mounting conditions.
Figure 6. Typical Mounting Techniques
6a. Screw–Mounted 6b. Clip–Mounted
**For more information about mounting power semiconductors see Application Note AN1040.
MBRF745
4Rectifier Device Data
PACKAGE DIMENSIONS
CASE 221E–01
–B–
–Y–
SEATING
PLANE
–T–
R
C
S
U
J
A
F
Q
H
K
G
N
L
D2 PL
M
B
M
0.25 (0.010) Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.621 0.629 15.78 15.97
B0.394 0.402 10.01 10.21
C0.181 0.189 4.60 4.80
D0.026 0.034 0.67 0.86
F0.121 0.129 3.08 3.27
G0.100 BSC 2.54 BSC
H0.123 0.129 3.13 3.27
J0.018 0.025 0.46 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.14 1.52
N0.200 BSC 5.08 BSC
Q0.126 0.134 3.21 3.40
R0.107 0.111 2.72 2.81
S0.096 0.104 2.44 2.64
U0.259 0.267 6.58 6.78
STYLE 1:
PIN 1. CATHODE
2. N/A
3. ANODE
123
ISSUE O
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MBRF745/D
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