CREAT BY ART
- Ideal for printed circuit board
- High case dielectric strength
- High surge current capability
- UL Recognized File # E-326243
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
V
RRM
50 100 200 400 600 800 V
V
RMS
35 70 140 280 420 560 V
V
DC
50 100 200 400 600 800 V
I
F(AV)
A
I
2
TA
2
s
T
JO
C
T
STG O
C
Document Number: DS_D1311021 Version: H13
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Peak forward surge current, 8.3 ms single half sine-
wave superimposed on rated load
Typical thermal resistance R
θjL
R
θjA
10
47
O
C/W
Operating junction temperature range - 55 to +150
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
10 μA
500
Rating of fusing ( t<8.3ms) 26
Maximum instantaneous forward voltage (Note 1)
I
F
= 2 A V
F
1.1 V
I
FSM
80 A
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 2
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL D2SB
05
D2SB
10
D2SB
20
D2SB
40
D2SB
60
D2SB
80
GBL
MECHANICAL DATA
Case: GBL
Polarity: As marked
Weight: 2 g (approximately)
D2SB05 thru D2SB80
Taiwan Semiconductor
Glass Passivated Sin
g
le-Phase Brid
g
e Rectifier
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
PART NO.
PART NO.
D2SB80
D2SB80
(TA=25℃ unless otherwise noted)
Document Number: DS_D1311021 Version: H13
RATINGS AND CHARACTERISTICS CURVES
D2SB80 C2 C2
D2SB80 C2G C2 G Green compound
GBL
D2 GBL
D2SB05 thru D2SB80
Taiwan Semiconductor
PACKING COD E GREEN COMPOUND
CODE
PACKAGE
PACKING CODE GREEN COMPOUND
CODE
Note 1: "xx" defines voltage from 50V (D2SB05) to 800V (D2SB80)
D2SBxx
(Note 1)
C2
Suffix "G"
GBL
X0
25 / Tube
PACKING
ORDERING INFORMATION
DESCRIPTION
EXAMPLE
25 / Tube
25 / Tube / Forming
PREFERRED P/N
0
0.5
1
1.5
2
2.5
0 25 50 75 100 125 150
AVERAGE FORWARD A
CURRENT (A)
AMBIENT TEMPERATURE (oC)
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
20
30
40
50
60
70
80
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
0.1
1
10
0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
PULSE WIDTH-300μs
1% DUTY CYCLE
Min Max Min Max
A 19.70 20.30 0.776 0.799
B 2.30 2.70 0.091 0.106
C 1.30 1.70 0.051 0.067
D 0.90 1.10 0.035 0.043
E 4.80 5.20 0.189 0.205
F 10.70 11.30 0.421 0.445
G 2.30 2.70 0.091 0.106
H 13.00 14.00 0.512 0.551
I 3.30 3.70 0.130 0.146
J 0.80 1.20 0.031 0.047
K 0.40 0.60 0.016 0.024
P/N = Specific Device Code
G = Green Compound
YWW = Date Code
F = Factory Code
Document Number: DS_D1311021 Version: H13
MARKING DIAGRAM
D2SB05 thru D2SB80
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
0
100
200
300
400
500
600
0.1 1 10 100 1000
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE(V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vslg=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1311021 Version: H13
D2SB05 thru D2SB80
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
