MM74HC374 3-STATE Octal D-Type Flip-Flop September 1983 Revised May 2005 MM74HC374 3-STATE Octal D-Type Flip-Flop General Description Features The MM74HC374 high speed Octal D-Type Flip-Flops utilize advanced silicon-gate CMOS technology. They possess the high noise immunity and low power consumption of standard CMOS integrated circuits, as well as the ability to drive 15 LS-TTL loads. Due to the large output drive capability and the 3-STATE feature, these devices are ideally suited for interfacing with bus lines in a bus organized system. Typical propagation delay: 20 ns Wide operating voltage range: 2-6V Low input current: 1 PA maximum Low quiescent current: 80 PA maximum Compatible with bus-oriented systems Output drive capability: 15 LS-TTL loads These devices are positive edge triggered flip-flops. Data at the D inputs, meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. The 74HC logic family is speed, function, and pinout compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Ordering Code: Order Number Package Number MM74HC374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HC374SJ MM74HC374MTC MM74HC374N MTC20 N20A Package Description 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code. Connection Diagram Truth Table Pin Assignments for DIP, SOIC, SOP and TSSOP Output Clock Data Output L n H H L n L L L L X Q0 H X X Z Control H HIGH Level L LOW Level X Don't Care n Transition from LOW-to-HIGH Z High Impedance State The level of the output before steady state input conditions were Q0 established Top View (c) 2005 Fairchild Semiconductor Corporation DS005336 www.fairchildsemi.com MM74HC374 Absolute Maximum Ratings(Note 1) Recommended Operating Conditions (Note 2) Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) 0.5 to 7.0V 1.5 to VCC 1.5V 0.5 to VCC 0.5V r20 mA r35 mA r70 mA 65qC to 150qC Supply Voltage (VCC) 600 mW S.O. Package only 500 mW (VIN, VOUT) Operating Temperature Range (TA) Units 6 V 0 VCC V 40 85 qC Input Rise or Fall Times (tr, tf) VCC 2.0V 1000 ns VCC 4.5V 500 ns VCC 6.0V 400 ns Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Lead Temperature (TL) Note 2: Unless otherwise specified all voltages are referenced to ground. 260qC (Soldering 10 seconds) Max 2 DC Input or Output Voltage Power Dissipation (PD) (Note 3) Min Note 3: Power Dissipation temperature derating -- plastic "N" package: 12 mW/qC from 65qC to 85qC. DC Electrical Characteristics Symbol VIH VIL VOH Parameter Conditions 25qC TA 40 to 85qC TA 55 to 125qC Guaranteed Limits Units 2.0V 1.5 1.5 1.5 V Input Voltage 4.5V 3.15 3.15 3.15 V 6.0V 4.2 4.2 4.2 V Maximum LOW Level 2.0V 0.5 0.5 0.5 V Input Voltage 4.5V 1.35 1.35 1.35 V 6.0V 1.8 1.8 1.8 V Minimum HIGH Level VIN Output Voltage |IOUT| d 20 PA VIH or VIL 2.0V 2.0 1.9 1.9 1.9 V 4.5V 4.5 4.4 4.4 4.4 V 6.0V 6.0 5.9 5.9 5.9 V |IOUT| d 6.0 mA 4.5V 4.2 3.98 3.84 3.7 V |IOUT| d 7.8 mA 6.0V 5.7 5.48 5.34 5.2 V VIH or VIL Maximum LOW Level VIN Output Voltage |IOUT| d 20 PA VIH or VIL 2.0V 0 0.1 0.1 0.1 V 4.5V 0 0.1 0.1 0.1 V 6.0V 0 0.1 0.1 0.1 V |IOUT| d 6.0 mA 4.5V 0.2 0.26 0.33 0.4 V |IOUT| d 7.8 mA 6.0V 0.2 0.26 0.33 0.4 V VIN VCC or GND 6.0V r0.1 r1.0 r1.0 PA Maximum 3-STATE VIN VIH, OC 6.0V r0.5 r5 r10 PA Output Leakage VOUT 6.0V 8.0 80 160 PA VIN IIN TA Typ Minimum HIGH Level VIN VOL VCC Maximum Input VIH or VIL Current IOZ VIH VCC or GND Current ICC Maximum Quiescent VIN Supply Current IOUT VCC or GND 0 PA Note 4: For a power supply of 5V r10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. www.fairchildsemi.com 2 VCC 5V, TA 25qC, tr Symbol fMAX tf 6 ns Parameter Conditions Maximum Operating Typ Guaranteed Limit Units 50 35 MHz 20 32 ns Frequency tPHL, tPLH Maximum Propagation CL 45 pF Delay Clock to Q tPZH, tPZL tPHZ, tPLZ Maximum Output Enable RL k: Time CL 45 pF 19 28 ns Maximum Output Disable RL k: 17 25 ns Time CL 5 pF ns tS Minimum Setup Time 20 tH Minimum Hold Time 5 ns tW Minimum Pulse Width 16 ns 9 3 www.fairchildsemi.com MM74HC374 AC Electrical Characteristics MM74HC374 AC Electrical Characteristics VCC 2.06.0V, CL Symbol fMAX 50 pF, tr tf 6 ns (unless otherwise specified) Parameter Maximum Operating Conditions CL 50 pF Frequency tPHL, tPLH Maximum Propagation Delay, Clock to Q tPZH, tPZL Maximum Output Enable Time tPHZ, tPLZ Maximum Output Disable Time tS tH tW CPD CIN 25qC TA 40 to 85qC TA 55 to 125qC Units Guaranteed Limits 2.0V 6 5 4 MHz 4.5V 30 24 20 MHz 6.0V 35 28 23 MHz ns 50 pF 2.0V 68 180 225 270 CL 150 pF 2.0V 110 230 288 345 ns CL 50 pF 4.5V 22 36 45 48 ns CL 150 pF 4.5V 30 46 57 69 ns CL 50 pF 6.0V 20 31 39 46 ns CL 150 pF 6.0V 28 40 50 60 ns RL 1 k: CL 50 pF 2.0V 50 150 189 225 ns CL 150 pF 2.0V 80 200 250 300 ns CL 50 pF 4.5V 21 30 37 45 ns CL 150 pF 4.5V 30 40 50 60 ns CL 50 pF 6.0V 19 26 31 39 ns CL 150 pF 6.0V 26 35 44 53 ns RL 1 k: 2.0V 50 150 189 225 ns CL 50 pF 4.5V 21 30 37 45 ns 6.0V 19 ns Minimum Hold Time Minimum Pulse Width CL 50 pF and Fall Time tr , tf TA Typ CL Minimum Setup Time tTHL, tTLH Maximum Output Rise VCC 26 31 39 2.0V 50 60 75 ns 4.5V 9 13 15 ns 6.0V 9 11 13 ns 2.0V 5 30 5 ns 4.5V 5 5 5 ns 6.0V 5 5 5 ns 2.0V 30 80 100 120 ns 4.5V 9 16 20 24 ns 6.0V 8 14 18 20 ns 2.0V 25 60 75 90 ns 4.5V 7 12 15 18 ns 6.0V 6 10 13 15 ns Maximum Input Rise and 2.0V 1000 1000 1000 ns Fall Time, Clock 4.5V 500 500 500 ns 6.0V 400 400 400 ns Power Dissipation (per flip-flop) Capacitance (Note 5) OC VCC 30 OC GND 50 Maximum Input Capacitance Note 5: CPD determines the no load dynamic power consumption, PD IS CPD VCC f ICC. www.fairchildsemi.com 5 pF pF 10 10 10 CPD VCC2f ICC VCC, and the no load dynamic current consumption, 4 pF MM74HC374 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B 5 www.fairchildsemi.com MM74HC374 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D www.fairchildsemi.com 6 MM74HC374 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 7 www.fairchildsemi.com MM74HC374 3-STATE Octal D-Type Flip-Flop Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N20A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 8