© 2012 IXYS All rights reserved 2 - 5
20120410c
MKI 80-06T6K
IXYS reserves the right to change limits, test conditions and dimensions.
IGBTs
Ratings
Symbol Definitions Conditions min. typ. max. Unit
VCES collector emitter voltage TVJ = 25°C to 150°C 600 V
VGES
VGEM
max. DC gate voltage
max. transient collector gate voltage
continuous
transient
±20
±30
V
V
IC25
IC80
collector current TC = 25°C
TC = 80°C
89
67
A
A
Ptot total power dissipation TC = 25°C 210 W
VCE(sat) collector emitter saturation voltage IC = 75 A; VGE = 15 V TVJ = 25°C
TVJ = 125°C
1.8
2.1
2.3 V
V
VGE(th) gate emitter threshold voltage IC = 1.2 mA; VGE = VCE TVJ = 25°C 5 6.5 V
ICES collector emitter leakage current VCE = VCES; VGE = 0 V TVJ = 25°C
TVJ = 125°C 1
0.5 mA
mA
IGES gate emitter leakage current VCE = 0 V; VGE = ±20 V 400 nA
Cies input capacitance VCE = 25 V; VGE = 0 V; f = 1 MHz 4620 pF
QG(on) total gate charge VCE = 480 V; VGE = 15 V; IC = 75 A 470 nC
td(on)
tr
td(off)
tf
Eon
Eoff
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
inductive load TVJ = 125°C
VCE = 300 V; IC = 75 A
VGE = ±15 V; RG = 5.1 W
30
20
250
70
2.5
2.8
ns
ns
ns
ns
mJ
mJ
ICM
VCEK
reverse bias safe operating area RBSOA; VGE = ±15 V; RG = 5.1 W; L = 100 µH
clamped inductive load
; TVJ = 125°C
150
0.9x VCES
A
tSC
(SCSOA)
short circuit safe operating area VCE = 480 V; VGE = ±15 V; TVJ = 125°C
RG = 5.1 W; non-repetitive
6 µs
RthJC thermal resistance junction to case (per IGBT) 0.6 K/W
RthCH thermal resistance case to heatsink (per IGBT) 0.2 K/W
Diodes
Symbol Definitions Conditions Maximum Ratings
VRRM max. repetitive reverse voltage 600 V
IF25
IF80
forward current TC = 25°C
TC = 80°C
105
67
A
A
Symbol Conditions Characteristic Values
min. typ. max.
VFforward voltage IF = 75 A TVJ = 25°C
TVJ = 125°C
1.8
1.6
2.2 V
V
IRM
trr
max. reverse recovery current
reverse recovery time
VR = 300 V; IF = 75 A
diF /dt = -600 A/µs TVJ = 100°C
36
100
A
ns
RthJC thermal resistance junction to case (per diode) TVJ = 25°C 0.65 K/W
RthCH thermal resistance case to heatsink (per diode) 0.25 K/W