May. 2018 DDR4 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. (c) 2018 Samsung Electronics Co., Ltd. All rights reserved. -1- May. 2018 Product Guide DDR4 SDRAM Memory 1. DDR4 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 A X X X X X X X - X X X X Speed SAMSUNG Memory DRAM Temp & Power DRAM Type Package Type Density Revision Interface (VDD, VDDQ) Bit Organization # of Internal Banks 1. SAMSUNG Memory : K 2. DRAM : 4 3. DRAM Type A: DDR4 SDRAM (1.2V VDD) 4. Density 4G: 4Gb 8G: 8Gb AG: 16Gb BG: 32Gb 5. Bit Organization 04: x 4 08: x 8 16: x16 6. # of Internal Banks 5: 16 Banks 7. Interface (VDD, VDDQ) W: POD (1.2V, 1.2V) 8. Revision M: 1st Gen. A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. 9. Package Type B: FBGA (Halogen-free & Lead-free, Flip Chip) M: FBGA (Halogen-free & Lead-free, DDP) 2: FBGA (Halogen-free & Lead-free, 2H TSV) 3: FBGA (Halogen-free & Lead-free, 2H 3DS) 4: FBGA (Halogen-free & Lead-free, 4H TSV) 5: FBGA (Halogen-free & Lead-free, 4H 3DS) 10. Temp & Power C: Commercial Temp.( 0C ~ 85C) & Normal Power I: Industrial Temp.(-40C ~ 95C) & Normal Power 11. Speed PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15) RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17) TD: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19) RB: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15) TC: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17) WD: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19) VF: DDR4-2933 (1466MHz @ CL=21, tRCD=21, tRP=21) WE : DDR4-3200 (1600MHz @ CL=22, tRCD=22, tRP=22) YF: DDR4-2933 (1466MHz @ CL=24, tRCD=21, tRP=21) AE: DDR4-3200 (1600MHz @ CL=26, tRCD=22, tRP=22) -2- May. 2018 Product Guide DDR4 SDRAM Memory 2. DDR4 SDRAM Component Product Guide [Table 1] DDR4 SDRAM Component Product Guide for PC/SVR Density 8Gb B-die 8Gb C-die 8Gb D-die 16Gb A-die 32Gb A-die Banks Part Number Package & Power, Temp. & Speed Org. 16Banks (4Bank Groups) K4A8G045WB1) BCPB/RC/TD 2G x4 K4A8G085WB BCPB/RC/TD 1G x8 K4A8G165WB BCPB/RC/TD 512M x16 K4A8G045WC1) BCTD/VF/WE 2G x4 K4A8G085WC BCTD/*VF/*WE 1G x8 K4A8G165WC BCTD/*VF/*WE 512M x16 K4A8G045WD1) BC/TD/VF/WE 2G x4 K4A8G085WD BC/TD/*VF/*WE 1G x8 16Banks (4Bank Groups) K4AAG085WA BCTD/*VF/*WE 8Banks (2Bank Groups) K4AAG165WA 16Banks (4Bank Groups) 8Banks (2Bank Groups) 8Banks (2Bank Groups) 16Banks (4Bank Groups) 8Banks (2Bank Groups) 16Banks (4Bank Groups) VDD Voltage PKG 1.2V 78 ball FBGA 1.2V 96 ball FBGA 1.2V 78 ball FBGA Avail. Note '19 2Q EOL MP 1.2V 96 ball FBGA 1.2V 78 ball FBGA 2G x8 1.2V 78 ball FBGA BCTD/*VF/*WE 1G x16 1.2V 96 ball FBGA K4AAG085WA BCTD/*VF/*WE 2G x8 1.2V 78 ball FBGA K4AAG165WA BCTD/*VF/*WE 1G x16 1.2V 96 ball FBGA '18 4Q CS '19 1Q CS '19 1Q CS NOTE : 1) Please contact Samsung for sample availability. [Table 2] DDR4 SDRAM Component Product Guide for Consumer Density 4Gb D-die 4Gb E-die 4Gb F-die 8Gb B-die 8Gb C-die 16Gb B-die 16Gb A-die Banks Part Number Package & Power, Temp. & Speed Org. VDD Voltage PKG 16Banks (4Bank Groups) K4A4G085WD BCPB/RC BIPB/RC 512M x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4A4G165WD BCPB/RC BIPB/RC 256M x16 1.2V 96 ball FBGA 16Banks (4Bank Groups) K4A4G085WE BCRC/TD/WE BIRC/TD/WE 512M x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4A4G165WE BCRC/TD/WE BIRC/TD/WE 256M x16 1.2V 96 ball FBGA 16Banks (4Bank Groups) K4A4G085WF BCTD/*WE 512M x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4A4G165WF BCTD/*WE 256M x16 1.2V 96 ball FBGA 16Banks (4Bank Groups) K4A8G085WB BCRC/TD/WE BIRC/TD/WE 1G x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4A8G165WB BCRC/TD/WE BIRC/TD/WE 512M x16 1.2V 96 ball FBGA 16Banks (4Bank Groups) K4A8G085WC BCRC/TD/*WE 1G x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4A8G165WC BCRC/TD/*WE 512M x16 1.2V 96 ball FBGA 16Banks (4Bank Groups) K4AAG085WB MCRC/TD 1G x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4AAG165WB MCRC/TD 512M x16 1.2V 96 ball FBGA 16Banks (4Bank Groups) K4AAG085WA BCTD/*WE 2G x8 1.2V 78 ball FBGA 8Banks (2Bank Groups) K4AAG165WA BCTD/*WE 1G x16 1.2V 96 ball FBGA Avail. '18 4Q EOL MP '18 4Q CS MP MP MP -3- '19 1Q CS Note May. 2018 Product Guide DDR4 SDRAM Memory 3. DDR4 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X X X A X X X X X X X - X X XX Memory Module DIMM Type Memory buffer Data bits Speed DRAM Component Type Temp & Power Depth PCB Revision Package # of Banks in Comp. & Interface Component Revision Bit Organization 1. Memory Module : M 8. Component Revision M: 1st Gen. B: 3rd Gen. D: 5th Gen. F: 7th Gen. 2. DIMM Type 3: DIMM 4: SODIMM 3. Data Bits 71: x64 74: x72 78: x64 86: x72 91: x72 92: x72 93: x72 260pin Unbuffered SODIMM 260pin ECC Unbuffered SODIMM 288pin Unbuffered DIMM 288pin Load Reduced DIMM 288pin ECC Unbuffered DIMM 288pin VLP Registered DIMM 288pin Registered DIMM 9. Package B: FBGA (Halogen-free & Lead-free, Flip Chip) M: FBGA (Halogen-free & Lead-free, DDP) 2: FBGA (Halogen-free & Lead-free, 2H TSV) 3: FBGA (Halogen-free & Lead-free, 2H 3DS) 4: FBGA (Halogen-free & Lead-free, 4H TSV) 5: FBGA (Halogen-free & Lead-free, 4H 3DS) 10. PCB Revision 0: None 2: 2nd Rev. 4: 4th Rev. 4. DRAM Component Type A: DDR4 SDRAM (1.2V VDD) 5. Depth 56 : 256M 51 : 512M 1G : 1G 2G : 2G 4G : 4G 8G : 8G AG : 16G 1K : 1G (for 8Gb) 2K : 2G (for 8Gb) 4K : 4G (for 8Gb) 8K : 8G (for 8Gb) AK : 16G 6. # of Banks in comp. & Interface 4 : 16Banks & POD-1.2V 7. Bit Organization A: 2nd Gen. C: 4th Gen. E: 6th Gen. G: 8th Gen. 1: 1st Rev. 3: 3rd Rev. 11. Temp & Power C: Commercial Temp.(0C ~ 85C) & Normal Power 12. Speed PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15) RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17) TD: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19) RB: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15) TC: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17) WD: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19) VF: DDR4-2933 (1466MHz @ CL=21, tRCD=21, tRP=21) WE: DDR4-3200 (1600MHz @ CL=22, tRCD=22, tRP=22) YF: DDR4-2933 (1466MHz @ CL=24, tRCD=21, tRP=21) AE: DDR4-3200 (1600MHz @ CL=26, tRCD=22, tRP=22) 0:x4 3:x8 4 : x 16 -4- May. 2018 Product Guide DDR4 SDRAM Memory 4. DDR4 SDRAM MODULE PRODUCT GUIDE 4.1 288Pin DDR4 Registered DIMM [Table 3] 288Pin DDR4 Registered DIMM Org. Density Part Number Temp & Power & Speed Raw Card Composition 1G x72 8GB M393A1G40EB1 CPB C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1G x72 8GB M393A1G40EB1 CRC C (1Rx4) 1G x4 * 18pcs 4Gb E-die 1G x72 8GB M393A1G40EB2 CTD C (1Rx4) 1G x4 * 18pcs 4Gb 1G x72 8GB M393A1G43EB1 CPB E (2Rx8) 512G x8 * 18pcs 1G x72 8GB M393A1G43EB1 CRC 1G x72 8GB M393A1G43EB1 1G x72 8GB 1G x72 PKG Height Avail. 1 78ball FBGA 31.25mm EOL 2Q'18 16 1 78ball FBGA 31.25mm EOL 2Q'18 E-die 16 1 78ball FBGA 31.25mm EOL 2Q'18 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 E (2Rx8) 512G x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 CTD E (2Rx8) 512G x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 M393A1K43BB0 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP 8GB M393A1K43BB0 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP 1G x72 8GB M393A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP 2G x72 16GB M393A2G40EB1 CPB A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 2G x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 2G x72 16GB M393A2G40EB2 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 2G x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 2G x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 2G x72 16GB M393A2G40EB2 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 2G x72 16GB M393A2K40BB0 CPB C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K40BB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K40BB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 4G x72 32GB M393A4K40BB0 CPB A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 4G x72 32GB M393A4K40BB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP -5- Comp. Version Internal Banks Rank May. 2018 Product Guide DDR4 SDRAM Memory [Table 3] 288Pin DDR4 Registered DIMM Org. Density Part Number Temp & Power & Speed Raw Card Composition 4G x72 32GB M393A4K40BB2 CTD B (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 8G x72 64GB M393A8K40B21 CRB A (4Rx4) 3DS 2H 8G x4 * 36pcs 8Gb B-die 8G x72 64GB M393A8K40B21 CTC A (4Rx4) 3DS 2H 8G x4 * 36pcs 8Gb 8G x72 64GB M393A8K40B2B CTC A (4Rx4) 3DS 2H 8G x4 * 36pcs 8G x72 64GB M393A8K40B22 CWD B (4Rx4) 16G x72 128GB M393AAK40B41 CTC 16G x72 128GB M393AAK40B42 2G x72 16GB 2G x72 PKG Height Avail. 2 78ball FBGA 31.25mm MP 16 4 78ball FBGA 31.25mm MP B-die 16 4 78ball FBGA 31.25mm MP 8Gb B-die 16 4 78ball FBGA 31.25mm MP 3DS 2H 8G x4 * 36pcs 8Gb B-die 16 4 78ball FBGA 31.25mm MP A (8Rx4) 3DS 4H 8G x4 * 36pcs 8Gb B-die 16 8 78ball FBGA 31.25mm MP CWD B (8Rx4) 3DS 4H 8G x4 * 36pcs 8Gb B-die 16 8 78ball FBGA 31.25mm MP M393A2K43CB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP 16GB M393A2K43CB2 CTD E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K43CB2 CVF E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball FBGA 31.25mm CS 3Q'18 2G x72 16GB M393A2K40CB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K40CB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball FBGA 31.25mm MP 2G x72 16GB M393A2K40CB2 CVF C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball FBGA 31.25mm CS 3Q'18 4G x72 32GB M393A4K40CB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP 4G x72 32GB M393A4K40CB2 CTD B (2Rx4) 2G x4 * 36pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP 4G x72 32GB M393A4K40CB2 CVF B (2Rx4) 2G x4 * 36pcs 8Gb C-die 16 2 78ball FBGA 31.25mm CS 3Q'18 -6- Comp. Version Internal Banks Rank May. 2018 Product Guide DDR4 SDRAM Memory 4.2 288Pin DDR4 Load Reduced DIMM [Table 4] 288Pin DDR4 Load Reduced DIMM Org. Density Part Number Temp & Power & Speed Raw Card Composition 4G x72 32GB M386A4G40EM2 CPB D (4Rx4) DDP 2G x4 * 36pcs 4Gb E-die 16 4G x72 32GB M386A4G40EM2 CRC D (4Rx4) DDP 2G x4 * 36pcs 4Gb E-die 4G x72 32GB M386A4K40BB0 CRC A (2Rx4) 2G x4 * 36pcs 8Gb 8G x72 64GB M386A8K40BM1 CPB D (4Rx4) DDP 4G x4 * 36pcs 8G x72 64GB M386A8K40BM1 CRC D (4Rx4) 8G x72 64GB M386A8K40BM2 CTD 8G x72 64GB M386A8K40BMB 8G x72 64GB 16G x72 PKG Height Avail. 4 78ball FBGA 31.25mm EOL 2Q'18 16 4 78ball FBGA 31.25mm EOL 2Q'18 B-die 16 2 78ball FBGA 31.25mm MP 8Gb B-die 16 4 78ball FBGA 31.25mm MP DDP 4G x4 * 36pcs 8Gb B-die 16 4 78ball FBGA 31.25mm MP D (4Rx4) DDP 4G x4 * 36pcs 8Gb B-die 16 4 78ball FBGA 31.25mm MP CPB D (4Rx4) DDP 4G x4 * 36pcs 8Gb B-die 16 4 78ball FBGA 31.25mm MP M386A8K40BMB CRC D (4Rx4) DDP 4G x4 * 36pcs 8Gb B-die 16 4 78ball FBGA 31.25mm MP 128GB M386AAK40B40 CUC A (8Rx4) 3DS 4H 8G x4 * 36pcs 8Gb B-die 16 8 78ball FBGA 31.25mm MP 16G x72 128GB M386AAK40B40 CWD A (8Rx4) 3DS 4H 8G x4 * 36pcs 8Gb B-die 16 8 78ball FBGA 31.25mm MP 8G x72 64GB M386A8K40CM2 CRC D (4Rx4) DDP 4G x4 * 36pcs 8Gb C-die 16 4 78ball FBGA 31.25mm MP 8G x72 64GB M386A8K40CM2 CTD D (4Rx4) DDP 4G x4 * 36pcs 8Gb C-die 16 4 78ball FBGA 31.25mm MP 8G x72 64GB M386A8K40CM2 CVF D (4Rx4) DDP 4G x4 * 36pcs 8Gb C-die 16 4 78ball FBGA 31.25mm CS 3Q'18 -7- Comp. Version Internal Banks Rank May. 2018 Product Guide DDR4 SDRAM Memory 4.3 288Pin DDR4 VLP Registered DIMM [Table 5] 288Pin DDR4 VLP Registered DIMM Org. Density Part Number Temp & Power & Speed Raw Card Composition 2G x72 16GB M392A2K43BB0 CPB H (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2G x72 16GB M392A2K43BB0 CRC H (2Rx8) 1G x8 * 18pcs 8Gb B-die 4G x72 32GB M392A4K40BM0 CPB J (2Rx4) 4G x4 * 18pcs 8Gb 4G x72 32GB M392A4K40BM0 CRC J (2Rx4) 4G x4 * 18pcs 8Gb Comp. Version Internal Banks Rank PKG Height Avail. 2 78ball FBGA 18.75mm MP 16 2 78ball FBGA 18.75mm MP B-die 16 2 78ball FBGA 18.75mm MP B-die 16 2 78ball FBGA 18.75mm MP PKG Height Avail. 4.4 260Pin DDR4 ECC SODIMM [Table 6] 260Pin DDR4 ECC SODIMM Org. Density Part Number Temp & Power & Speed 1G x72 8GB M474A1G43EB1 CPB G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL 2Q'18 1G x72 8GB M474A1G43EB1 CRC G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL 2Q'18 1G x72 8GB M474A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 30mm MP 2G x72 16GB M474A2K43BB1 CPB G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 30mm MP 2G x72 16GB M474A2K43BB1 CRC G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 30mm MP 30mm MP Raw Card Composition Comp. Version Internal Banks Rank 78ball FBGA 2G x72 16GB M474A2K43BB1 CTD G (2Rx8) 1G x8 * 18pcs -8- 8Gb B-die 16 2 78ball FBGA May. 2018 Product Guide DDR4 SDRAM Memory 4.5 260Pin DDR4 ECC UDIMM [Table 7] 260Pin DDR4 ECC UDIMM Org. Density Part Number Temp & Power & Speed 512M x72 4GB M391A5143EB1 CPB D (1Rx8) 512M x8 * 9pcs 4Gb E-die 16 512M x72 4GB M391A5143EB1 CRC D (1Rx8) 512M x8 * 9pcs 4Gb E-die 1G x72 8GB M391A1G43EB1 CPB E (2Rx8) 512M x8 * 18pcs 4Gb 1G x72 8GB M391A1G43EB1 CRC E (2Rx8) 512M x8 * 18pcs 1G x72 8GB M391A1K43BB1 CPB D (1Rx8) 1G x72 8GB M391A1K43BB1 CRC 1G x72 8GB M391A1K43BB2 2G x72 16GB 2G x72 2G x72 Raw Card Composition PKG Height Avail. 1 78ball FBGA 31.25mm EOL 2Q'18 16 1 78ball FBGA 31.25mm EOL 2Q'18 E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q'18 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP M391A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 16GB M391A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP 16GB M391A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP -9- Comp. Version Internal Banks Rank May. 2018 Product Guide DDR4 SDRAM Memory 4.6 260Pin DDR4 Non ECC SODIMM [Table 8] 260Pin DDR4 Non ECC SODIMM Org. Density Part Number Temp & Power & Speed 256M x64 2GB M471A5644EB0 CRC C 256M x16 * 4pcs (1Rx16) 4Gb E-die 8 512M x64 4GB M471A5244CB0 CTD C 256M x16 * 4pcs (1Rx16) 8Gb C-die 512M x64 4GB M471A5244BB0 CRC C 256M x16 * 4pcs (1Rx16) 8Gb 512M x64 4GB M471A5244BB0 CTD C 256M x16 * 4pcs (1Rx16) 512M x64 4GB M471A5143EB1 CRC 1G x64 8GB M471A1K43DB1 1G x64 8GB 1G x64 Raw Card Composition PKG Height Avail. 1 96ball FBGA 30mm EOL '18 1Q 8 1 96ball FBGA 30mm MP B-die 8 1 96ball FBGA 30mm EOL '19 1Q 8Gb B-die 8 1 96ball FBGA 30mm EOL '19 1Q A (1Rx8) 512M x8 * 8pcs 4Gb E-die 16 1 78ball FBGA 30mm EOL '18 2Q CTD A (1Rx8) 1G x8 * 8pcs 8Gb D-die 16 1 78ball FBGA 30mm MP M471A1K43CB1 CRC A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP 8GB M471A1K43CB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP 1G x64 8GB M471A1K43BB1 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL '19 1Q 1G x64 8GB M471A1K43BB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL '19 1Q 1G x64 8GB M471A1G43EB1 CRC E (2Rx8) 512M x8 * 16pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL '18 2Q 2G x64 16GB M471A2K43DB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb D-die 16 2 78ball FBGA 30mm MP 2G x64 16GB M471A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP 2G x64 16GB M471A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP 2G x64 16GB M471A2K43BB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL '19 1Q 2G x64 16GB M471A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL '19 1Q 4G x64 32GB M471A4G43MB1 CTD E (2Rx8) 2G x8 * 16pcs 16Gb M-die 16 2 78ball FBGA 30mm MP 4G x64 32GB M471A4G43AB1 CVF E (2Rx8) 2G x8 * 16pcs 16Gb A-die 16 2 78ball FBGA 30mm CS '18 4Q - 10 - Comp. Version Internal Banks Rank May. 2018 Product Guide DDR4 SDRAM Memory 4.7 260Pin DDR4 Non ECC UDIMM [Table 9] 260Pin DDR4 Non ECC UDIMM Org. Density Part Number Temp & Power & Speed 256M x64 2GB M378A5644EB0 CRC C 256M x16 * 4pcs (1Rx16) 4Gb E-die 8 512M x64 4GB M378A5244CB0 CTD C 256M x16 * 4pcs (1Rx16) 8Gb C-die 512M x64 4GB M378A5244BB0 CRC C 256M x16 * 4pcs (1Rx16) 8Gb 512M x64 4GB M378A5244BB0 CTD C 256M x16 * 4pcs (1Rx16) 512M x64 4GB M378A5143EB2 CRC 1G x64 8GB M378A1K43DB2 1G x64 8GB 1G x64 Raw Card Composition PKG Height Avail. 1 96ball FBGA 30mm EOL '18 1Q 8 1 96ball FBGA 30mm MP B-die 8 1 96ball FBGA 30mm EOL '19 1Q 8Gb B-die 8 1 96ball FBGA 30mm EOL '19 1Q A (1Rx8) 512M x8 * 8pcs 4Gb E-die 16 1 78ball FBGA 30mm EOL '18 2Q CTD A (1Rx8) 1G x8 * 8pcs 8Gb D-die 16 1 78ball FBGA 30mm CS '18 2Q M378A1K43CB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP 8GB M378A1K43CB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP 1G x64 8GB M378A1K43BB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL '19 1Q 1G x64 8GB M378A1K43BB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL '19 1Q 1G x64 8GB M378A1G43EB1 CRC E (2Rx8) 512M x8 * 16pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL '18 2Q 2G x64 16GB M378A2K43DB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb D-die 16 2 78ball FBGA 30mm CS '18 2Q 2G x64 16GB M378A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP 2G x64 16GB M378A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP 2G x64 16GB M378A2K43BB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL '19 1Q 2G x64 16GB M378A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL '19 1Q 4G x64 32GB M378A4G43MB1 CTD E (2Rx8) 2G x8 * 16pcs 16Gb M-die 16 2 78ball FBGA 30mm CS '18 2Q 4G x64 32GB M378A4G43AB1 CVF E (2Rx8) 2G x8 * 16pcs 16Gb A-die 16 2 78ball FBGA 30mm CS '19 1Q - 11 - Comp. Version Internal Banks Rank May. 2018 Product Guide DDR4 SDRAM Memory 5. RDIMM, LRDIMM Memory Buffer Information 5.1 Label Example C2AHA40633333C78B3 64GB 4Rx4 PC4 -2400T-LD1-11 Country 1 2 3 4 5 YYWW 6 7 8 9 10 M386A8K40BM1-CRC5Q 5.2 JEDEC Description Information 1. Module total capacity, in gigabytes, for primary bus (ECC not counted) 2. Number of package ranks of memory installed and number of logical ranks per package rank 3. Device organization (data bit width) of SDRAMs used on this assembly 4. SDRAM and support component supply voltage (VDD) blank = 1.2 V operable 5. Module speed in Mb/s/data pin 6. SDRAM speed grade 7. Module Type A = Unbuffered 16-bit Small Outline DIMM ("16b-SO-DIMM"), x16 data bus (placeholder) B = Unbuffered 32-bit Small Outline DIMM ("32b-SO-DIMM"), x32 data bus (placeholder) C = Registered 72-bit Small Outline DIMM ("72b-SO-RDIMM"), x64 primary + 8 bit ECC module data bus(placeholder) E = Unbuffered DIMM ("UDIMM"), x64 primary + 8 bit ECC module data bus L = Load Reduced DIMM ("LRDIMM"), x64 primary + 8 bit ECC module data bus N = Mini registered DIMM ("Mini-RDIMM"), x64 primary + 8 bit ECC module data bus R = Registered DIMM ("RDIMM"), x64 primary + 8 bit ECC module data bus S = Small Outline DIMM ("SO-DIMM"), no ECC (x64 bit module data bus) T = Unbuffered 72-bit Small Outline DIMM ("72b-SO-DIMM"), x64 primary + 8 bit ECC module data bus U = Unbuffered DIMM ("UDIMM"), no ECC (x64 bit module data bus) W = Mini unbuffered DIMM ("Mini-UDIMM"), x64 primary + 8 bit ECC module data bus 8. Reference design file used for this design (if applicable) A = Reference design for raw card 'A' is used for this assembly B = Reference design for raw card 'B' is used for this assembly AC = Reference design for raw card 'AC' is used for this assembly (example only) ZZ = None of the JEDEC standard reference designs were used for this assembly 9. Revision number of the reference design used 0 = Initial release 1 = First revision 2 = Second revision P = Pre-release or Engineering sample Z = To be used when reference raw card = ZZ 10. JEDEC SPD Revision Encoding and Additions level used on this DIMM - 12 - May. 2018 Product Guide DDR4 SDRAM Memory 5.3 RCD (& Data Buffer) Information (These codes are only used SAMSUNG, Not JEDEC) 11&12. RCD, Data Buffer Revision & Vendor used on this DIMM Jedec Description on label Buffer Vendor RCD ver DB ver (Only LRDIMM) DC0 IDT C0 B1 MB1 Montage B1 A1 MC0 Montage C0 B0 DC3 IDT C0 A3 MA0 Montage A0 A1 DB1 IDT B1 B0 PA0 Rambus (Inphi) A0 A0 DC1 IDT C1 C1 - 13 - May. 2018 Product Guide DDR4 SDRAM Memory 6. PACKAGE DIMENSION 0.80 (Datum A) 1.60 A #A1 INDEX MARK 3.20 #A1 0.80 x12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 7.50 0.10 B 9 8 7 6 5 4 3 2 1 11.00 0.10 0.80 x 8 6.40 11.00 0.10 7.50 0.10 0.10MAX 78ball FBGA for 4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4) 4Gb E-die (x4/x8) 8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4) 8Gb C-die (x4/x8) 0.37 0.05 78 - AE0.48 Solder ball (Post Reflow AE0.50 0.05) 1.10 0.10 0.2 M A B BOTTOM VIEW TOP VIEW - 14 - May. 2018 Product Guide DDR4 SDRAM Memory 0.10MAX 78ball FBGA for 16Gb M-die (x4/x8) 0.80 x 8 6.40 0.80 1.60 #A1 INDEX MARK 3.20 0.30 0.60 A B C 11.00 0.10 0.80 x12 = 9.60 A' 4.80 0.80 A 0.80 0.37 0.05 78 - 0.48 Solder ball (Post Reflow 0.50 0.05) 1.10 0.10 0.20 M A B BOTTOM VIEW TOP VIEW 0.20 MAX A B C D E F G H J K L M N 10.30 0.10 #A1 9 8 7 6 5 4 3 2 1 MOLDING COMPOUND SECTION A-A' - 15 - SIDE VIEW May. 2018 Product Guide DDR4 SDRAM Memory 96ball FBGA for 4Gb D-die (x16) / 4Gb E-die (x16) 8Gb B-die (x16) / 8Gb C-die (x16) 7.50 0.10 1.60 #A1 INDEX MARK 3.20 96 - 0.48 Solder ball (Post reflow 0.50 0.05) 0.40 7.50 0.10 0.80 (Datum B) 0.80 x15 = 12.00 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T #A1 B 13.30 0.10 0.80 13.30 0.10 (Datum A) 0.10MAX A 0.80 x 8 = 6.40 (0.30) MOLDING AREA 0.37 0.05 (0.60) 1.10 0.10 0.2 M A B BOTTOM VIEW TOP VIEW - 16 - May. 2018 Product Guide DDR4 SDRAM Memory 0.10MAX 96ball FBGA for 16Gb M-die (x16) 0.80 x 8 6.40 1.60 #A1 INDEX MARK 3.20 A' 0.80 x15 = 12.00 6.00 0.40 A A B C 0.80 0.37 0.05 96 - 0.48 Solder ball (Post Reflow 0.50 0.05) 0.30 0.60 1.10 0.10 0.20 M A B BOTTOM VIEW TOP VIEW 0.20 MAX A B C D E F G H J K L M N P R T 10.30 0.10 #A1 9 8 7 6 5 4 3 2 1 13.30 0.10 0.80 MOLDING COMPOUND SECTION A-A' - 17 - SIDE VIEW May. 2018 Product Guide DDR4 SDRAM Memory 7. MODULE DIMENSION x72 288pin DDR4 SDRAM RDIMM x72 288pin DDR4 SDRAM LRDIMM x72 288pin DDR4 SDRAM ECC UDIMM x64 288pin DDR4 SDRAM Non ECC UDIMM Units : Millimeters Max 1.4 133.35 64.60 56.10 31.25 17.60 30.75 Max 1.4 1.4 0.10 3.35 126.65 4.30 3.85 0.10 C A E D B 1.50 0.05 Detail A 9.35 10.20 0.85 2.1 2.6 2.6 0.25 2.1 B : 2.1 E : 2.6 0.6 0.03 9.35 10.20 Detail C Detail B,E - 18 - Detail D May. 2018 Product Guide DDR4 SDRAM Memory x72 260pin DDR4 SDRAM ECC SODIMM x64 260pin DDR4 SDRAM Non ECC SODIMM Units : Millimeters 69.60 Max 3.7 30.00 65.60 1.2 0.10 A 35.50 B 28.50 1.375 0.35 0.03 0.50 4.00 0.10 2.55 1.00 0.05 0.30 MAX Detail A Detail B - 19 - May. 2018 Product Guide DDR4 SDRAM Memory x72 288pin DDR4 SDRAM VLP RDIMM Units : Millimeters Max 4.9 64.60 18.75 18.25 Register 133.35 1.4 0.10 56.10 126.65 4.30 C A E D B 3.85 0.10 1.50 0.05 0.85 Detail B,E 9.35 10.20 2.6 2.6 2.1 B : 2.1 E : 2.6 0.25 2.1 Detail A 0.6 0.03 9.35 10.20 Detail C Detail D - 20 - May. 2018 Product Guide DDR4 SDRAM Memory x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP) 1. FRONT 127 0.12 50.81 50.81 21.49 21.49 0.6 9.9 13.6 8.9 0.8 0.05 0.6 Caution "Hot surface" 63.68 2. BACK 127 0.12 50.81 50.81 21.49 21.49 9.9 13.6 8.9 "Hot surface" 3. CLIP 35.82 0.12 3.80 +0.5 -0.8 9.3 0.12 6.8 0.1 4. ASS'Y VIEW Reference thickness total (Maximum) : 7.30 (With clip thickness) - 21 - May. 2018 Product Guide DDR4 SDRAM Memory x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV) 1. FRONT PART 133.15 0.2 130.45 0.2 5.785 0.12 17.02 0.12 6.075 0.12 4.35 0.12 25.75 0.15 31.1 0.12 0.6 0.12 2.6 0.2 127 0.12 2. BACK PART 3. CLIP PART 39.3 0.2 19.25 0.12 7 0.12 Clip open size 3.2 0.6 - 22 - May. 2018 Product Guide DDR4 SDRAM Memory x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP) 1. FRONT PART 133.15 +0.40 -0.20 18.6 0.25 25.75 0.2 130.45 0.2 0.6 0.1 2.8 0.2 127 0.25 2. BACK PART 3. CLIP PART 39.3 0.2 19.25 0.12 7 0.12 Clip open size 3.2 0.6 - 23 -