Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 LM2937 500-mA Low Dropout Regulator 1 Features * * * 1 * * * * * * 3 Description Fully Specified for Operation Over -40C to 125C Output Current in Excess of 500 mA Output Trimmed for 5% Tolerance Under all Operating Conditions Typical Dropout Voltage of 0.5 V at Full Rated Load Current Wide Output Capacitor ESR Range, up to 3 Internal Short Circuit and Thermal Overload Protection Reverse Battery Protection 60-V Input Transient Protection Mirror Image Insertion Protection 2 Applications * * * Automotive Industrial Control Point-of-Load regulation space space space Simplified Schematic The LM2937 is a positive voltage regulator capable of supplying up to 500 mA of load current. The use of a PNP power transistor provides a low dropout voltage characteristic. With a load current of 500 mA the minimum input to output voltage differential required for the output to remain in regulation is typically 0.5 V (1-V ensured maximum over the full operating temperature range). Special circuitry has been incorporated to minimize the quiescent current to typically only 10 mA with a full 500-mA load current when the input to output voltage differential is greater than 3 V. The LM2937 requires an output bypass capacitor for stability. As with most low dropout regulators, the ESR of this capacitor remains a critical design parameter, but the LM2937 includes special compensation circuitry that relaxes ESR requirements. The device is stable for all ESR below 3 . This allows the use of low ESR chip capacitors. Ideally suited for automotive applications, the LM2937 will protect itself and any load circuitry from reverse battery connections, two-battery jumps, and up to 60V/-50-V load dump transients. Familiar regulator features such as short circuit and thermal shutdown protection are also built in. Device Information(1) PART NUMBER LM2937 PACKAGE BODY SIZE (NOM) TO-220 (3) 14.986 mm x 10.66 mm SOT (4) 6.50 mm x 3.5 mm TO-263 (3) 10.18 mm x 8.41 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 4 4 4 4 5 5 5 7 7 8 Absolute Maximum Ratings ...................................... Handling Ratings ...................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: LM2937-5 ........................ Electrical Characteristics: LM2937-8 ........................ Electrical Characteristics: LM2937-10 ...................... Electrical Characteristics: LM2937-12 ...................... Electrical Characteristics: LM2937-15 ...................... Typical Characteristics ............................................ Detailed Description ............................................ 11 7.1 7.2 7.3 7.4 8 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 12 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application ................................................. 13 9 Power Supply Recommendations...................... 17 10 Layout................................................................... 18 10.1 Layout Guidelines ................................................. 18 10.2 Layout Example .................................................... 18 11 Device and Documentation Support ................. 19 11.1 Trademarks ........................................................... 19 11.2 Electrostatic Discharge Caution ............................ 19 11.3 Glossary ................................................................ 19 12 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (June 2013) to Revision F * 2 Page Changed format to meet new TI standards; added Device Information and Handling Ratings tables; updated connection drawings; rename Functional Description and Applications sections, reformat and add new information, add Devices and Documentation section .............................................................................................................................. 1 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 5 Pin Configuration and Functions TO-220 Plastic Package (NDE) 3 Top View INPUT 1 GND 2 OUTPUT 3 TAB SOT-223 Plastic Package (DCY) 4 Top View INPUT 1 GND 2 OUTPUT 3 4 (TAB) DDPAK/TO-263 Surface-Mount Package (KTT) 3 Top View 1 GND 2 OUTPUT 3 TAB INPUT Pin Functions PIN I/O DESCRIPTION NAME NDE KTT DCY INPUT 1 1 1 I GND 2 2 2 -- Ground OUTPUT 3 3 3 O Regulated voltage output. This pin requires an output capacitor to maintain stability. See the Detailed Design Procedure section for output capacitor details. -- Thermal and ground connection. Connect the TAB to a large copper area to remove heat from the device. The TAB is internally connected to device pin 2 (GND). Connect the TAB to GND or leave floating. Do not connect the TAB to any potential other than GND at device pin 2. GND TAB TAB 4 Unregulated voltage input Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 3 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN Input voltage (VIN) MAX Continuous 26 Transient (t 100 ms) 60 Internal power dissipation (3) (2) (3) V Internally limited Maximum junction temperature (1) UNIT 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum allowable power dissipation at any ambient temperature is PMAX = (125C - TA)/RJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and RJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125C and the electrical specifications do not apply. If the die temperature rises above 150C, the LM2937 will go into thermal shutdown. 6.2 Handling Ratings Tstg Storage temperature range V(ESD) (1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) MIN MAX UNIT -65 150 C -2000 2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN Junction temperature (TJ) (2) (2) MAX LM2937ET (NDE), LM2937ES (KTT) -40 125 LM2937IMP (DCY) -40 85 VOUT + 1V 26 Input voltage (VIN) (1) NOM UNIT C V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The maximum allowable power dissipation at any ambient temperature is PMAX = (125C - TA)/RJA, where 125C is the maximum junction temperature for operation, TA is the ambient temperature, and RJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125C and the electrical specifications do not apply. If the die temperature rises above 150C, the LM2937 will go into thermal shutdown. 6.4 Thermal Information LM2937 THERMAL METRIC (1) NDE (2) KTT DCY 3 PINS 3 PINS 4 PINS RJA Junction-to-ambient thermal resistance 77.9 41.8 58.3 RJC(top) Junction-to-case (top) thermal resistance 35.5 43.5 39.2 RJB Junction-to-board thermal resistance 70.6 0.8 N/A JT Junction-to-top characterization parameter 13 23.5 7 JB Junction-to-board characterization parameter 70.6 10.3 1.6 RJC(bot) Junction-to-case (bottom) thermal resistance 1 22.5 22.5 (1) (2) 4 UNIT C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Thermal information for the TO-220 package is for a free-standing package vertically mounted in the middle of a PCB which is compliant to the JEDEC HIGH-K 2s2p (JESD51-7) specifications. No additional heat sink is attached. See Heatsinking TO-220 Package Parts section for more information. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 6.5 Electrical Characteristics: LM2937-5 Unless otherwise specified: VIN = VOUT(NOM) + 5 V; IOUT(MAX) = 500 mA for the TO-220 and DDPAK/TO-263 packages; IOUT(MAX) = 400 mA for the SOT-223 package; and COUT = 10 F. Conditions and the associated minimum and maximum limits apply over the Recommended Operating temperature range for the specific package, unless otherwise noted. PARAMETER Output voltage MIN TYP MAX UNIT TA = TJ = 25C, 5 mA IOUT IOUT(MAX) CONDITIONS 4.85 5 5.15 V 5 mA IOUT IOUT(MAX) 4.75 5 5.25 V Line regulation (VOUT + 2 V) VIN 26 V, IOUT = 5 mA 15 50 mV Load regulation 5 mA IOUT IOUT(MAX) 5 50 mV Quiescent Current (VOUT + 2 V) VIN 26 V, IOUT = 5 mA 2 10 mA 10 20 VIN = (VOUT + 5 V), IOUT = IOUT(MAX) 10 Hz to 100 kHz, IOUT = 5 mA Long-term stability 1000 Hrs. 20 Dropout voltage IOUT = IOUT(MAX) 0.5 1 150 110 250 IOUT = 50 mA Short-circuit current Peak line transient voltage tf < 100 ms, RL = 100 Maximum operational input voltage mA Vrms Output noise voltage mV V mV 0.6 1 A 60 75 V 26 V Reverse DC input voltage VOUT -0.6 V, RL = 100 -15 -30 V Reverse transient input voltage tr < 1 ms, RL = 100 -50 -75 V 6.6 Electrical Characteristics: LM2937-8 Unless otherwise specified: VIN = VOUT(NOM) + 5 V; IOUT(MAX) = 500 mA for the TO-220 and DDPAK/TO-263 packages; IOUT(MAX) = 400 mA for the SOT-223 package; and COUT = 10 F. Conditions and the associated Minimum and Maximum limits apply over the Recommended Operating temperature range for the specific package, unless otherwise noted. PARAMETER Output voltage CONDITIONS TA = TJ = 25C, 5 mA IOUT IOUT(MAX) 5 mA IOUT IOUT(MAX) Line regulation (VOUT + 2 V) VIN 26 V, IOUT = 5 mA Load regulation 5 mA IOUT IOUT(MAX) Quiescent Current (VOUT + 2 V) VIN 26 V, IOUT = 5 mA MIN TYP MAX UNIT 7.76 8 8.24 V 7.6 8 8.4 V 24 80 mV 8 80 mV 2 10 mA 10 20 VIN = (VOUT + 5 V), IOUT = IOUT(MAX) 10 Hz to 100 kHz, IOUT = 5 mA Long-term stability 1000 Hrs. 32 Dropout voltage IOUT = IOUT(MAX) 0.5 1 IOUT = 50 mA 110 250 Short-circuit current Peak line transient voltage tf < 100 ms, RL = 100 Maximum operational input voltage mA Vrms Output noise voltage 240 mV V mV 0.6 1 A 60 75 V 26 V Reverse DC input voltage VOUT -0.6 V, RL = 100 -15 -30 V Reverse transient input voltage tr < 1 ms, RL = 100 -50 -75 V 6.7 Electrical Characteristics: LM2937-10 Unless otherwise specified: VIN = VOUT(NOM) + 5 V; IOUT(MAX) = 500 mA for the TO-220 and DDPAK/TO-263 packages; IOUT(MAX) = 400 mA for the SOT-223 package; and COUT = 10 F. Conditions and the associated Minimum and Maximum limits apply over the Recommended Operating temperature range for the specific package, unless otherwise noted. PARAMETER Output voltage Line regulation MIN TYP MAX UNIT TA = TJ = 25C, 5 mA IOUT IOUT(MAX) CONDITIONS 9.7 10 10.3 V 5 mA IOUT IOUT(MAX) 9.5 10 10.5 V 30 100 mV (VOUT + 2V) VIN 26V, IOUT = 5 mA Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 5 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com Electrical Characteristics: LM2937-10 (continued) Unless otherwise specified: VIN = VOUT(NOM) + 5 V; IOUT(MAX) = 500 mA for the TO-220 and DDPAK/TO-263 packages; IOUT(MAX) = 400 mA for the SOT-223 package; and COUT = 10 F. Conditions and the associated Minimum and Maximum limits apply over the Recommended Operating temperature range for the specific package, unless otherwise noted. PARAMETER CONDITIONS Load regulation 5 mA IOUT IOUT(MAX) Quiescent Current (VOUT + 2V) VIN 26V, IOUT = 5 mA MIN VIN = (VOUT + 5V), IOUT = IOUT(MAX) TYP MAX UNIT 10 100 mV 2 10 mA 10 20 Vrms 40 mV 10 Hz to 100 kHz, IOUT = 5 mA Long-term stability 1000 Hrs. Dropout voltage IOUT = IOUT(MAX) 0.5 1 IOUT = 50 mA 110 250 Short-circuit current Peak line transient voltage tf < 100 ms, RL = 100 Maximum operational input voltage mA 300 Output noise voltage V mV 0.6 1 A 60 75 V 26 V Reverse DC input voltage VOUT -0.6 V, RL = 100 -15 -30 V Reverse transient input voltage tr < 1 ms, RL = 100 -50 -75 V 6 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 6.8 Electrical Characteristics: LM2937-12 Unless otherwise specified: VIN = VOUT(NOM) + 5 V; IOUT(MAX) = 500 mA for the TO-220 and DDPAK/TO-263 packages; IOUT(MAX) = 400 mA for the SOT-223 package; and COUT = 10 F. Conditions and the associated Minimum and Maximum limits apply over the Recommended Operating temperature range for the specific package, unless otherwise noted. PARAMETER Output voltage CONDITIONS TA = TJ = 25C, 5 mA IOUT IOUT(MAX) 5 mA IOUT IOUT(MAX) MIN TYP MAX UNIT 11.64 12 12.36 V 11.4 12 12.6 V Line regulation (VOUT + 2V) VIN 26V, IOUT = 5 mA 36 120 mV Load regulation 5 mA IOUT IOUT(MAX) 12 120 mV Quiescent Current (VOUT + 2V) VIN 26V, IOUT = 5 mA 2 10 mA 10 20 VIN = (VOUT + 5V), IOUT = IOUT(MAX) 10 Hz to 100 kHz, IOUT = 5 mA Long-term stability 1000 Hrs. 44 Dropout voltage IOUT = IOUT(MAX) 0.5 1 360 110 250 IOUT = 50 mA Short-circuit current Peak line transient voltage tf < 100 ms, RL = 100 Maximum operational input voltage mA Vrms Output noise voltage mV V mV 0.6 1 A 60 75 V 26 V Reverse DC input voltage VOUT -0.6 V, RL = 100 -15 -30 V Reverse transient input voltage tr < 1 ms, RL = 100 -50 -75 V 6.9 Electrical Characteristics: LM2937-15 Unless otherwise specified: VIN = VOUT(NOM) + 5 V; IOUT(MAX) = 500 mA for the TO-220 and DDPAK/TO-263 packages; IOUT(MAX) = 400 mA for the SOT-223 package; and COUT = 10 F. Conditions and the associated Minimum and Maximum limits apply over the Recommended Operating temperature range for the specific package, unless otherwise noted. PARAMETER Output voltage CONDITIONS MIN TYP MAX UNIT TA = TJ = 25C, 5 mA IOUT IOUT(MAX) 14.55 15 15.45 V 5 mA IOUT IOUT(MAX) 14.25 15 15.75 V Line regulation (VOUT + 2V) VIN 26V, IOUT = 5 mA 45 150 mV Load regulation 5 mA IOUT IOUT(MAX) 15 150 mV Quiescent Current (VOUT + 2V) VIN 26V, IOUT = 5 mA 2 10 mA 10 20 VIN = (VOUT + 5V), IOUT = IOUT(MAX) 10 Hz to 100 kHz, IOUT = 5 mA Long-term stability 1000 Hrs. 56 Dropout voltage IOUT = IOUT(MAX) 0.5 1 IOUT = 50 mA 110 250 Short-circuit current Peak line transient voltage tf < 100 ms, RL = 100 Maximum operational input voltage mA Vrms Output noise voltage 450 mV V mV 0.6 1 A 60 75 V 26 V Reverse DC input voltage VOUT -0.6 V, RL = 100 -15 -30 V Reverse transient input voltage tr < 1 ms, RL = 100 -50 -75 V Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 7 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com 6.10 Typical Characteristics 8 Figure 1. Dropout Voltage vs. Output Current Figure 2. Dropout Voltage vs. Temperature Figure 3. Output Voltage vs. Temperature Figure 4. Quiescent Current vs. Temperature Figure 5. Quiescent Current vs. Input Voltage Figure 6. Quiescent Current vs. Output Current Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 Typical Characteristics (continued) Figure 7. Line Transient Response Figure 8. Load Transient Response Figure 9. Ripple Rejection Figure 10. Output Impedence Figure 11. Maximum Power Dissipation (TO-220)1 Figure 12. Maximum Power Dissipation (DDPAK/TO-263) 1. The maximum allowable power dissipation at any ambient temperature is PMAX = (125C - TA)/RJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and RJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125C and the electrical specifications do not apply. If the die temperature rises above 150C, the LM2937 will go into thermal shutdown. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 9 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com Typical Characteristics (continued) Figure 13. Low-Voltage Behavior Figure 14. Low-Voltage Behavior Figure 15. Output at Voltage Extremes Figure 16. Output Capacitor ESR Figure 17. Peak Output Current 10 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 7 Detailed Description 7.1 Overview The LM2937 is a positive voltage regulator capable of supplying up to 500 mA of load current. The use of a PNP power transistor provides a low dropout voltage characteristic. With a load current of 500 mA the minimum input to output voltage differential required for the output to remain in regulation is typically 0.5 V (1 V ensured maximum over the full operating temperature range). Special circuitry has been incorporated to minimize the quiescent current to typically only 10 mA with a full 500-mA load current when the input to output voltage differential is greater than 3 V. 7.2 Functional Block Diagram INPUT OUTPUT PNP OVSD (32V) Current Limit Thermal Shutdown + Bandgap Reference LM2937 GND 7.3 Feature Description 7.3.1 Thermal Shutdown (TSD) The Thermal Shutdown circuitry of the LM2937 has been designed to protect the device against temporary thermal overload conditions. The TSD circuitry is not intended to replace proper heat-sinking. Continuously running the LM2937 device at thermal shutdown may degrade device reliability as the junction temperature will be exceeding the absolute maximum junction temperature rating. 7.3.2 Short Circuit Current Limit The output current limiting circuitry of the LM2937 has been designed to limit the output current in cases where the load impedance is unusually low. This includes situations where the output may be shorted directly to ground. Continuous operation of the LM2937 at the current limit will typically result in the LM2937 transitioning into Thermal Shutdown mode. 7.3.3 Overvoltage Shutdown (OVSD) Input voltages greater than typically 32 V will cause the LM2937 output to be disabled. When operating with the input voltage greater than the maximum recommended input voltage of 26 V the device performance is not ensured. Continuous operation with the input voltage greater than the maximum recommended input voltage is discouraged. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 11 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com 7.4 Device Functional Modes The LM2937 design does not include any undervoltage lock-out (UVLO), or enable functions. Generally, the output voltage will track the input voltage until the input voltage is greater than VOUT + 1V. When the input voltage is greater than VOUT + 1V the LM2937 will be in linear operation, and the output voltage will be regulated; however, the device will be sensitive to any small perturbation of the input voltage. Device dynamic performance is improved when the input voltage is at least 2 V greater than the output voltage. 12 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 8 Application and Implementation 8.1 Application Information Figure 18 shows the typical application circuit for the LM2937. The output capacitor, COUT, must have a capacitance value of at least 10 F with an ESR of at least 10 m, but no more than 3 . The minimum capacitance value, and the ESR requirements apply across the entire expected operating ambient temperature range. 8.2 Typical Application Figure 18. LM2937 Typical Application *Required if the regulator is located more than 3 inches from the power-supply-filter capacitors. **Required for stability. COUT must be at least 10 F (over full expected operating temperature range) and located as close as possible to the regulator. The equivalent series resistance, ESR, of this capacitor may be as high as 3 . 8.2.1 Design Requirements For this design example, use the parameters listed in Table 1: Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Output voltage 8V Input voltage 10 V to 26 V Output current requirement 5 mA to IOUT(MAX) (see Electrical Characteristics: LM2937-5, Electrical Characteristics: LM2937-8, Electrical Characteristics: LM2937-10, Electrical Characteristics: LM2937-12, Electrical Characteristics: LM2937-15 for details) Input capacitor value 0.1 F Output capacitor capacitance value 10 F minimum Output capacitor ESR value 0.01 to 3 8.2.2 Detailed Design Procedure 8.2.2.1 External Capacitors The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both Equivalent Series Resistance (ESR) and minimum amount of capacitance. Minimum Capacitance: The minimum output capacitance required to maintain stability is 10 F. (This value may be increased without limit.) Larger values of output capacitance will give improved transient response. ESR Limits: The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet these requirements, or oscillations can result. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 13 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com 8.2.2.2 Output Capacitor ESR Figure 19. ESR Limits It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design. For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25C to -40C. This type of capacitor is not well-suited for low temperature operation. Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value. If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The "flatter" ESR of the Tantalum will keep the effective ESR from rising as quickly at low temperatures. 8.2.2.3 Heatsinking A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junction temperature must be within the range specified under Absolute Maximum Ratings. To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated. Figure 20 below shows the voltages and currents which are present in the circuit, as well as the formula for calculating the power dissipated in the regulator: IIN = IL + IG PD = (VIN - VOUT) IL + (VIN) IG Figure 20. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR (max). This is calculated by using the formula: TR (max) = TJ(max) - TA (max) 14 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 where * TJ (max) is the maximum allowable junction temperature, which is 125C for the TO-220 and TO-263 packages, and 85C for the SOT-223 package. TA (max) is the maximum ambient temperature which will be encountered in the application. * (1) Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance, RJA, can now be found: RJA = TR (max)/PD (2) NOTE IMPORTANT: If the maximum allowable value for RJA is found to be 53C/W for the TO-220 package, 80C/W for the DDPAK/TO-263 package, or 174C/W for the SOT223 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for R JA falls below these limits, a heatsink is required. 8.2.2.4 Heatsinking TO-220 Package Parts The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane is to be used, the values of RJA will be the same as shown in the next section for the DDPAK/TO-263. If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, RHA, must first be calculated: RHA = RJA - RCH - RJC where * * RJC is defined as the thermal resistance from the junction to the surface of the case. A value of 3C/W can be assumed for RJC for this calculation RCH is defined as the thermal resistance between the case and the surface of the heatsink. The value of RCH will vary from about 1.5C/W to about 2.5C/W (depending on method of attachment, insulator, etc.). If the exact value is unknown, 2C/W should be assumed for RCH (3) When a value for RHA is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. RHA is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink. 8.2.2.5 Heatsinking DDPAK/TO-263 and SOT-223 Package Parts Both the DDPAK/TO-263 and SOT-223 packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 21 shows for the DDPAK/TO-263 the measured values of RJA for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 15 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com Figure 21. RJA vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package As shown in Figure 21, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of RJA for the DDPAK/TO-263 package mounted to a PCB is 32C/W. As a design aid, Figure 22 shows the maximum allowable power dissipation compared to ambient temperature for the DDPAK/TO-263 device (assuming RJA is 35C/W and the maximum junction temperature is 125C). Figure 22. Maximum Power Dissipation vs. TAMB for the DDPAK/TO-263 Package Figure 23 and Figure 24 show information for the SOT-223 package. Figure 24 assumes an RJA of 74C/W for 1 ounce copper and 51C/W for 2 ounce copper and a maximum junction temperature of 85C. 16 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 Figure 23. RJA vs Copper (2 ounce) Area for the SOT-223 Package Figure 24. Maximum Power Dissipation vs TAMB for the SOT-223 Package 8.2.2.6 SOT-223 Soldering Recommendations It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed circuit board. The excessive temperatures involved may cause package cracking. Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223 package. 8.2.3 Application Curves Figure 25. Output at Voltage Extremes Figure 26. Dropout Voltage vs. Temperature 9 Power Supply Recommendations This device is designed to operate from an input supply voltage from at least VOUT + 1 V up to a maximum of 26 V. The input supply should be well regulated and free of spurious noise. To ensure that the LM2937 output voltage is well regulated the input supply should be at least VOUT + 2 V. A capacitor at the INPUT pin may not be specifically required if the bulk input supply filter capacitors are within three inches of the INPUT pin, but adding one will not be detrimental to operation. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 17 LM2937 SNVS100F - MARCH 2000 - REVISED JULY 2014 www.ti.com 10 Layout 10.1 Layout Guidelines The dynamic performance of the LM2937 is dependent on the layout of the PCB. PCB layout practices that are adequate for typical LDO's may degrade the PSRR, noise, or transient performance of the LM2937. Best performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2937, and as close as is practical to the package. The ground connections for CIN and COUT should be back to the LM2937 ground pin using as wide, and as short, of a copper trace as is practical. Connections using long trace lengths, narrow trace widths, and/or connections through vias should be avoided as these will add parasitic inductances and resistances that will give inferior performance, especially during transient conditions 10.2 Layout Example 3 2 INPUT COUT 1 CIN OUTPUT GND Figure 27. LM2937 SOT-223-4 Layout 18 Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100F - MARCH 2000 - REVISED JULY 2014 11 Device and Documentation Support 11.1 Trademarks All trademarks are the property of their respective owners. 11.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.3 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2000-2014, Texas Instruments Incorporated Product Folder Links: LM2937 19 PACKAGE OPTION ADDENDUM www.ti.com 9-Jun-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2937ES-10/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -10 LM2937ES-12 NRND DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -12 LM2937ES-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -12 LM2937ES-15 NRND DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -15 LM2937ES-15/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -15 LM2937ES-2.5/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -2.5 LM2937ES-3.3 NRND DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -3.3 LM2937ES-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -3.3 LM2937ES-5.0 NRND DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -5.0 LM2937ES-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -5.0 LM2937ES-8.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -8.0 LM2937ESX-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -12 LM2937ESX-15/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -15 LM2937ESX-3.3 NRND DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2937ES -3.3 LM2937ESX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -3.3 LM2937ESX-5.0 NRND DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2937ES -5.0 LM2937ESX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -5.0 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-Jun-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2937ESX-8.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2937ES -8.0 LM2937ET-10/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -10 LM2937ET-12 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -12 LM2937ET-12/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -12 LM2937ET-15 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -15 LM2937ET-15/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -15 LM2937ET-2.5/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -2.5 LM2937ET-3.3 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -3.3 LM2937ET-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -3.3 LM2937ET-5.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -5.0 LM2937ET-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -5.0 LM2937ET-8.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -8.0 LM2937ET-8.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2937ET -8.0 LM2937IMP-10 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L73B LM2937IMP-10/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L73B LM2937IMP-12 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L74B LM2937IMP-12/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L74B LM2937IMP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L68B LM2937IMP-3.3 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L69B Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-Jun-2020 Status (1) LM2937IMP-3.3/NOPB Package Type Package Pins Package Drawing Qty ACTIVE SOT-223 DCY 4 1000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L69B (4/5) LM2937IMP-5.0 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L71B LM2937IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L71B LM2937IMP-8.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L72B LM2937IMPX-10/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L73B LM2937IMPX-12/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L74B LM2937IMPX-15/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L75B LM2937IMPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L68B LM2937IMPX-3.3 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L69B LM2937IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L69B LM2937IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L71B LM2937IMPX-8.0 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L72B LM2937IMPX-8.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 L72B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Jun-2020 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2937ESX-12/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-15/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-3.3 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-3.3/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-5.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-8.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937IMP-10 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-10/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-12 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-12/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-2.5/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-3.3 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2019 Device Package Package Pins Type Drawing SPQ LM2937IMP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 LM2937IMP-5.0 SOT-223 DCY 4 1000 330.0 16.4 LM2937IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 LM2937IMP-8.0/NOPB SOT-223 DCY 4 1000 330.0 LM2937IMPX-10/NOPB SOT-223 DCY 4 2000 LM2937IMPX-12/NOPB SOT-223 DCY 4 LM2937IMPX-15/NOPB SOT-223 DCY 4 LM2937IMPX-2.5/NOPB SOT-223 DCY LM2937IMPX-3.3 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 7.0 7.5 2.2 12.0 16.0 Q3 7.0 7.5 2.2 12.0 16.0 Q3 16.4 7.0 7.5 2.2 12.0 16.0 Q3 16.4 7.0 7.5 2.2 12.0 16.0 Q3 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-8.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-8.0 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2937ESX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-15/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-3.3 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2019 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2937ESX-5.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-8.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937IMP-10 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-10/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-12 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-12/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-3.3 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-8.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMPX-10/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-12/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-15/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-3.3 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-8.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-8.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 Pack Materials-Page 3 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com MECHANICAL DATA MPDS094A - APRIL 2001 - REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0-10 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. 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