OUT
UVLO/EN
VIN
GATE
R1
OVLO
PGD
SENSE
VDD
TIMER
PWR
LM5069
VOUT
COUT
100kŸ
VIN
RPWR
GND
RSNS
R2
R3
CTIMER
CIN Z1
D1
Q1
D2
1kŸ
Cdv/dt
Only required when
using dv/dt start-up
Q2
R4
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM5069
SNVS452G –SEPTEMBER 2006–REVISED JAUNUARY 2020
LM5069 Positive High-Voltage Hot Swap and In-Rush Current Controller
with Power Limiting
1
1 Features
1• Wide operating range: 9 V to 80 V
• In-rush current limit for safe board insertion into
live power sources
• Programmable maximum power dissipation in the
external pass device
• Adjustable current limit
• Circuit breaker function for severe overcurrent
events
• Internal high side charge pump and gate driver for
external N-channel MOSFET
• Adjustable undervoltage lockout (UVLO) and
hysteresis
• Adjustable overvoltage lockout (OVLO) and
hysteresis
• Initial insertion timer allows ringing and transients
to subside after system connection
• Programmable fault timer avoids nuisance trips
• Active high open drain POWER GOOD output
• Available in latched fault and automatic restart
versions
• 10-Pin VSSOP package
2 Applications
• Server backplane systems
• Base station power distribution systems
• Solid state circuit breaker
• 24-V and 48-V Industrial systems
3 Description
The LM5069 positive hot swap controller provides
intelligent control of the power supply connections
during insertion and removal of circuit cards from a
live system backplane or other hot power sources.
The LM5069 provides in-rush current control to limit
system voltage droop and transients. The current limit
and power dissipation in the external series pass N-
Channel MOSFET are programmable, ensuring
operation within the Safe Operating Area (SOA). The
POWER GOOD output indicates when the output
voltage is within 1.25 V of the input voltage. The input
undervoltage and overvoltage lockout levels and
hysteresis are programmable, as well as the initial
insertion delay time and fault detection time. The
LM5069-1 latches off after a fault detection, while the
LM5069-2 automatically restarts at a fixed duty cycle.
LM5069 is available in a 10-pin VSSOP package.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM5069 VSSOP (10) 3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Diagram
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison ............................................... 3
6 Pin Configuration and Functions......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Typical Characteristics.............................................. 7
8 Detailed Description............................................ 11
8.1 Overview................................................................. 11
8.2 Functional Block Diagram....................................... 11
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 13
9 Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Application.................................................. 17
10 Power Supply Recommendations ..................... 27
11 Layout................................................................... 28
11.1 Layout Guidelines ................................................. 28
11.2 Layout Example .................................................... 29
12 Device and Documentation Support................. 31
12.1 Device Support...................................................... 31
12.2 Documentation Support ........................................ 31
12.3 Receiving Notification of Documentation Updates 31
12.4 Community Resources.......................................... 31
12.5 Trademarks........................................................... 31
12.6 Electrostatic Discharge Caution............................ 31
12.7 Glossary................................................................ 31
13 Mechanical, Packaging, and Orderable
Information........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (February 2019) to Revision G Page
• Added Device Comparison table............................................................................................................................................ 3
Changes from Revision E (November 2016) to Revision F Page
• Updated the Absolute Maximum Ratings section................................................................................................................... 4
Changes from Revision D (May 2013) to Revision E Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Added Thermal Information table........................................................................................................................................... 4
1SENSE 10 GATE
2VIN 9 OUT
3UVLO 8 PGD
4OVLO 7 PWR
5GND 6 TIMER
Not to scale
3
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5 Device Comparison
DEVICE NUMBER RETRY BEHAVIOR AFTER FAULT PACKAGE
LM5069-1 Latch Off on Fault VSSOP (10)
LM5069-2 Auto Retry on Fault
6 Pin Configuration and Functions
DGS Package
10-Pin VSSOP
Top View
Pin Functions
PIN I/O DESCRIPTION
NO. NAME
1 SENSE I Current sense input: The voltage across the current sense resistor (RS) is measured from VIN to this
pin. If the voltage across RSreaches 55 mV the load current is limited and the fault timer activates.
2 VIN I Positive supply input: A small ceramic bypass capacitor close to this pin is recommended to suppress
transients which occur when the load current is switched off.
3 UVLO I Undervoltage lockout: An external resistor divider from the system input voltage sets the undervoltage
turnon threshold. An internal 21-µA current source provides hysteresis. The enable threshold at the pin
is 2.5 V. This pin can also be used for remote shutdown control.
4 OVLO I Overvoltage lockout: An external resistor divider from the system input voltage sets the overvoltage
turnoff threshold. An internal 21-µA current source provides hysteresis. The disable threshold at the pin
is 2.5 V.
5 GND — Circuit ground
6 TIMER I/O Timing capacitor: An external capacitor connected to this pin sets the insertion time delay and the fault
timeout period. The capacitor also sets the restart timing of the LM5069-2.
7 PWR I Power limit set: An external resistor connected to this pin, in conjunction with the current sense resistor
(RS), sets the maximum power dissipation allowed in the external series pass MOSFET.
8 PGD O Power Good indicator: An open drain output. When the external MOSFET VDS decreases below 1.25 V,
the PGD indicator is active (high). When the external MOSFET VDS increases above 2.5 V the PGD
indicator switches low.
9 OUT I Output feedback: Connect to the output rail (external MOSFET source). Internally used to determine the
MOSFET VDS voltage for power limiting, and to control the PGD indicator.
10 GATE O Gate drive output: Connect to the external MOSFET’s gate. This pin's voltage is typically 12 V above
the OUT pin when enabled.
4
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The GATE pin voltage is typically 12 V above VIN when the LM5069 is enabled. Therefore, the Absolute Maximum Ratings for VIN
(100 V) applies only when the LM5069 is disabled, or for a momentary surge to that voltage because the Absolute Maximum Rating for
the GATE pin is also 100 V.
(4) Select external MOSFET with VGS(th) voltage higher than VOUT during -ve transient. This avoids MOSFET getting turned-ON during -ve
transient.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN to GND(3) –0.3 100 V
SENSE, OUT, and PGD to GND –0.3 100 V
GATE to GND(3) –0.3 100 V
OUT to GND (1 -ms transient) (4) –1 100 V
UVLO to GND –0.3 100 V
OVLO to GND –0.3 7 V
VIN to SENSE –0.3 0.3 V
Maximum junction temperature, TJMAX 150 °C
Storage temperature, Tstg –65 150 °C
(1) The Human-body model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin.
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge(1) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±500
(1) For detailed information on soldering plastic VSSOP packages, see Absolute Maximum Ratings for Soldering (SNOA549) available from
Texas Instruments.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Supply voltage 9 80 V
PGD off voltage 0 80 V
TJJunction temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1) LM5069
UNITDGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 156 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.6 °C/W
RθJB Junction-to-board thermal resistance 75.8 °C/W
ψJT Junction-to-top characterization parameter 4.8 °C/W
ψJB Junction-to-board characterization parameter 74.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
5
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(1) OUT bias current (disabled) due to leakage current through an internal 1-MΩresistance from SENSE to VOUT.
7.5 Electrical Characteristics
Minimum and maximum limits are specified through test, design, or statistical correlation at TJ= –40°C to 125°C. Typical
values represent the most likely parametric norm at TJ= 25°C and are provided for reference purposes only. VIN = 48 V
(unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT (VIN PIN)
IIN-EN Input current, enabled UVLO > 2.5 V and OVLO < 2.5 V 1.3 1.6 mA
IIN-DIS Input current, disabled UVLO < 2.5 V or OVLO > 2.5 V 480 650 µA
PORIT Power-On reset threshold at
VIN to trigger insertion timer VIN increasing 7.6 8 V
POREN Power-On reset threshold at
VIN to enable all functions VIN increasing 8.4 9 V
POREN-HYS POREN hysteresis VIN decreasing 90 mV
OUT PIN
IOUT-EN OUT bias current, enabled OUT = VIN, Normal operation 11 µA
IOUT-DIS OUT bias current, disabled(1) Disabled, OUT = 0 V, SENSE = VIN 50
UVLO, OVLO PINS
UVLOTH UVLO threshold 2.45 2.5 2.55 V
UVLOHYS UVLO hysteresis current UVLO = 1 V 12 21 30 µA
UVLODEL UVLO delay Delay to GATE high 55 µs
Delay to GATE low 11
UVLOBIAS UVLO bias current UVLO = 48 V 1 µA
OVLOTH OVLO threshold 2.4 2.5 2.6 V
OVLOHYS OVLO hysteresis current OVLO = 2.6 V 12 21 30 µA
OVLODEL OVLO delay Delay to GATE high 55 µs
Delay to GATE low 11
OVLOBIAS OVLO bias current OVLO = 2.4 V 1 µA
POWER LIMIT (PWR PIN)
PWRLIM-1 Power limit sense voltage
(VIN-SENSE) SENSE-OUT = 48 V, RPWR = 150 kΩ19 25 31 mV
PWRLIM-2 SENSE-OUT = 24 V, RPWR = 75 kΩ25 mV
IPWR PWR pin current VPWR = 2.5 V 20 µA
GATE CONTROL (GATE PIN)
IGATE
Source current Normal operation, GATE-OUT = 5 V 10 16 22 µA
Sink current UVLO < 2.5 V 1.75 2 2.6 mA
VIN to SENSE = 150 mV or VIN < PORIT, VGATE = 5 V 45 110 175 mA
VGATE Gate output voltage in normal
operation GATE-OUT voltage 11.4 12 12.6 V
6
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Electrical Characteristics (continued)
Minimum and maximum limits are specified through test, design, or statistical correlation at TJ= –40°C to 125°C. Typical
values represent the most likely parametric norm at TJ= 25°C and are provided for reference purposes only. VIN = 48 V
(unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT LIMIT
VCL Threshold voltage VIN-SENSE voltage 48.5 55 61.5 mV
tCL Response time VIN-SENSE stepped from 0 mV to 80 mV 45 µs
ISENSE SENSE input current Enabled, SENSE = OUT 23 µA
Disabled, OUT = 0 V 60
CIRCUIT BREAKER
VCB Threshold voltage VIN to SENSE 80 105 130 mV
tCB Response time VIN to SENSE stepped from 0 mV to 150 mV, time to
GATE low, no load 0.44 1.2 µs
TIMER (TIMER PIN)
VTMRH Upper threshold 3.76 4 4.16 V
VTMRL Lower threshold Restart cycles (LM5069-2) 1.187 1.25 1.313 V
End of 8th cycle (LM5069-2) 0.3 V
Re-enable Threshold (LM5069-1) 0.3 V
ITIMER
Insertion time current 3 5.5 8 µA
Sink current, end of insertion
time TIMER pin = 2 V 1 1.5 2 mA
Fault detection current 51 85 120 µA
Fault sink current 1.25 2.5 3.75 µA
DCFAULT Fault restart duty cycle LM5069-2 only 0.5%
tFAULT Fault to GATE low delay TIMER pin reaches 4 V 12 µs
POWER GOOD (PGD PIN)
PGDTH Threshold measured at
SENSE-OUT Decreasing 0.67 1.25 1.85 V
Increasing, relative to decreasing threshold 0.95 1.25 1.55
PGDVOL Output low voltage ISINK = 2 mA 60 150 mV
PGDIOH Off leakage current VPGD = 80 V 5 µA
0
PGD SINK CURRENT (mA)
PGD VOLTAGE (V)
0 5 10 15 20
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
05 10 15 20 70 80
VIN VOLTAGE (V)
9
10
11
12
13
14
15
16
17
18
GATE PIN CURRENT (PA)
Enabled, UVLO = VIN
Normal Operation
POREN
05 10 15 20 70 80
VIN VOLTAGE (V)
GATE-OUT VOLTAGE
0
2
4
6
8
10
12
14
Enabled, UVLO = VIN
Normal Operation
POREN
Enabled, UVLO = VIN
Disabled, UVLO = 0V
2.0
1.5
1.0
0.5
00 20 60 8040
VIN PIN INPUT CURRENT (mA)
VIN VOLTAGE (V)
100
75
50
25
0
0 20 40 60 80
SENSE PIN VOLTAGE (V)
SENSE PIN INPUT CURRENT (PA)
Enabled, UVLO = VIN
Disabled, UVLO = 0V
7
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7.6 Typical Characteristics
TJ= 25°C and VIN = 48 V (unless otherwise noted)
Figure 1. VIN Pin Input Current vs VIN Figure 2. SENSE Pin Input Current
Figure 3. OUT Pin Current Figure 4. GATE Pin Voltage vs VIN
Figure 5. GATE Pin Source Current vs VIN Figure 6. PGD Pin Low Voltage vs Sink Current
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
UVLO, OVLO THRESHOLD VOLTAGE (V)
2.45
2.47
2.49
2.50
2.51
2.53
2.55
OVLO
UVLO
UVLO
OVLO
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
INPUT CURRENT, ENABLED (mA)
1.280
1.290
1.300
1.310
1.320
VIN = 48V
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
UVLO HYSTERESIS CURRENT (PA)
19
20
21
22
23
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (°C)
OVLO HYSTERESIS CURRENT (PA)
19
20
21
22
23
0 10 20 30 82 92
0
50
100
150
200
250
GATE PULLDOWN CURRENT,
CIRCUIT BREAKER (mA)
GATE PIN VOLTAGE (V)
TJ = 25°C
|
|
240
200
120
0
0
160
40
RPWR (k:)
PFET (W)
30 60 90 120 150
80
RS = 0.005:
RS = 0.01:
RS = 0.02:
RS = 0.05:
RS = 0.1:
8
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Typical Characteristics (continued)
TJ= 25°C and VIN = 48 V (unless otherwise noted)
Figure 7. MOSFET Power Dissipation Limit vs RPWR and RSFigure 8. GATE Pulldown Current, Circuit Breaker
vs GATE Voltage
Figure 9. UVLO Hysteresis Current vs Temperature Figure 10. OVLO Hysteresis Current vs Temperature
Figure 11. UVLO, OVLO Threshold vs Temperature Figure 12. Input Current, Enabled vs Temperature
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (°C)
GATE SOURCE CURRENT (PA)
15.6
15.8
16.0
16.2
16.4
GATE-OUT = 5V
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (°C)
GATE PULLDOWN CURRENT,
CIRCUIT BREAKER (mA)
50
70
90
100
110
130
150
GATE PIN = 5V
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
POWER LIMIT THRESHOLD
(VOLTAGE ACROSS RS) (mV)
23
24
25
26
27
RPWR = 150 k:
VDS = 48V
VDS = 48V
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
GATE OUTPUT VOLTAGE ABOVE
OUT PIN (V)
GATE-OUT Voltage,
Normal Operation
11.0
11.5
12.0
12.5
13.0
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
CURRENT LIMIT THRESHOLD
(VOLTAGE ACROSS RS) (mV)
53
54
55
56
57
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
CIRCUIT BREAKER THRESHOLD
(VOLTAGE ACROSS RS) (mV)
85
90
95
100
105
110
115
9
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Typical Characteristics (continued)
TJ= 25°C and VIN = 48 V (unless otherwise noted)
Figure 13. Current Limit Threshold vs Temperature Figure 14. Circuit Breaker Threshold vs Temperature
Figure 15. Power Limit Threshold vs Temperature Figure 16. GATE Output Voltage vs Temperature
Figure 17. GATE Source Current vs Temperature Figure 18. GATE Pulldown Current, Circuit Breaker
vs Temperature
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
160
120
80
40
.
0
PGD OUTPUT LOW VOLTAGE (mV)
PGD Sink Current = 2 mA
10
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Typical Characteristics (continued)
TJ= 25°C and VIN = 48 V (unless otherwise noted)
Figure 19. PGD Low Voltage vs Temperature
GATE
Fault
Timer
TIMER
Current Limit
Threshold
Enable POR
Charge
Pump
TIMER AND GATE
LOGIC CONTROL
Power Limit
Threshold
Gate
Control
OUT
1.5 mA
End
Insertion
Time
LM5069
Current Limit/
Power Limit
Control
VIN
Insertion Timer POR
230
mA
VIN
SENSE
OUT
PWR
OVLO
UVLO
Insertion
Timer
Fault
Discharge
PGD
VIN
GND
20 PA
21 PA
21 PA
2.5 PA
85 PA
5.5 PA
16 PA
VDS
ID
1 M:
55 mV
2 mA
1.25V
4.0V
0.3V
7.6V
2.5V
2.5V
8.4/8.3V
1.25V/
2.5V
12V
11
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8 Detailed Description
8.1 Overview
The inline protection functionality of the LM5069 is designed to control the in-rush current to the load upon
insertion of a circuit card into a live backplane or other hot power source, thereby limiting the voltage sag on the
backplane's supply voltage and the dV/dt of the voltage applied to the load. Effects on other circuits in the
system are minimized, preventing possible unintended resets. A controlled shutdown when the circuit card is
removed can also be implemented using the LM5069.
In addition to a programmable current limit, the LM5069 monitors and limits the maximum power dissipation in
the series pass device to maintain operation within the device Safe Operating Area (SOA). Either current limiting
or power limiting for an extended period of time results in the shutdown of the series pass device. In this event,
the LM5069-1 latches off while the LM5069-2 retries an infinite number of times to recover after the fault is
removed. The circuit breaker function quickly switches off the series pass device upon detection of a severe
overcurrent condition. Programmable undervoltage lockout (UVLO) and overvoltage lockout (OVLO) circuits shut
down the LM5069 when the system input voltage is outside the desired operating range.
8.2 Functional Block Diagram
12
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8.3 Feature Description
8.3.1 Current Limit
The current limit threshold is reached when the voltage across the sense resistor RS(VIN to SENSE) reaches
55 mV. In the current limiting condition, the GATE voltage is controlled to limit the current in MOSFET Q1. While
the current limit circuit is active, the fault timer is active as described in Fault Timer and Restart. If the load
current falls below the current limit threshold before the end of the fault timeout period, the LM5069 resumes
normal operation. For proper operation, the RSresistor value must be no larger than 100 mΩ.
8.3.2 Circuit Breaker
If the load current increases rapidly (for example, the load is short-circuited) the current in the sense resistor (RS)
may exceed the current limit threshold before the current limit control loop is able to respond. If the current
exceeds twice the current limit threshold (105 mV/RS), Q1 is quickly switched off by the 230-mA pulldown current
at the GATE pin, and a fault timeout period begins. When the voltage across RSfalls below 105 mV the 230-mA
pulldown current at the GATE pin is switched off, and the gate voltage of Q1 is then determined by the current
limit or the power limit functions. If the TIMER pin reaches 4 V before the current limiting or power limiting
condition ceases, Q1 is switched off by the 2-mA pulldown current at the GATE pin as described in Fault Timer
and Restart.
8.3.3 Power Limit
An important feature of the LM5069 is the MOSFET power limiting. The Power Limit function can be used to
maintain the maximum power dissipation of MOSFET Q1 within the device SOA rating. The LM5069 determines
the power dissipation in Q1 by monitoring its drain-source voltage (SENSE to OUT), and the drain current
through the sense resistor (VIN to SENSE). The product of the current and voltage is compared to the power
limit threshold programmed by the resistor at the PWR pin. If the power dissipation reaches the limiting threshold,
the GATE voltage is modulated to reduce the current in Q1. While the power limiting circuit is active, the fault
timer is active as described in Fault Timer and Restart.
8.3.4 Undervoltage Lockout (UVLO)
The series pass MOSFET (Q1) is enabled when the input supply voltage (VSYS) is within the operating range
defined by the programmable undervoltage lockout (UVLO) and overvoltage lockout (OVLO) levels. Typically the
UVLO level at VSYS is set with a resistor divider (R1-R3) as shown in Figure 30. When VSYS is below the UVLO
level, the internal 21-µA current source at UVLO is enabled, the current source at OVLO is off, and Q1 is held off
by the
2-mA pulldown current at the GATE pin. As VSYS is increased, raising the voltage at UVLO above 2.5 V, the
21-µA current source at UVLO is switched off, increasing the voltage at UVLO, providing hysteresis for this
threshold. With the UVLO pin above 2.5 V, Q1 is switched on by the 16-µA current source at the GATE pin if the
insertion time delay has expired (Figure 22). See Application and Implementation for a procedure to calculate the
values of the threshold setting resistors (R1-R3). The minimum possible UVLO level at VSYS can be set by
connecting the UVLO pin to VIN. In this case Q1 is enabled when the VIN voltage reaches the POREN threshold.
8.3.5 Overvoltage Lockout (OVLO)
The series pass MOSFET (Q1) is enabled when the input supply voltage (VSYS) is within the operating range
defined by the programmable undervoltage lockout (UVLO) and overvoltage lockout (OVLO) levels. If VSYS raises
the OVLO pin voltage above 2.5 V, Q1 is switched off by the 2-mA pulldown current at the GATE pin, denying
power to the load. When the OVLO pin is above 2.5 V, the internal 21-µA current source at OVLO is switched on,
raising the voltage at OVLO to provide threshold hysteresis. When VSYS is reduced below the OVLO level Q1 is
enabled. See Application and Implementation for a procedure to calculate the threshold setting resistor values.
8.3.6 Power Good Pin
During turnon, the Power Good pin (PGD) is high until the voltage at VIN increases above ≊5 V. PGD then
switches low, remaining low as the VIN voltage increases. When the voltage at OUT increases to within 1.25 V of
the SENSE pin (VDS <1.25 V), PGD switches high. PGD switches low if the VDS of Q1 increases above 2.5 V. A
pullup resistor is required at PGD as shown in Figure 20. The pullup voltage (VPGD) can be as high as 80 V, with
transient capability to 100 V, and can be higher or lower than the voltages at VIN and OUT.
a) Delay Rising Edge Only b) Long delay at rising edge,
short delay at falling edge
c) Short Delay at Rising Edge and
Long Delay at Falling Edge or
Equal Delays
GND
PGD
RPG1
LM5069
VPGD
Power
Good
CPG
GND
PGD
RPG1
LM5069
VPGD
Power
Good
CPG
GND
PGD
RPG1
LM5069
VPGD
Power
Good
CPG
RPG2
RPG2
Copyright © 2016, Texas Instruments Incorporated
GND
PGD
RPG
LM5069
VPGD
Power
Good
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Feature Description (continued)
Figure 20. Power Good Output
If a delay is required at PGD, suggested circuits are shown in Figure 21.InFigure 21a, capacitor CPG adds delay
to the rising edge, but not to the falling edge. In Figure 21b, the rising edge is delayed by RPG1 + RPG2 and CPG,
while the falling edge is delayed a lesser amount by RPG2 and CPG. Adding a diode across RPG2 (Figure 21c)
allows for equal delays at the two edges, or a short delay at the rising edge and a long delay at the falling edge.
Figure 21. Adding Delay to the Power Good Output Pin
8.4 Device Functional Modes
The LM5069 hot swap controller has a power up sequence which can be broken down into 3x distinct sections:
Insertion Time, In-Rush Limiting, and Normal Operation. Once the device reaches normal operation, the GATE
and TIMER behavior depends on whether a fault condition is present or not on the output.
8.4.1 Power Up Sequence
The VIN operating range of the LM5069 is 9 V to 80 V, with a transient capability to 100 V. See Functional Block
Diagram and Figure 22, as the voltage at VIN initially increases, the external N-channel MOSFET (Q1) is held off
by an internal 230-mA pulldown current at the GATE pin. The strong pulldown current at the GATE pin prevents
an inadvertent turnon as the MOSFET’s gate-to-drain (Miller) capacitance is charged. Additionally, the TIMER pin
is initially held at ground. When the VIN voltage reaches the PORIT threshold (7.6 V) the insertion time begins.
During the insertion time, the capacitor at the TIMER pin (CT) is charged by a 5.5-µA current source, and Q1 is
held off by a 2-mA pulldown current at the GATE pin regardless of the VIN voltage. The insertion time delay
allows ringing and transients at VIN to settle before Q1 can be enabled. The insertion time ends when the TIMER
pin voltage reaches 4 V. CTis then quickly discharged by an internal 1.5-mA pulldown current. After the insertion
time, the LM5069 control circuitry is enabled when VIN reaches the POREN threshold (8.4 V). The GATE pin then
switches on Q1 when VSYS exceeds the UVLO threshold (UVLO pin >2.5 V). If VSYS is above the UVLO threshold
at the end of the insertion time, Q1 switches on at that time. The GATE pin charge pump sources 16 µA to
charge Q1’s gate capacitance. The maximum gate-to-source voltage of Q1 is limited by an internal 12-V Zener
diode.
TIMER
Pin
Load
Current
Output
Voltage
(OUT Pin)
PGD
UVLO
Normal Operation
GATE
Pin
Insertion Time
PORIT
VSYS
VIN
ILIMIT
16 PA source
2.5 PA
85 PA
1.25V
t 3
t 2t 1
In- rush
Limiting
5.5 PA4V
1.5 mA
2 mA pull-down
230 mA
pull-down
14
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Device Functional Modes (continued)
As the voltage at the OUT pin increases, the LM5069 monitors the drain current and power dissipation of
MOSFET Q1. In-rush current limiting and/or power limiting circuits actively control the current delivered to the
load. During the in-rush limiting interval (t2 in Figure 22) an internal 85-µA fault timer current source charges CT.
If Q1’s power dissipation and the input current reduce below their respective limiting thresholds before the
TIMER pin reaches 4 V, the 85-µA current source is switched off, and CTis discharged by the internal 2.5-µA
current sink (t3 in Figure 22). The in-rush limiting interval is complete when the voltage at the OUT pin increases
to within 1.25 V of the input voltage (VSYS), and the PGD pin switches high.
If the TIMER pin voltage reaches 4 V before in-rush current limiting or power limiting ceases (during t2), a fault is
declared and Q1 is turned off. See Fault Timer and Restart for a complete description of the fault mode.
Figure 22. Power-Up Sequence (Current Limit Only)
8.4.2 Gate Control
A charge pump provides internal bias voltage above the output voltage (OUT pin) to enhance the N-Channel
MOSFET’s gate. The gate-to-source voltage is limited by an internal 12-V Zener diode. During normal operating
conditions (t3 in Figure 22) the gate of Q1 is held charged by an internal 16-µA current source to approximately
12 V above OUT. If the maximum VGS rating of Q1 is less than 12 V, an external Zener diode of lower voltage
must be added between the GATE and OUT pins. The external Zener diode must have a forward current rating
of at least 250 mA.
When the system voltage is initially applied, the GATE pin is held low by a 230-mA pulldown current. This helps
prevent an inadvertent turnon of the MOSFET through its drain-gate capacitance as the applied system voltage
increases.
During the insertion time (t1 in Figure 22) the GATE pin is held low by a 2-mA pulldown current. This maintains
Q1 in the off-state until the end of t1, regardless of the voltage at VIN or UVLO.
Following the insertion time, during t2 in Figure 22, the gate voltage of Q1 is modulated to keep the current or
power dissipation level from exceeding the programmed levels. While in the current or power limiting mode the
TIMER pin capacitor is charging. If the current and power limiting cease before the TIMER pin reaches 4 V the
TIMER pin capacitor then discharges, and the circuit enters normal operation.
Restart
Control
VIN
VSYS
UVLO
OVLO
GND
R1
R 2
R 3
LM5069-1
Copyright © 2016, Texas Instruments Incorporated
Charge
Pump
GATEVIN OUT
VSYS VOUT
SENSE
RS
Q 1
12V
CL
2 mA
Gate
Control
16 PA
time
Insertion
OVLO/
UVLO/
Fault /
Power Limit
Control
Current Limit /230 mA
Initial Hold - down
Circuit Breaker /
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Device Functional Modes (continued)
If the in-rush limiting condition persists such that the TIMER pin reached 4 V during t2, the GATE pin is then
pulled low by the 2-mA pulldown current. The GATE pin is then held low until either a power-up sequence is
initiated (LM5069-1), or until the end of the restart sequence (LM5069-2). See Fault Timer and Restart.
If the system input voltage falls below the UVLO threshold, or rises above the OVLO threshold, the GATE pin is
pulled low by the 2-mA pulldown current to switch off Q1.
Figure 23. Gate Control
8.4.3 Fault Timer and Restart
When the current limit or power limit threshold is reached during turnon or as a result of a fault condition, the
gate-to-source voltage of Q1 is modulated to regulate the load current and power dissipation. When either
limiting function is activated, an 85-µA fault timer current source charges the external capacitor (CT) at the
TIMER pin as shown in Figure 25 (fault timeout period). If the fault condition subsides during the fault timeout
period before the TIMER pin reaches 4 V, the LM5069 returns to the normal operating mode and CTis
discharged by the 2.5-µA current sink. If the TIMER pin reaches 4 V during the fault timeout period, Q1 is
switched off by a 2-mA pulldown current at the GATE pin. The subsequent restart procedure then depends on
which version of the LM5069 is in use.
The LM5069-1 latches the GATE pin low at the end of the fault timeout period. CTis then discharged to ground
by the 2.5-µA fault current sink. The GATE pin is held low by the 2-mA pulldown current until a power-up
sequence is externally initiated by cycling the input voltage (VSYS), or momentarily pulling the UVLO pin below
2.5 V with an open-collector or open-drain device as shown in Figure 24. The voltage at the TIMER pin must be
<0.3 V for the restart procedure to be effective.
Figure 24. Latched Fault Restart Control
The LM5069-2 provides an automatic restart sequence which consists of the TIMER pin cycling between 4 V and
1.25 V seven times after the fault timeout period, as shown in Figure 25. The period of each cycle is determined
by the 85-µA charging current, and the 2.5-µA discharge current, and the value of the capacitor CT. When the
TIMER pin reaches 0.3 V during the eighth high-to-low ramp, the 16-µA current source at the GATE pin turns on
Q1. If the fault condition is still present, the fault timeout period and the restart cycle repeat.
Shutdown
Control
VIN
VSYS
UVLO
OVLO
GND
R1
R 2
R 3
LM5069
Copyright © 2016, Texas Instruments Incorporated
ILIMIT
Load
Current
GATE
Pin
TIMER
Pin 1 2 3 7 8
2 mA
pulldown
2. 5 PA
Fault Timeout
Period
0.3V
Fault
Detection
tRESTART
1.25V
85 PA
4V
16 PA
Gate Charge
16
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Device Functional Modes (continued)
Figure 25. Restart Sequence (LM5069-2)
8.4.4 Shutdown Control
The load current can be remotely switched off by taking the UVLO pin below its 2.5-V threshold with an open
collector or open-drain device, as shown in Figure 26. Upon releasing the UVLO pin the LM5069 switches on the
load current with in-rush current and power limiting.
Figure 26. Shutdown Control
OUT
UVLO/EN
VIN
GATE
R1
OVLO
PGD
SENSE
VDD
TIMER
PWR
LM5069
VOUT
COUT
100kŸ
VIN
RPWR
GND
RSNS
R2
R3
CTIMER
CIN Z1
D1
Q1
D2
1kŸ
Cdv/dt
Only required when
using dv/dt start-up
Q2
R4
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM5069 is a hot swap controller which is used to manage inrush current and protect in case of faults. When
designing a hot swap, three key scenarios must be considered:
• Start-up
• Output of a hot swap is shorted to ground when the hot swap is on. This is often referred to as a hot-short.
• Powering up a board when the output and ground are shorted. This is usually called a start-into-short.
All of these scenarios place a lot of stress on the hot swap MOSFET and thus special care is required when
designing the hot swap circuit to keep the MOSFET within its SOA (Safe Operating Area). Detailed design
examples are provided in the following sections. Solving all of the equations by hand is cumbersome and can
result in errors. Instead, TI recommends using the LM5069 Design Calculator provided on the product page.
9.2 Typical Application
9.2.1 48-V, 10-A Hot Swap Design
This section describes the design procedure for a 48-V, 10-A hot swap design.
Figure 27. Typical Application Schematic
9.2.1.1 Design Requirements
Table 1 summarizes the design parameters that must be known before designing a hot swap circuit. When
charging the output capacitor through the hot swap MOSFET, the FET’s total energy dissipation equals the total
energy stored in the output capacitor (½CV2). Thus, both the input voltage and output capacitance determine the
stress experienced by the MOSFET. The maximum load current drives the current limit and sense resistor
selection. In addition, the maximum load current, maximum ambient temperature, and the thermal properties of
CL,MIN
SNS
LIM
V48.5mV
R 0.00485
I 10 A
:
VIN
GND
PGD
OUT
Q1
GND
LM5069
VSYS
CLRL
RS
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Typical Application (continued)
the PCB (RθCA) drive the selection of the MOSFET RDSON and the number of MOSFETs used. RθCA is a strong
function of the layout and the amount of copper that is connected to the drain of the MOSFET. Note that the
drain is not electrically connected to the ground plane and thus the ground plane cannot be used to help with
heat dissipation. For this design example RθCA = 30°C/W is used, which is similar to the LM5069 EVM. It’s a
good practice to measure the RθCA of a given design after the physical PCBs are available.
Finally, it’s important to understand what test conditions the hot swap must pass. In general, a hot swap is
designed to pass both a Hot-Short and a Start into a Short. Also, TI recommends keeping the load OFF until the
hot swap is fully powered up. Starting the load early causes unnecessary stress on the MOSFET and could lead
to MOSFET failures or a failure to start-up.
Figure 28. No Load Current During Turnon
Table 1. Design Parameters
PARAMETER VALUE
Input voltage range 18 to 30 V
Maximum load current 10 A
Lower UVLO threshold 17 V
Upper UVLO threshold 18 V
Lower OVLO threshold 30 V
Upper OVLO threshold 31 V
Maximum output capacitance of the hot swap 330 µF
Maximum ambient temperature 55°C
MOSFET RθCA (function of layout) 30°C/W
Pass Hot-short on output? Yes
Pass a Start into short? Yes
Is the load off until PG asserted? Yes
Can a hot board be plugged back in? No
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Select RSNS and CL setting
The LM5069 monitors the current in the external MOSFET (Q1) by measuring the voltage across the sense
resistor (RS), connected from VIN to SENSE. When the voltage difference across the VIN and SENSE pins
(VCL) is greater than 55 mV (typical), the LM5069 begins modulating the MOSFET gate. Size RSNS for maximum
or minimum VCL for applications that require ensured shutoff or ensured conduction. RSNS is sized to exhibit
minimum VCL across RSNS at maximum load current in Equation 1.
(1)
2
C,MAX A,MAX CA DSON,MAX J
LOAD,MAX
T T R I R T
T
u u
SNS 1
SNS,EFF
1 2
R R
RR R
u
1 SNS,CLC
2 SNS SNS,CLC
R R 4.8 m 24
R R R 5m 4.8 m
:
: :
RSNS
R1
R2
VIN SENSE
19
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Typically sense resistors are only available in discrete value. We choose the next smallest discrete value, 4 mΩ.
If a precise current limit is desired, a sense resistor along with a resistor divider can be used as shown in
Figure 29.
Figure 29. SENSE Resistor Divider
If using a resistor divider, then the next larger available sense resistor must be chosen (5 mΩin this example).
The ratio of R1 and R2 can then be calculated with Equation 2.
(2)
Note that the SENSE pin pulls 23 µA of current, which creates an offset across R2. TI recommends keeping R2
below 10 Ωto reduce the offset that this introduces. In addition, the 1% resistors add to the current monitoring
error. Finally, if the resistor divider approach is used, compute the effective sense resistance (RSNS, EFF) using
Equation 3 and use that in all equations instead of RSNS.
(3)
Note that for many applications, a precise current limit may not be required. In that case, it’s simpler to pick the
next smaller available sense resistor.
9.2.1.2.2 Selecting the Hot Swap FET(s)
It is critical to select the correct MOSFET for a hot swap design. The device must meet the following
requirements:
• The VDS rating must be sufficient to handle the maximum system voltage along with any ringing caused by
transients.
• The SOA of the FET must be sufficient to handle all usage cases: start-up, hot-short, start into short.
• RDSON must be sufficiently low to maintain the junction and case temperature below the maximum rating of
the FET. In fact, TI recommends keeping the steady state FET temperature below 125°C to allow margin to
handle transients.
• Maximum continuous current rating must be above the maximum load current and the pulsed drain current
must be greater than the current threshold of the circuit breaker. Most MOSFETs that pass the first three
requirements also pass these two.
For this design the SUM40N15-38 was selected. After selecting the MOSFET, the maximum steady state case
temperature can be computed as Equation 4.
(4)
OUT IN,MAX
start,max
LIM
C V
tI
u
5
PWR
30 V
R 1.30 10 4m 37.5 W 1.18mV 14.9k
4m
§ ·
u u : u :
¨ ¸
:
© ¹
DS
5
S
PWR SNS LIM
NS
V
R 1.30 10 R (P 1.18mV )
R
u u u
SNS,MIN IN,MAX
LIM,MIN
SNS
V V 5mV 30 V
P 37.5 W
R 4m
uu
:
LIM SNS
SNS
DS
P R
V
V
u
2
LOAD,MAX
C,MAX A,MAX CA DSON J
I
T T R R T
# of MOSFETs
T
§ ·
¨ ¸
u u
¨ ¸
© ¹
2
C,MAX
C
T 55 C 30 10 A 1.2 2.4m 63.64 C
W
q q u u u : q
20
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Note that the RDSON is a strong function of junction temperature, which for most MOSFETs is close to the case
temperature. A few iterations of the above equations may be necessary to converge on the final RDSON and
TC,MAX value. According to the CSD19536KTT datasheet, its RDSON is approximately 1.2× at 65°C. Equation 5
uses this RDSON value to compute the TC,MAX.
(5)
This maximum steady state case temperature does not indicate that a second MOSFET may be required to
reduce and distribute power dissipation during normal operation.
As an aside, when using parallel MOSFETs, the maximum steady state case temperature can be computed in
Equation 6.
(6)
Iterate until the computed TC,MAX is using two parallel MOSFETs is less than to the junction temperature
assumed for RDSON. Then, no further iterations are necessary.
9.2.1.2.3 Select Power Limit
In general, a lower-power limit setting is preferred to reduce the stress on the MOSFET. However, when the
LM5069 is set to a very low power limit setting, it has to regulate the FET current and hence the voltage across
the sense resistor (VSNS) to a very low value. VSNS can be computed as shown in Equation 7.
(7)
To avoid significant degradation of the power limiting accuracy, a VSNS of less than 5 mV is not recommended.
Based on this requirement the minimum allowed power limit can be computed in Equation 8.
(8)
To avoid significant degradation of the power limiting accuracy a VSNS of less than 5 mV is not recommended.
Based on this requirement, the minimum allowed power limit can be computed with Equation 9.
(9)
Note that the minimum RPWR would occur when VDS = VIN,MAX. We can then compute the minimum RPWR with
Equation 10.
(10)
To obtain the smallest accurate power limit, the next largest available resistor must be selected. In this case a
15.8-kΩresistor was chosen, which sets a 39.23-W power limit.
9.2.1.2.4 Set Fault Timer
The fault timer runs when the hot swap is in power limit or current limit, which is the case during start-up. Thus
the timer has to be sized large enough to prevent a time-out during start-up. If the part starts directly into current
limit (ILIM × VDS < PLIM) the maximum start time can be computed with Equation 11.
(11)
175 C 63.6 C
10.17 A 7.55 A
175 C 25 C
q q
u
q q
J,ABSMAX C,MAX
SOA C,MAX SOA
J,ABSMAX
T T
I 7.06 ms, T I 7.06 ms,25 C T 25 C
q u q
0.346 0.346
SOA
I 7.06 ms 20 A 1 ms 7.06 ms 10.17 A
u u
0.346
SOA 1
m 0.346
1
I t 20 A
a 20 A 1 ms
t1ms
u
SOA 1
SOA 2
1
2
I t 20 A
ln ln
I t 9 A
m 0.346
1ms
tln
ln 10ms
t
§ ·
¨ ¸
© ¹
§ · § ·
¨ ¸ ¨ ¸
¨ ¸ © ¹
© ¹
m
SOA
I t a t u
TIMER timer,typ
flt
timer,typ
C v 150nF 4 V
t 7.06 ms
i 85 A
uu
P
flt timer(typ)
TIMER
timer(typ)
t ×i 3.85ms×85μA
C = ×1.5= ×1.5=123nF
v 4V
22
OUT IN,MAX LIM
start 2 2
LIM LIM
V
C P 330 F (30 V) 39.23 W
t 3.85ms
2 P 2 39.23 W (10 A)
I
ª º ª º
P
« »
u u
« »
« » « »
¬ ¼
¬ ¼
21
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For most designs (including this example), ILIM × VDS > PLIM, so the hot swap starts in power limit and transition
into current limit. In that case, the estimated start time can be computed with Equation 12.
(12)
Note that the above start-time assumes constant, typical current limit and power limit values. The actual startup
time is slightly longer, as the power limit is a function of Vds and decreases as the output voltage increases. To
ensure that the timer never times out during start-up, TI recommends setting the minimum fault time (tflt) to be
greater than the start time (tstart) by adding an additional margin of 50% of the fault time. This accounts for the
variation in power limit, timer current, and timer capacitance. Thus CTIMER can be computed with Equation 13.
(13)
The next largest available CTIMER is chosen as 150 nf. Once the CTIMER is chosen the actual programmed fault
time can be computed with Equation 14.
(14)
This is the typical time that the LM5069 shuts off the CSD19536KTT MOSFET.
9.2.1.2.5 Check MOSFET SOA
Once the power limit and fault timer are chosen, it’s critical to check that the FET stays within its SOA during all
test conditions. During a Hot-Short, the circuit breaker trips and the LM5069 restarts into power limit until the
timer runs out. In the worst case, the MOSFET’s VDS equals VIN,MAX, IDS equals PLIM / VIN,MAX and the stress
event lasts for tflt. For this design example, the MOSFET has 30 V, 1.25 A across it for 7.06 ms.
Based on the SOA of the CSD19536KTT, it can handle 30 V, 9 A for 10 ms and it can handle 30 V, 20 A for
1 ms. The SOA for 7.06 ms can be extrapolated by approximating SOA versus time as a power function as
shown Equation 15 through Equation 18.
(15)
(16)
(17)
(18)
Note that the SOA of a MOSFET is specified at a case temperature of 25°C, while the case temperature can be
much hotter during a hot-short. The SOA must be derated based on TC,MAX using Equation 19.
(19)
(20)
R3 = 2.5V x 190.5 k: x 32V
60V x (32V - 2.5V) = 8.61 k:
R1 = 36V ± 32V
21 PA=4V
21 PA= 190.5 k:
VOVL = [(R1 + R2) x ((2.5V) - 21 PA)] + 2.5V
R3
R2 = 2.5V x R1
VUVL - 2.5V - R3
R3 = 2.5V x R1 x VUVL
VOVH x (VUVL - 2.5V)
R1 = VUVH - VUVL
21 PA=VUV(HYS)
21 PA
VIN
UVLO
OVLO
GND
R1
R2
R3
TIMER AND GATE
LOGIC CONTROL
LM5069
21 PA
21 PA
2. 50V
2. 50V
VSYS
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Based on this calculation the MOSFET can handle 7.55 A, 30 V for 7.06 ms at elevated case temperature, and is
required to handle 1.25 A during a hot-short. This means the MOSFET is not at risk of getting damaged during a
hot-short. In general, TI recommends for the MOSFET to be able to handle a minimum of 1.3× more power than
what is required during a hot-short to provide margin to cover the variance of the power limit and fault time.
9.2.1.2.6 Set Undervoltage and Overvoltage Threshold
By programming the UVLO and OVLO thresholds the LM5069 enables the series pass device (Q1) when the
input supply voltage (VSYS) is within the desired operational range. If VSYS is below the UVLO threshold, or above
the OVLO threshold, Q1 is switched off, denying power to the load. Hysteresis is provided for each threshold.
9.2.1.2.6.1 Option A
The configuration shown in Figure 30 requires three resistors (R1-R3) to set the thresholds.
Figure 30. UVLO and OVLO Thresholds Set By R1-R3
The procedure to calculate the resistor values is as follows:
1. Choose the upper UVLO threshold (VUVH), and the lower UVLO threshold (VUVL).
2. Choose the upper OVLO threshold (VOVH).
3. The lower OVLO threshold (VOVL) cannot be chosen in advance in this case, but is determined after the
values for R1-R3 are determined. If VOVL must be accurately defined in addition to the other three thresholds,
see Option B below.
The resistors are calculated with Equation 21,Equation 22, and Equation 23.
(21)
(22)
(23)
The lower OVLO threshold is calculated from Equation 24.
(24)
As an example, assume the application requires the following thresholds: VUVH = 36 V, VUVL = 32 V, VOVH = 60 V.
(25)
(26)
R4 = (VOVH - 2.5V)
2.5V x R3
R3 = VOVH - VOVL
21 PA=VOV(HYS)
21 PA
R2 = (VUVL - 2.5V)
2.5V x R1
R1 = VUVH - VUVL
21 PA=VUV(HYS)
21 PA
VIN
UVLO
OVLO
GND
R3 R2
R1
TIMER AND GATE
LOGIC CONTROL
LM5069
21 PA
21 PA
2.5V
2.5V
VSYS
R4
Copyright © 2016, Texas Instruments Incorporated
VOVL = [(R1 + R2) x (2.5V) - 21 PA)] + 2.5V
R3
VOVH = 2.5V x (R1 + R2 + R3)
R3
VUVL = 2.5V x (R1 + R2 + R3)
R2 + R3
VUVH = 2.5V + [R1 x (21 PA + (R2 + R3)
2.5V )]
R2 = 2.5V x 190.5 k:
(32V - 2.5V) - 8.61 k: = 7.53 k:
23
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(27)
The lower OVLO threshold calculates to 55.8 V, and the OVLO hysteresis is 4.2 V. Note that the OVLO
hysteresis is always slightly greater than the UVLO hysteresis in this configuration. When the R1-R3 resistor
values are known, the threshold voltages and hysteresis are calculated from Equation 28 through Equation 33.
(28)
(29)
VUV(HYS) = R1 × 21 µA (30)
(31)
(32)
VOV(HYS) = (R1 + R2) × 21 µA (33)
9.2.1.2.6.2 Option B
If all four thresholds must be accurately defined, the configuration in Figure 31 can be used.
Figure 31. Programming the Four Thresholds
The four resistor values are calculated as follows:
1. Choose the upper UVLO threshold (VUVH) and lower UVLO threshold (VUVL) with Equation 34 and
Equation 35.
(34)
(35)
2. Choose the upper OVLO threshold (VOVH) and lower OVLO threshold (VOVL) with Equation 36 and
Equation 37.
(36)
(37)
As an example, assume the application requires the following thresholds: VUVH = 22 V, VUVL = 17 V, VOVH = 60 V,
and VOVL = 58 V. Therefore VUV(HYS) = 5 V, and VOV(HYS) = 2 V. The resistor values are:
• R1 = 238 kΩ,R2=41kΩ
• R3 = 95.2 kΩ, R4 = 4.14 kΩ
OVH
2.5 V R3 2.5 V 47.62k
R4 4.18k
31 V 2.5 V
V 2.5 V
u u
OVH OVL
V V 31 V 30 V
R3 47.62k
21µA 21µA
UVL
2.5 V R1 2.5 V 47.62k
R2 8.21k
17 V 2.5 V
V 2.5 V
u u
UVH UVL
V V 18 V 17 V
R1 47.62k
21µA 21µA
VIN
UVLO
OVLO
GND
TIMER AND GATE
LOGIC CONTROL
LM5069
21 PA
21 PA
2.5V
2.5V
VSYS
100k
R3
R4
Control
Restart
Shutdown/
Copyright © 2016, Texas Instruments Incorporated
VOVL = 2.5V + [R3 x (2.5V - 21 PA)]
R4
VOVH = 2.5V x (R3 + R4)
R4
VUVL = 2.5V x (R1 + R2)
R2
VUVH = 2.5V + [R1 x (2.5V + 21 PA)]
R2
24
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Where the R1-R4 resistor values are known, the threshold voltages and hysteresis are calculated from
Equation 38 to Equation 43.
(38)
(39)
VUV(HYS) = R1 x 21 µA (40)
(41)
(42)
VOV(HYS) = R3 x 21 µA (43)
9.2.1.2.6.3 Option C
The minimum UVLO level is obtained by connecting the UVLO pin to VIN as shown in Figure 32. Q1 is switched
on when the VIN voltage reaches the POREN threshold (≊8.4 V). An external transistor can be connected to
UVLO to provide remote shutdown control, and to restart the LM5069-1 after a fault detection. The OVLO
thresholds are set using R3, R4. Their values are calculated using the procedure in Option B.
Figure 32. UVLO = POREN With Shutdown/Restart Control
9.2.1.2.6.4 Option D
The OVLO function can be disabled by grounding the OVLO pin. The UVLO thresholds are set as described in
Option B or Option C.
For this design example, option B is used and the following values are targeted: VUVH = 10 V, VUVL = 9 V,
VOVH = 15 V, VOVL = 14 V. R1, R2, R3, and R4 are computed using Equation 44 through Equation 47.
(44)
(45)
(46)
(47)
Nearest available 1% resistors must be chosen. Set R1 = 47.5 kΩ, R2 = 8.25 kΩ, R3 = 47.5 kΩ, and
R4 = 4.22 kΩ.
25
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9.2.1.2.7 Input and Output Protection
Proper operation of the LM5069 hot swap circuit requires a voltage clamping element present on the supply side
of the connector into which the hot swap circuit is plugged in. A TVS is ideal, as depicted in Figure 27. The TVS
is necessary to absorb the voltage transient generated whenever the hot swap circuit shuts off the load current.
This effect is the most severe during a hot-short when a large current is suddenly interrupted when the FET
shuts off. The TVS must be chosen to have minimal leakage current at VIN,MAX and to clamp the voltage to under
30 V during hot-short events. For many high-power applications intended to clamp at 30 V, SMBJ30A-13-F is a
good choice.
9.2.1.2.8 Final Schematic and Component Values
Figure 27 shows the schematic used to implement the requirements described in the previous section. In
addition, Table 2 below provides the final component values that were used to meet the design requirements for
a 12-V, 40-A hot swap design. The Application Curves are based on these component values.
Table 2. Component Values
COMPONENT VALUE
Rsns 4 mΩ
R1 47.5 kΩ
R2 8.25 kΩ
R3 47.5 kΩ
R4 4.22 kΩ
RPWR 15.8 kΩ
Q1 CSD19536KTT
Z1 SMBJ30A-13-F
D1 MBR3100
CTIMER 150 nF
COUT 330 µF
9.2.1.3 Application Curves
Figure 33. Start-Up Figure 34. Start-Up (Zoomed In)
26
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Figure 35. Start-Up into Short Circuit Figure 36. Undervoltage
Figure 37. Overvoltage Figure 38. Gradual Overcurrent
Figure 39. Load Step Figure 40. Hot-Short on Output
27
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Figure 41. Hot-Short (Zoomed In) Figure 42. Auto-Retry
10 Power Supply Recommendations
In general, the LM5069 behavior is more reliable if it is supplied from a very regulated power supply. However,
high-frequency transients on a backplane are not uncommon due to adjacent card insertions or faults. If this is
expected in the end system, TI recommends placing a 1-µF ceramic capacitor to ground close to the drain of the
hot swap MOSFET. This reduces the common mode voltage seen by VIN and SENSE. Additional filtering may
be necessary to avoid nuisance trips.
VIN
Sense
Trace
Inductance
28
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11 Layout
11.1 Layout Guidelines
11.1.1 PC Board Guidelines
The following guidelines must be followed when designing the PC board for the LM5069:
• Place the LM5069 close to the board’s input connector to minimize trace inductance from the connector to the
FET.
• Note that special care must be taken when placing the bypass capacitor for the VIN pin. During hot shorts,
there is a very large dV/dt on input voltage after the MOSFET turns off. If the bypass capacitor is placed right
next to the pin and the trace from Rsns to the pin is long, an LC filter is formed. As a result, a large differential
voltage can develop between VIN and SENSE. To avoid this, place the bypass capacitor close to Rsns
instead of the VIN pin.
Figure 43. Layout Trace Inductance
• The sense resistor (RS) must be close to the LM5069, and connected to it using the Kelvin techniques shown
in Figure 46.
• The high current path from the board’s input to the load (via Q1), and the return path, must be parallel and
close to each other to minimize loop inductance.
• The ground connection for the various components around the LM5069 must be connected directly to each
other, and to the LM5069’s GND pin, and then connected to the system ground at one point. Do not connect
the various component grounds to each other through the high current ground line.
• Provide adequate heat sinking for the series pass device (Q1) to help reduce stresses during turnon and
turnoff.
• The board’s edge connector can be designed to shut off the LM5069 as the board is removed, before the
supply voltage is disconnected from the LM5069. In Figure 45 the voltage at the UVLO pin goes to ground
before VSYS is removed from the LM5069 due to the shorter edge connector pin. When the board is inserted
into the edge connector, the system voltage is applied to the LM5069’s VIN pin before the UVLO voltage is
taken high.
11.1.2 System Considerations
A) Continued proper operation of the LM5069 hot swap circuit requires capacitance be present on the supply
side of the connector into which the hot swap circuit is plugged in, as depicted in Figure 44. The capacitor in the
Live Backplane section is necessary to absorb the transient generated whenever the hot swap circuit shuts off
the load current. If the capacitance is not present, inductance in the supply lines generate a voltage transient at
shut-off which can exceed the absolute maximum rating of the LM5069, resulting in its destruction.
B) If the load powered via the LM5069 hot swap circuit has inductive characteristics, a diode is required across
the LM5069’s output. The diode provides a recirculating path for the load’s current when the LM5069 shuts off
that current. Adding the diode prevents possible damage to the LM5069 as the OUT pin is taken below ground
by the inductive load at shutoff. See Figure 44.
Q1
SENSE
VIN
UVLO
OVLO
GND
GATE
OUT
PGD
PWR
TIMER
R1
R2
R3
To
Load
LM5069
RS
CARD EDGE
CONNECTOR
PLUG-IN CARD
VSYS
GND
Copyright © 2016, Texas Instruments Incorporated
LM5069
VIN
GND
GND
LIVE
BACKPLANE
OUT
Q1
PLUG-IN BOARD
RS
VSYS VOUT
+48V
CL
Inductive
Load
Copyright © 2016, Texas Instruments Incorporated
29
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Layout Guidelines (continued)
Figure 44. Output Diode Required for Inductive Loads
11.2 Layout Example
Figure 45. Recommended Board Connector Design
Hot Swap
R R
C
C C
Rsns
Output Caps
Source
R
R
IC GND
High Current GND
SENSE
RESISTOR
RS
FROM
SYSTEM
INPUT
VOLTAGE
TO MOSFET' S
DRAIN
HIGH CURRENT PATH
VIN
3
4
5
SENSE
9
8
7
6
LM5069
10
Copyright © 2016, Texas Instruments Incorporated
30
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Layout Example (continued)
Figure 46. Sense Resistor Connections
Figure 47. LM5069 Quiet IC Ground Layout
31
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
For the LM5069 Design Calculator, go to Tools & Software in the Product Folder on ti.com.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
•Absolute Maximum Ratings for Soldering (SNOA549)
•Robust Hot Swap Design (SLVA673)
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM5069MM-1/NOPB ACTIVE VSSOP DGS 10 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SNAB
LM5069MM-2 NRND VSSOP DGS 10 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 SNBB
LM5069MM-2/NOPB ACTIVE VSSOP DGS 10 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SNBB
LM5069MMX-1/NOPB ACTIVE VSSOP DGS 10 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SNAB
LM5069MMX-2/NOPB ACTIVE VSSOP DGS 10 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SNBB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM5069MM-1/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5069MM-2 VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5069MM-2/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5069MMX-1/NOPB VSSOP DGS 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5069MMX-2/NOPB VSSOP DGS 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Nov-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5069MM-1/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0
LM5069MM-2 VSSOP DGS 10 1000 210.0 185.0 35.0
LM5069MM-2/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0
LM5069MMX-1/NOPB VSSOP DGS 10 3500 367.0 367.0 35.0
LM5069MMX-2/NOPB VSSOP DGS 10 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Nov-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
5.05
4.75
1.1 MAX
8X 0.5
10X 0.27
0.17
2X
2
0.15
0.05
TYP
0.23
0.13
0 - 8
0.25
GAGE PLANE
0.7
0.4
A
NOTE 3
3.1
2.9
B
NOTE 4
3.1
2.9
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA.
110
0.1 C A B
6
5
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 3.200
www.ti.com
EXAMPLE BOARD LAYOUT
(4.4)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
10X (1.45)
10X (0.3)
8X (0.5)
(R )
TYP
0.05
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:10X
1
56
10
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(4.4)
8X (0.5)
10X (0.3)
10X (1.45)
(R ) TYP0.05
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
56
10
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
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