2018 Microchip Technology Inc. DS20005897B-page 1
MIC29302A
Features
• High-Current Capability
• Operating Input Voltage Range: 3V to 16V
• Low Dropout Voltage
• Low Ground Current
• Accurate 1% Tolerance
• Fast Transient Response
• 1.24V to 15V Adjustable Output Voltage
• Packages: TO-263-5L and TO-252-5L
Applications
• Processor Peripheral and I/O Supplies
• High-Efficiency Green Computer Systems
• Automotive Electronics
• High-Efficiency Linear Lower Supplies
• Battery-Powered Equipment
• PC Add-In Cards
• High-Efficiency Post-Regulator for Switching
Supply
General Description
The MIC29302A is a high-current, low-dropout voltage
regulator that uses Microchip's proprietary Super βeta
PNP process with a PNP pass element. The 3A LDO
regulator features 560 mV (full load) dropout voltage
and very low ground current. Designed for high-current
loads, these devices also find applications in lower
current, low-dropout critical systems, where their
dropout voltages and ground current values are
important attributes.
Along with a total accuracy of ±2% (over temperature,
line, and load regulation) the regulator features very
fast transient recovery from input voltage surges and
output load current changes.
The MIC29302A has an adjustable output that can be
set by two external resistors to a voltage between
1.24V and 15V. In addition, the device is fully protected
against overcurrent faults, reversed input polarity,
reversed lead insertion, and overtemperature
operation. A TTL/CMOS logic enable (EN) pin is
available in the MIC29302A to shutdown the regulator.
When not used, the device can be set to continuous
operation by connecting EN to the input (IN). The
MIC29302A is available in the standard and 5-pin
TO-263 and TO-252 packages with an operating
junction temperature range of –40°C to +125°C.
Package Types
MIC29302AWU
5-Lead TO-263 (U)
(D2Pak) Adjustable Voltage
MIC29302AWD
5-Lead TO-252 (D)
(D-Pak) Adjustable Voltage
TAB
4
1
5
2
3
OUT
EN
ADJ
IN
GND
TAB
5 ADJ
4 OUT
3 GND
2IN
1EN
3A Fast Response LDO Regulator
MIC29302A
DS20005897B-page 2 2018 Microchip Technology Inc.
Typical Ap plication Circuit
Functional Block Diagram
MIC29302A
TO-263 or TO-252
3.3V
IN
C
IN
R1

R2

2.5V
OUT
C
L
OUTIN
EN ADJ
GND
EN
IN
ADJ
OUT
BIAS
GND
MIC29302A
THERMAL
SHUTDOWN
REFERENCE
ON/OFF
FEEDBACK
O.V.
LIMIT
16V
2018 Microchip Technology Inc. DS20005897B-page 3
MIC29302A
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Supply Voltage (VIN) .......................................................................................................................... –20V to +20V
Enable Input Voltage (VEN) ............................................................................................................................–0.3V to VIN
Power Dissipation .................................................................................................................................. Internally Limited
ESD Rating (All Pins)..............................................................................................................................................Note 1
Operating Ratings ‡
Operating Input Voltage ................................................................................................................................ +3V to +16V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions recommended.
TABLE 1-1: ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = 4.184V; IOUT = 100 mA; TA = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
Output Voltage
Output Voltage Accuracy ∆VOUT –2 —2%100 mA ≤ IOUT ≤ 3A, (VOUT + 1V) ≤
VIN ≤ 16V
Line Regulation ∆VOUT/
∆VIN
—0.10.5 %
IOUT = 100 mA, (VOUT + 1V) ≤ VIN ≤
16V
Load Regulation ∆VOUT/
∆IOUT
—0.2 1 %
VIN = VOUT + 1V, 100 mA ≤ IOUT ≤
3A
Dropout Voltage (Note 2)V
DO
—100200
mV
IOUT = 100 mA, VIN ≥ 3.184V
—300— I
OUT = 1.5A, VIN ≥ 3.184V
—500— I
OUT = 2.75A, VIN ≥ 3.184V
—560800 IOUT = 3A, VIN ≥ 3.4V
Ground Current
Ground Current IGND
—520
mA
IOUT = 750 mA, VIN = VOUT + 1V
—15— I
OUT = 1.5A
—60150 IOUT = 3A
Ground Pin Current at
Dropout IGNDDO —2—mA
VIN = 0.5V less than specified
VOUT; IOUT = 10 mA
Current Limit ILIMIT 34— AV
OUT = 0V, Note 3
Output Noise Voltage
(10Hz to 100kHz) eN
—400—
µVRMS
CL = 10 µF
—260— C
L = 33 µF
Ground Pin Current in
Shutdown ISHDN — 32 — µA Input Voltage VIN = 16V
Reference
Reference Voltage VREF 1.215 —1.267 VNote 4
Adjust Pin Bias Current IADJ
—40— nA —
——120
MIC29302A
DS20005897B-page 4 2018 Microchip Technology Inc.
ENABLE Input
Input Logic Voltage VENABLE
——0.8 VLow (OFF)
2.4 — — High (ON)
Enable Pin Input Current IENABLE
—1530
µA
VEN = 4.2V
——75
—— 2 VEN = 0.8V
—— 4
Regulator Output Current in
Shutdown IOUT-SHDN
—10— µA Note 5
——20
Note 1: Specification for packaged product only
2: Dropout voltage is defined as the input-to-output differential when output voltage drops to 99% of its nor-
mal value with VOUT + 1V applied to VIN.
3: VIN = VOUT (nominal) + 1V. For example, use VIN = 4.3V for a 3.3V regulator or use 6V for a 5V regulator.
Employ pulse testing procedure for current-limit.
4: VREF ≤ VOUT ≤ VIN – 1, 3V ≤ VOUT ≤ 16V, 10 mA ≤ IL ≤ IFL, TJ ≤ TJ(MAX).
5: VEN ≤ 0.8V, VIN ≤ 16V and VOUT = 0V.
TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = 4.184V; IOUT = 100 mA; TA = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
2018 Microchip Technology Inc. DS20005897B-page 5
MIC29302A
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Junction Operating Temperature
Range
TJ–40 — +125 °C —
Storage Temperature Range TS–65 — +150 °C —
Package Thermal Resistances
Thermal Resistance TO-263 JC —3 —°C/W—
Thermal Resistance TO-252 JC —3 —°C/W—
Thermal Resistance TO-263 JA —28 —°C/W—
Thermal Resistance TO-252 JA —35 —°C/W—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
MIC29302A
DS20005897B-page 6 2018 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Dropout Voltage vs. Input
Voltage.
FIGURE 2-2: GND Pin Current vs. Input
Voltage.
FIGURE 2-3: Adjust Pin Voltage vs. Input
Voltage.
FIGURE 2-4: Adjust Pin Current vs. Input
Voltage.
FIGURE 2-5: Load Regulation vs. Input
Voltage.
FIGURE 2-6: Short-Circuit Current vs.
Input Voltage.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2018 Microchip Technology Inc. DS20005897B-page 7
MIC29302A
FIGURE 2-7: Enable Pin Current vs. Inpu t
Voltage.
FIGURE 2-8: Output Voltage vs. Input
Voltage.
FIGURE 2-9: GND Pin Current vs.
Temperature.
FIGURE 2-10: Enable Bias Current vs.
Temperature.
FIGURE 2-11: Dropout Voltage vs.
Temperature.
FIGURE 2-12: Dropout Voltage vs.
Temperature.
MIC29302A
DS20005897B-page 8 2018 Microchip Technology Inc.
FIGURE 2-13: Short-Circuit Current vs.
Temperature.
FIGURE 2-14: Adjust Pin Voltage vs.
Temperature.
FIGURE 2-15: Adjust Pin Current vs.
Temperature.
FIGURE 2-16: Line Regulation vs.
Temperature.
FIGURE 2-17: Dropout Voltage vs. Output
Current.
FIGURE 2-18: Dropout Voltage vs. Output
Current.
2018 Microchip Technology Inc. DS20005897B-page 9
MIC29302A
FIGURE 2-19: Adjust Pin Voltage vs.
Output Current.
FIGURE 2-20: Line Regulation vs. Output
Current.
FIGURE 2-21: GND Pin Current vs. Output
Current.
FIGURE 2-22: Output Noise vs. Frequency.
FIGURE 2-23: Ripple Rejection (IOUT =
10 mA) vs. Frequency.
FIGURE 2-24: Ripple Rejection (IOUT =
1.5A) vs. Frequency.
MIC29302A
DS20005897B-page 10 2018 Microchip Technology Inc.
FIGURE 2-25: Ripple Rejection (IOUT = 3A)
vs. Frequency.
FIGURE 2-26: Line Transient Response
with 3A Load, 1000 µF Output Capacitance.
FIGURE 2-27: MIC29302A Load Transient
Response Test Circuit.
FIGURE 2-28: Line Transient Response
with 3A Load, 10 µF Output Capacitance.
FIGURE 2-29: Load Transient Response
with 3A Load, 1000 µF Output Capacitance.
Time (1.00ms/div)
5V
6mV
11mV
15V
IOUT = 3A
COUT = 1000μF
VOUT
VIN
3.3VIN
CIN
R1

R2

2.5VOUT
CL
OUTIN
EN ADJ
GND
Time (1.00ms/div)
200mA
32mV
3mV
3A
IOUT = 3A
COUT = 1000μF
VOUT
IOUT
2018 Microchip Technology Inc. DS20005897B-page 11
MIC29302A
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number
TO-263 Pin Number
TO-252 Pin Name Description
1 1 EN Enable (Input): Active-high TTL/CMOS-compatible control input. Do
not float.
2 2 IN INPUT: Unregulated input, +3V to +16V maximum.
3, TAB 3, TAB GND GND: TAB is also connected internally to the IC’s ground on both
packages.
4 4 OUT OUTPUT: The regulator output voltage.
5 5 ADJ Feedback Voltage: 1.24V feedback from external resistor divider.
MIC29302A
DS20005897B-page 12 2018 Microchip Technology Inc.
4.0 APPLICATION INFORMATION
The MIC29302A is a high-performance, low-dropout
voltage regulator suitable for all moderate to
high-current voltage regulation applications. Its 560 mV
typical dropout voltage at full load makes it especially
valuable in battery-powered systems and as high
efficiency noise filters in post-regulator applications.
Unlike older NPN-pass transistor designs, where the
minimum dropout voltage is limited by the base-emitter
voltage drop and collector-emitter saturation voltage,
dropout performance of the PNP output is limited
merely by the low VCE saturation voltage.
A trade-off for the low dropout voltage is a varying base
driver requirement. But the Super ßeta PNP process
reduces this drive requirement to merely 1% of the load
current.
The MIC29302A regulator is fully protected from
damage due to fault conditions. Current limiting is
linear; output current under overload conditions is
constant. Thermal shutdown disables the device when
the die temperature exceeds the +125°C maximum
safe operating temperature. The output structure of the
regulators allows voltages in excess of the desired
output voltage to be applied without reverse current
flow. The MIC29302A offers a logic-level ON/OFF
control. When disabled, the device draws 32 µA at
maximum 16V input.
4.1 Capacitor Requirements
For stability and minimum output noise, a capacitor on
the regulator output is necessary. The value of this
capacitor is dependent upon the output current; lower
currents allow smaller capacitors. The MIC29302A is
stable with a 10 μF capacitor at full load.
This capacitor need not be an expensive low-ESR type;
aluminum electrolytics are adequate. In fact, extremely
low-ESR capacitors may contribute to instability.
Tantalum capacitors are recommended for systems
where fast load transient response is important.
When the regulator is powered from a source with high
AC impedance, a 0.1 µF capacitor connected between
input and GND is recommended.
FIGURE 4-1: Linear Regulators Requir e
Only Two Capacitors for Operation.
4.2 Transient Response and 5V to
3.3V Conversion
The MIC29302A has excellent response to variations in
input voltage and load current. By virtue of its low
dropout voltage, the device does not saturate into
dropout as readily as similar NPN-based designs. A
3.3V output Microchip LDO will maintain full speed and
performance with an input supply as low as 4.2V, and
will still provide some regulation with supplies down to
3.8V, unlike NPN devices that require 5.1V or more for
good performance and become nothing more than a
resistor under 4.6V of input. Microchip’s PNP
regulators provide superior performance in “5V to 3.3V”
conversion applications than NPN regulators,
especially when all tolerances are considered.
4.3 Minimum Load Current
The MIC29302A regulator operates within a specified
load range. If the output current is too small, leakage
currents dominate and the output voltage rises.
A minimum load current of 10 mA is necessary for
proper regulation and to swamp any expected leakage
current across the operating temperature range.
For best performance the total resistance (R1+R2)
should be small enough to pass the minimum regulator
load current of 10 mA.
4.4 Adjustable Regulator Design
The output voltage can be programmed anywhere
between 1.25V and the 15V. Two resistors are used.
The resistor values are calculated by:
EQUATION 4-1:
Figure 4-2 shows component definition. Applications
with widely varying load currents may scale the
resistors to draw the minimum load current required for
proper operation (see the Minimum Load Current
section).
OUT V
OU
T
IN
GND
V
IN
R1R2VOUT
1.240
------------- 1–


=
Where:
VOUT = Desired output voltage.
2018 Microchip Technology Inc. DS20005897B-page 13
MIC29302A
FIGURE 4-2: Adjustable Regulator with
Resistors.
4.5 Enable Input
MIC29302A features an enable (EN) input that allows
ON/OFF control of the device. The EN input has
TTL/CMOS-compatible thresholds for simple
interfacing with logic, or may be directly tied to VIN.
Enabling the regulator requires approximately 20 µA of
current into the EN pin.
4.6 Thermal Design
Linear regulators are simple to use. The most
complicated set of design parameters to consider are
thermal characteristics. Thermal design requires the
following application-specific parameters:
• Maximum Ambient Temperature, TA
• Output Current, IOUT
• Output Voltage, VOUT
• Input Voltage, VIN
First, calculate the power dissipation of the regulator
from these numbers and the device parameters from
this data sheet:
EQUATION 4-2:
Ground current is, in the worst case, 5% of IOUT. Then
the heatsink thermal resistance is determined with this
formula:
EQUATION 4-3:
The heatsink may be significantly increased in
applications where the minimum input voltage is known
and is large compared to the dropout voltage. A series
input resistor can be used to drop excessive voltage
and distribute the heat between this resistor and the
regulator. The low-dropout properties of Microchip
Super βeta PNP regulators allow very significant
reductions in regulator power dissipation and the
associated heatsink without compromising
performance. When this technique is employed, a
capacitor of at least 0.1 µF is needed directly between
the input and regulator ground.
Please refer to Application Note 9 and Application Hint
17 on Microchip’s website for further details and
examples on thermal design and heatsink
specification.
With no heatsink in the application, calculate the
junction temperature to determine the maximum power
dissipation that will be allowed before exceeding the
maximum junction temperature of the MIC29302A. The
maximum power allowed can be calculated using the
thermal resistance (θJA) of the D-Pak (TO-252)
adhering to the following criteria for the PCB design:
2 oz./ft.2, meaning 70 µm thickness, copper and
100 mm2 copper area for the MIC29302A.
For example, given an expected maximum ambient
temperature (TA) of +75°C with VIN = 3.3V, VOUT =
2.5V, and IOUT = 3A, first calculate the expected PD
using Equation 4-4.
R1
R2
22μF
10μF
VIN VOUT
MIC29302A
PDIOUT 1.05VIN VOUT
–=
SA TJMAX
TA
–
PD
-------------------------------- JC CS
+–=
Where:
TJ(MAX) = Less than or equal to +125°C.
θCS = Between 0°C/W and 2°C/W.
θJC = Selected from Temperature
Specifications table for selected package
MIC29302A
DS20005897B-page 14 2018 Microchip Technology Inc.
EQUATION 4-4:
Next, calculate the junction temperature for the
expected power dissipation:
EQUATION 4-5:
Now determine the maximum power dissipation
allowed that would not exceed the IC’s maximum
junction temperature (125°C) without the use of a
heatsink by:
EQUATION 4-6:
PD3.0A1.05 3.3V2.5V–2.9W==
TJJA PD
TA
+
35C/W 2.9W75C176.5C=+
==
PDMAX TJMAX
TA
–
JA
=
125C75C–35C/W=
1.428W=
2018 Microchip Technology Inc. DS20005897B-page 15
MIC29302A
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Example
5-Pin TO-252*
TAB
XXX
XXXXXXX
WNNNP
TAB
MIC
29302AWD
4031P
Example
5-Pin TO-263*
TAB
XXX
XXXXXXX
WNNNP
TAB
MIC
29302AWU
8604P
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
3
e
3
e
MIC29302A
DS20005897B-page 16 2018 Microchip Technology Inc.
5-Lead TO-252 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc. DS20005897B-page 17
MIC29302A
5-Lead TO-263 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC29302A
DS20005897B-page 18 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005897B-page 19
MIC29302A
APPENDIX A: REVISION HISTOR Y
Revision A (November 2017)
• Converted Micrel document MIC29302A to Micro-
chip data sheet DS20005897A.
• Minor text changes throughout.
• Updated the list of Features.
• Updated values and notes in Table 1-1.
• Rearranged sub-sections and revised values in
Application Information section to improve clarity.
Revision B (January 2018)
• Updated Current Limit values in Ta b l e 1 - 1 .
MIC29302A
DS20005897B-page 20 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005897B-page 21
MIC29302A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC29302AWD: 3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHS-
Compliant*, 5-Lead D-PAK
(TO-252) package, 80/Tube
b) MIC29302AWU: 3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHS-
Compliant*, 5-Lead D2PAK
(TO-263) package, 50/Tube
c) MIC29302AWD-TR: 3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHS-
Compliant*, 5-Lead D-PAK
(TO-252) package,
2,500/Reel
d) MIC29302AWU-TR: 3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHS-
Compliant*, 5-Lead D2PAK
(TO-263) package,
750/Reel
PART NO. X
Package
Device
Device: MIC29302A: 3A Fast Response LDO Regulator
Output Voltage: <blank>= Adjustable
Junction
Temperature
Range: W = –40°C to +125°C, RoHS-Compliant*
Package: D = 5-Lead D-Pak (TO-252)
U = 5-Lead D2Pak (TO-263)
Media Type:
<blank>= 80/Tube (TO-252 Package)
TR = 2,500/Reel (TO-252 Package)
<blank>= 50/Tube (TO-263 Package)
TR = 750/Reel (TO-263 Package)
X
Output
X
Junction Temp.
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
–XX
Media Type
Voltage Range
* RoHS-Compliant with “high melting solder” exemption.
MIC29302A
DS20005897B-page 22 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005897B-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
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© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2606-6
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intended manner and under normal conditions.
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knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
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• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, micro perip hera ls, n onvolat ile memory and
analog products. In addition, Microchip’s quality system fo r the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005897B-page 24 2018 Microchip Technology Inc.
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10/25/17