DATA SH EET
Product specification
Supersedes data of 1997 Sep 22
File under Integrated Circuits, IC01
1999 Jun 30
INTEGRATED CIRCUITS
TDA8561Q
2× 24 W BTL or 4 × 12 W
single-ended car radio power
amplifier
1999 Jun 30 2
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
FEATURES
Requires very few external components
High output power
Flexibility in use; Quad single-ended or stereo BTL
Low output offset voltage
Fixed gain
Diagnostic facility (distortion, short-circuit and
temperature detection)
Good ripple rejection
Mode select switch (operating, mute and standby)
Load dump protection
AC and DC short-circuit safe to ground and to VP
Low power dissipation in any short-circuit condition
Thermally protected
Reverse polarity safe
Electrostatic discharge protection
No switch-on/switch-off plop
Flexible leads
Low thermal resistance
Identical inputs (inverting and non-inverting).
GENERAL DESCRIPTION
The TDA8561Q is an integrated class-B output amplifier in
a 17-lead single-in-line (SIL) power package. It contains
4×12 W Single-Ended (SE) or 2 ×24 W Bridge-Tied
Load (BTL) amplifiers.
The device is primarily developed for car radio
applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPpositive operating supply voltage 6 14.4 18 V
IORM repetitive peak output current −−4A
I
Ptotal quiescent current 80 mA
Isb standby current 0.1 100 µA
Stereo BTL application
Pooutput power RL=4; THD = 10% 24 W
RR supply voltage ripple rejection 46 −−dB
Vno noise output voltage Rs=0Ω−70 −µV
Z
I
input impedance 25 −−k
∆VO|DC output offset voltage −−150 mV
Quad single-ended application
Pooutput power THD = 10%
RL=4Ω−7W
R
L
=2Ω−12 W
RR supply voltage ripple rejection 46 −−dB
Vno noise output voltage Rs=0Ω−50 −µV
Z
I
input impedance 50 −−k
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA8561Q DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
1999 Jun 30 3
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
BLOCK DIAGRAM
Fig.1 Block diagram.
mode
select
switch
MEA858 - 1
output 1
15 k
15 k
x1
VA
stand-by
switch
VP
mute
switch
stand-by
reference
voltage
513
VP1 VP2
18 k
2
k
mute switch
VA
Cm
power stage
18 k
mute switch
VA
Cm
power stage
6
8
14
18 k
mute switch
VA
Cm
power stage
18 k
mute switch
VA
Cm
power stage
12
10
2711
ground
(signal)
GND1 GND2
power ground (substrate)
output 4
output 3
output 2
non-inverting
input 1
non-inverting
input 4 17
1
TDA8561Q
mute
reference
voltage
input
reference
voltage
2
k
60
k
60
k
inverting
input 2 3
PROTECTIONS
thermal
short-circuit
diagnostic
output
16
4
supply voltage
ripple rejection
inverting
input 3 15
2
k
60
k
2
k
60
k
9
not connected
1999 Jun 30 4
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
PINNING
SYMBOL PIN DESCRIPTION
INV 1 1 non-inverting input 1
GND(S) 2 signal ground
INV 2 3 inverting input 2
RR 4 supply voltage ripple rejection
VP1 5 supply voltage
OUT 1 6 output 1
GND1 7 power ground 1
OUT 2 8 output 2
n.c. 9 not connected
OUT 3 10 output 3
GND2 11 power ground 2
OUT 4 12 output 4
VP2 13 supply voltage
MODE 14 mode select switch input
INV 3 15 inverting input 3
VDIAG 16 diagnostic output
INV 4 17 non-inverting input 4
Fig.2 Pin configuration.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
TDA8561Q
INV 1
GND(S)
INV 2
RR
OUT 1
GND1
OUT 2
n.c.
OUT 3
GND2
OUT 4
V
MODE
INV 3
DIAG
INV 4
P2
VP1
MEA859 - 1
V
1999 Jun 30 5
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
FUNCTIONAL DESCRIPTION
The TDA8561Q contains four identical amplifiers and can
be used for Single-Ended (SE) or Bridge-Tied Load (BTL)
applications. The gain of each amplifier is fixed at 20 dB
(26 dB in BTL). Special features of the device are:
Mode select switch (pin 14)
Low standby current (<100 µA)
Low switching current (low cost supply switch)
Mute facility.
To avoid switch-on plops, it is advised to keep the amplifier
in the mute mode during 100 ms (charging of the input
capacitors at pins 1, 3, 15 and 17). This can be achieved
by:
Microcontroller control
External timing circuit (see Fig.11).
Diagnostic output (pin 16)
DYNAMIC DISTORTION DETECTOR (DDD)
At the onset of clipping of one or more output stages, the
dynamic distortion detector becomes active and pin 16
goes LOW. This information can be used to drive a sound
processor or DC volume control to attenuate the input
signal and thus limit the distortion. The output level of
pin 16 is independent of the number of channels that are
clipping (see Figs 3 and 4).
SHORT-CIRCUIT PROTECTION
When a short-circuit occurs at one or more outputs to
ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device is switched on again, with a delay of approximately
20 ms, after removal of the short-circuit. During this
short-circuit condition, pin 16 is continuously LOW.
When a short-circuit across the load of one or both
channels occurs the output stages are switched off for
approximately 20 ms. After that time it is checked during
approximately 50 µs to see whether the short-circuit is still
present. Due to this duty cycle of 50 µs/20 ms the average
current consumption during this short-circuit condition is
very low (approximately 40 mA).
During this short-circuit condition, pin 16 is LOW for 20 ms
and HIGH for 50 µs (see Fig.5).
The power dissipation in any short-circuit condition is very
low.
Fig.3 Distortion detector waveform; BTL
application.
handbook, halfpage
V
0
VP
VO
0
t
MGA705
16
Fig.4 Distortion detector waveform; single-ended
application.
handbook, halfpage
0
VP
VO
t
0
MGA706
V16
1999 Jun 30 6
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
TEMPERATURE DETECTION
When the virtual junction temperature Tvj reaches 150 °C, pin 16 will be active LOW.
OPEN-COLLECTOR OUTPUT
Pin 16 is an open-collector output, which allows pin 16 of more devices being tied together.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
vPpositive supply voltage
operating 18 V
non-operating 30 V
load dump protection during 50 ms; tr2.5 ms 45 V
IOSM non-repetitive peak output current 6A
I
ORM repetitive peak output current 4A
T
stg storage temperature 55 +150 °C
Tamb operating ambient temperature 40 +85 °C
Tvj virtual junction temperature 150 °C
Vpsc AC and DC short-circuit safe voltage 18 V
Vpr reverse polarity 6V
P
tot total power dissipation 60 W
Fig.5 Short-circuit waveform.
handbook, full pagewidth
MGL214
short-circuit over the load
20 ms
50 µs
t
t
VP
current
in
output
stage
V16
1999 Jun 30 7
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
THERMAL CHARACTERISTICS
In accordance with IEC 747-1.
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 40 K/W
Rth j-c thermal resistance from junction to case (see Figs 6 and 7) 1.3 K/W
Fig.6 Equivalent thermal resistance network;
BTL application.
handbook, halfpage
2.2 K/W
0.2 K/W
2.2 K/W
virtual junction output 1 output 2
case
MEA861 - 1
Fig.7 Equivalent thermal resistance network;
single-ended application.
handbook, halfpage
3.0 K/W
0.7 K/W
3.0 K/W
virtual junction
output 1 output 2
case
3.0 K/W
0.7 K/W
3.0 K/W
output 3 output 4
MEA860 - 2
0.2 K/W
1999 Jun 30 8
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
DC CHARACTERISTICS
VP= 14.4 V; Tamb =25°C; measured in Fig.8; unless otherwise specified.
Notes
1. The circuit is DC adjusted at VP= 6 to 18 V and AC operating at VP= 8.5 to 18 V.
2. At 18V<V
P< 30 V the DC output voltage 0.5VP.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPpositive supply voltage note 1 6 14.4 18 V
IPtotal quiescent current 80 160 mA
VODC output voltage note 2 6.9 V
∆VODC output offset voltage −−150 mV
Mode select switch
Von switch-on voltage level 8.5 −−V
MUTE CONDITION
Vmute mute voltage 3.3 6.4 V
VOoutput voltage in mute position VImax = 1 V; f = 1 kHz −−2mV
∆VODC output offset voltage (between
pins 6 to 8 and 10 to 12) −−150 mV
STANDBY CONDITION
Vsb standby voltage 0 2V
I
sb standby current −−100 µA
Isw switch-on current 12 40 µA
Diagnostic output (pin 16)
VDIAG diagnostic output voltage any short-circuit or clipping −−0.6 V
1999 Jun 30 9
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
AC CHARACTERISTICS
VP= 14.4 V; RL=4; f = 1 kHz; Tamb =25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Stereo BTL application (measured in Fig.8)
Pooutput power note 1
THD = 0.5% 15 19 W
THD = 10% 20 24 W
THD total harmonic distortion Po=1W 0.06 %
Pooutput power VP= 13.2 V
THD = 0.5% 16 W
THD = 10% 20 W
B power bandwidth THD = 0.5%; 20 to Hz
Po=1 dB; with respect to 15 W 15000
fllow frequency roll-off at 1 dB; note 2 45 Hz
fhhigh frequency roll-off at 1dB 20 −−kHz
Gvclosed loop voltage gain 25 26 27 dB
SVRR supply voltage ripple rejection note 3
on 48 −−dB
mute 46 −−dB
standby 80 −−dB
ZIinput impedance 25 30 38 k
Vno noise output voltage
on Rs=0; note 4 70 −µV
on Rs=10k; note 4 100 200 µV
mute notes 4 and 5 60 −µV
α
cs channel separation Rs=10k40 60 dB
∆Gvchannel unbalance −−1dB
DYNAMIC DISTORTION DETECTOR
THD total harmonic distortion V16 0.6 V; no short-circuit 10 %
Quad single-ended application (measured in Fig.9)
Pooutput power note 1
THD = 0.5% 4 5 W
THD = 10% 5.5 7 W
THD total harmonic distortion Po=1W 0.06 %
POoutput power RL=2; note 1
THD = 0.5% 7.5 10 W
THD = 10% 10 12 W
fllow frequency roll-off at 1 dB; note 2 25 Hz
fhhigh frequency roll-off at 1dB 20 −−kHz
Gvclosed loop voltage gain 19 20 21 dB
1999 Jun 30 10
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Notes
1. Output power is measured directly at the output pins of the IC.
2. Frequency response externally fixed.
3. Ripple rejection measured at the output with a source impedance of 0 , maximum ripple amplitude of 2 V (p-p) and
at a frequency of between 100 Hz and 10 kHz.
4. Noise measured in a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage independent of Rs (Vi= 0 V).
SVRR supply voltage ripple rejection note 3
on 48 −−dB
mute 46 −−dB
standby 80 −−dB
ZIinput impedance 50 60 75 k
Vno noise output voltage
on Rs=0; note 4 50 −µV
on Rs=10k; note 4 70 100 µV
mute notes 4 and 5 50 −µV
α
cs channel separation Rs=10k40 60 dB
∆Gvchannel unbalance −−1dB
DYNAMIC DISTORTION DETECTOR
THD total harmonic distortion V16 0.6 V; no short-circuit 10 %
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1999 Jun 30 11
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
TEST AND APPLICATION INFORMATION
Fig.8 Stereo BTL application diagram.
handbook, full pagewidth
MEA862 - 2
100
nF
16 5 13
220 nF 16
8
711
V
P
TDA8561Q
TDA8564Q
2200
µF
60
k
2
ground (signal)
10
k
14
9not connected
3
inverting input 2
60
k
60
k
reference
voltage
220 nF 17 12
60
k
non-inverting
input 4
4
15 10
power ground (substrate)
non- inverting
input 1
supply voltage
ripple rejection
inverting input 3
diagnostic
mode
switch
1999 Jun 30 12
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Fig.9 Quad single-ended application diagram 1.
handbook, full pagewidth
MEA863 - 2
100
nF
16 5 13
220 nF 16
8
711
V
P
TDA8561Q
TDA8564Q
2200
µF
60
k
2
ground (signal)
10
k
14
9not connected
3
inverting
input 2 60
k
60
k
reference
voltage
220 nF
100
µF
17 12
60
k
non-inverting
input 4
4
15 10
power ground (substrate)
non- inverting
input 1
supply voltage
ripple rejection
inverting
input 3
220 nF
1/2Vp
1000 µF
220 nF 1000 µF
1000 µF
1000 µF
mode
switch
1999 Jun 30 13
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Fig.10 Quad single-ended application diagram 2.
(1) When short-circuiting the single-ended capacitor, the dissipation will be reduced due to diode D1.
handbook, full pagewidth
MEA864 - 2
100
nF
16 5 13
220 nF 16
8
711
V
P
V
P
TDA8561Q
TDA8564Q
2200
µF
60
k
2
ground (signal)
10
k
14
4
not connected
3
inverting
input 2
60
k
60
k
reference
voltage
220 nF
17 12
60
k
non-inverting
input 4
9
15 10
power ground (substrate)
non- inverting
input 1
inverting
input 3 220 nF
220 nF
2200
µF
2
D1
100
µF
mode
switch
1999 Jun 30 14
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Mode select switch
To avoid switch-on plops, it is advised to keep the amplifier
in the mute mode during >100 ms (charging of the input
capacitors at pins 1, 3, 15 and 17.
The circuit in Fig.11 slowly ramps up the voltage at the
mode select switch pin when switching on and results in
fast muting when switching off.
Fig.11 Mode select switch circuitry.
handbook, halfpage
100 k
MGA708
47 µF
10 k100
mode
select
switch
VP
Fig.12 Total harmonic distortion as a function of output power; VP= 14.4 V, RL=4Ω.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
102
MGA709
10110 1
102
10
1
10
P (W)
o
10 2
1
10 2
THD
(%)
(1)
(2)
(3)
1999 Jun 30 15
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
handbook, full pagewidth
18
50
0810121416
MGA710
10
20
30
40
Po
(W)
V (V)
P
(1)
(3)
(2)
Fig.13 Output power as a function of supply voltage.
(1) THD = 30%.
(2) THD = 10%.
(3) THD = 0.5%.
Fig.14 Power bandwidth as a function of frequency; THD = 0.5%, VP= 14.4 V, RL=4Ω.
10
20
105
MGA711
104
103
102
10
12
14
16
18
f (Hz)
Po
(W)
1999 Jun 30 16
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Fig.15 Total harmonic distortion as a function of frequency; VP= 14.4 V, RL=4Ω.
(1) Po= 0.1 W.
(2) Po=1W.
(3) Po=10W.
105
MGA712
104
103
102
10
1
10 2f (Hz)
10 1
THD
(%)
(1)
(2)
(3)
100
50
105
MGA713
104
103
102
10
90
80
70
60
f (Hz)
RR
(dB) (1)
(2)
(3)
Fig.16 Ripple rejection as a function of frequency.
(1) On condition.
(2) Mute condition.
(3) Standby condition.
1999 Jun 30 17
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Fig.17 Quiescent current as a function of supply voltage; RL=∞.
handbook, full pagewidth
18
100
60 8 10121416
MGA714
68
76
84
92
V (V)
P
Iq
(mA)
SINGLE-ENDED APPLICATION
102
MGA715
10110 1
102
10
1
10
P (W)
o
10 2
1
10 2
THD
(%)
(2)
(1)
(3)
Fig.18 Total harmonic distortion as a function of output power; VP= 14.4 V, RL=2Ω.
(1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.
1999 Jun 30 18
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Fig.19 Output power as a function of supply voltage.
(1) THD = 30%.
(2) THD = 10%.
(3) THD = 0.5%.
handbook, full pagewidth
18
15
08 10121416
MGA716
3
6
9
12
Po
(W)
V (V)
P
(2)
(3)
(1)
Fig.20 Power bandwidth as a function of frequency; THD = 0.5%, VP= 14.4 V, RL=2Ω.
0
10
105
MGA717
104
103
102
10
2
4
6
8
f (Hz)
Po
(W)
1999 Jun 30 19
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
Fig.21 Total harmonic distortion as a function of frequency; VP= 14.4 V, RL=2Ω.
(1) Po= 0.1 W.
(2) Po=1W.
105
MGA718
104
103
102
10
1
10 2f (Hz)
10 1
THD
(%)
(1) (2)
Fig.22 Channel separation as a function of frequency.
handbook, full pagewidth
80
30
105
MGA719
104
103
102
10
70
60
50
40
f (Hz)
(dB)
αcs
1999 Jun 30 20
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
BTL APPLICATION
Fig.23 Total power dissipation as a function of output power; VP= 14.4 V, RL=4(1 channel driven BTL or
4 channels in single-ended mode).
14
204
MGA720
4
Ptot
(W)
P (W)
o
6
8
10
12
8 1216202428
1999 Jun 30 21
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT243-1
0 5 10 mm
scale
D
L
E
A
c
A2
L3
Q
wM
bp
1
d
D
Ze
e
xh
117
j
E
h
non-concave
95-03-11
97-12-16
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
view B: mounting base side
m2
e
vM
B
UNIT A e1
A2bpcD
(1) E(1) Z(1)
deD
hLL
3m
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 2.54
v
0.8
12.2
11.8 1.27
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
12.4
11.0
Qj
0.4
w
0.03
x
1999 Jun 30 22
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
“Data Handbook IC26; Integrated Circuit
Packages”
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE SOLDERING METHOD
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Jun 30 23
Philips Semiconductors Product specification
2× 24 W BTL or 4 × 12 W single-ended
car radio power amplifier TDA8561Q
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999 66
Philips Semiconductors – a worldwide company
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
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Tel. +64 9 849 4160, Fax. +64 9 849 7811
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Printed in The Netherlands 545002/04/pp24 Date of release: 1999 Jun 30 Document order number: 9397 750 06053