LPC1751FBD80,551 - NXP Semiconductors

1. General description

The LPC1759/58/56/54/52/51 are ARM Corte x-M3 based microcontrollers for embedded

applications featuring a high level of integration and low power consumption. The ARM

Cortex-M3 is a next generation core that offers system enhancements such as enhanced

debug features and a higher level of support block integration.

The LPC1758/56/57/54/52/51 operate at CPU frequencies of up to 100 MHz. The

LPC1759 operates at CPU frequencies of up to 120 MHz. The ARM Cortex-M3 CPU

incorporates a 3- stage pipelin e an d us es a Ha rva rd arc hit ec tu re with separate loca l

instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3

CPU also includes an internal prefetch unit that supports speculative branching.

The peripheral com plement of the LPC1759/58 /56/54/52/51 includ es up to 512 kB of flash

memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface,

8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers,

SPI interface, 2 I2C-bus interfaces, 2-input plus 2-output I2S-bus interface, 6 channel

12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, 4 general

purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC)

with separate battery supply, and up to 52 general purpose I/O pins.

2. Features and benefits

ARM Cortex-M3 processor, running at frequencies of up to 100 MHz

(LPC1758/56/57/54/5 2/51) or of up to 120 MHz (LPC17 59). A Memo ry Protection Unit

(MPU) supporting eight regions is included.

ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).

Up to 512 kB on-chip flash programming memory . Enhanced flash memory accelerator

enables high-speed 120 MHz operation with zero wait states.

In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software.

On-chip SRAM includes:

Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance

CPU access.

Two/one 16 kB SRAM blocks with separate access paths for higher throughput.

These SRAM blocks may be used for Ethernet (LPC1758 only), USB, and DMA

memory, as well as for general purpose CPU instruction and data storage.

Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer

matrix that can be used with the SSP, I2S-bus, UART, the Analog-to-Digital and

Digital-to-Analog converter peripherals, timer match signals, and for

memory-to-memory transfers.

LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB

SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN

Rev. 8 — 9 August 2012 Product data sheet

Product data sheet Rev. 8 — 9 August 2012 2 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Multilayer AHB matrix interconnect provides a separate bus for each AHB master.

AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC

(LPC1758 only), and the USB interface. This interconnect provides communication

with no arbitration delays.

Split APB bus allows high throughput with few stalls between the CPU and DMA.

Serial interfaces:

On the LPC1758 only, Ethernet MAC with RMII interface and dedicated DMA

controller.

USB 2.0 full-speed devic e/H ost/ OT G co nt ro ller with de dic ated DMA contr o ller and

on-chip PHY for device, Host, and OTG function s. The LPC1752/51 include a USB

device controller only.

Four UAR Ts with fractional baud rate generation, inter nal FIF O, and DMA su ppo rt.

One UART has modem control I/O and RS-485/EIA-485 support, and one UART

has IrDA support.

CAN 2.0B controller with two (LPC1759/58/56) or one (LPC1754/52/51) channels.

SPI controller with synchronous, serial, full duplex commu nication and

programmable data length.

Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces

can be used with the GPDMA controller.

Two I2C-bus interfaces supporting fast mode with a data rate of 400 kbit/s with

multiple address recognition and monitor mode.

On the LPC1759/58/56 only, I2S (Inter- IC Sound) interfac e for digi t al audio input or

output, with fractional rate control. The I2S-bus interface can be used with the

GPDMA. The I2S-bus interface supports 3-wire and 4-wire data transmit and

receive as well as master clock input/output.

Other periph er als :

52 General Purpose I/O (GPIO) pins with configurable pull-up/down resistors. All

GPIOs support a new, configurable open-drain oper ating mode. The GPIO bl ock is

accessed through the AHB multilayer bus for fast access and located in memory

such that it supports Cortex- M3 bit ba ndin g an d use by the Gener al Pur pose DMA

Controller.

12-bit Analog-to-Digital Converter (ADC) with input multiplexing among six pins,

conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can

be used with the GPDMA controller.

On the LPC1759/58/56/54 only, 10-bit Digital-to-Analog Converter (DAC) with

dedicated conversion timer and DMA support.

Four general purpose timers/counters, with a total of three capture inputs and ten

compare outputs. Each timer block has an external count input. Specific timer

events can be selected to generate DMA requests.

One motor control PWM with support for three-phase motor control.

Quadrature encoder interface that can monitor one external quadrature encoder.

One standard PWM/timer block with external count input.

Real-Time Clock (RTC) with a separate power domain and dedicated RTC

oscillator. The RTC block includes 20 bytes of battery-powered backup registers.

WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator,

the RTC oscillator, or the APB clock.

ARM Cortex-M3 system tick timer, including an external clock input option.

Product data sheet Rev. 8 — 9 August 2012 3 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Repetitive Interrupt Timer (RIT) provides programmable and repeating timed

interrupts.

Each peripheral ha s its own clock divider for further power savings.

Standard JTAG test/debug interface for compatibility with existing tools. Serial Wire

Debug and Serial Wire Trace Port options.

Emulation trace module enables non-intrusive, high-speed real-time tracing of

instruction execution.

Integrated PMU (Power Management Unit) automatically adjusts internal regulators to

minimize power consumption during Sleep, Deep sleep, Power- down, and Deep

power-down modes.

Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.

Single 3.3 V power supply (2.4 V to 3.6 V).

One external interrupt input config urable as edge/level sensitive. All pins on Port 0 and

Port 2 can be used as edge sensitive interrupt sources.

Non-maskable Interrupt (NM I) input.

The Wakeup Interrupt Controller (WIC) allows the CPU to automatically wake up from

any priority interrupt that can occur while the clocks are stopped in Deep sleep,

Power-down, and Deep power-down modes.

Processor wake-up from Power-down mode via any interrupt able to operate during

Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet

wake-up interrupt (LPC1758 only), CAN bus activity, Port 0/2 pin interrupt, and NMI).

Brownout detect with separate threshold for interrupt and forced reset.

Power-On Reset (POR).

Crystal oscillator with an operating range of 1 MHz to 25 MHz.

4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a

system clock.

PLL allows CPU operation up to the maximum CPU rate without the need for a

high-frequency crystal. May be run from the main oscillator, the internal RC oscillator,

or the RTC oscillator.

USB PLL for added flexibility.

Code Read Protection (CRP) with different security levels.

Unique device serial number for identification purposes.

Available as 80-pin LQFP package (12 mm  12 mm  1.4 mm).

3. Applications

eMetering

Lighting

Industrial networking

Alarm systems

White goods

Motor control

Product data sheet Rev. 8 — 9 August 2012 4 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

4. Ordering information

4.1 Ordering options

Ta ble 1. Ordering information

Type number Package

Name Description Version

LPC1759FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1

LPC1758FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1

LPC1756FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1

LPC1754FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1

LPC1752FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1

LPC1751FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1

Table 2. Ordering options

Type number Flash SRAM in kB Ethernet USB CAN I2S-bus DAC Maximum

CPU

operating

frequency

CPU AHB

SRAM0 AHB

SRAM1 Total

LPC1759FBD80 512 kB 32 16 16 64 no Device/Host/OTG 2 yes yes 120 MHz

LPC1758FBD80 512 kB 32 16 16 64 yes Device/Host/OTG 2 yes yes 100 MHz

LPC1756FBD80 256 kB 16 16 - 32 no Device/Host/OTG 2 yes yes 100 MHz

LPC1754FBD80 128 kB 16 16 - 32 no Device/Host/OTG 1 no yes 100 MHz

LPC1752FBD80 64 kB 16 - - 16 no Device only 1 no no 100 MHz

LPC1751FBD80 32 kB 8 - - 8 no Device only 1 no no 100 MHz

Product data sheet Rev. 8 — 9 August 2012 5 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

5. Block diagram

Grey-shaded blocks represent peripherals with connection to the GPDMA.

Fig 1. Block diagram

SRAM

64/32/

16/8 kB

ARM

CORTEX-M3

TEST/DEBUG

INTERFACE

EMULATION

TRACE MODULE

FLASH

ACCELERATOR

FLASH

512/256/128/64/32 kB

DMA

CONTROLLER

ETHERNET

CONTROLLER

WITH DMA

(2)

USB HOST/

DEVICE/OTG

CONTROLLER

WITH DMA

(4)

I-code

bus D-code

bus system

bus

AHB TO

APB

BRIDGE 0

HIGH-SPEED

GPIO AHB TO

APB

BRIDGE 1

CLOCK

GENERATION,

POWER CONTROL,

SYSTEM

FUNCTIONS

XTAL1

XTAL2 RESET

clocks and

controls

JTAG

interface

debug

port

USB PHY

SSP0

UART2/3

I2S

(1)

RI TIMER

SYSTEM CONTROL

SSP1

UART0/1

CAN1/CAN2

(1)

I2C1

SPI0

TIMER 0/1

WDT

PWM1

12-bit ADC

PIN CONNECT

GPIO INTERRUPT CONTROL

RTC

BACKUP REGISTERS

32 kHz

OSCILLATOR

APB slave group 1

APB slave group 0

RTC POWER DOMAIN

LPC1759/58/56/54/52/51

master master master

002aae153

slaveslave slave

slave

ROM

slave

MULTILAYER AHB MATRIX

P0, P1,

P2, P4

SCK0

SSEL0

MISO0

MOSI0

SCK1

SSEL1

MISO1

MOSI1 RXD2/3

TXD2/3

SCL2

I2C2 SDA2

MOTOR CONTROL PWM MCOA[2:0]

MCOB[2:0]

MCI[2:0]

TIMER2/3 4 × MAT2

2 × MAT3

I2SRX_SDA

I2STX_CLK

I2STX_WS

I2STX_SDA

TX_MCLK

RX_MCLK

DAC

(3)

AOUT

QUADRATURE ENCODER PHA, PHB

INDEX

RTCX1

RTCX2

VBAT

PWM1[6:1]

2 × MAT0/1

1 × CAP0,

2 × CAP1

RD1/2

TD1/2

SDA1

SCL1

AD0[7:2]

SCK/SSEL

MOSI/MISO

8 × UART1

RXD0/TXD0

P0, P2

PCAP1[1:0]

RMII pins USB pins

MPU

(1)

LPC1759/58/56 only

(2)

LPC1758 only

EXTERNAL INTERRUPTS EINT0

(3)

LPC1759/58/56/54 only

(4)

LPC1752/51 USB device only

Product data sheet Rev. 8 — 9 August 2012 6 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pin configuration LQ FP80 package

002aae158

Table 3. Pin de scription

Symbol Pin Type Description

P0[0] to P0[31] I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The

operation of Port 0 pins depends upon the pin function selected via the pin

connect block. Some port pins are not available on the LQFP80 package.

P0[0]/RD1/TXD3/

SDA1 37[1] I/O P0[0] — General purpose digital input/output pin.

IRD1 — CAN1 receiver input.

OTXD3 — Transmitter output for UART3.

I/O SDA1 — I2C1 data input/output (this is not an I2C-bus compliant open-drain pin).

P0[1]/TD1/RXD3/

SCL1 38[1] I/O P0[1] — General purpose digital input/output pin.

OTD1 — CAN1 transmitter output.

IRXD3 — Receiver input for UART3.

I/O SCL1 — I2C1 clock input/output (this is not an I2C-bus comp liant open-drain pin).

P0[2]/TXD0/AD0[7] 79[2] I/O P0[2] — General purpose digital input/outpu t pin.

OTXD0 — Transmitter output for UART0.

IAD0[7] — A/D converter 0, input 7.

P0[3]/RXD0/AD0[6] 80[2] I/O P0[3] — General purpose digital input/output pin.

IRXD0 — Receiver input for UART0.

IAD0[6] — A/D converter 0, input 6.

P0[6]/

I2SRX_SDA/

SSEL1/MAT2[0]

64[1] I/O P0[6] — General purpose digital input/output pin.

I/O I2SRX_SDA — Receive data. It is driven by the transmitter and read by the

receiver. Corresponds to the signal SD in the I2S-bus specification.

(LPC1759/58/56 only).

I/O SSEL1 — Slave Select for SSP1.

OMAT2[0] — Match output for Timer 2, channel 0.

Product data sheet Rev. 8 — 9 August 2012 7 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

P0[7]/I2STX_CLK/

SCK1/MAT2[1] 63[1] I/O P0[7] — General purpose digital input/output pin.

I/O I2STX_CLK — Transmit Clock. It is driven by the master and received by the

slave. Corresponds to the signal SCK in the I2S-bus specification.

(LPC1759/58/56 only).

I/O SCK1 — Serial Clock for SSP1.

OMAT2[1] — Match output for Timer 2, channel 1.

P0[8]/I2STX_WS/

MISO1/MAT2[2] 62[1] I/O P0[8] — General purpose digital input/output pin.

I/O I2STX_WS — T ransmit Word Select. It is driven by the master and received by the

slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1759/58/56

only).

I/O MISO1 — Master In Slave Out for SSP1.

OMAT2[2] — Match output for Timer 2, channel 2.

P0[9]/I2STX_SDA/

MOSI1/MAT2[3] 61[1] I/O P0[9] — General purpose digital input/output pin.

I/O I2STX_SDA — Transmit data. It is driven by the transmitter and read by the

receiver. Corresponds to the signal SD in the I2S-bus specification.

(LPC1759/58/56 only).

I/O MOSI1 — Master Out Slave In for SSP1.

OMAT2[3] — Match output for Timer 2, channel 3.

P0[10]/TXD2/

SDA2/MAT3[0] 39[1] I/O P0[10] — General purpose digital input/output pin.

OTXD2 — Transmitter output for UART2.

I/O SDA2 — I2C2 data input/output (this is not an open-drain pin).

OMAT3[0] — Match output for Timer 3, channel 0.

P0[11]/RXD2/

SCL2/MAT3[1] 40[1] I/O P0[11] — General purpose digital input/output pin.

IRXD2 — Receiver input for UART2.

I/O SCL2 — I2C2 clock input/output (this is not an op en-drain pin).

OMAT3[1] — Match output for Timer 3, channel 1.

P0[15]/TXD1/

SCK0/SCK 47[1] I/O P0[15] — General purpose di gital input/ou tput pin.

OTXD1 — Transmitter output for UART1.

I/O SCK0 — Serial clock for SSP0.

I/O SCK — Serial clock for SPI.

P0[16]/RXD1/

SSEL0/SSEL 48[1] I/O P0[16] — General purpose di gital input/output pin.

IRXD1 — Receiver input for UART1.

I/O SSEL0 — Slave Select for SSP0.

I/O SSEL — Slave Select for SPI.

P0[17]/CTS1/

MISO0/MISO 46[1] I/O P0[17] — General purpose di gital input/output pin.

ICTS1 — Clear to Send input for UART1.

I/O MISO0 — Master In Slave Out for SSP0.

I/O MISO — Master In Slave Out for SPI.

P0[18]/DCD1/

MOSI0/MOSI 45[1] I/O P0[18] — General purpose digital input/output pin.

IDCD1 — Data Carrier Detect input for UART1.

I/O MOSI0 — Master Out Slave In for SSP0.

I/O MOSI — Master Out Slave In for SPI.

Table 3. Pin de scription …continued

Symbol Pin Type Description

Product data sheet Rev. 8 — 9 August 2012 8 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

P0[22]/RTS1/TD1 44[1] I/O P0[22] — General purpose digital input/outp ut pin.

ORTS1 — Request to Send output for UART1. Can also be configured to be an

RS-485/EIA-485 output enable signal.

OTD1 — CAN1 transmitter output.

P0[25]/AD0[2]/

I2SRX _SDA/

TXD3

7[2] I/O P0[25] — General purpose digital input/output pin.

IAD0[2] — A/D converter 0, input 2.

I/O I2SRX_SDA — Receive data. It is driven by the transmitter and read by the

receiver. Corresponds to the signal SD in the I2S-bus specification.

(LPC1759/58/56 only).

OTXD3 — Transmitter output for UART3.

P0[26]/AD0[3]/

AOUT/RXD3 6[3] I/O P0[26] — General purpose digital input/outp ut pin.

IAD0[3] — A/D converter 0, input 3.

OAOUT — DAC output. (LPC1759/58/56/54 only).

IRXD3 — Receiver input for UART3.

P0[29]/USB_D+ 22[4] I/O P0[29] — General purpose digital input/ou tput pin.

I/O USB_D+ — USB bidirectional D+ line.

P0[30]/USB_D23[4] I/O P0[30] — General purpose di gital input/output pin.

I/O USB_D — USB bidirectional D line.

P1[0] to P1[31] I/O Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each bit. The

operation of port 1 pins depends upon the pin function selected via the pin connect

block. Some port pins are not available on the LQFP80 package.

P1[0]/

ENET_TXD0 76[1] I/O P1[0] — General purpose digital input/output pin.

OENET_TXD0 — Ethernet transmit data 0. (LPC1758 only).

P1[1]/

ENET_TXD1 75[1] I/O P1[1] — General purpose digital input/output pin.

OENET_TXD1 — Ethernet transmit data 1. (LPC1758 only).

P1[4]/

ENET_TX_EN 74[1] I/O P1[4] — General purpose digital input/output pin.

OENET_TX_EN — Ethernet transmit data enable. (LPC1758 only).

P1[8]/

ENET_CRS 73[1] I/O P1[8] — General purpose digital input/output pin.

IENET_CRS — Ethernet carrier sense. (LPC1758 only).

P1[9]/

ENET_RXD0 72[1] I/O P1[9] — General purpose digital input/output pin.

IENET_RXD0 — Ethernet receive data. (LPC1758 only).

P1[10]/

ENET_RXD1 71[1] I/O P1[10] — General purpose digital input/ou tput pin.

IENET_RXD1 — Ethernet receive data. (LPC1758 only).

P1[14]/

ENET_RX_ER 70[1] I/O P1[14] — General purpose digital input/ou tput pin.

IENET_RX_ER — Ethernet receive error. (LPC1758 only).

P1[15]/

ENET_REF_CLK 69[1] I/O P1[15] — General purpose digital input/ou tput pin.

IENET_REF_CLK — Ethernet reference clock. (LPC1758 only).

Table 3. Pin de scription …continued

Symbol Pin Type Description

Product data sheet Rev. 8 — 9 August 2012 9 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

P1[18]/

USB_UP_LED/

PWM1[1]/

CAP1[0]

25[1] I/O P1[18] — General purpose di gital input/output pin.

OUSB_UP_LED — USB GoodLink LED indicator. It is LOW when the device is

configured (non-control endpoints enabled), or when the host is enabled and has

detected a device on the bus. It is HIGH when the device is not configured, or

when host is enabled and has not detected a device on the bus, or during global

suspend. It transitions between LOW and HIGH (flashes) when the host is enabled

and detects activity on the bus.

OPWM1[1] — Pulse Width Modulator 1, channel 1 output.

ICAP1[0] — Capture input for Timer 1, channel 0.

P1[19]/MCOA0/

USB_PPWR

CAP1[1]

26[1] I/O P1[19] — General purpose di gital input/output pin.

OMCOA0 — Motor control PWM channel 0, output A.

OUSB_PPWR — Port Power enable signal for USB port. (LPC1759/58/56/54 only).

ICAP1[1] — Capture input for Timer 1, channel 1.

P1[20]/MCI0/

PWM1[2]/SCK0 27[1] I/O P1[20] — General purpose di gital input/output pin.

IMCI0 — Motor control PWM channel 0, input. Also Quadrature Encoder Interface

PHA input.

OPWM1[2] — Pulse Width Modulator 1, channel 2 output.

I/O SCK0 — Serial clock for SSP0.

P1[22]/MCOB0/

USB_PWRD/

MAT1[0]

28[1] I/O P1[22] — General purpose di gital input/output pin.

OMCOB0 — Motor control PWM channel 0, output B.

IUSB_PWRD — Power Status for USB port (host power switch).

(LPC1759/58/56/54 only).

OMAT1[0] — Match output for Timer 1, channel 0.

P1[23]/MCI1/

PWM1[4]/MISO0 29[1] I/O P1[23] — General purpose digital input/outp ut pin.

IMCI1 — Motor control PWM channel 1, input. Also Quadrature Encoder Interface

PHB input.

OPWM1[4] — Pulse Width Modulator 1, channel 4 output.

I/O MISO0 — Master In Slave Out for SSP0.

P1[24]/MCI2/

PWM1[5]/MOSI0 30[1] I/O P1[24] — General purpose digital input/outp ut pin.

IMCI2 — Motor control PWM channel 2, input. Also Quadrature Encoder Interface

INDEX input.

OPWM1[5] — Pulse Width Modulator 1, channel 5 output.

I/O MOSI0 — Master Out Slave in for SSP0.

P1[25]/MCOA1/

MAT1[1] 31[1] I/O P1[25] — General purpose digital input/output pin.

OMCOA1 — Motor control PWM channel 1, output A.

OMAT1[1] — Match output for Timer 1, channel 1.

P1[26]/MCOB1/

PWM1[6]/CAP0[0] 32[1] I/O P1[26] — General purpose di gital input/output pin.

OMCOB1 — Motor control PWM channel 1, output B.

OPWM1[6] — Pulse Width Modulator 1, channel 6 output.

ICAP0[0] — Capture input for Timer 0, channel 0.

Table 3. Pin de scription …continued

Symbol Pin Type Description

Product data sheet Rev. 8 — 9 August 2012 10 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

P1[28]/MCOA2/

PCAP1[0]/

MAT0[0]

35[1] I/O P1[28] — General purpose di gital input/output pin.

OMCOA2 — Motor control PWM channel 2, output A.

IPCAP1[0] — Capture input for PWM1, channel 0.

OMAT0[0] — Match output for Timer 0, channel 0.

P1[29]/MCOB2/

PCAP1[1]/

MAT0[1]

36[1] I/O P1[29] — General purpose di gital input/output pin.

OMCOB2 — Motor control PWM channel 2, output B.

IPCAP1[1] — Capture input for PWM1, channel 1.

OMAT0[1] — Match output for Timer 0, channel 1.

P1[30]/VBUS/

AD0[4] 18[2] I/O P1[30] — General purpose di gital input/output pin.

IVBUS — Monitors the p r esence of USB bus power.

Note: This signal must be HIGH for USB reset to occur.

IAD0[4] — A/D converter 0, input 4.

P1[31]/SCK1/

AD0[5] 17[2] I/O P1[31] — General purpose digital input/output pin.

I/O SCK1 — Serial Clock for SSP1.

IAD0[5] — A/D converter 0, input 5.

P2[0] to P2[31] I/O Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each bit. The

operation of port 2 pins depends upon the pin function selected via the pin connect

block. Some port pins are not available on the LQFP80 package.

P2[0]/PWM1[1]/

TXD1 60[1] I/O P2[0] — General purpose digital input/output pin.

OPWM1[1] — Pulse Width Modulator 1, channel 1 output.

OTXD1 — Transmitter output for UART1.

P2[1]/PWM1[2]/

RXD1 59[1] I/O P2[1] — General purpose digital input/output pin.

OPWM1[2] — Pulse Width Modulator 1, channel 2 output.

IRXD1 — Receiver input for UART1.

P2[2]/PWM1[3]/

CTS1/

TRACEDATA[3]

58[1] I/O P2[2] — General purpose digital input/output pin.

OPWM1[3] — Pulse Width Modulator 1, channel 3 output.

ICTS1 — Clear to Send input for UART1.

OTRACEDATA[3] — Trace data, bit 3.

P2[3]/PWM1[4]/

DCD1/

TRACEDATA[2]

55[1] I/O P2[3] — General purpose digital input/output pin.

OPWM1[4] — Pulse Width Modulator 1, channel 4 output.

IDCD1 — Data Carrier Detect input for UART1.

OTRACEDATA[2] — Trace data, bit 2.

P2[4]/PWM1[5]/

DSR1/

TRACEDATA[1]

54[1] I/O P2[4] — General purpose digital input/output pin.

OPWM1[5] — Pulse Width Modulator 1, channel 5 output.

IDSR1 — Data Set Ready input for UART1.

OTRACEDATA[1] — Trace data, bit 1.

P2[5]/PWM1[6]/

DTR1/

TRACEDATA[0]

53[1] I/O P2[5] — General purpose digital input/output pin.

OPWM1[6] — Pulse Width Modulator 1, channel 6 output.

ODTR1 — Data Terminal Ready output for UART1. Can also be configured to be an

RS-485/EIA-485 output enable signal.

OTRACEDATA[0] — Trace data, bit 0.

Table 3. Pin de scription …continued

Symbol Pin Type Description

Product data sheet Rev. 8 — 9 August 2012 11 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

P2[6]/PCAP1[0]/

RI1/TRACECLK 52[1] I/O P2[6] — General purpose digital input/output pin.

IPCAP1[0] — Capture input for PWM1, channel 0.

IRI1 — Ring Indicator input for UART1.

OTRACECLK — Trace Clock.

P2[7]/RD2/

RTS1 51[1] I/O P2[7] — General purpose digital input/output pin.

IRD2 — CAN2 receiver input. (LPC1759/58/56 only).

ORTS1 — Request to Send output for UART1. Can also be configured to be an

RS-485/EIA-485 output enable signal.

P2[8]/TD2/

TXD2 50[1] I/O P2[8] — General purpose digital input/output pin.

OTD2 — CAN2 transmitter output. (LPC1759/58/56 only).

OTXD2 — Transmitter output for UART2.

P2[9]/

USB_CONNECT/

RXD2

49[1] I/O P2[9] — General purpose digital input/output pin.

OUSB_CONNECT — Signal used to switch an externa l 1.5 k resistor under

software control. Used with the SoftConnect USB feature.

IRXD2 — Receiver input for UART2.

P2[10]/EINT0/NMI 41[5] I/O P2[10] — General purpose digital input/output pin. A LOW level on this pin during

reset starts the ISP command handler.

IEINT0 — External interrupt 0 input.

INMI — Non-maskable interrupt input.

P4[0] to P4[31] I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The

operation of port 4 pins depends upon the pin function selected via the pin connect

block. Some port pins are not available on the LQFP80 package.

P4[28]/RX_MCLK/

MAT2[0]/TXD3 65[1] I/O P4[28] — General purpose digital input/output pin.

IRX_MCLK — I2S receive master clock. (LPC1759/58/56 only).

OMAT2[0] — Match output for Timer 2, channel 0.

OTXD3 — Transmitter output for UART3.

P4[29]/TX_MCLK/

MAT2[1]/RXD3 68[1] I/O P4[29] — General purpose digital input/output pin.

ITX_MCLK — I2S transmit master clock. (LPC1759/58/56 only).

OMAT2[1] — Match output for Timer 2, channel 1.

IRXD3 — Receiver input for UART3.

TDO/SWO 1[6] OTDO — Te st Data out for JTAG interface.

OSWO — Serial wi re tr ace output.

TDI 2[7] ITDI — Test Data in for JTAG interface.

TMS/SWDIO 3[7] ITMS — Test Mode Select for JTAG interface.

I/O SWDIO — Serial wire debug data input/output.

TRST 4[7] ITRST — Test Reset for JTAG interface.

TCK/SWDCLK 5[6] ITCK — Test Clock for JTAG interface.

ISWDCLK — Serial wire clock.

RSTOUT 11 O RSTOUT — This is a 3.3 V pin. LOW on this pin indicates

LPC1759/58/56/54/52/51 being in Reset state.

RESET 14[8] IExternal reset input: A LOW-going pulse as short as 50 ns on this pin resets the

device, causing I/O ports and peripherals to take on their default states, and

processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant.

Table 3. Pin de scription …continued

Symbol Pin Type Description

Product data sheet Rev. 8 — 9 August 2012 12 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

[1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. This pin is pulled up to a voltage level of 2.3 V to 2.6 V

[2] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,

digital section of the pad is disabled and the pin is not 5 V tolerant. This pin is pulled up to a voltage level of 2.3 V to 2.6 V

[3] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,

digital section of the pad is disabled. This pin is pulled up to a voltage level of 2.3 V to 2.6 V

[4] Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and

Low-speed mode only). This pad is not 5 V tolerant.

[5] 5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. This pin is pulled up to a voltage

level of 2.3 V to 2.6 V

[6] 5 V tolerant pad with TTL levels and hysteresis. Internal pull-up and pull-down resistors disabled.

[7] 5 V tolerant pad with TTL levels and hysteresis and internal pull-up resistor.

[8] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.

[9] Pad provides special analog functionality. 32 kHz crystal oscillator must be used with the RTC.

[10] When the system oscillator is not used, connect XTAL1 and XTAL2 as follows: XT AL1 can be left floating or can be grounded (grounding

is preferred to reduce susceptibility to noise). XTAL2 should be left floating.

[11] When the RTC is not used, connect VBAT to VDD(REG)(3V3) and leave RTCX1 floating.

XTAL1 19[9][10] I Input to the oscillator circuit and internal clock generator circuits.

XTAL2 20[9][10] O Output from the oscillator amplifier.

RTCX1 13[9][11] I Input to the RTC oscillator circuit.

RTCX2 15[9] O Output from the RTC oscillator circuit.

VSS 24, 33,

43, 57,

66, 78

Iground: 0 V reference.

VSSA 9Ianalog ground: 0 V reference. This should nominally be the same voltage as VSS,

but should be isolated to minimize noise and error.

VDD(3V3) 21, 42,

56, 77 I3.3 V supply voltage: This is the power supply voltage for the I/O ports.

VDD(REG)(3V3) 34, 67 I 3.3 V voltage regulator supply voltage: This is the supply voltage for the on-chip

voltage regulator only.

VDDA 8Ianalog 3.3 V pad supply voltage: This should be nominally the same voltage as

VDD(3V3) but should be isolated to minimize noise and error . This voltage is used to

power the ADC and DAC. This pin should be tied to 3.3 V if the ADC and DAC are

not used.

VREFP 10 I ADC positive reference voltage: This should be nominally the same voltage as

VDDA but should be isolated to minimize noise and error. Level on this pin is used

as a reference for ADC and DAC. This pin should be tied to 3.3 V if the ADC and

DAC are not used.

VREFN 12 I ADC negative reference voltage: This should be nominally the same voltage as

VSS but should be isolated to minimize noise and error . Level on this pin is used as

a reference for ADC and DAC.

VBAT 16[11] IRTC pin power supply: 3.3 V on this pin supplies the power to the RTC

peripheral.

Table 3. Pin de scription …continued

Symbol Pin Type Description

Product data sheet Rev. 8 — 9 August 2012 13 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7. Functional description

7.1 Architectural overview

The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and

the D-code bus (see Figure 1). The I-code and D-code core buses are faster than the

system bus and are used similarly to Tightly Coupled Memory (TCM) interfaces: one bus

dedicated for instruction fetch (I-code) and one bus for data access (D-code). The use of

two core buses allows for simult aneous operations if concurrent ope rations target dif ferent

devices.

The LPC1759/58/56/54/52/51 use a multi-layer AHB matrix to connect the ARM

Cortex-M3 buses and other bus masters to peripherals in a flexible manner that optimizes

performance by allowing peripherals that are on different slaves ports of the matrix to be

accessed simultaneously by different bus masters.

7.2 ARM Cortex-M3 processor

The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high

performance and very low power consumption. The ARM Cortex-M3 offers many new

features, including a Thumb-2 instruction set, low interrupt latency, hardware divide,

interruptable/continuable multiple load and store instructions, automatic state save and

restore for interrupts, tightly integrated interrupt controller with wakeup interrupt controller,

and multiple core buses capable of simultaneous accesses.

Pipeline techniques are employed so that all p arts o f the processing and m emory systems

can operate continuously. Typically, while one instruction is being executed, its successor

is being decoded, and a third instruction is being fetched from memory.

The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical

Reference Manual that can be found on official ARM website.

7.3 On-chip flash program memory

The LPC1759/58/56/54/52/51 contain up to 512 kB of on-chip flash memory. A new

two-port flash accelerator maximizes performance for use with the two fast AHB-Lite

buses.

7.4 On-chip SRAM

The LPC1759/58/56/54/52/51 contain a total of up to 64 kB on-chip static RAM memory.

This includes the main 32 /16/8 kB SRAM, accessible by the CPU and DM A controller on a

higher-speed bus, and up to two additional 16 kB each SRAM blocks situated on a

separate slave port on the AHB multilayer matrix.

This architecture allows CPU and DMA accesses to be spread over three sep arate RAMs

that can be accessed simultaneously.

7.5 Memory Protection Unit (MPU)

The LPC1759/58/56/54/52/51 have a Memory Protection Unit (MPU) which can be used

to improve the reliability of an embedded system by protecting critical data within the user

application.

Product data sheet Rev. 8 — 9 August 2012 14 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

The MPU allows separating processing tasks by disallowing access to each other's data,

disabling access to memo ry regio ns, allowing memor y reg ions to b e defined as re ad -onl y

and detecting unexpected memory accesses that could potentially break the system.

The MPU separates the memory into distinct regions and implements protection by

preventing disallowed accesses. The MPU support s up to 8 regions each of which can be

divided into 8 subregions. Accesses to memory locations that are not defined in the MPU

regions, or not permit te d by th e re gio n settin g , will ca use the Memory Ma na ge m en t Fa u lt

exception to take place.

7.6 Memory map

The LPC1759/58/56/54/52/51 incorporate several distinct memory regions, shown in the

following figures. Figure 3 shows the overall map of the entire address space from the

user program viewpoint following reset. The interrupt vector area supports address

remapping.

The AHB peripheral ar ea is 2 MB in size, and is divided to a llow for up to 1 28 per ipherals.

The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals.

Each peripheral of either type is allocated 16 kB of space. This allows simplifying the

address decoding for each peripheral.

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Product data sheet Rev. 8 — 9 August 2012 15 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Fig 3. LPC1759/58/56/54/52/51 memory map

0x4000 4000

0x4000 8000

0x4000 C000

0x4001 0000

0x4001 8000

0x4002 0000

0x4002 8000

0x4002 C000

0x4003 4000

0x4003 0000

0x4003 8000

0x4003 C000

0x4004 0000

0x4004 4000

0x4004 8000

0x4004 C000

0x4005 C000

0x4006 0000

0x4008 0000

0x4002 4000

0x4001 C000

0x4001 4000

0x4000 0000

APB1 peripherals

0x4008 0000

0x4008 8000

0x4008 C000

0x4009 0000

0x4009 4000

0x4009 8000

0x4009 C000

0x400A 0000

0x400A 4000

0x400A 8000

0x400A C000

0x400B 0000

0x400B 4000

0x400B 8000

0x400B C000

0x400C 0000

0x400F C000

0x4010 0000

SSP0

DAC

(3)

timer 2

timer 3

UART2

UART3

reserved

I2S

(1)

I2C2

1 - 0 reserved

reserved

repetitive interrupt timer

reserved

motor control PWM

30 - 16 reserved

system control31

reserved

32 kB local static RAM (LPC1759/8)

reserved

private peripheral bus

0x0000 0000

0 GB

0.5 GB

4 GB

1 GB

0x0000 8000

0x1000 4000

16 kB local static RAM (LPC1756/4/2) 0x1000 2000

8 kB local static RAM (LPC1751) 0x1000 0000

0x1000 8000

0x1FFF 0000

0x1FFF 2000

0x2008 0000

0x2008 4000

0x2200 0000

0x200A 0000

0x2009 C000

0x2400 0000

0x4000 0000

0x4008 0000

0x4010 0000

0x4200 0000

0x4400 0000

0x5000 0000

0x5020 0000

0xE000 0000

0xE010 0000

0xFFFF FFFF

reserved

GPIO

reserved

APB0 peripherals

AHB peripherals

APB1 peripherals

AHB SRAM bit-band alias addressing

peripheral bit-band alias addressing

16 kB AHB SRAM1 (LPC1759/8)

0x2007 C000

16 kB AHB SRAM0 (LPC1759/8/6/4)

LPC1759/58/56/54/52/51 memory space

32 kB on-chip flash (LPC1751)

0x0001 0000

64 kB on-chip flash (LPC1752)

0x0002 0000

128 kB on-chip flash (LPC1754)

0x0004 0000

256 kB on-chip flash (LPC1756)

0x0008 0000

512 kB on-chip flash (LPC1759/8)

QEI

APB0 peripherals

WDT

timer 0

timer 1

UART0

UART1

reserved

SPI

RTC + backup registers

GPIO interrupts

pin connect

SSP1

ADC

CAN AF RAM

CAN AF registers

CAN common

CAN1

CAN2

(1)

22 - 19 reserved

I2C1

31 - 24 reserved

PWM1

8 kB boot ROM

0x0000 0000

0x0000 0400 active interrupt vectors+ 256 words

I-code/D-code

memory space

002aae154

(1)

LPC1759/58/56 only

(2)

LPC1758 only

(3)

LPC1759/58/56/54 only

0x5000 0000

0x5000 4000

0x5000 8000

0x5000 C000

0x5020 0000

0x5001 0000

AHB peripherals

Ethernet controller

(2)

USB controller

reserved

127- 4 reserved

GPDMA controller

Product data sheet Rev. 8 — 9 August 2012 16 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.7 Nested Vectored Interrupt Controller (NVIC)

The NVIC is an integral p art of the Cortex-M3. The tight co upling to the CPU allows for low

interrupt latency and efficient processing of late arriving interrupts.

7.7.1 Features

•Controls system exceptions and peripheral interrupts

•In the LPC1759/58/56/54/52/51, the NVIC supports 33 vectored interrupts

•32 programmable interrupt priority levels, with hardware priority level masking

•Relocatable vector table

•Non-Maskable Interrupt (NMI)

•Software interrupt generation

7.7.2 Interrupt sources

Each peripheral devi ce has one interrupt line con nected to the NVIC but may have several

interrupt flags. Individual interrupt flags may also represent more than one interrupt

source.

Any pin on Port 0 and Port 2 (total of 30 pins) regardless of the selected function, can be

programmed to generate an interrupt on a rising edge, a falling edge, or both.

7.8 Pin connect block

The pin connect block allows selected pins of the microcontroller to have more than one

function. Configuration registers control the multiplexers to allow connection between the

pin and the on-chip peripherals.

Peripherals should be conn ected to the appro priate pins prior to being activated and pr ior

to any related interrup t(s) being enabled. Activity of any enabled peripheral function that is

not mapped to a related pin should be considered undefined.

Most pins can also be con figured as open- drain output s or to have a pull- up, pull-do wn, or

no resistor enabled.

7.9 General purpose DMA controller

The GPDMA is an AMBA AHB compliant peripheral allowing selected

LPC1759/58/56/54/52/51 peripherals to have DMA support.

The GPDMA enables peripheral-to-memory, memory-to-peripheral,

peripheral-to-peripheral, and memory-to-memory transactions. The source and

destination areas can each be either a memory region or a peripheral, and can be

accessed through the AHB master. The GPDMA controller allows data transfers between

the USB and Ethernet (LPC1758 only) controllers and the various on-chip SRAM areas.

The supported APB peripherals are SSP0/1, all UARTs, the I2S-bus interface, the ADC,

and the DAC. Two match signals for each timer can be used to trigger DMA transfers.

Remark: Note that the DAC is not available on the LPC1 752/51, and the I2S-bus inter face

is not available on the LPC1754/52/51.

Product data sheet Rev. 8 — 9 August 2012 17 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.9.1 Features

•Eight DMA channels. Each channel can support an unidirectional transfer.

•16 DMA request lines.

•Single DMA and burst DMA request signals. Each peripheral connected to the DMA

Controller can assert either a burst DMA request or a single DMA request. The DMA

burst size is set by programming the DMA Controller.

•Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and

periphera l-to -p e riphe ra l tra ns fe rs ar e su pp or te d.

•Scatter or gather DMA is supported through the use of linked lists. This means that

the source and destination areas do not have to occupy contiguous areas of memory.

•Hardware DMA channel priority.

•AHB slave DMA programming interface. The DMA Controller is programmed by

writing to the DMA control registers over the AHB slave interface.

•One AHB bus master for transferring data. The interface transfers data when a DMA

request goes active.

•32-bit AHB master bus width.

•Incrementing or non-incrementing addressing for source and destination.

•Programmable DMA burst size. The DMA burst size can be programmed to more

efficiently transfer data.

•Internal four-word FIFO per channel.

•Supports 8, 16, and 32-bit wid e tra n sactions.

•Big-endian and little-endian support. The DMA Controller defaults to little-endian

mode on reset.

•An interrupt to the pr ocessor ca n be gene rate d on a DMA comp letion or when a DMA

error has occurred.

•Raw interrupt status. The DMA error and DMA count raw interrupt status can be read

prior to masking.

7.10 Fast general purpose parallel I/O

Device pins that are not connected to a specific peripheral function are controlled by the

GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate

registers allow setting or clearing any nu mber of outp uts simultaneously. The value of the

output register may be read back as well as the current state of the port pins.

LPC1759/58/56/54/52/51 use accelerated GPIO functions:

•GPIO registers ar e accessed throug h the AHB mu ltila ye r bu s so th at th e fa ste st

possible I/O timing can be achieved.

•Mask registers allow treating sets of port bits as a group, leaving other bits

unchanged.

•All GPIO registers are byte and half-word addressable.

•Entire port value can be written in one instruction.

•Support for Cortex-M3 bit banding.

•Support for use with the GPDMA controller.

Product data sheet Rev. 8 — 9 August 2012 18 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Additionally, any pin on Port 0 and Port 2 (total of 42 pins) providing a digital function can

be programmed to generate an interrupt on a rising edge, a falling edge, or both. The

edge detection is asynchronous, so it may operate when clocks are not present such as

during Power-down mode. Each enabled interrupt can be used to wake up the chip from

Power-down mode.

7.10.1 Features

•Bit level set and clear registers allow a single instr uction to set or clear any nu mber of

bits in one port.

•Direction control of individual bits.

•All I/O default to inputs after reset.

•Pull-up/pull-down resistor configuration and open-drain configuration can be

programmed through the pin connect block for each GPIO pin.

7.11 Ethernet (LPC1758 only)

The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC

designed to provide optimized performance through the use of DMA hardware

acceleration. Features include a generous suite of control registers, half or full duplex

operation, flow control, control frames, hardware acceleration for transmit retry, receive

packet filtering an d wa ke-u p on LAN activity. Automatic frame transmissio n and recep tion

with scatter-gather DMA off-loads many operations from the CPU.

The Ethernet block and the CPU share the ARM Cortex-M3 D-code and system bus

through the AHB-multilayer matrix to access the various on-chip SRAM blocks for

Ethernet data, control, and status information.

The Ethernet block interfaces between an off-chip Ethernet PHY using the Reduced MII

(RMII) protocol an d the on-chip Media Independent Interface Management (MIIM) serial

bus.

The Ethernet block supports bus clock rates of up to 100 MHz.

7.11.1 Features

•Ethernet standards support:

–Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,

100 Base-FX, and 100 Base-T4.

–Fully compliant with IEEE standard 802.3.

–Fully compliant with 802.3x full duplex flow control and half duplex back pressure.

–Flexible transmit and receive frame options.

–Virtual Local Area Network (VLAN) frame support.

•Memory management:

–Independent transmit and receive buffers memory mapped to shared SRAM.

–DMA managers with scatter/gather DMA and arrays of frame descriptors.

–Memory traffic optimized by buffering and pre-fetchi ng.

•Enhanced Ethernet features:

Product data sheet Rev. 8 — 9 August 2012 19 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

–Receive filtering.

–Multicast and broadcast frame support for both transmit and receive.

–Optional automatic Frame Check Sequence (FCS) insertion with Cyclic

Redundancy Check (CRC) for transmit.

–Selectable automatic transmit frame padding.

–Over-length frame support for both transmit an d receive allows any length frames.

–Promiscuous receive mode.

–Automatic collision back-off and frame retransmission.

–Includes power management by clock switching.

–Wake-on-LAN power management support allows system wake-up: using th e

receive filters or a magic frame detection filter.

•Physical interface:

–Attachment of external PHY chip through standard RMII interface.

–PHY register access is available via the MIIM interface.

7.12 USB interface

The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a

host and one or more (up to 127) peripherals. The host controller allocates the USB

bandwidth to attached devices through a token-based protocol. The bus supports hot

plugging and dynamic configuration of the devices. All transactions are initiated by the

host controller.

The LPC1759/58/56/54 USB interface includes a device, Host, and OTG controller with

on-chip PHY for device an d Ho st fu nct ion s. The OTG switching protocol is sup po rt ed

through the use of an external controller. Details on typical USB interfacing solutions can

be found in Section 14.1. The LPC1752/51 include a USB device controller only.

7.12.1 USB device controller

The device controller enables 12 Mbit/s data exchange with a USB Host controller. It

consists of a register interface, serial interface engine, endpoint buffer memory, and a

DMA controller. The serial interface engi ne decodes the USB dat a stream a nd writes dat a

to the appropriate endpoint buffer. The status of a completed USB transfer or error

condition is indicated via status registers. An interrupt is also generated if enabled. When

enabled, the DMA controller transfers data between the endpoint buffer and the on-chip

SRAM.

7.12.1.1 Features

•Fully compliant with USB 2.0 specification (full speed).

•Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.

•Supports Control, Bulk, Interrupt and Isochronous endpoints.

•Scalable realization of endpoints at run time.

•Endpoint Maximum packet size selection (up to USB maximum specification) by

software at run time.

•Supports SoftConnect and GoodLink features.

Product data sheet Rev. 8 — 9 August 2012 20 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

•While USB is in the Suspend mode, the LPC1759/58/56/54/5 2/51 can enter one of the

reduced power modes and wake up on USB activity.

•Supports DMA transfers wi th all on -c hip SRAM blo cks on all non-contro l endpoin ts.

•Allows dynamic switching between CPU-controlled slave and DMA modes.

•Double buffer implementation for Bulk and Isochronous endpoints.

7.12.2 USB host controller (LPC1759/58/56/54 only).

The host controller ena bles full- and low-speed dat a exchange with USB devices attached

to the bus. It consists of a register interface, a serial interface engine, and a DMA

controller. The register interface complies with the Open Host Controller Interface (OHCI)

specification.

7.12.2.1 Features

•OHCI compliant.

•One downstream port.

•Supports port power switch in g .

7.12.3 USB OTG controller (LPC1759/58/56/54 only).

USB OTG is a supplement to the USB 2.0 specification that augments the capability of

existing mobile devices and USB peripherals by adding host functionalit y for connecti on to

USB peripherals.

The OTG Controller integrates the host controller, device controller, and a master-only

I2C-bus interface to implement OTG dual-role device functionality. The dedicate d I2C-bus

interface controls an external OTG transceiver.

7.12.3.1 Features

•Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision

1.0a.

•Hardware support for Host Negotiation Protocol (HNP).

•Includes a programmable timer required for HNP and Session Requ est Protocol

(SRP).

•Supports any OTG transceiver compliant with the OTG Transceiver Specification

(CEA-2011), Rev. 1.0.

7.13 CAN controller and acceptance filters

The Controller Area Network (CAN) is a serial communications protocol which efficiently

supports distributed real-time control with a very high level of security. Its domain of

application ranges from high-speed networks to low cost multiplex wiring.

The CAN block is intended to support multiple CAN buses simultaneously, allowing the

device to be used as a gateway, switch, or router among a number of CAN buses in

industrial or automotive applications.

Remark: LPC1754/52/51 have only one CAN bus.

Product data sheet Rev. 8 — 9 August 2012 21 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.13.1 Features

•One or two CAN controllers and buses.

•Data rates to 1 Mbit/s on each bus.

•32-bit register and RAM access.

•Compatible with CAN specification 2.0B, ISO 11898-1.

•Global Acceptance Filter recognizes standard (11-bit) and extended-frame (29-bit)

receive identifiers for all CAN buses.

•Acceptance Filter can provide FullC AN- style automatic reception for selected

Standard Identifiers.

•FullCAN messages can generate interrupts.

7.14 12-bit ADC

The LPC1759/58/56/54/52/51 contain one ADC. It is a single 12-bit successive

approximation ADC with six ch an nels an d DM A sup port .

7.14.1 Features

•12-bit successive approximation ADC.

•Input multiplexing among 6 pins.

•Power-down mode.

•Measurement range VREFN to VREFP.

•12-bit conver sio n rate : 200 kHz.

•Individual channels can be selected for conversion.

•Burst conversion mode for single or multiple inputs.

•Optional conversion on transition of input pin or Timer Match signal.

•Individual result registers for each ADC channel to reduce interrupt overhead.

•DMA support.

7.15 10-bit DAC (LPC1759/58/56/54 only)

The DAC allows to generate a variable analog output. The maximum output value of the

DAC is VREFP.

7.15.1 Features

•10-bit DAC

•Resistor string architecture

•Buffered output

•Power-down mode

•Selectable output drive

•Dedicated conversion timer

•DMA support

Product data sheet Rev. 8 — 9 August 2012 22 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.16 UARTs

The LPC1759/58/56/54/52/51 each conta in four UARTs. In addition to standard transmit

and receive data lines, UART1 also provides a full modem control handshake interface

and support for RS-485/9-bit mode allowing both software address detection and

automatic address detection using 9-bit mode.

The UARTs include a fractional baud rate generator. Standard baud rates such as

115200 Bd can be ach ieved with any crystal frequency above 2 MHz.

7.16.1 Features

•Maximum UART data bit rate of 6.25 Mbit/s.

•16 B Receive and Transmit FIFOs.

•Register locations conform to 16C550 industry standard.

•Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.

•Built-in fractional baud rate generator covering wide range of baud rates without a

need for external crystals of particular values.

•Fractional divider for baud rate control, auto baud capabilities and FIFO control

mechanism that enables soft ware flow control implementation.

•UART1 equipped with standard modem interface signals. This module also provides

full support for hardware flow control (auto-CTS/RTS).

•Support for RS-4 85 /9 -b it/EIA-485 mode (UART1).

•UART3 includes an IrDA mode to support infrared communication.

•All UARTs have DMA support.

7.17 SPI serial I/O controller

The LPC1759/58/56/54/52/51 contain one SPI controller. SPI is a full duplex seria l

interface designed to handle multiple masters and slaves connected to a given bus. Only

a single master and a single slave can communicate on the interface during a given data

transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the

slave, and the slave always sends 8 bits to 16 bits of data to the master.

7.17.1 Features

•Maximum SPI data bit rate of 12.5 Mbit/s

•Compliant with SPI specification

•Synchronous, serial, full duplex communication

•Combined SPI master and slave

•Maximum data bit rate of one eighth of the input clock rate

•8 bits to 16 bits per transfer

7.18 SSP serial I/O controller

The LPC1759/58/56/54/52/51 contain two SSP controllers. The SSP controller is capable

of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with mu ltip le ma st er s

and slaves on the bus. Only a single master and a single slave can communicate on the

Product data sheet Rev. 8 — 9 August 2012 23 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

bus during a given data transfer. The SSP supports full duplex transfers, with frames of

4 bits to 16 bits of data flowing from the master to the slave and from the slave to the

master. In practice, often only one of these data flows carries meaningful data.

7.18.1 Features

•Maximum SSP speed of 50 Mbit/s (master) or 8 Mbit/s (slave)

•Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National

Semiconductor Microwire buses

•Synchronous serial communication

•Master or slave operation

•8-frame FIFOs for both transmit and receive

•4-bit to 16-bit frame

•DMA transfers supp or te d by GPDM A

7.19 I2C-bus serial I/O controllers

The LPC1759/58/56/54/52/51 each conta in two I2C-bus controllers.

The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line

(SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and

can operate as either a r eceiver-o nly device ( e.g., an LCD driver) or a tra nsmitter with the

capability to both receive and send information (such as memory). Transmitters and/or

receivers can oper ate in eithe r master or sl ave mo de, dependin g on wheth er the chip has

to initiate a data transfer or is only addressed. The I2C is a multi-master bus an d ca n be

controlled by more than one bus master connected to it.

7.19.1 Features

•I2C1 and I2C2 use standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus).

•Easy to configure as master, slave, or master/slave.

•Programmable clocks allow versatile rate control.

•Bidirectional data transfer between masters and slaves.

•Multi-master bus (no central master).

•Arbitration between simultaneously transmitting masters without corruption of serial

data on the bus.

•Serial clock synchronization allows devices with different bit rates to communicate via

one serial bus.

•Serial clock synchronization can be used as a handshake mech anism to suspend and

resume serial transfer.

•The I2C-bus can be used for test and diagnostic purposes.

•Both I2C-bus controllers support multiple address recognition and a bus monitor

mode.

7.20 I2S-bus serial I/O controllers (LPC1759/58/56 only)

The I2S-bus provides a standard communication interface for digital audio applications.

Product data sheet Rev. 8 — 9 August 2012 24 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,

and one word select signal. The basic I2S connection has one master, which is always the

master, and one slave. The I2S-bu s int er fa ce pr ovides a separate transm it an d re ce ive

channel, each of which can operate as either a master or a slave.

7.20.1 Features

•The interface has sep arate input/output channels each of which can o perate in master

or slave mode.

•Capable of handling 8-bit, 16-bit, and 32-bit word sizes.

•Mono and stereo audio data supported.

•The sampling frequency can range from 16 kHz to 96 kHz (16, 22.05, 32, 44.1, 48,

96) kHz.

•Support for an aud io ma st er clock.

•Configurable word select period in master mode (separately for I2S input and output).

•Two 8-word FIFO data buffers are provided, one for transmit and one for receive.

•Generates interrupt requests when buffer levels cross a programmable boundar y.

•Two DMA requests, controlled by programmable buffer levels. These are connected

to the GPDMA block.

•Controls include reset, stop and mute options separately for I2S input and I2S output.

7.21 General purpose 32-bit timers/external event counters

The LPC1759/58/56/54/52/51 include four 32-bit timer/counters. The timer/counter is

designed to count cycles of the system derived clock or an externally-sup plied clock. It

can optionally generate interr upts, generate timed DMA request s, or perform other actions

at specified timer values, based on four match registers. Each timer/counter also includes

two capture inputs to trap the timer value when an input signal transitions, optionally

generating an interrupt.

7.21.1 Features

•A 32-bit timer/counter with a programmable 32-bit prescaler.

•Counter or timer op er a tion .

•Two 32-bit capture channels per timer, that can take a snapshot of the timer value

when an input signal transitions. A capture event may also generate an interrupt.

•Four 32-bit matc h re gist er s tha t allo w:

–Continuous operation with optional interrupt generation on match.

–Stop timer on match with optional interr upt generation.

–Reset timer on match with optional interrupt generation.

•Up to four external outputs corresponding to match registers, with the following

capabilities:

–Set LOW on match.

–Set HIGH on match.

–Toggle on match.

–Do nothing on match.

Product data sheet Rev. 8 — 9 August 2012 25 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

•Up to two match registers can be used to generate timed DMA requests.

7.22 Pulse width modulator

The PWM is based on the standard Timer block and inherits all of its features, although

only the PWM function is pinned out on the LPC1759/58/56/54/52/51. The T imer is

designed to count cycles of the syste m d erive d clock an d optionally switch pins, generate

interrupts or perform ot he r ac tion s wh en spe cifie d tim er values occur, based on seven

match registers. The PWM function is in addition to these features , and is based on match

The ability to separately control rising and falling edge locations allows the PWM to be

used for more applications. For instance, multi-phase motor control typica lly requires

three non-overlapping PWM outputs with individual control of all three pulse widths and

positions.

Two match registers can be used to provide a single edge controlled PWM output. One

match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon

match. The other match register controls the PWM edge position. Additional single edge

controlled PWM ou tp u ts require only on e m atc h register each, since the repetition rate is

the same for all PWM outputs. Multiple single edge controlled PWM output s will all have a

rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.

Three match registers can be used to provide a PWM output with both edge s co ntr o lled .

Again, the PWMMR0 match register controls the PWM cycle rate. The other match

registers control the two PWM edge positions. Additional double edge controlled PWM

outputs require only two match registers each, since the repetition rate is the same for all

PWM outputs.

With double edge controlled PWM outputs, specific match registers control the rising and

falling edge of the output. This allows both positive going PWM pulses (when the rising

edge occurs prior to the falling edge), and negative going PWM pulses (when the falling

edge occurs prior to the rising edge).

7.22.1 Features

•LPC1759/58/56/54/52/51 has one PWM block with Counter or Timer operation (may

use the peripheral clock or one of the capture inputs as the clock source).

•Seven match registers allow up to 6 single edge controlled or 3 double edge

controlled PWM outputs, or a mix of both types. The match registers also allow:

–Continuous operation with optional interrupt generation on match.

–Stop timer on match with optional interr upt generation.

–Reset timer on match with optional interrupt generation.

•Supports single edge controlled and/or double edge controlled PWM outputs. Single

edge controlled PWM outputs all go high at the beginning of each cycle unless the

output is a constant low. Double edge controlled PWM outputs can have either edge

occur at any position within a cycle. This allows for both positive going and negative

going pulses.

•Pulse period and width can be any number of timer counts. This allows complete

flexibility in the trade-off between resolution and repetition rate. All PWM outputs will

occur at the same repetition rate.

Product data sheet Rev. 8 — 9 August 2012 26 of 76

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32-bit ARM Cortex-M3 microcontroller

•Double edge controlled PWM outputs can be programmed to be either positive going

or negative going pulses.

•Match register updates are synchronized with pulse outputs to prevent ge ne ra tion of

erroneous pulses. Sof tware must ‘release’ new ma tch values before they ca n become

effective.

•May be used as a stand ard 32-bit timer /counte r with a progra mmable 32-bit p rescaler

if the PWM mode is not enabled.

7.23 Motor control PWM

The motor control PWM is a specialized PWM supporting 3-phase motors and other

combinations. Feedback inputs ar e provided to automatically sense rotor position and use

that information to ramp speed up or down. At the same time, the motor control PWM is

highly configurable for other generalized timing, counting, capture, and compare

applications.

7.24 Quadrature Encoder Interface (QEI)

A quadrature encoder, also known as a 2-channel incremental encoder, converts angular

displacement into two pulse signals. By monitoring both the number of pulses and the

relative phase of the two sign als, th e use r can track the position, direction of rotation, and

velocity. In addition, a third channel, or index signal, can be used to reset the position

counter. The quadrature encoder interface decodes the digital pulses from a quadrature

encoder wheel to integrate position over time and determine direction of rotation. In

addition, the QEI can capture the velocity of the encoder wheel.

7.24.1 Features

•Tracks encoder position.

•Increments/decrements depending on direction.

•Programmable for 2 or 4 position counting.

•Velocity capture using built-in timer.

•Velocity compare function with “less than” inter rupt.

•Uses 32-bit regis ter s for po sitio n an d ve loc ity.

•Three position co mpare registers with interrup ts.

•Index counter for revolution counting.

•Index compare registe r w ith int er ru p ts.

•Can combine index and position interrupts to produce an interrupt for whole and

partial revolution displacement.

•Digital filter with programmable delays for encoder input signals.

•Can accept decoded signal inputs (clk and direction).

•Connected to APB.

Product data sheet Rev. 8 — 9 August 2012 27 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.25 Repetitive Interrupt (RI) timer

The repetitive interrupt timer provides a free-running 32-bit counter which is compared to

a selectable value, generating an interrupt when a match occurs. Any bits of the

timer/compare can be masked such that they do not contribute to the match detection.

The repetitive interrupt timer can be used to create an interrupt that repeats at

predetermined intervals.

7.25.1 Features

•32-bit counter running from PCLK. Counter can be free-running or be reset by a

generated interrupt.

•32-bit compare value.

•32-bit compare mask. An interrupt is generated when the counter value equals the

compare value, after masking. This allows for combinations not possible with a simple

compare.

7.26 ARM Cortex-M3 system tick timer

The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate

a dedicated SYSTICK exception at a 10 ms interval. In the LPC1759/58/56/54/52/51, this

timer can be clocked from the internal AHB clock or from a device pin.

7.27 Watchdog timer

The purpose of the watchdog is to reset the mi crocontroller within a reasonable amount of

time if it enters an erroneous state. When enabled, the watchdog will generate a system

reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined

amount of time.

7.27.1 Features

•Internally resets chip if not periodically reloaded.

•Debug mode.

•Enabled by soft ware but requires a har dware reset or a watchdog reset/interrupt to be

disabled.

•Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.

•Flag to indicate watchdog reset.

•Programmable 32-bit timer with internal prescaler.

•Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 232 4) in

multiples of Tcy(WDCLK) 4.

•The Watchdog Clock (WDCLK) source can be selected from the Internal RC (IRC)

oscillator, the RTC oscillator, or the APB peripheral clock. This gives a wide range of

potential timing choices of Watchdog operation under different powe r reduction

conditions. It also provides the ability to run the WDT from an entirely internal source

that is not dep endent on an external crystal a nd its associated compon ents and wirin g

for increased reliability.

•Includes lock/safe feature.

Product data sheet Rev. 8 — 9 August 2012 28 of 76

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32-bit ARM Cortex-M3 microcontroller

7.28 RTC and backup registers

The RTC is a set of counte rs for measur ing time when system power is on, and optio nally

when it is off. The RTC on the LPC1759/58/56/54/52/51 is designed to have extremely low

power consum p tion , i.e. less than 1 A. The RTC will typically run from the main chip

power supply, conserving battery power while the rest of the device is powered up. When

operating from a battery, the RTC will continue working down to 2.1 V. Battery power can

be provided from a standard 3 V Lithium button cell.

An ultra-low power 32 kHz oscillator will provide a 1 Hz clock to the time counting portion

of the RTC, moving most of the power consumption out of the time counting function.

The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way

that will provide less than 1 second per day error when operated at a const ant voltage and

temperature.

The RTC contains a small set of backup registers (20 bytes) for holding data while the

main part of the LPC1759/58/56/54/52/51 is powered off.

The RTC includes an alarm function that can wake up the LPC1759 /58/56/54/52/51 from

all reduced power modes with a time resolution of 1 s.

7.28.1 Features

•Measures the passage of time to maintain a calendar and clock.

•Ultra low power design to support battery powered systems.

•Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and

Day of Year.

•Dedicated power supply pin can be connected to a battery or to the main 3.3 V.

•Periodic interrup t s can be gene rated from in crement s of any fie ld of th e time registe rs.

•Backup registe rs (2 0 by te s) po we re d by VBAT.

•RTC power supply is isolated from the rest of the chip.

7.29 Clocking and power control

7.29.1 Crystal oscillators

The LPC1759/58/56/54/52/51 include three independent oscillators. These are the main

oscillator, the IRC oscillator, and the RTC oscillator. Each oscillator can be used for more

than one purpose as required in a particular application. Any of the three clock sources

can be chosen by software to drive the main PLL and ultimately the CPU.

Following reset, the LPC1759/58/56/54/52/51 will operate from the Internal RC oscillator

until switched by software. This allows systems to operate without any external crystal a nd

the bootloader code to operate at a known frequency.

See Figure 4 for an overview of the LPC1759/58/56/54/52/51 clock generation.

Product data sheet Rev. 8 — 9 August 2012 29 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.29.1.1 Internal RC oscillator

The IRC may be used as the clock so urce for th e WDT, and/or as the clock that drives the

PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is

trimmed to 1 % accuracy over the entire voltage and temperature range.

Upon power-up or any chip reset, the LPC1759/58/56/54/52/51 use the IRC as the clock

source. Software may later switch to one of the other available clock sources.

7.29.1.2 Main oscillator

The main oscillator can be used as the clock source for the CPU, with or withou t using the

PLL. The main oscillator also provides the clock source for the dedicated USB PLL.

The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be

boosted to a highe r fr equen cy, up to the maxi mum CPU o pe rating fre que ncy, by the main

PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock

frequency is referred to as CCLK elsewhere in this document. The frequencies of

PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The

clock frequency for each peripheral can be selected individually and is referred to as

PCLK. Refer to Section 7.29.2 for additional information.

7.29.1.3 RTC oscillator

The RTC oscillator can be used as the clock source for the RTC block, the main PLL,

and/or the CPU.

Fig 4. LPC1759/58/56/54/52/51 clocking generation block diag ra m

MAIN

OSCILLATOR

INTERNAL

OSCILLATOR

RTC

OSCILLATOR

MAIN PLL

WATCHDOG

TIMER

REAL-TIME

CLOCK

CPU

CLOCK

DIVIDER

PERIPHERAL

CLOCK

GENERATOR

USB BLOCK

ARM

CORTEX-M3

ETHERNET

BLOCK

DMA

GPIO

NVIC

USB

CLOCK

DIVIDER

system

clock

select

(CLKSRCSEL)

USB clock config

(USBCLKCFG)

CPU clock config

(CCLKCFG)

pllclk

CCLK/8

CCLK/6

CCLK/4

CCLK/2

CCLK

pclkWDT

rtclk = 1Hz

usbclk

(48 MHz)

cclk

USB PLL

USB PLL enable

main PLL enable

32 kHz

APB peripherals

LPC17xx

002aad947

Product data sheet Rev. 8 — 9 August 2012 30 of 76

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32-bit ARM Cortex-M3 microcontroller

7.29.2 Main PLL (PLL0)

The PLL0 accepts an input clock frequency in the range of 32 kHz to 25 MHz. The input

frequency is multiplied up to a high frequency, then divided down to provide the actual

clock used by the CPU and/or the USB block.

The PLL0 input, in the range of 32 kHz to 25 MHz, may initially be divided down by a

value ‘N’, which may be in the range of 1 to 256. This input division provides a wide range

of output frequencies from the same input frequency.

Following the PLL0 input divider is the PLL0 multiplier. This can multiply the input divider

output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the

range of 1 through 32768. The resulting freq uency must be in the range of 275 MHz to

550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a

phase-frequency detector to compare the divided CCO output to the multiplier input. The

error value is used to adjust the CCO frequency.

The PLL0 is turned off and bypassed following a chip Reset and by entering Power-down

mode. PLL0 is enabled by software only. The program must configure and activate the

PLL0, wait for the PLL0 to lock, and then connect to the PLL0 as a clock source.

7.29.3 USB PLL (PLL1)

The LPC1759/58/56 /5 4/52/5 1 con tain a second, dedicated USB PLL1 to pr ovide clocking

for the USB interface.

The PLL1 receives its clock input from the main oscillator only and provides a fixed

48 MHz clock to the USB block only . The PLL1 is disabled and powered of f on reset. If the

PLL1 is left disabled, the USB clock will be supplied by the 48 MHz clock from the main

PLL0.

The PLL1 accepts an input clock frequency in the range of 10 MHz to 25 MHz only. The

input frequency is multiplied up the range of 48 MHz for the USB clock using a Current

Controlled Oscillators (CCO). It is insured that the PLL1 output has a 50 % duty cycle.

7.29.4 Wake-up timer

The LPC1759/58/56/54/52/51 begin operatio n at power-up and when awakened from

Power-down mode by using the 4 MHz IRC oscillator as the clock source. This allows chip

operation to resume quickly. If the main oscillator or the PLL is needed b y the application,

software will need to enable these features and wait for them to stabilize before they are

used as a clock source.

When the main oscillator is initially activate d, the wake-up timer allows sof tware to e nsure

that the main oscillator is fully functional before the processor uses it as a clock source

and starts to execute instructions. This is important at power on, all types of Reset, and

whenever any of the aforementioned functions are turned off for any reason. Since the

oscillator and other functions are turned off during Power-down mode, any wake-up of the

processor from Power-down mode makes use of the wake-up Timer.

The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin

code execution. When power is applied to the chip, or when some eve nt caused the chip

to exit Power-down mode, some time is required for the oscillator to produce a signal of

sufficie nt amplitude to drive the clock logic. The amount of time d epends on many factors,

including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its

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32-bit ARM Cortex-M3 microcontroller

electrical characteristics (if a q uartz cr yst al is used) , as well as any other external cir cuitry

(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient

conditions.

7.29.5 Power control

The LPC1759 /5 8/ 56/5 4/ 52 /5 1 su pp or t a vari et y of po we r con tr ol feat ur es. There are four

special modes of processor power reduction: Sleep mode, Deep-sleep mode,

Power-down mode, and Deep power-down mode. The CPU clock rate may also be

controlled as needed by changing clock sources, reconfiguring PLL va lues, and/or altering

the CPU clock divider value. This allows a trade-off of power versus processing speed

based on application requirements. In addition, Peripheral Power Control allows shutting

down the clocks to individual on-chip periphe rals, allowing fine tuning of power

consumption by eliminating all dynamic power use in any pe ripherals that are not required

for the application. Each of the peripherals has its own clock divider which provides even

better power control.

Integrated PMU (Power Management Unit) automatically adjust internal regulators to

minimize power consumption during Sleep, Deep sleep, Power- down, and Deep

power-down modes.

The LPC1759/58/56/54/52/51 also implement a separate power domain to allow turning

off power to the bulk of the device while maint a ining op er ation of the RTC and a small set

of registers for storing data during any of the power-down modes.

7.29.5.1 Sleep mode

When Sleep mode is entered, the clock to the core is stoppe d. Resumption from the Sleep

mode does not need any special sequence but re-enabling the clock to the ARM core.

In Sleep mode, execution of instructions is suspended until either a Reset or interrupt

occurs. Peripheral functions continue operation during Sleep mode and may generate

interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic

power used by the processor itself, memory systems and related controllers, and internal

buses.

7.29.5.2 Deep-sleep mode

In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks.

The processor state and registers, peripheral registers, and internal SRAM value s ar e

preserved throughout Deep-sleep mode and the logic levels of chip pins remain static.

The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later .

The RTC oscillator is not stopped because the RTC interrupts may be used as the

wake-up source. The PLL is automatically turned off and disconnected. The CCLK and

USB clock dividers automatically get reset to zero.

The Deep-sleep mode can be terminated and normal operation resumed by either a

Reset or certain specific interrupts that are able to function without clocks. Since all

dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power

consumptio n to a ve ry low value . Pow er to the flash memory is left on in Deep -sleep

mode, allowing a very quick wake-up.

Product data sheet Rev. 8 — 9 August 2012 32 of 76

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32-bit ARM Cortex-M3 microcontroller

On wake-up from Deep-sleep mode, the code execution and peripherals activities will

resume after 4 cycles expire if the IRC was used before enterin g Deep- sleep mode. If the

main external oscillator was used, the code execution will resume when 4096 cycles

expire. PLL and clock dividers need to be reconfigured accordingly.

7.29.5.3 Power-down mode

Power-down mode does everything that Deep-sleep mode does, but also turns off the

power to the IRC oscillator and the flash memory. This saves more power but requires

waiting for resumption of flash operation before execution of code or data access in the

flash memory can be accomplished.

On the wake-up of Power-down mode, if the IRC was used before entering Power-down

mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire before the code

execution can then be resumed if the code was running from SRAM. In the meantime, the

flash wake-up timer then coun ts 4 MHz IRC clock cycle s to make the 100 s flash st art-up

time. When it times out, access to the flash will be allowed. Users need to reconfigure the

PLL and clock dividers accordingly.

7.29.5.4 Deep power-down mode

The Deep power-down mode can only be entered from the RTC block. In Deep

power-down mode, power is shut off to the entire chip with the exception of the RTC

module and the RESET pin.

The LPC1759/58/56/54/52/51 can wake up from Deep power-down mode via the RESET

pin or an alarm match event of the RTC.

7.29.5.5 Wakeup interrupt controller

The W akeup Interrupt Controller (WIC) allows the CPU to automatically wake up from any

enabled priority interrupt that can occur while the clocks are stopped in Deep sleep,

Power-down, and Deep power-down modes.

The Wakeup Interrupt Controller (WIC) works in connection with the Nested Vectored

Interrupt Controller (NVIC). When the CPU enters Deep sleep, Power-down, or Deep

power-down mode, the NVIC sends a mask of the current interrupt situation to the

WIC.This mask includes a ll of th e interrup t s that are both enabled and of sufficient priority

to be serviced immediately. With this information, the WIC simply notices when one of the

interrupts has occurred and then it wakes up the CPU.

The Wakeup Interrupt Controller (WIC) eliminates the need to periodi cally wake up the

CPU and poll the interrupts resulting in additional power savings.

7.29.6 Peripheral power control

A power control for peripherals feature allows individual peripherals to be turned off if they

are not needed in the application, resulting in additional power savings.

7.29.7 Power domains

The LPC1759/58/56/54 /52/51 provide two independ ent power domains that allow the bulk

of the device to have power removed while maintaining operation of the RTC and the

backup Registers.

Product data sheet Rev. 8 — 9 August 2012 33 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

On the LPC1759/58/56/54/52/51, I/O pads are po wered by the 3.3 V (VDD(3V3)) pins, while

the VDD(REG)(3V3) pin powers the on-chip vo lt age r egulator which in turn provide s powe r to

the CPU and most of the peripherals.

Depending on the LPC1759/58/56/54/52/51 application, a design can use two power

options to manage power consumption.

The first option assumes that power consumption is not a conce rn and th e design ties the

VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power

supply for both pads, the CPU, and peripherals. While this solution is simple, it does not

support powering do wn the I/O pad ring “on the fly” while keeping the CPU and

peripherals alive.

The second option uses two power supplie s; a 3.3 V supply for the I/O pads (V DD(3V3)) and

a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator

powered independently from the I/O pad ring enables sh utting do wn of the I/O p a d power

supply “on the fly”, while the CPU and peripherals stay active.

The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of

power to operate, which can be supplied by an external battery. The device core power

(VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. Therefore,

there is no power drain from the RTC battery when VDD(REG)(3V3) is available.

Product data sheet Rev. 8 — 9 August 2012 34 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.30 System control

7.30.1 Reset

Reset has four sources on the LPC17xx: the RESET pin, the Watchdog reset, power-on

reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt

trigger input pin. Assertion of chip Reset by any source, once the operating volt age attains

a usable level, causes the RSTOUT pin to go LOW and starts the wake-up timer (see

description in Section 7.29.4). The wake-up timer ensures that reset remains asserted

until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks

have passed, and the flash controller has completed its initialization. Once reset is

de-asserted, or, in case of a BOD-triggered reset, once the voltage rises above the BOD

threshold, the RSTOUT pin goes HIGH.

When the internal Reset is removed, the processor begins executing at address 0, which

is initially the Reset vector mapped from the boot block. At that point, all of the processor

and peripheral registers have been initialized to predetermined values.

Fig 5. Power distribu tio n

REAL-TIME CLOCK

BACKUP REGISTERS

REGULATOR

32 kHz

OSCILLATOR

RTC POWER DOMAIN

MAIN POWER DOMAIN

002aad978

RTCX1

VBAT

DD(REG)(3V3)

RTCX2

DD(3V3)

to memories,

peripherals,

oscillators,

PLLs

to core

to I/O pads

ADC

DAC

ADC POWER DOMAIN

DDA

VREFP

VREFN

SSA

LPC17xx

ULTRA LOW-POWER

REGULATOR

POWER

SELECTOR

Product data sheet Rev. 8 — 9 August 2012 35 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.30.2 Brownout detection

The LPC1759/58/56/54/52/51 include 2-stage monitoring of the voltage on the

VDD(REG)(3V3) pins. If this voltage falls below 2.2 V, the BOD asserts an interrupt signal to

the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt

Enable Register in the NVIC in order to ca use a CPU interrupt; if not, software can monitor

the signal by reading a dedicated status register.

The second stage of low-voltage detection asserts reset to inactivate the

LPC1759/58/56/54/52/51 when the volta ge on the VDD(REG)(3V3) pins falls below 1.85 V.

This reset prevents alteration of the flash as operation of the various elemen ts of the chip

would otherwise become unreliable due to low voltage. The BOD circuit maintains this

reset down below 1 V, at which point the power-on reset circuitry maintains the overall

reset.

Both the 2.2 V and 1.85 V thresholds include some hysteresis. In normal operation, this

hysteresis allows the 2.2 V detection to reliably interrupt, or a regularly executed event

loop to sense the condition.

7.30.3 Code security (Code Read Protection - CRP)1

This feature of the LPC1759/58/56/54/52/51 allows user to enable different levels of

security in the syste m so that access to the on- chip flash and use of the JTAG and ISP

can be restricted. When needed, CRP is invoked by programming a specific pattern into a

dedicated flash location. IAP commands are not affected by the CRP.

There are three levels of the Code Read Protection.

CRP1 disables access to chip via the JTAG and allows partial flash update (excluding

flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is

required and flash field updates are needed but all sectors can not be erased.

CRP2 disables ac ce ss to chip via th e JTAG and only allows full fla sh er as e an d upd at e

using a reduced set of the ISP commands.

Running an application with level CRP3 selected fully disables any access to chip via the

JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too.

It is up to the user’s application to provide (if needed) flash update mechanism using IAP

calls or call reinvoke ISP command to enable flash update via UART0.

7.30.4 APB interface

The APB peripherals are split into two separate APB buses in order to distribute the bus

bandwidth and thereby reducing stalls caused by contention between the CPU and the

GPDMA controller.

1. LPC1751FBD80 with device ID 25001110 does not support CRP feature. LPC1751FBD80 with device ID 25001118 does support

CRP. See errata note in ES_LPC1751.

CAUTION

If level three Code Read Protection (CRP3) is selected, no future factory testing can be

performed on the device.

Product data sheet Rev. 8 — 9 August 2012 36 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

7.30.5 AHB multilayer matrix

The LPC1759/58/56/54/52/51 use an AHB multilayer matrix. This matrix connects the

instruction (I-code) and data (D-code) CPU buses of the ARM Cortex-M3 to the flash

memory, the main (32 kB) static RAM, and the Boot ROM. The GPDMA can also access

all of these memories. The peripheral DMA controllers, Ethernet (LPC1758 only) and

USB, can access all SRAM blocks. Additionally, the matrix connects the CPU system bus

and all of the DMA controllers to the various peripheral functions.

7.30.6 External interrupt inputs

The LPC1759/58/56/54/52/51 include up to 30 edge sen sitive interrupt inputs comb ined

with one level sensitive external interrupt input as selectable pin function. The external

interrupt input can optionally be used to wake up the processor from Power-down mode.

7.30.7 Memory mapping control

The Cortex-M3 incorp orates a mechanism that allows remapping the interrupt vector table

to alternate locations in the memory map. This is controlled via the Vector Table Offset

The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address

space. The vector table must be located on a 128 word (512 byte) boun dary because the

NVIC on the LPC1759/58/56/54/52/51 is configured for 128 total interrupts.

7.31 Emulation and debugging

Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire deb ug a nd

trace functions are supported in addition to a standard JTAG debug and parallel trace

functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four

watch points.

Product data sheet Rev. 8 — 9 August 2012 37 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

8. Limiting values

[1] The following applies to the limiting values:

a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive

static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated

maximum.

b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless

otherwise noted.

[2] Including voltage on outputs in 3-state mode.

[3] Not to exceed 4.6 V.

[4] Dependent on package type.

[5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1]

Symbol Parameter Conditions Min Max Unit

VDD(3V3) supply voltage (3.3 V) external rail 2.4 3.6 V

VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.6 V

VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V

Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V

Vi(VREFP) input voltage on pin VREFP 0.5 +4.6 V

VIA analog input voltage on ADC related

pins 0.5 +5.1 V

VIinput voltage 5 V tolerant I/O

pins; only valid

when the VDD(3V3)

supply voltage is

present

[2] 0.5 +5.5 V

other I/O pins [2][3] 0.5 VDD(3V3) +

0.5 V

IDD supply current per supply pin - 100 mA

ISS ground current per ground pin - 100 mA

Ilatch I/O latch-up current (0.5VDD(3V3)) < VI

< (1.5VDD(3V3));

Tj < 125 C

- 100 mA

Tstg storage temperature [4] 65 +150 C

Ptot(pack) total power dissipation (per package) based on package

heat transfer, not

device power

consumption

-1.5W

VESD electrostatic discharge voltage human body

model; all pins [5] 4000 +4000 V

Product data sheet Rev. 8 — 9 August 2012 38 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

9. Thermal characteristics

9.1 Thermal characteristics

The average chip junction temperature, TJ (C), can be calculated using the following

equation:

(1)

•Tamb = ambient temperature (C),

•Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)

•PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is of ten small and ma ny times can be n egligible. However it can be significant

in some applications.

TJTamb PDRth j a–

+=

Table 5. Ther mal characteristics

VDD = 2.4 V to 3.6 V; Tamb =





C to +85



C unless otherwise specified;

Symbol Parameter Conditions Min Typ Max Unit

Tj(max) maximum junction

temperature --125 C

Product data sheet Rev. 8 — 9 August 2012 39 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

10. Static characteristics

Table 6. Static characteristics

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Supply pins

VDD(3V3) supply voltage (3.3 V) external rail [2] 2.4 3.3 3.6 V

VDD(REG)(3V3) regulator supply voltage

(3.3 V) 2.4 3.3 3.6 V

VDDA analog 3.3 V pad supply

voltage 2.7 3.3 3.6 V

Vi(VBAT) input voltage on pin

VBAT [3] 2.1 3.3 3.6 V

Vi(VREFP) input voltage on pin

VREFP 2.7 3.3 VDDA V

IDD(REG)(3V3) regulator supply current

(3.3 V) active mode; code

while(1){}

executed from flash; all

peripherals disabled;

PCLK = CCLK⁄8

CCLK = 12 MHz; PLL

disabled [4][5] -7-mA

CCLK = 100 MHz; PLL

enabled [4][5] -42-mA

CCLK = 100 MHz; PLL

enabled (LPC1759) [4][6] 50

CCLK = 120 MHz; PLL

enabled (LPC1759) [4][6] -67-mA

Sleep mode [4][7] -2-mA

Deep sleep mode [4][8] -240-A

Power-down mode [4][8] -31-A

Deep power-down mode;

RTC running [9] -630-nA

IBAT battery supply current Deep power-down mode;

RTC running

VDD(REG)(3V3) present [10] -530-nA

VDD(REG)(3V3) not

present [11] -1.1 - A

IDD(IO) I/O supply current Deep sleep mode [12] -40-nA

Power-down mode [12] -40-nA

Deep power-down mode [12] -10-nA

Product data sheet Rev. 8 — 9 August 2012 40 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

IDD(ADC) ADC supply current active mode;

ADC powered

[13][14] -1.95-mA

ADC in Power-down

mode [13][15] -<0.2-A

Deep sleep mode [13] -38-nA

Power-down mode [13] -38-nA

Deep power-down mode [13] -24-nA

II(ADC) ADC input current on pin VREFP

Deep sleep mode [16] -100-nA

Power-down mode [16] -100-nA

Deep power-down

mode [16] -100-nA

Standard port pins, RESET

IIL LOW-level input current VI= 0 V; on-chi p pull-up

resistor disabled - 0.5 10 nA

IIH HIGH-level input

current VI=V

DD(3V3); on-chip

pull-down resistor

disabled

- 0.5 10 nA

IOZ OFF-state output

current VO=0V; V

O=V

DD(3V3);

on-chip pull-up/down

resistors disabled

- 0.5 10 nA

VIinput voltage pin configured to provide

a digital function [17][18]

[19] 0- 5.0V

VOoutput voltage output active 0 - VDD(3V3) V

VIH HIGH-level input

voltage 0.7VDD(3V3) --V

VIL LOW-level input voltage - - 0.3VDD(3V3) V

Vhys hysteresis voltage 0.4 - - V

VOH HIGH-level output

voltage IOH =4 mA VDD(3V3) 

0.4 --V

VOL LOW-level output

voltage IOL =4 mA --0.4V

IOH HIGH-level output

current VOH =V

DD(3V3) 0.4 V 4--mA

IOL LOW-level output

current VOL =0.4V 4--mA

IOHS HIGH-level short-circuit

output current VOH =0V [20] --45 mA

IOLS LOW-level short-circuit

output current VOL =V

DD(3V3) [20] --50mA

Ipd pull-down current VI=5V 10 50 150 A

Ipu pull-up current VI=0V 15 50 85 A

VDD(3V3) <V

I<5V 000A

Table 6. Static characteristics …continued

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 8 — 9 August 2012 41 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.

[2] For USB operation 3.0 V  VDD((3V3)  3.6 V. Guaranteed by design.

[3] The RTC typically fails when Vi(VBAT) drops below 1.6 V.

[4] VDD(REG)(3V3) = 3.3 V; Tamb =25C for all power consumption measurements.

[5] Applies to LPC1758, LPC1756, LPC1754, LPC1752, LPC1751.

[6] Applies to LPC1759 only.

[7] IRC running at 4 MHz; main oscillator and PLL disabled; PCLK = CCLK8.

[8] BOD disabled.

[9] On pin VDD(REG)(3V3). IBAT = 530 nA. VDD(REG)(3V3) = 3.0 V; VBAT = 3.0 V; Tamb =25C.

[10] On pin VBAT. IDD(REG)(3V3) = 630 nA. VDD(REG)(3V3) = 3.0 V; VBAT = 3.0 V. Tamb =25C.

[11] On pin VBAT. VBAT = 3.0 V. Tamb =25C.

[12] All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb =25C.

[13] VDDA = 3.3 V; Tamb =25C.

[14] The ADC is powered if the PDN bit in the AD0CR register is set to 1. See LPC17xx user manual UM10360.

Oscillator pins

Vi(XTAL1) input voltage on pin

XTAL1 0.5 1.8 1.95 V

Vo(XTAL2) output voltage on pin

XTAL2 0.5 1.8 1.95 V

Vi(RTCX1) input voltage on pin

RTCX1 0.5 - 3.6 V

Vo(RTCX2) output voltage on pin

RTCX2 0.5 - 3.6 V

USB pins

IOZ OFF-state output

current 0V<V

I<3.3V [2] --10 A

VBUS bus supply voltage [2] --5.25V

VDI differential input

sensitivity voltage (D+) (D)[2] 0.2--V

VCM differential common

mode voltage range includes VDI range [2] 0.8 - 2.5 V

Vth(rs)se single-ended recei v er

switching threshold

voltage

[2] 0.8 - 2.0 V

VOL LOW-level output

voltage for

low-/full-speed

RL of 1.5 k to 3.6 V [2] --0.18V

VOH HIGH-level output

voltage (driven) for

low-/full-speed

RL of 15 k to GND [2] 2.8 - 3.5 V

Ctrans transceiver capacitance pin to GND [2] --20pF

ZDRV driver output

impedance for driver

which is not high-speed

capable

with 33  series resistor;

steady state drive [21][2] 36 - 44.1 

Table 6. Static characteristics …continued

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 8 — 9 August 2012 42 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

[15] The ADC is in Power-down mode if the PDN bit in the AD0CR register is set to 0. See LPC17xx user manual UM10360.

[16] Vi(VREFP) = 3.3 V; Tamb =25C.

[17] Including voltage on outputs in 3-state mode.

[18] VDD(3V3) supply voltages must be present.

[19] 3-state outputs go into 3-state mode in Deep power-down mode.

[20] Allowed as long as the current limit does not exceed the maximum current allowed by the device.

[21] Includes external resistors of 33 1 % on D+ and D.

10.1 Power consumption

Conditions: VDD(Reg)(3V3) = 3.3 V; BOD disabled.

Fig 6. Deep-sleep mode: Typical regulato r supply current IDD(Reg)(3V3) versus

temperature

002aaf568

temperature (°C)

−40 853510 60−15

250

350

300

400

IDD(Reg)(3V3)

(μA)

200

3.6 V

3.3 V

2.4 V

Product data sheet Rev. 8 — 9 August 2012 43 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Conditions: VDD(Reg)(3V3) = 3.3 V; BOD disabled.

Fig 7. Pow e r-down mode: Typical regulator supply current IDD(Reg)(3V3) versus

temperature

Conditions: VDD(REG)(3V3) floating; RTC running.

Fig 8. Deep power-down mode: Typical battery supply current IBAT versus temperature

002aaf569

120

temperature (°C)

−40 853510 60−15

IDD(Reg)(3V3)

(μA)

3.6 V

3.3 V

2.4 V

002aag119

1.0

1.4

1.8

0.6

temperature (°C)

-40 853510 60-15

IBAT)

(μA)

Vi(VBAT) = 3.6 V

3.3 V

3.0 V

2.4 V

Product data sheet Rev. 8 — 9 August 2012 44 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Conditions: VBAT = 3.0 V; VDD(REG)(3V3) = 3.0 V; RTC running.

Fig 9. Deep power-down mode: Typical regulator supply cu rrent IDD(REG)(3V3) and battery

supply current IBAT versus te mperature

002aag120

temperature (°C)

-40 853510 60-15

0.8

1.6

0.4

1.2

2.0

IDD(REG)(3V3)

IBAT

IDD(REG)(3V3)/IBAT

(µA)

Product data sheet Rev. 8 — 9 August 2012 45 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

10.2 Peripheral power consumption

The supply current p er peripheral is measured as the differ ence in supply current between

the peripheral block enabled and the peripheral block disabled in the PCONP register. All

other blocks are disabled and no code is executed. Measured on a typical sample at

Tamb =25C. The peripheral clock PCLK = CCLK/4.

[1] The combined current of several peripherals running at the same time can be less than th e sum of each individual peripheral current

measured separately.

Table 7. Power consumpti on for individual analog and digital blocks

Peripheral Conditions Typical supply current in mA;

CCLK = Notes

12 MHz 48 MHz 100 MHz

Timer 0.03 0.11 0.23 Average current per timer

UART 0.07 0.26 0.53 Average current per UART

PWM 0.05 0.20 0.41

Motor control

PWM 0.05 0.21 0.42

I2C 0.02 0.08 0.16 Average current per I2C

SPI 0.02 0.06 0.13

SSP1 0.04 0.16 0.32

ADC PCLK = 12 MHz for CCLK = 12 MHz

and 48 MHz; PCLK = 12.5 MHz for

CCLK = 100 MHz

2.12 2.09 2.07

CAN PCLK = CCLK/6 0.13 0.49 1.00 Average current per CAN

CAN0, CAN1,

acceptance filter PCLK = CCLK/6 0.22 0.85 1.73 Both CAN blocks and

acceptance filter[1]

DMA PCLK = CCLK 1.33 5.10 10.36

QEI 0.05 0.20 0.41

GPIO 0.33 1.27 2.58

I2S 0.09 0.34 0.70

USB and PLL1 0.94 1.32 1.94

Ethernet Ethernet block enabled in the PCONP

Ethernet

connected Ethernet initialized, conn ected to

network, and running web server

example.

- - 5.19

Product data sheet Rev. 8 — 9 August 2012 46 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

10.3 Electrical pin characteristics

Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.

Fig 10. Typical HIGH-level output voltage VOH versus HIGH-level output source current

IOH

Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.

Fig 11. Typical LOW-level output current IOL versus LOW-level output voltage VOL

IOH (mA)

0 24168

002aaf112

2.8

2.4

3.2

3.6

VOH

(V)

2.0

T = 85 °C

25 °C

−40 °C

VOL (V)

0 0.60.40.2

002aaf111

IOL

(mA)

T = 85 °C

25 °C

−40 °C

Product data sheet Rev. 8 — 9 August 2012 47 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.

Fig 12. Typical pull-up current Ipu versus input voltage VI

Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.

Fig 13. Typical pull-down current Ipd versus input voltage VI

0 54231

002aaf108

−30

−50

−10

Ipu

(μA)

−70

T = 85 °C

25 °C

−40 °C

VI (V)

002aaf109

VI (V)

0 53241

Ipd

(μA)

−10

T = 85 °C

25 °C

−40 °C

Product data sheet Rev. 8 — 9 August 2012 48 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11. Dynamic characteristics

11.1 Flash memory

[1] Number of program/erase cycles.

[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.

11.2 External clock

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.

Table 8. Flash ch aracteristics

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Nendu endurance [1] 10000 100000 - cycles

tret retention time powered 10 - - years

unpowered 20 - - years

ter erase time sector or multiple

consecutive sectors 95 100 105 ms

tprog programming time [2] 0.95 1 1.05 ms

Table 9. Dy namic characteristic: exte rnal clock

Tamb =





C to +85



C; VDD(3V3) over specified ranges.[1]

Symbol Parameter Conditions Min Typ[2] Max Unit

fosc oscillator frequency 1 - 25 MHz

Tcy(clk) clock cycle time 40 - 1000 ns

tCHCX clock HIGH time Tcy(clk) 0.4 - - ns

tCLCX clock LOW time Tcy(clk) 0.4 - - ns

tCLCH clock rise time - - 5 ns

tCHCL clock fall time - - 5 ns

Fig 14. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)

tCHCL tCLCX tCHCX

Tcy(clk)

tCLCH

002aaa907

Product data sheet Rev. 8 — 9 August 2012 49 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11.3 Internal oscillators

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.

11.4 I/O pins

[1] Applies to standard port pins.

Table 10. Dynamic characteristic: internal oscillators

Tamb =





C to +85



C; 2.7 V



VDD(REG)(3V3)



3.6 V.[1]

Symbol Parameter Conditions Min Typ[2] Max Unit

fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz

fi(RTC) R TC input frequency - - 32.768 - kHz

Conditions: Frequency values are typical values. 4 MHz  1 % accuracy is guaranteed for

2.7 V VDD(REG)(3V3) 3.6 V and Tamb = 40 C to +85 C. V ariations between parts may cause the

IRC to fall outside the 4 MHz  1 % accuracy specification for voltages below 2.7 V.

Fig 15. Internal RC oscillator frequency versus temperature

002aaf107

temperature (°C)

-40 853510 60-15

4.024

4.032

4.020

4.028

4.036

fosc(RC)

(MHz)

4.016

VDD(REG)(3V3) = 3.6 V

3.3 V

3.0 V

2.7 V

2.4 V

Table 11. Dynamic characteristic: I/O pins[1]

Tamb =





C to +85



C; VDD(3V3) over specified ranges.

Symbol Parameter Conditions Min Typ Max Unit

trrise time pin configured as output 3.0 - 5.0 ns

tffall time pin configured as output 2.5 - 5.0 ns

Product data sheet Rev. 8 — 9 August 2012 50 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11.5 I2C-bus

[1] See the I2C-bus specification UM10204 for details.

[2] Parameters are valid over operating temperature range unless otherwise specified.

[3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission

and the acknowledge.

[4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the

VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.

[5] Cb = total capacitance of one bus line in pF.

[6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA

output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the

SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf.

[7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors

are used, designers should allow for this when considering bus timing.

[8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than

the maximum of tVD;DAT or tVD;ACK by a transition time (see the I2C-bus specification UM10204). This

maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the

clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.

[9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in

transmission and the acknowledge.

Table 12. Dynamic characteristic: I2C-bus pins[1]

Tamb =





C to +85



C.[2]

Symbol Parameter Conditions Min Max Unit

fSCL SCL clock

frequency Standard-mode 0 100 kHz

Fast-mode 0 400 kHz

tffall time [4][5][6][7] of both SDA and

SCL signals

Standard-mode

- 300 ns

Fast-mode 20 + 0.1  Cb300 ns

tLOW LOW period of

the SCL clock Standard-mode 4.7 - s

Fast-mode 1.3 - s

tHIGH HIGH period of

the SCL clock Standard-mode 4.0 - s

Fast-mode 0.6 - s

tHD;DAT data hold time [3][4][8] Standard-mode 0 - s

Fast-mode 0 - s

tSU;DAT data set-up

time

[9] Standard-mode 250 - ns

Fast-mode 100 - ns

Product data sheet Rev. 8 — 9 August 2012 51 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Fig 16. I2C-bus pins clock timing

002aaf425

70 %

30 %

SDA

70 %

30 %

70 %

30 %

70 %

30 %

HD;DAT

SCL

1 / f

SCL

70 %

30 % 70 %

30 %

VD;DAT

HIGH

LOW

SU;DAT

Product data sheet Rev. 8 — 9 August 2012 52 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11.6 I2S-bus interface (LPC1759/58/56 only)

[1] CCLK = 20 MHz; peripheral clock to the I2S-bus interface PCLK = CCLK4; Tcy(clk) = 1600 ns, corresponds to the SCK signal in the

I2S-bus specification.

Table 13. Dynamic character istics: I2S-bus interface pins

Tamb =





C to +85



Symbol Parameter Conditions Min Typ Max Unit

common to input and output

trrise time [1] - - 35 ns

tffall time [1] - - 35 ns

tWH pulse width HIGH on pins I2STX_CL K and

I2SRX_CLK [1] 0.495 Tcy(clk) -- -

tWL pulse width LOW on pins I2STX_CLK an d

I2SRX_CLK [1] - - 0.505 Tcy(clk) ns

output

tv(Q) data output valid time on pin I2STX_SDA; [1] - - 30 ns

on pin I2STX_WS [1] - - 30 ns

input

tsu(D) data input set-up time on pin I2SRX_SDA [1] 3.5 - - ns

th(D) data input hold time on pin I2SRX_SDA [1] 4.0 - - ns

Fig 17. I2S-bus timing (output)

002aad992

I2STX_CLK

I2STX_SDA

I2STX_WS

cy(clk)

v(Q)

Product data sheet Rev. 8 — 9 August 2012 53 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Fig 18. I2S-bus timing (input)

002aae159

Tcy(clk) tftr

tWH

tsu(D) th(D)

tsu(D) tsu(D)

tWL

I2SRX_CLK

I2SRX_SDA

I2SRX_WS

Product data sheet Rev. 8 — 9 August 2012 54 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11.7 SSP interface

[1] The peripheral clock for SSP is PCLK = CCLK = 20 MHz.

Table 14. Dynamic characteristic: SSP interface

Tamb =25



C; VDD(3V3) over specified ranges.

Symbol Parameter Conditions Min Typ Max Unit

tsu(SPI_MISO) SPI_MISO set-up time measured in SPI Master mode;

see Figure 19 [1] 30 - - ns

Fig 19. SSP MISO line set-up time in SPI Master mode

tsu(SPI_MISO)

SCK

shifting edges

MOSI

MISO

002aad326

sampling edges

Product data sheet Rev. 8 — 9 August 2012 55 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11.8 USB interface

[1] Characterized but not implemented as production test. Guaranteed by design.

Table 15. Dynamic character istics: USB pins (full-speed)

CL = 50 pF; Rpu = 1.5 k



on D+ to VDD(3V3); 3.0 V



VDD(3V3)



3.6 V.

Symbol Parameter Conditions Min Typ Max Unit

trrise time 10 % to 90 % 8.5 - 13.8 ns

tffall time 10 % to 90 % 7.7 - 13.7 ns

tFRFM differential rise and fall time

matching tr/t

f--109%

VCRS output signal crossover voltage 1.3 - 2.0 V

tFEOPT source SE0 interval of EOP see Figure 20 160 - 175 ns

tFDEOP source jitter for differential transition

to SE0 transition see Figure 20 2-+5ns

tJR1 receiver jitter to next transition 18.5 - +18.5 ns

tJR2 receiver jitter for paired transitions 10 % to 90 % 9-+9ns

tEOPR1 EOP width at receiver must reject as

EOP; see

Figure 20

[1] 40 --ns

tEOPR2 EOP width at receiver must accept as

EOP; see

Figure 20

[1] 82 --ns

Fig 20. Differential data-to-EOP transition skew and EOP width

002aab561

TPERIOD

differential

data lines

crossover point

source EOP width: tFEOPT

receiver EOP width: tEOPR1, tEOPR2

crossover point

extended

differential data to

SE0/EOP skew

n × TPERIOD + tFDEOP

Product data sheet Rev. 8 — 9 August 2012 56 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

11.9 SPI

[1] TSPICYC = (Tcy(PCLK)  n)  0.5 %, n is the SPI clock divider value (n  8); PCLK is derived from the

processor clock CCLK.

[2] Timing parameters are measured with respect to the 50 % edge of the clock PCLK and the 10 % (90 %)

edge of the data signal (MOSI or MISO).

Table 16. Dynamic characteristics of SPI pins

Tamb =





C to +85



Symbol Parameter Min Typ Max Unit

Tcy(PCLK) PCLK cycle time 10 - - ns

TSPICYC SPI cycle time [1] 79.6 - - ns

tSPICLKH SPICLK HIGH time 0.485  TSPICYC -- ns

tSPICLKL SPICLK LOW time - 0.515  TSPICYC ns

SPI master

tSPIDSU SPI data set-up time [2] 0--ns

tSPIDH SPI data hold time [2] 2 Tcy(PCLK)  5 - - ns

tSPIQV SPI data output valid time [2] 2 Tcy(PCLK) + 30 - - ns

tSPIOH SPI output data hold time [2] 2 Tcy(PCLK) + 5 - - ns

SPI slave

tSPIDSU SPI data set-up time [2] 0--ns

tSPIDH SPI data hold time [2] 2 Tcy(PCLK) + 5 - - ns

tSPIQV SPI data output valid time [2] 2 Tcy(PCLK) + 35 - - ns

tSPIOH SPI output data hold time [2] 2 Tcy(PCLK) + 15 - - ns

Fig 21. SPI master timing (CPHA = 1)

SCK (CPOL = 0)

MOSI

MISO

002aad986

TSPICYC tSPICLKH tSPICLKL

tSPIDSU tSPIDH

tSPIQV

D ATA V ALID D ATA VALID

tSPIOH

SCK (CPOL = 1)

D ATA V ALID D ATA V ALID

Product data sheet Rev. 8 — 9 August 2012 57 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Fig 22. SPI master timing (CPHA = 0)

Fig 23. SPI slave timing (CPHA = 1)

SCK (CPOL = 0)

MOSI

MISO

002aad987

TSPICYC tSPICLKH tSPICLKL

tSPIDSU tSPIDH

D ATA V ALID D ATA VALID

tSPIOH

SCK (CPOL = 1)

D ATA V ALID D ATA V ALID

tSPIQV

SCK (CPOL = 0)

MOSI

MISO

002aad988

TSPICYC tSPICLKH tSPICLKL

tSPIDSU tSPIDH

tSPIQV

D ATA V ALID D ATA VALID

tSPIOH

SCK (CPOL = 1)

D ATA V ALID D ATA V ALID

Product data sheet Rev. 8 — 9 August 2012 58 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

12. ADC electrical characteristics

[1] The ADC is monotonic, there are no missing codes.

[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 25.

[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after

appropriate adjustment of gain and offset errors. See Figure 25.

[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the

ideal curve. See Figure 25.

[5] ADCOFFS value (bits 7:4) = 2 in the ADTRM register. See LPC17xx user manual UM10360.

[6] The gain error (EG) is the re lative difference in percent between the straight line fitting the actual transfer curve after removing offset

error, and the straight line which fits the ideal transfer curve. See Figure 25.

[7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated

ADC and the ideal transfer curve. See Figure 25.

[8] See Figure 26.

[9] The conversion frequency corresponds to the number of samples per second.

Fig 24. SPI slave timing (CPHA = 0)

SCK (CPOL = 0)

MOSI

MISO

002aad989

SPICYC

SPICLKH

SPICLKL

SPIDSU

SPIDH

SPIQV

D ATA V ALID D ATA VALID

SPIOH

SCK (CPOL = 1)

D ATA V ALID D ATA V ALID

Table 17. ADC char acteristics (full resolution)

VDDA = 2.7 V to 3.6 V; Tamb =





C to +85



C unless otherwise specified; ADC frequency 13 MHz; 12-bit resolution.

Symbol Parameter Conditions Min Typ Max Unit

VIA analog input vol tage 0 - VDDA V

Cia analog input capacitance - - 15 pF

EDdifferential linearity error [1][2] --1LSB

EL(adj) integral non-linearity [3] --3LSB

EOoffset error [4][5] --2LSB

EGgain error [6] --0.5%

ETabsolute er ror [7] --4LSB

Rvsi voltage source interface

resistance [8] --7.5k

fclk(ADC) ADC clock frequency - - 13 MHz

fc(ADC) ADC conversion frequency [9] --200kHz

Product data sheet Rev. 8 — 9 August 2012 59 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

[1] The ADC is monotonic, there are no missing codes.

[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 25.

[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after

appropriate adjustment of gain and offset errors. See Figure 25.

[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the

ideal curve. See Figure 25.

[5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset

error, and the straight line which fits the ideal transfer curve. See Figure 25.

[6] The conversion frequency corresponds to the number of samples per second.

Table 18. ADC char acteristics (lower resolution)

Tamb =





C to +85



C unless otherwise specified; 12-bit ADC used as 10-bit resolution ADC.

Symbol Parameter Conditions Min Typ Max Unit

EDdifferential linearity error [1][2] -1LSB

EL(adj) integral non-linearity [3] -1.5 - LSB

EOoffset error [4] -2- LSB

EGgain error [5] -2- LSB

fclk(ADC) ADC clock frequency 3.0 V  VDDA  3.6 V - - 33 MHz

2.7 V  VDDA < 3.0 V - - 25 MHz

fc(ADC) ADC conversion frequency 3 V  VDDA  3.6 V [6] -- 500 kHz

2.7 V  VDDA < 3.0 V [6] -- 400 kHz

Product data sheet Rev. 8 — 9 August 2012 60 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

(1) Example of an actual transfer curve.

(2) The ideal transfer curve.

(3) Differential linearity error (ED).

(4) Integral non-linearity (EL(adj)).

(5) Center of a step of the actual transfer curve.

Fig 25. 12-bit ADC characteristics

002aad948

4095

4094

4093

4092

4091

(2)

(1)

40964090 4091 4092 4093 4094 4095

7123456

4090

(5)

(4)

(3)

1 LSB

(ideal)

code

out

VREFP − VREFN

4096

offset

error

gain

error

offset error

VIA (LSBideal)

1 LSB =

Product data sheet Rev. 8 — 9 August 2012 61 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

13. DAC electrical characteristics (LPC1759/58/56/54 only)

The values of resistor components Ri1 and Ri2 vary with temperature and input voltage and are

process-dependent (see Table 19).

Parasitic resistance and capacitance from the pad are not included in this figure.

Fig 26. ADC interface to pins AD0[n]

Table 19. ADC interface components

Component Range Description

Ri1 2 k to 5.2 kSwitch-on resistance for channel selection switch. V aries with

temperature, input voltage, and process.

Ri2 100  to 600 Switch-on resistance for the comparator input switch. Varies

with temperature, input voltage, and process.

C1 750 fF Parasitic capacit ance from the ADC block level.

C2 65 fF Parasitic capacitance from the ADC block level.

C3 2.2 pF Sampling capacitor.

LPC17xx

AD0[n]

750 fF 65 fF Cia

2.2 pF

Rvsi

Ri2

100 Ω - 600 Ω

Ri1

2 kΩ - 5.2 kΩ

VSS VEXT

002aaf197

ADC

COMPARATOR

BLOCK C1

Table 20. DAC electrical characteristics

VDDA = 2.7 V to 3.6 V; Tamb =





C to +85



C unless otherwise specified

Symbol Parameter Conditions Min Typ Max Unit

EDdifferential linearity error - 1- LSB

EL(adj) integral non-linearity - 1.5 - LSB

EOoffset error - 0.6 - %

EGgain error - 0.6 - %

CLload capacitance - 200 - pF

RLload resistance 1 - - k

Product data sheet Rev. 8 — 9 August 2012 62 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

14. Application information

14.1 Suggested USB interface solutions

Fig 27. LPC1759/58/56/54/52/51 USB interface on a self-powered device

LPC17xx

USB-B

connector

USB_D+

USB_CONNECT

SoftConnect switch

USB_D−

BUS

DD(3V3)

1.5 kΩ

RS = 33 Ω

002aad939

RS = 33 Ω

USB_UP_LED

Fig 28. LPC1759/58/56/54/52/51 USB interface on a bus-powered device

LPC17xx

VDD(3V3)

1.5 kΩ

USB_UP_LED

002aad940

USB-B

connector

USB_D+

USB_D−

VBUS

VSS

RS = 33 Ω

Product data sheet Rev. 8 — 9 August 2012 63 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Fig 29. LPC1759/58/56/54 USB OTG port configuration

USB_D+

USB_D−

SDA1/2

SCL1/2

RSTOUT

LPC1759/58/

56/54

Mini-AB

connector

33 Ω

VDD

002aae155

EINT0

RESET_N

ADR/PSW

SPEED

SUSPEND

OE_N/INT_N

SCL

SDA

INT_N

VBUS

ISP1302

VSS

USB_UP_LED

VDD

Fig 30. LPC1759/58/56/54 USB host port configuration

USB_UP_LED

USB_D+

USB_D−

USB_PWRD

15 kΩ15 kΩ

LPC1759/58/

56/54

USB-A

connector

33 Ω

002aae156

VDD

USB_PPWR

LM3526-L

ENA

5 V

FLAGA

OUTA

VDD

D+

D−

VBUS

VSS

Product data sheet Rev. 8 — 9 August 2012 64 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

14.2 Crystal oscillator XTAL input and component selection

The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a

clock in slave mode, it is recommende d that the inpu t be coupled throug h a cap acitor with

Ci = 100 pF. To limit the input voltage to the specified range, choose an additional

capacitor to ground Cg which attenuate s the input volt age by a facto r Ci/(Ci + Cg). In slave

mode, a minimum of 200 mV(RMS) is needed.

In slave mode the input clock signal should be coup led by means of a cap acitor of 100 pF

(Figure 32), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This

corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.

The XTALOUT pin in this configuration can be left unconnected.

External components and models used in oscillation mode are shown in Figure 33 and in

Table 21 and Table 22. Since the feedback resistance is integrated on chip, only a crysta l

and the capacitances CX1 and CX2 need to be connected externally in case of

fundamental mode oscillation (the fundamental frequency is represented by L, CL and

RS). Capacitance CP in Figure 33 represent s the p arallel p ackage cap acitance and sho uld

not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal

manufacturer.

Fig 31. LPC1759/58/56 /5 4/52/51 USB device port co nfiguration

LPC17xx

USB-B

connector

33 Ω

002aad943

USB_UP_LED

USB_CONNECT

VDD

D+

D−

USB_D+

USB_D−

VBUS VBUS

VSS

Fig 32. Slave mode operation of the on-chip oscillator

LPC1xxx

XTAL1

100 pF Cg

002aae835

Product data sheet Rev. 8 — 9 August 2012 65 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

14.3 XTAL Printed-Circuit Board (PCB) layout guidelines

The crystal should be connected on the PCB as close as possible to the oscillator input

and output pins of the chip. Take care that the load cap acitors Cx1, Cx2, and Cx3 in case of

third overtone crystal usage have a common ground plane. The external components

must also be connected to the ground plain. Loops must be made as small as possible in

Fig 33. Oscillator modes and models: oscillation mode of operation and external crystal

model used for CX1/CX2 evaluation

Table 21. Recommended values for CX1/CX2 in oscillation mode (crystal and external

components parameters): low frequency mode

Fundamental oscillation

frequency FOSC

Crystal load

capacitance CL

Maximum crystal

series resistance RS

External load

capacitors CX1/CX2

1 MHz - 5 MHz 10 pF < 300 18 pF, 18 pF

20 pF < 300 39 pF, 39 pF

30 pF < 300 57 pF, 57 pF

5 M Hz - 10 MHz 10 pF < 300 18 pF, 18 pF

20 pF < 200 39 pF, 39 pF

30 pF < 100 57 pF, 57 pF

10 MHz - 15 MHz 10 pF < 160 18 pF, 18 pF

20 pF < 60 39 pF, 39 pF

15 MHz - 20 MHz 10 pF < 80 18 pF, 18 pF

Table 22. Recommended values for CX1/CX2 in oscillation mode (crystal and external

components parameters): high frequen cy mode

Fundamental oscillation

frequency FOSC

Crystal load

capacitance CL

Maximum crystal

series resistance RS

External load

capacitors CX1, CX2

15 MHz - 20 MHz 10 pF < 180 18 pF, 18 pF

20 pF < 100 39 pF, 39 pF

20 MHz - 25 MHz 10 pF < 160 18 pF, 18 pF

20 pF < 80 39 pF, 39 pF

002aaf424

LPC1xxx

XTALIN XTALOUT

CX2

CX1

XTAL

=CLCP

Product data sheet Rev. 8 — 9 August 2012 66 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

order to keep the no ise couple d in via th e PCB as sm all as po ss ible . A lso parasitic s

should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller

accordingly to the increase in parasitics of the PCB layout.

14.4 Standard I/O pin configuration

Figure 34 shows the possible pin modes for standard I/O pins with analog input function:

•Digital output driver: Open -dra i n mod e en ab le d/ disa b led

•Digital input: Pull-up enabled/disabled

•Digital input: Pull-down enabled/disabled

•Digital input: Repeater mode enabled/disabled

•Analog input

The default configuration for standard I/O pins is input with pull-up enabled. The weak

MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.

Fig 34. Standard I/O pin configuration with analog input

VDD VDD

ESD

VSS

ESD

strong

pull-up

strong

pull-down

VDD

weak

pull-up

weak

pull-down

open-drain enable

output enable

repeater mode

enable

pull-up enable

pull-down enable

data output

data input

analog input

select analog input

002aaf272

pin configured

as digital output

driver

pin configured

as digital input

pin configured

as analog input

Product data sheet Rev. 8 — 9 August 2012 67 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

14.5 Reset pin configuration

Fig 35. Reset pin configuration

VSS

reset

002aaf274

VDD

Rpu ESD

ESD

20 ns RC

GLITCH FILTER PIN

Product data sheet Rev. 8 — 9 August 2012 68 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

14.6 ElectroMagnetic Compatibility (EMC)

Radiated emission measurements according to the IEC61967-2 standard using the

TEM-cell method are shown for part LPC1768.

[1] IEC levels refer to Appendix D in the IEC61967-2 Specification.

Table 23. ElectroMagnetic Compatibility (EMC) for part LPC1768 (TEM-cell method)

VDD = 3.3 V; Tamb = 25



Parameter Frequency band System clock = Unit

12 MHz 24 MHz 48 MHz 72 MHz 100 MHz

Input clock: IRC (4 MHz)

maximum

peak level 150 kHz - 30 MHz 76477dBV

30 MHz - 150 MHz +1 +5 +11 +16 +9 dBV

150 MHz - 1 GHz 2+4+11+12+19dBV

IEC level[1] -OONML-

Input clock: crystal oscillator (12 MHz)

maximum

peak level 150 kHz - 30 MHz 54478dBV

30 MHz - 150 MHz 1+5+10+15+7dBV

150 MHz - 1 GHz 1+6+11+10+16dBV

IEC level[1] -OONMM-

Product data sheet Rev. 8 — 9 August 2012 69 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

15. Package outline

Fig 36. Package outline (LQFP80)

UNIT A

max. A1A2A3bpcE

(1) eH

ELL

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 1.6 0.16

0.04 1.5

1.3 0.25 0.27

0.13 0.18

0.12 12.1

11.9 0.5 14.15

13.85 1.45

1.05 7

0.15 0.10.21

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.30

SOT315-1 136E15 MS-026 00-01-19

03-02-25

D(1) (1)(1)

12.1

11.9

14.15

13.85

1.45

1.05

EA1

detail X

(A )

HA2

vMB

vMA

60 41

pin 1 index

0 5 10 mm

scale

LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1

Product data sheet Rev. 8 — 9 August 2012 70 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

16. Soldering

Fig 37. Reflow soldering for the LQFP80 package

SOT315-1

DIMENSIONS in mm

occupied area

Footprint information for reflow soldering of LQFP80 package

AyBy

P1P2

D2 (8×) D1

(0.125)

Ax Ay Bx By D1 D2 Gx Gy Hx Hy

15.300 15.300 12.300 12.300

0.500

0.560 0.280

1.500 0.400 12.500 12.500 15.550 15.550 sot315-1_fr

solder land

Generic footprint pattern

Refer to the package outline drawing for actual layout

Product data sheet Rev. 8 — 9 August 2012 71 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

17. Abbreviations

Table 24. Abbreviations

Acronym Description

ADC Analog-to-Digital Converter

AHB Advanced High-performance Bus

AMBA Advanced Microcontroller Bus Architecture

APB Advanced Peripheral Bus

BOD BrownOut Detection

CAN Controller Area Networ k

DAC Digital-to-Analog Converter

DMA Direct Memory Access

EOP End Of Packet

GPIO General Purpose Input/Output

IRC Internal RC

IrDA Infrared Data Association

JTAG Joint Test Action Group

MAC Media Access Control

MIIM Media Independent Interface Management

OTG On-The-Go

PHY Physical Layer

PLL Phase-Locked Loop

PWM Pulse Width Modulator

RMII Reduced Media Independent Interface

SE0 Single Ended Zero

SPI Serial Peripheral Interface

SSI Serial Synchronous Interface

SSP Synchronous Serial Port

TTL Transistor-Transistor Logic

UART Universal Asynchronous Receiver/Transmitter

USB Universal Serial Bus

Product data sheet Rev. 8 — 9 August 2012 72 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

18. Revision history

Table 25. Revision history

Document ID Release date Data sheet status Change

notice Supersedes

LPC1759_58_56_54_52_51 v.8 20120809 Product data sheet - LPC1759_58_56_54_52_51 v.7

Modifications: •Remove table note “The peak current is limited to 25 times the corresponding

maximum current.” from Table 4 “ Limiting values”.

•Change VDD(3V3) to VDD(REG)(3V3) in Section 11.3 “Internal oscillators”.

•Glitch filter constant changed to 10 ns in Table note 5 in Table 3.

•Description of RESET function updated in Table 3.

•Pull-up value added for GPIO pins in Table 3.

•Pin configuration diagram for LQFP80 package corrected (Figure 2).

•Pin description of USB_UP_LED pin updated in Table 3.

•Ri1 and Ri2 labels in Figure 26 updated.

•Table note 9 updated in Table 3.

•Table note 1 updated in Table 11.

•Electromagnetic compatibility data added in Section 14.6.

•Section 16 added.

LPC1759_58_56_54_52_51 v.7 20110329 Product data sheet - LPC1759_58_56_54_52_51 v.6

Modifications: •Pin description of pins P0[29] and P0[30] updated in Table note 4 of Table 3. Pins

are not 5 V tolerant.

•Typical value for Parameter Nendu added in Table 8.

•Condition 3.0 V  VDD(3V3)  3.6 V added in Table 15.

•Typical values for parameters IDD(REG)(3V3) and IBAT with condition Deep

power-down mode corrected in Table 6 and Table note 9, Table note 10, and Table

note 11 updated.

•For Deep power-down mode, Fig ure 8 updated and Figure 9 added.

LPC1759_58_56_54_52_51 v.6 20100825 Product data sheet - LPC1759_58_56_54_52_51 v.5

Modifications: •Section 7 .30.2; BOD level corrected.

•Added Section 10.2.

LPC1759_58_56_54_52_51 v.5 20100716 Product data sheet - LPC1759_58_56_54_52_51 v.4

LPC1759_58_56_54_52_51 v.4 20100126 Product data sheet - LPC1758_56_54_52_51 v.3

LPC1758_56_54_52_51 v.3 2 0091119 Product data sheet - LPC1758_56_54_52_51 v.2

LPC1758_56_54_52_51 v.2 20090211 Objective data sheet - LPC1758_56_54_52_51 v.1

LPC1758_56_54_52_51 v.1 20090115 Objective data sheet - -

Product data sheet Rev. 8 — 9 August 2012 73 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

19.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

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authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 8 — 9 August 2012 74 of 76

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

19.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

I2C-bus — logo is a trademark of NXP B.V.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 8 — 9 August 2012 75 of 76

continued >>

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 4

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 4

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

7 Functional de scription . . . . . . . . . . . . . . . . . . 13

7.1 Architectural overview . . . . . . . . . . . . . . . . . . 13

7.2 ARM Cortex-M3 processor. . . . . . . . . . . . . . . 13

7.3 On-chip flash program memory . . . . . . . . . . . 13

7.4 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 13

7.5 Memory Protection Unit (MPU). . . . . . . . . . . . 13

7.6 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.7 Nested Vectored Interrupt Controller (NVIC) . 16

7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7.7.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 16

7.8 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 16

7.9 General purpose DMA controller . . . . . . . . . . 16

7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.10 Fast general purpose parallel I/O . . . . . . . . . . 17

7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.11 Ethernet (LPC1758 only) . . . . . . . . . . . . . . . . 18

7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.12 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.12.1 USB device controller. . . . . . . . . . . . . . . . . . . 19

7.12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.12.2 USB host controller (LPC1759/58/56/54 only). 20

7.12.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.12.3 USB OTG controller (LPC1759/58/56/54

only).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.12.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.13 CAN controller and acceptance filters . . . . . . 20

7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.14 12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.15 10-bit DAC (LPC1759/58/56/54 only). . . . . . . 21

7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.16 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.17 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 22

7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.18 SSP serial I/O controller. . . . . . . . . . . . . . . . . 22

7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.19 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 23

7.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.20 I2S-bus serial I/O controllers (LPC1759/

58/56 only). . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7.21 General purpose 32-bit timers/external

event counters . . . . . . . . . . . . . . . . . . . . . . . . 24

7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 25

7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.23 Motor control PWM . . . . . . . . . . . . . . . . . . . . 26

7.24 Quadrature Encoder Interface (QEI) . . . . . . . 26

7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

7.25 Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 27

7.25.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.26 ARM Cortex-M3 system tick timer . . . . . . . . . 27

7.27 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 27

7.27.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.28 RTC and backup registers. . . . . . . . . . . . . . . 28

7.28.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7.29 Clocking and power control . . . . . . . . . . . . . . 28

7.29.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 28

7.29.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 29

7.29.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 29

7.29.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 29

7.29.2 Main PLL (PLL0) . . . . . . . . . . . . . . . . . . . . . . 30

7.29.3 USB PLL (PLL1) . . . . . . . . . . . . . . . . . . . . . . 30

7.29.4 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 30

7.29.5 Power control. . . . . . . . . . . . . . . . . . . . . . . . . 31

7.29.5.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.29.5.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 31

7.29.5.3 Power-down mode. . . . . . . . . . . . . . . . . . . . . 32

7.29.5.4 Deep power-down mode . . . . . . . . . . . . . . . . 32

7.29.5.5 Wakeup interrupt controller . . . . . . . . . . . . . . 32

7.29.6 Peripheral power control . . . . . . . . . . . . . . . . 32

7.29.7 Power domains . . . . . . . . . . . . . . . . . . . . . . . 32

7.30 System control. . . . . . . . . . . . . . . . . . . . . . . . 34

7.30.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.30.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 35

7.30.3 Code security (Code Read Protection - CRP) 35

7.30.4 APB interface. . . . . . . . . . . . . . . . . . . . . . . . . 35

7.30.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . 36

7.30.6 External interrupt inputs. . . . . . . . . . . . . . . . . 36

7.30.7 Memory mapping control . . . . . . . . . . . . . . . . 36

7.31 Emulation and debugging . . . . . . . . . . . . . . . 36

8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 37

9 Thermal characteristics . . . . . . . . . . . . . . . . . 38

9.1 Thermal characte ristics . . . . . . . . . . . . . . . . . 38

NXP Semiconductors LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 9 August 2012

Document identifier: LPC1759_58_56_54_52_51

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

10 Static characteristics. . . . . . . . . . . . . . . . . . . . 39

10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 42

10.2 Peripheral power consumption. . . . . . . . . . . . 45

10.3 Electrical pin characteristics. . . . . . . . . . . . . . 46

11 Dynamic characteristics . . . . . . . . . . . . . . . . . 48

11.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 48

11.2 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 48

11.3 Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 49

11.4 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

11.5 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

11.6 I2S-bus interface (LPC1759/58/56 only). . . . . 52

11.7 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 54

11.8 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 55

11.9 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

12 ADC electrical characteristics . . . . . . . . . . . . 58

13 DAC electrical characteristics

(LPC1759/58/56/54 only) . . . . . . . . . . . . . . . . . 61

14 Application information. . . . . . . . . . . . . . . . . . 62

14.1 Suggested USB interface solutions . . . . . . . . 62

14.2 Crystal oscillator XTAL input and component

selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

14.3 XTAL Printed-Circuit Board (PCB) layout

guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

14.4 Standard I/O pin configuration . . . . . . . . . . . . 66

14.5 Reset pin configuration. . . . . . . . . . . . . . . . . . 67

14.6 ElectroMagnetic Compatibility (EMC). . . . . . . 68

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 69

16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 71

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 72

19 Legal in formation. . . . . . . . . . . . . . . . . . . . . . . 73

19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73

19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 73

19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74

20 Contact information. . . . . . . . . . . . . . . . . . . . . 74

21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75