LMC6762
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LMC6762 Dual MicroPower Rail-To-Rail Input CMOS Comparator with Push-Pull Output
Check for Samples: LMC6762
1FEATURES DESCRIPTION
The LMC6762 is an ultra low power dual comparator
2• (Typical Unless Otherwise Noted) with a maximum supply current of 10 μA/comparator.
• Low Power Consumption (Max): IS= 10 It is designed to operate over a wide range of supply
μA/comp voltages, from 2.7V to 15V. The LMC6762 has
• Wide Range of Supply Voltages: 2.7V to 15V ensured specifications at 2.7V to meet the demands
of 3V digital systems.
• Rail-To-Rail Input Common Mode Voltage
Range The LMC6762 has an input common-mode voltage
range which exceeds both supplies. This is a
• Rail-To-Rail Output Swing (Within 100 mV of significant advantage in low-voltage applications. The
the Supplies, @ V+= 2.7V, and ILOAD = 2.5 mA) LMC6762 also features a push-pull output that allows
• Short Circuit Protection: 40 mA direct connections to logic devices without a pull-up
• Propagation Delay (@ V+= 5V, 100 mV resistor.
Overdrive): 4 μsA quiescent power consumption of 50 μW/amplifier
(@ V+= 5V) makes the LMC6762 ideal for
APPLICATIONS applications in portable phones and hand-held
electronics. The ultra-low supply current is also
• Laptop Computers independent of power supply voltage. Ensured
• Mobile Phones operation at 2.7V and a rail-to-rail performance
• Metering Systems makes this device ideal for battery-powered
• Hand-Held Electronics applications.
• RC Timers Refer to the LMC6772 datasheet for an open-drain
version of this device.
• Alarm and Monitoring Circuits
• Window Comparators, Multivibrators
Connection Diagram Typical Application
8-Pin PDIP/SOIC
Top View
Zero Crossing Detector
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1997–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMC6762
SNOS739D –JULY 1997–REVISED MARCH 2013
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Absolute Maximum Ratings(1)(2)
ESD Tolerance(3) 2 KV
Differential Input Voltage (V+)+0.3V to (V−)−0.3V
Voltage at Input/Output Pin (V+)+0.3V to (V−)−0.3V
Supply Voltage (V+–V−) 16V
Current at Input Pin ±5 mA
Current at Output Pin(4)(5) ±30 mA
Current at Power Supply Pin, LMC6762 40 mA
Lead Temperature (Soldering, 10 seconds) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature(6) 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the electrical characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 1.5 kΩin series with 100 pF.
(4) Do not short circuit output to V+, when V+is greater than 12V or reliability will be adversely affected.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(6) The maximum power dissipation is a function of TJ(max),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(max) – TA)/θJA.All numbers apply for packages soldered directly into a PC board.
Operating Ratings(1)
Supply Voltage 2.7 ≤VS≤15V
Junction Temperature Range LMC6762AI, LMC6762BI −40°C ≤TJ≤+85°C
Thermal Resistance (θJA) P0008E Package, 8-Pin PDIP 100°C/W
D0008A Package, 8-Pin SOIC 172°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the electrical characteristics.
2.7V Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 2.7V, V−= 0V, VCM = V+/2. Boldface limits apply at the
temperature extremes. LMC6762AI LMC6762BI Units
Symbol Parameter Conditions Typ(1) Limit(2) Limit(2)
VOS Input Offset Voltage 3 5 15 mV
8 18 max
TCVOS Input Offset Voltage 2.0 μV/°C
Temperature Drift
Input Offset Voltage See(3) 3.3 μV/Month
Average Drift
IBInput Current 0.02 pA
IOS Input Offset Current 0.01 pA
CMRR Common Mode Rejection Ratio 75 dB
PSRR Power Supply Rejection Ratio ±1.35V < VS< ±7.5V 80 dB
AVVoltage Gain (By Design) 100 dB
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) Input Offset Voltage Average Drift is calculated by dividing the accelerated operating life drift average by the equivalent operational time.
The Input Offset Voltage Average Drift represents the input offset voltage change at worst-case input conditions.
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2.7V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 2.7V, V−= 0V, VCM = V+/2. Boldface limits apply at the
temperature extremes. LMC6762AI LMC6762BI Units
Symbol Parameter Conditions Typ(1) Limit(2) Limit(2)
VCM Input Common-Mode CMRR > 55 dB 3.0 2.9 2.9 V
Voltage Range 2.7 2.7 min
−0.3 −0.2 −0.2 V
0.0 0.0 max
VOH Output Voltage High ILOAD = 2.5 mA 2.5 2.4 2.4 V
2.3 2.3 min
VOL Output Voltage Low ILOAD = 2.5 mA 0.2 0.3 0.3 V
0.4 0.4 max
ISSupply Current For Both Comparators 12 20 20 μA
(Output Low) 25 25 max
5.0V and 15.0V Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 5.0V and 15.0V, V−= 0V, VCM = V+/2. Boldface limits apply
at the temperature extremes. LMC6762AI LMC6762BI
Symbol Parameter Conditions Typ(1) Units
Limit(2) Limit(1)
VOS Input Offset Voltage 3 5 15 mV
8 18 max
TCVOS Input Offset Voltage V+= 5V 2.0 μV/°C
Temperature Drift V+= 15V 4.0
Input Offset Voltage V+= 5V(3) 3.3 μV/Month
Average Drift V+= 15V(3) 4.0
IBInput Current V = 5V 0.04 pA
IOS Input Offset Current V+= 5V 0.02 pA
CMRR Common Mode V+= 5V 75 dB
Rejection Ratio V+= 15V 82 dB
PSRR Power Supply Rejection Ratio ±2.5V < VS< ±5V 80 dB
AVVoltage Gain (By Design) 100 dB
VCM Input Common-Mode V+= 5.0V 5.3 5.2 5.2 V
Voltage Range CMRR > 55 dB 5.0 5.0 min
−0.3 −0.2 −0.2 V
0.0 0.0 max
V+= 15.0V 15.3 15.2 15.2 V
CMRR > 55 dB 15.0 15.0 min
−0.3 −0.2 −0.2 V
0.0 0.0 max
VOH Output Voltage High V+= 5V 4.8 4.6 4.6 V
ILOAD = 5mA 4.45 4.45 min
V+= 15V 14.8 14.6 14.6 V
ILOAD = 5 mA 14.45 14.45 min
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) Input Offset Voltage Average Drift is calculated by dividing the accelerated operating life drift average by the equivalent operational time.
The Input Offset Voltage Average Drift represents the input offset voltage change at worst-case input conditions.
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5.0V and 15.0V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 5.0V and 15.0V, V−= 0V, VCM = V+/2. Boldface limits apply
at the temperature extremes. LMC6762AI LMC6762BI
Symbol Parameter Conditions Typ(1) Units
Limit(2) Limit(1)
VOL Output Voltage Low V+= 5V 0.2 0.4 0.4 V
ILOAD = 5 mA 0.55 0.55 max
V+= 15V 0.2 0.4 0.4 V
ILOAD = 5 mA 0.55 0.55 max
ISSupply Current For Both Comparators 12 20 20 μA
(Output Low) 25 25 max
ISC Short Circuit Current Sourcing 30 mA
Sinking, VO= 12V(4) 45
(4) Do not short circuit output to V+, when V+is greater than 12V or reliability will be adversely affected.
AC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 5V, V−= 0V, VCM = VO= V+/2. Boldface limits apply at the
temperature extreme.
Symbol Parameter Conditions Typ(1) LMC6762AI LMC6762BI Units
Limit(2) Limit(2)
tRISE Rise Time f = 10 kHz, CL= 50 pF, 0.3 μs
Overdrive = 10 mV(3)(4)
tFALL Fall Time f = 10 kHz, CL= 50 pF, 0.3 μs
Overdrive = 10 mV(3)(4)
tPHL Propagation Delay f = 10 kHz, Overdrive = 10 mV 10 μs
(High to Low) CL= 50 pF(3)(4) Overdrive = 100 mV 4 μs
V+= 2.7V, Overdrive = 10 mV 10 μs
f = 10 kHz,
CL= 50 pF(3)(4) Overdrive = 100 mV 4 μs
tPLH Propagation Delay f = 10 kHz, Overdrive = 10 mV 6 μs
(Low to High) CL= 50 pF(3)(4) Overdrive = 100 mV 4 μs
V+= 2.7V, Overdrive = 10 mV 7 μs
f = 10 kHz,
CL= 50 pF(3)(4) Overdrive = 100 mV 4 μs
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) CLincludes the probe and jig capacitance.
(4) The rise and fall times are measured with a 2V input step. The propagation delays are also measured with a 2V input step.
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Typical Performance Characteristics
V+= 5V, Single Supply, TA= 25°C unless otherwise specified
Supply Current Supply Current
vs vs
Supply Supply
Voltage (Output High) Voltage (Output Low)
Figure 1. Figure 2.
Input Current vs Input Current vs
Common-Mode Voltage Common-Mode Voltage
Figure 3. Figure 4.
Input Current vs Input Current
Common-Mode Voltage vs Temperature
Figure 5. Figure 6.
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Typical Performance Characteristics (continued)
V+= 5V, Single Supply, TA= 25°C unless otherwise specified
ΔVOS ΔVOS
vs vs
ΔVCM ΔVCM
Figure 7. Figure 8.
ΔVOS
vs Output Voltage vs
ΔVCM Output Current (Sourcing)
Figure 9. Figure 10.
Output Voltage vs Output Voltage vs
Output Current (Sourcing) Output Current (Sourcing)
Figure 11. Figure 12.
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Typical Performance Characteristics (continued)
V+= 5V, Single Supply, TA= 25°C unless otherwise specified
Output Voltage vs Output Voltage vs
Output Current (Sinking) Output Current (Sinking)
Figure 13. Figure 14.
Output Voltage vs Output Short Circuit Current
Output Current (Sinking) vs Supply Voltage (Sourcing)
Figure 15. Figure 16.
Output Short Circuit Current Response Time for
vs Supply Voltage (Sinking) Overdrive (tPLH)
Figure 17. Figure 18.
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Typical Performance Characteristics (continued)
V+= 5V, Single Supply, TA= 25°C unless otherwise specified
Response Time for Response Time for
Overdrive (tPHL) Overdrive (tPLH)
Figure 19. Figure 20.
Response Time for Response Time for
Overdrive (tPHL) Overdrive (tPLH)
Figure 21. Figure 22.
Response Time for Response Time vs
Overdrive (tPHL) Capacitive Load
Figure 23. Figure 24.
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APPLICATION HINTS
Input Common-Mode Voltage Range
At supply voltages of 2.7V, 5V and 15V, the LMC6762 has an input common-mode voltage range which exceeds
both supplies. As in the case of operational amplifiers, CMVR is defined by the VOS shift of the comparator over
the common-mode range of the device. A CMRR (ΔVOS/ΔVCM) of 75 dB (typical) implies a shift of < 1 mV over
the entire common-mode range of the device. The absolute maximum input voltage at V+= 5V is 200 mV beyond
either supply rail at room temperature.
Figure 25. An Input Signal Exceeds the LMC6762 Power Supply Voltages
with No Output Phase Inversion
A wide input voltage range means that the comparator can be used to sense signals close to ground and also to
the power supplies. This is an extremely useful feature in power supply monitoring circuits.
An input common-mode voltage range that exceeds the supplies, 20 fA input currents (typical), and a high input
impedance makes the LMC6762 ideal for sensor applications. The LMC6762 can directly interface to sensors
without the use of amplifiers or bias circuits. In circuits with sensors which produce outputs in the tens to
hundreds of millivolts, the LMC6762 can compare the sensor signal with an appropriately small reference
voltage. This reference voltage can be close to ground or the positive supply rail.
Low Voltage Operation
Comparators are the common devices by which analog signals interface with digital circuits. The LMC6762 has
been designed to operate at supply voltages of 2.7V without sacrificing performance to meet the demands of 3V
digital systems.
At supply voltages of 2.7V, the common-mode voltage range extends 200 mV (ensured) below the negative
supply. This feature, in addition to the comparator being able to sense signals near the positive rail, is extremely
useful in low voltage applications.
Figure 26. Even at Low-Supply Voltage of 2.7V,
an Input Signal which Exceeds the Supply Voltages Produces No Phase Inversion at the Output
At V+= 2.7V, propagation delays are tPLH =4μs and tPHL =4μs with overdrives of 100 mV. Please refer to the
performance curves for more extensive characterization.
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Shoot-Through Current
The shoot-through current is defined as the current surge, above the quiescent supply current, between the
positive and negative supplies of a device. The current surge occurs when the output of the device switches
states. This transient switching current results in glitches in the supply voltage. Usually, glitches in the supply
lines are compensated by bypass capacitors. When the switching currents are minimal, the values of the bypass
capacitors can be reduced considerably.
Figure 27. LMC6762 Circuit for Measurement of the Shoot-Through Current
Figure 28. Measurement of the Shoot-Through Current
From Figure 27 and Figure 28 the shoot-through current for the LMC6762 can be approximated to be 0.2 mA
(200 mV/1 kΩ). The duration of the transient is measured as 1 μs. The values needed for the local bypass
capacitors can be calculated as follows:
Area of Δ= ½ (1 μs × 200 μA)
= 100 pC
If the local bypass capacitor has to provide this charge of 100 pC, the minimum value of the local capacitor to
prevent local degradation of VCC can be calculated. Suppose that the maximum voltage droop that the system
can tolerate is 100mV,
ΔQ=C*(ΔV)
→C= (ΔQ/ΔV)
= 100 pC/100 mV
= 0.001 μF
The low internal feedthrough current of the LMC6762 thus requires lower values for the local bypass capacitors.
In applications where precision is not critical, this is a significant advantage, as lower values of capacitors result
in savings of board space, and cost.
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It is worth noting here that the delta shift of the power supply voltage due to the transient currents causes a
threshold shift of the comparator. This threshold shift is reduced by the high PSRR of the comparator. However,
the value of the PSRR applicable in this instance is the transient PSRR and not the DC PSRR. The transient
PSRR is significantly lower than the DC PSRR.
Generally, it is a good goal to reduce the delta voltage on the power supply to a value equal to or less than the
hysteresis of the comparator. For example, if the comparator has 50 mV of hysteresis, it would be reasonable to
increase the value of the local bypass capacitor to 0.01 μF to reduce the voltage delta to 10 mV.
Output Short Circuit Current
The LMC6762 has short circuit protection of 40 mA. However, it is not designed to withstand continuous short
circuits, transient voltage or current spikes, or shorts to any voltage beyond the supplies. A resistor is series with
the output should reduce the effect of shorts. For outputs which send signals off PC boards additional protection
devices, such as diodes to the supply rails, and varistors may be used.
Hysteresis
If the input signal is very noisy, the comparator output might trip several times as the input signal repeatedly
passes through the threshold. This problem can be addressed by making use of hysteresis as shown below.
Figure 29. Canceling the Effect of Input Capacitance
The capacitor added across the feedback resistor increases the switching speed and provides more short term
hysteresis. This can result in greater noise immunity for the circuit.
Spice Macromodel
A Spice Macromodel is available for the LMC6762. The model includes a simulation of:
• Input common-mode voltage range
• Quiescent and dynamic supply current
• Input overdrive characteristics
and many more characteristics as listed on the macromodel disk.
A SPICE macromodel of this and many other op amps is available at no charge from the WEBENCH Design
Center Team at http://www.ti.com/ww/en/analog/webench/
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Typical Applications
One-Shot Multivibrator
Figure 30. One-Shot Multivibrator
A monostable multivibrator has one stable state in which it can remain indefinitely. It can be triggered externally
to another quasi-stable state. A monostable multivibrator can thus be used to generate a pulse of desired width.
The desired pulse width is set by adjusting the values of C2and R4. The resistor divider of R1and R2can be
used to determine the magnitude of the input trigger pulse. The LMC6762 will change state when V1< V2. Diode
D2provides a rapid discharge path for capacitor C2to reset at the end of the pulse. The diode also prevents the
non-inverting input from being driven below ground.
Bi-Stable Multivibrator
Figure 31. Bi-Stable Multivibrator
A bi-stable multivibrator has two stable states. The reference voltage is set up by the voltage divider of R2and
R3. A pulse applied to the SET terminal will switch the output of the comparator high. The resistor divider of R1,
R4, and R5now clamps the non-inverting input to a voltage greater than the reference voltage. A pulse applied to
RESET will now toggle the output low.
Zero Crossing Detector
Figure 32. Zero Crossing Detector
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A voltage divider of R4and R5establishes a reference voltage V1at the non-inverting input. By making the series
resistance of R1and R2equal to R5, the comparator will switch when VIN = 0. Diode D1insures that V3never
drops below −0.7V. The voltage divider of R2and R3then prevents V2from going below ground. A small amount
of hysteresis is setup to ensure rapid output voltage transitions.
Oscillator
Figure 33. Square Wave Generator
Figure 33 shows the application of the LMC6762 in a square wave generator circuit. The total hysteresis of the
loop is set by R1, R2and R3. R4and R5provide separate charge and discharge paths for the capacitor C. The
charge path is set through R4and D1. So, the pulse width t1is determined by the RC time constant of R4and C.
Similarly, the discharge path for the capacitor is set by R5and D2. Thus, the time t2between the pulses can be
changed by varying R5, and the pulse width can be altered by R4. The frequency of the output can be changed
by varying both R4and R5.
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Figure 34. Time Delay Generator
The circuit shown above provides output signals at a prescribed time interval from a time reference and
automatically resets the output when the input returns to ground. Consider the case of VIN = 0. The output of
comparator 4 is also at ground. This implies that the outputs of comparators 1, 2, and 3 are also at ground.
When an input signal is applied, the output of comparator 4 swings high and C charges exponentially through R.
This is indicated above.
The output voltages of comparators 1, 2, and 3 switch to the high state when VC1 rises above the reference
voltage VA, VBand VC. A small amount of hysteresis has been provided to insure fast switching when the RC
time constant is chosen to give long delay times.
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REVISION HISTORY
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 14
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMC6762AIM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMC67
62AIM
LMC6762AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LMC67
62AIM
LMC6762AIMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMC67
62AIM
LMC6762AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LMC67
62AIM
LMC6762BIM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMC67
62BIM
LMC6762BIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LMC67
62BIM
LMC6762BIMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMC67
62BIM
LMC6762BIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LMC67
62BIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
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Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMC6762AIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6762AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6762BIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6762BIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMC6762AIMX SOIC D 8 2500 367.0 367.0 35.0
LMC6762AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMC6762BIMX SOIC D 8 2500 367.0 367.0 35.0
LMC6762BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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