RELIABILITY REPORT
FOR
MAX9697ATI+
PLASTIC ENCAPSULAT ED DE VI CES
May 12, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
MAX9697ATI+
App roved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved. Page 1/5
Conclusion
MAX9697ATI+
The MAX9697ATI+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Conte n ts
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX9697 12-channel programmable gamma reference system provides 12 programmable reference voltages with 10-bit resolution. These
voltages can be used for gamma correction in TFT-LCD displays, as a VCOM reference, or as sources for level shifter inputs. Each reference voltage
features a 10-bit digital-to-analog converter (DAC) and buffer with high peak current to reduce the recovery time of the output voltages when critical
levels and patterns are displayed. An adjustable, low-dropout linear regulator (LDO) further improves the stability and accuracy of the DAC outputs by
creating the DAC reference. The MAX9697's integrated gate-driver output controls an external p-channel FET to slowly turn on the linear regulator so
that the reference voltages ramp up in a controlled manner. The MAX9697 has a serial peripheral interface (SPI(tm)) bus for programming the
reference voltages. The device also has a current-sense comparator to detect an abnormally high supply current in other areas of the application
circuit. The MAX9697 is available in a 28-pin TQFN package and is specified for operation over the -40°C to +125°C temperature range.
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II. Manufacturing Information
A. Description/Function: 12-Channel Prog rammable Gamma Reference System
B. Process: S4
C. Number of Device Transistors: 22084
D. Fabri cation Location: Texas
E. Assembly Location: UTL Thailand
F. Date of Initial Production: January 24, 2009
III. Packaging Information
A. Package Type: 28-pin TQFN 5x5
B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Au (1.3 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: #
H. Flammability Rating: Class UL94-V0
MAX9697ATI+
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Singl e Layer The ta Ja: 47°C/W
K. Single Layer Theta Jc: 2.1°C/W
L. Multi Layer Theta Ja: 29°C/W
M. Multi Layer Theta Jc: 2.1°C/W
IV. Die Information
A. Dimensions: 89 X 85 mils
B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect: Aluminum/Si (Si = 1%)
D. Backside Metallization: None
E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectri c: SiO2
I. Die Separation Method: Wafer Saw
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V. Quality Assurance Information
A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Directo r of QA)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
MAX9697ATI+
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is ca lculated as follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4340 x 47 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.8 x 10-9
= 22.8 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-
ic.com/. Current monitor data for the S4 Process results in a FIT Rate of 4.6 @ 25C and 79.2 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PF35 die type has been found to have all pins able to withstand a transient pulse of:
ESD HBM: +/-2500 V per JESD22 A114
ESD MM: +/-200V per JESD22 A115.
Latch-Up testing has shown that this device withstands a current of +/-100 mA, 1.5x VCCMax Overvoltage per JESD78.
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Table 1
Reliability Evaluation Test Results
MAX9697ATI+
MAX9697ATI+
TEST ITEM TEST CONDITION FAILURE
IDENTIFICATION
SAMPLE SIZE NUMBER OF
FAILURES
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
DC Parameters 47 0
& functionality
Moisture Testing (Note 2)
85/85 Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77 0
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77 0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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