TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 WHITE LED CHARGE PUMP CURRENT SOURCE WITH PWM BRIGHTNESS CONTROL Check for Samples: TPS60231 FEATURES 1 * * * * * * * * * * * Regulated Output Current With 0.4% Matching Drives up to 3 LEDs at 25 mA Each LED Brightness Control Through PWM Control Signal High Efficiency by Fractional Conversion With 1x and 1.5x Modes 1 MHz Switching Frequency 2.7 V to 6.5 V Operating Input Voltage Range Internal Softstart Limits Inrush Current Low Input Ripple and Low EMI Overcurrent and Overtemperature Protected Undervoltage Lockout With Hysteresis Ultra-Small 3mm x 3mm QFN Package APPLICATIONS * * White LED Backlight for Color Displays in Cellular Phones, Smart Phones, PDAs, Handheld PCs, Digital Cameras, and Camcorders Keypad Backlight DESCRIPTION The TPS60231 charge pump is optimized for white LED supplies in color display backlight applications. The device provides a constant current for each LED, which the initial value can be set by an external resistor. The supply voltage ranges from 2.7 V to 6.5 V and is ideally suited for all applications powered by a single LI-Ion battery cell or three to four NiCd, NiMH, or alkaline battery cells. Over an input voltage range from 3.1 V to 6.5 V, the device provides a high output current of up to 25 mA per LED with a total of 75 mA. High efficiency is achieved by utilizing a 1x/1.5x fractional conversion technique in combination with very low dropout current sources. In addition, the current controlled charge pump ensures low input current ripple and EMI. Only two external 1 F and two 0.47 F capacitors are required to build a complete small and low cost power supply solution. To reduce board space to a minimum, the device switches at 1 MHz operating frequency and is available in a small 16-pin QFN (RGT) package. SPACER VIN = 2.7 V to 6.5 V VIN VOUT C1+ D1 C1- D2 0.47 mF 1 mF D3 0.47 mF C2+ C2- 1 mF EN1 EN2 GND ISET PGND 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2010, Texas Instruments Incorporated TPS60231 SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION PACKAGED DEVICE (1) (2) TPS60231RGTR (1) (2) PACKAGE MARKING QFN BKH T indicates shipment in tape and reel on a mini reel with 250 units per reel. R indicates shipment in tape and reel with 3000 units per reel. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT VI Supply voltage -0.3 V to 7 V Voltage at EN1, EN2, VOUT, ISET -0.3 V to VI Output current at VOUT 150 mA TJ Maximum junction temperature 150C TA Operating free-air temperature -40C to 85C Tst Storage temperature -65C to 150C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (1) PACKAGE TA 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 70C POWER RATING TA = 85C POWER RATING 16-Pin QFN (RGT) 1.9 W 20 mW/C 1W 760 mW The thermal resistance junction to ambient of the QFN package is 52C/W. RECOMMENDED OPERATING CONDITIONS MIN Supply voltage at VIN 2.7 Maximum output current at VOUT 75 TYP MAX 6.5 UNIT V mA CI Input capacitor Co Output capacitor 0.47 1 1 F Flying capacitor, C1, C2 0.22 0.47 F Operating junction temperature 2 -40 Submit Documentation Feedback F 125 C Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 ELECTRICAL CHARACTERISTICS VI = 3.6 V, EN1 = EN2 = VI, TA = -40C to 85C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IO = 0 mA to 75 mA 2.7 6.5 V IO = 0 mA to 45 mA, VLED 2.1 V, T = 0C to 85C 2.5 6.5 V SUPPLY VOLTAGE AND CURRENT VI Input voltage range IQ Operating quiescent current ISD Shutdown current VI = 4.2 V, x1-mode, EN1 = EN2 = 1, ISET = 20 A 200 A IO = 0 mA, x1.5-mode 2.1 mA EN2 = EN1 = GND 0.1 1 A CHARGE PUMP STAGE VOUT Overvoltage limit LED1 unconnected, VI = 4.2 V 5.5 V Startup time CO = 1 F, IDX 0.9 IDX, set 375 s Softstart duration 160 0.75 Switching frequency h Efficiency VI = 3.7 V, ILED = 15 mA each, VDX = 3.1 V Shutdown temperature Temperature rising 160 1.25 MHz 20 C EN2 = EN1 = 1, ISET = 100 A 350 mA 83% Shutdown temperature hysteresis Input current limit 1 s f C CURRENT SINKS IDx Recommended maximum current per current sink 3.2 V VI 6.5 V 25 mA IDx Current into each current sink when ISET is shorted to GND 3.0 V VI 6.5 V, ISET shorted to GND 50 mA Current matching between any two outputs VDx = 3.1 V, TA = 25C Line regulation 3.2 V VI 6.5 V, VDx = 3.1 V, EN1 = EN2 = 1, ISET = 80 A -2% 0.4% 3% EN2 = 0, EN1 = 1 VISET Reference voltage for current set 200 EN2 = 1, EN1 = 0 400 EN2 = 1, EN1 = 1 Iset Recommended ISET pin current range K IDx to ISET current ratio Vsource Voltage at Dx to GND 2% 580 600 4 EN2 = EN1 = 1, ISET = 80 A 230 mV 620 130 260 EN2 = 0, EN1 = 1 200 EN2 = 1, EN1 = 0 300 EN2 = 1, EN1 = 1 400 A 280 mV ENABLE 1, ENABLE 2 VIH EN1, EN2 high level input voltage VIL EN1, EN2 low level input voltage 1.3 V 0.3 EN1, EN2 trip point hysteresis 50 V mV IIKG EN2 input leakage current EN1, EN2 = GND or EN2 = VI, VI = 6.5 V 0.01 1 A IIKG EN1 input leakage current EN1 = VI, VI = 4.2 V 11 15 A UVLO Undervoltage lockout threshold Input voltage falling 2.1 V 50 mV Undervoltage lockout hysteresis Frequency range at PWM 0 Recommended ON-time for PWM signal Shutdown delay time 50 2.5 Delay time when EN1 = EN2 go to GND after which the TPS60231 shuts down completely 0.5 0.85 s 1.5 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 kHz ms 3 TPS60231 SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 www.ti.com PIN ASSIGNMENT 12 13 11 C2+ C1+ C1- C2- QFN PACKAGE (TOP VIEW) 9 10 VOUT VIN 8 14 PGND GND 7 15 D1 EN1 6 16 D2 EN2 5 4 D3 NC 3 NC 2 ISET 1 Pin Functions PIN NAME NO. I/O DESCRIPTION C1+ 10 - Connect to the flying capacitor C1 C1- 11 - Connect to the flying capacitor C1 C2+ 9 - Connect to the flying capacitor C2 C2- 12 - Connect to the flying capacitor C2 D1-D3 6-4 I Current sink input. Connect the cathode of the white LEDs to these inputs. EN1 15 I Enable input. A logic high enables the converter, logic low forces the device into shutdown mode reducing the supply current to less than 1 A if EN2 is tied to GND. EN2 16 I An applied PWM signal reduces the LED current as a function of the duty cycle of the PWM signal. EN1 and EN2 can be tied together for PWM dimming between 0 mA and the maximum set with ISET. EN1 and EN2 can also be used for digital dimming with 4 steps from 0 mA to the maximum current set with ISET. See the application section for more details. GND 14 - Analog ground ISET 1 I Connect a resistor between this pin and GND to set the maximum current through the LEDs. 2, 3 - No internal connection PGND 7 - Power ground VIN 13 I Supply voltage input VOUT 8 0 Connect the output capacitor and the anode of the LEDs to this pin. Power PAD - - Connect with PGND and GND NC 4 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 FUNCTIONAL BLOCK DIAGRAM 1 mF VOUT C1+ 0.47 mF Current Sinks C1- Charge Pump C2+ 0.47 mF VIN D3 D2 D1 C2- 1 mF Reference Control ISET EN1 EN2 RSET PGND GND SPACER TYPICAL CHARACTERISTICS Table of Graphs FIGURE h vs Input voltage (ILED = 25 mA, 15 mA, 10 mA, 5 mA per LED), EN2 = 0, EN1 = 1 1 vs Input voltage (ILED = 25 mA, 15 mA, 10 mA, 5 mA per LED), EN2 = 1, EN1 = 0 2 vs Input voltage (ILED = 25 mA, 15 mA, 10 mA, 5 mA per LED), EN2 = EN1 = 1 3 vs Input voltage (TA = -40C, 25C, 85C) (measured with ID1 = 5 mA) 4 Maximum output current from charge pump stage vs Input voltage (TA = -40C, 25C, 85C) 5 Switching frequency vs Free-Air Temperature (TA = -40C to 85C, VI = 3.6 V) 6 LED current, ILED vs Duty cycle on PWM (ILED max set to 20 mA) For f = 32 kHz and f = 1 kHz, DC = 1% to 100%, VI = 3.6 V 7 Line transient response VI and ID1 vs time on scope, LED current at D1 with VI = 4.2 V to 3.6 V to 4.2 V with EN2 = EN1 = 11, 3 x 20 mA 8 Dimming response PWM signal and current at D1 vs time on scope f = 32 kHz and f = 1 kHz, VI = 3.6 V, duty cycle = 50%, EN1 = EN2 = PWM Startup timing VI = 3.6 V, 3 x 20 mA, EN1 = EN2 = 00 changed to EN2 = EN1 = 11 Efficiency IQ Quiescent current fs 9, 10 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 11 5 TPS60231 SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 www.ti.com EFFICIENCY vs INPUT VOLTAGE EFFICIENCY vs INPUT VOLTAGE 100 100 ILED = 25 mA 90 90 ILED = 25 mA 80 80 ILED = 15 mA 60 ILED = 10 mA 50 40 ILED = 5 mA 60 20 20 10 10 3.5 3.9 4.3 4.7 5.1 5.5 5.9 0 2.7 6.3 ILED = 5 mA 40 30 3.1 ILED = 10 mA 50 30 0 2.7 ILED = 15 mA 70 Efficiency - % Efficiency - % 70 3.1 3.5 VI - Input Voltage - V 3.9 4.3 4.7 5.1 5.5 VI - Input Voltage - V Figure 1. Figure 2. EFFICIENCY vs INPUT VOLTAGE QUIESCENT CURRENT vs INPUT VOLTAGE 90 5.9 6.3 5.9 6.3 3 2.8 80 IQ - Quiescent Current - mA ILED = 25 mA ILED = 15 mA 70 Efficiency - % 60 50 40 ILED = 10 mA ILED = 5 mA 30 20 2.2 TA = 255C 2 1.8 1.6 TA = 855C 1.4 1.2 1 0.8 0.4 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VI - Input Voltage - V 5.9 6.3 0.2 0 2.7 Figure 3. 6 TA = -405C 2.4 0.6 10 0 2.7 2.6 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VI - Input Voltage - V Figure 4. Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 MAXIMUM OUTPUT CURRENT vs INPUT VOLTAGE SWITCHING FREQUENCY vs FREE-AIR TEMPERATURE 0.15 1040 TA = 255C VI = 3.6 V VLED = 3.2 V 1030 Switching Frequency - kHz I O - Maximum Output Current - A VLED = 3 V VLED = 3.4 V 0.10 VLED = 3.6 V VLED = 3.8 V 0.05 1010 1000 990 0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VI - Input Voltage - V 5.9 980 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 TA - Free-Air Temperature - 5C 6.3 Figure 5. Figure 6. D1 LED CURRENT vs DUTY CYCLE LINE TRANSIENT 25 500 mV/div VI = 3.6 V, ILED max set to 20 mA 20 EN1 = 1, EN2 = 1, VI = 3.6 V to 4.2 V, ILED = 20 mA, 3 LEDs Connected, ILED(D1) Measured With 1 W Resistor, TA = 255C VI 3.6 V 15 10 f = 32 kHz 1 mA/div I LED(D1) - D1 LED Current - mA 1020 5 ILED(D1) AC f = 1 kHz 0 0 10 20 30 40 50 60 70 Duty Cycle - % 80 90 100 Figure 7. 100 ms/div Figure 8. Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 7 TPS60231 SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 www.ti.com DIMMING RESPONSE DIMMING RESPONSE PWM 2 V/div 2 V/div PWM 0V 0V PWM Into EN1 and EN2, VI = 3.6 V, ILED = 20 mA, 3 LEDs Connected, f = 1 kHz, TA = 255C 10 mA/div 10 mA/div PWM Into EN1 and EN2, VI = 3.6 V, ILED = 20 mA, 3 LEDs Connected, f = 32 kHz, TA = 255C ILED(D1) 0A ILED(D1) 0A 200 ms/div 5 ms/div Figure 9. Figure 10. 5 V/div STARTUP TIMING EN1 + EN2 0V 20 mA/div 1 V/div VO 0V ILED VI = 3.6 V , ILED = 20 mA, 3 LED's Connected, TA = 255C 0A 20 ms/div Figure 11. DETAILED DESCRIPTION OPERATION The TPS60231 uses a fractional conversion charge pump to generate a supply voltage for the integrated current sinks. These current sinks are used to ensure a constant current for each LED. Depending on the input voltage and programmed LED current, the charge pump either operates in the 1x mode or in the 1.5x mode. By switching automatically between these two modes, the circuit optimizes power conversion efficiency as well as extends operating time by allowing the discharge of the battery completely. The charge pump can generate 75 mA of output current, so each of the 3 LED outputs can be powered with up to 25 mA of current. The maximum LED current is set by a resistor connected to the ISET pin. This resistor programs a reference current, which is current mirrored to set the LED current. 8 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 Applying a PWM signal to the EN1 pin and/or the EN2 pin controls the LED brightness. See a detailed description in the section Analog Dimming Using ISET Pin. LED CURRENT ADJUSTMENT (ISET) A resistor programs a reference current, which is current mirrored to set the LED current. The voltage at the ISET pin depends on the status of EN1 and EN2. The current in each LED is typically 260 times the current through the resistor at ISET. V R + ISET K ISET I LED VISET -- Voltage from ISET pin (0.2 V, 0.4 V or 0.6 V) to GND, see Table 1 ILED -- Current per LED from Dx pin to GND K -- Dx to ISET current ratio (typically 260) The LED current varies linearly from 0 mA to ILED(max) mA by applying a PMW signal with 0% to 100% duty cycle. The LED brightness can however also be controlled by an analog control signal that is fed into the ISET pin. SOFT START The TPS60231 has an internal soft start circuit to limit the inrush current during startup. This prevents possible voltage drops of the input voltage if a high impedance power source is connected to the input of the TPS60231. When the device starts up with an output voltage that is below the input voltage, the output capacitor is charged directly from the input with a current source. The output current increases linearly until the output reaches within 300 mV of the input voltage. When the programmed output current can be reached with the 1x mode, the TPS60231 terminates the soft start and begins normal operation. When the desired output current cannot be reached, the charge pump begins operation in 1.5x mode and pumps the output voltage up to the needed level to reach the programmed output current. ENABLE (EN1, EN2) The enable pins EN1 and EN2 are used to enable the device or set it into shutdown. The TPS60231 is enabled if one of the enable pins is pulled higher than the enable trip point of 1.3 V. The device starts up by going through the soft start routine as described in the section Soft Start. Pulling both pins to GND, after a delay, programs the device to shutdown. In shutdown, the charge pump, current sources, voltage reference, oscillator, and all other functions are turned off and the supply current is reduced to 0.1 A. EN1 and EN2 can also be used for dimming. The logic levels at EN1 and EN2 set the minimum voltage at the current mirrors and the voltage at the ISET pin to GND. This sets the current at the LEDs to be either the full current or a fraction of the full current. See Table 1 for further details. The maximum current through the LEDs is set by a resistor connected between ISET and GND. EN1 and EN2 can also be used for PWM dimming. The PWM signal can either be applied to EN1 or EN2, or both inputs can be tied together and the PWM signal can be applied to both pins. Depending on the configuration, the current during PWM dimming is switched between 0 mA and its maximum (EN1 and EN2 connected to the PWM signal) or between 0 mA and 1/3 of the full LED current if EN2 = 0 and EN1 is toggled. When EN1 = 0 and EN2 is toggled, the output current can be changed between 0 mA and 2/3 of the full range. Table 1. Enable Levels ENABLE LEVEL MODE LED CURRENT EN2 EN1 0 0 SHUTDOWN 0 0 1 VISET = 200 mV 1/3 1 0 VISET = 400 mV 2/3 1 1 VISET = 600 mV Full Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 9 TPS60231 SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 www.ti.com UNDERVOLTAGE LOCKOUT The undervoltage lockout circuit shuts down the device when the voltage at VIN drops below a typical threshold of 2.15 V. This prevents damage to the device. The UVLO circuit allows the device to start up again after the voltage on the VIN pin has increased by about 50 mV above the UVLO lockout threshold. SHORT CIRCUIT AND OVERTEMPERTURE PROTECTION The current at the VOUT pin is limited typically to 250 mA. When the junction temperature exceeds 160C, the device shuts down to protect the device from damage. After the temperature decreases to about 140C, the device starts up again if it is enabled. OVERVOLTAGE PROTECTION AT VOUT The device uses the voltage at D1 to regulate voltage at VOUT. In case D1 is not connected, an overvoltage protection circuit ensures that the output voltage at VOUT does not exceed its limits. The connection of the LEDs must be started using D1 first. For all other LEDs there is no restriction in the sequence. For example, if there are only 2 LEDs used, the first LED is connected to D1 and the other LED can be connected to any other of the D2 to D3 pins. THEORY OF OPERATION/DESIGN PROCEDURE Capacitor Selection Ceramic capacitors such as X5R or X7R are recommended to be used with the TPS60231. For the two flying capacitors C1 and C2, it is important to use low ESR capacitors to avoid unnecessary efficiency losses. Low ESR capacitors on VOUT reduce the ripple voltage on the supply of the current sources. Table 2 lists capacitor types that have been tested with the TPS60231. Table 2. Capacitors PART VALUE VOLTAGE MANUFACTURER SIZE WEBSITE C1608X5R1A105M C1608X5R1A474M C2012X7R1C105M 1 mF 0.47 mF 1m F 10 V 10 V 16 V TDK 0603 0603 0805 www.componnent.tdk.com LMK107BJ105MA LMK107BJ474MA LMK212BJ105MG 1 mF 0.47 mF 1m F 10 V 10 V 10 V Taiyo Yuden 0603 0603 0805 www.t-yuden.com Power Efficiency The power conversion efficiency of the TPS60231 can be calculated by adding up the products of each LED current and voltage and dividing it by the product of the input voltage and current. With a fully charged battery where the input voltage is typically above the LED forward voltage, the charge pump operates in the 1x mode and efficiency is very high. As the battery discharges, there is a point where the current sources no longer have enough voltage overhead to maintain a constant current regulation. At that point, the charge pump switches into the 1.5x mode. The conversion efficiency is lowest at the crossover. As the battery discharges further, the efficiency again increases until at about 3.1 V where it reaches a second maximum. Below 3.1 V input voltage, the maximum current per LED is less than 25 mA. Power Dissipation The maximum power dissipation inside the TPS60231 can be calculated based on the following equation: PD max = [(1.5 x VI) - VO + 0.4 V] x IO The maximum power dissipation occurs when the input voltage is just low enough to operate in 1.5x mode, with a forward voltage of the white LED at maximum. This is typically for VI = 4.2 V and a forward voltage of 3.6 V. This needs to be lower than the maximum allowed power dissipation of the package, which can be calculated using the following equation: 10 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 T P D max, package + * T Jmax A R qja For example, the worst case power dissipation occurs at the input voltage level where the charge pump switches from the 1x mode to the 1.5x mode. At this operating point, the supply voltage to the current sources is at its maximum and the current sources must drop the most voltage in order to maintain a regulated output current. The worst case power dissipation occurs when all 3 LED outputs are fully loaded with 25 mA of LED current. * With: VI = 4.2 V, Vf = 3.6 V, IO = 75 mA (1.5x mode) * PD max = 0.23 W APPLICATION INFORMATION TYPICAL APPLICATION OF A SMART PHONE DISPLAY WITH RESISTORS CONNECTED IN PARALLEL If more than 25 mA of output current is needed, then the input pins to the current sinks can be connected in parallel as shown in the following application figure. This method can also be used to connect a LC display with only two connections for the white LEDs. VIN = 2.7 V to 6.5 V VIN VOUT C1+ D1 C1- D2 0.47 mF 1 mF D3 0.47 mF C2+ C2- 1 mF EN1 EN2 ISET Typical Smartphone Display GND PGND Figure 12. Typical Application With Resistors in Parallel ANALOG DIMMING USING ISET PIN The ISET pin can be used to connect an analog dc signal in the range of 0 mV to 600 mV (EN1 = EN2 = 1) for analog dimming of the white LEDs. For an input voltage of 0 V at ISET, the current is at its maximum, whereas at 600 mV, the LED current is zero. The maximum current is: * For EN2 = EN1 = 1: ILED = Vset/Rset x K = 0.6V/6kR x 260 = 26 mA per LED * For EN2 = 1, EN0 = 1: ILED = Vset/Rset x K = 0.4V/6kR x 260 = 17 mA per LED * For EN2 = 0, EN1 = 1: ILED = Vset/Rset x K = 0.2V/6kR x 260 = 8.6 mA per LED * With EN2, EN1 set to 10 or 01, a voltage of 400 mV or 200 mV is required to set the LED current to zero. Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 11 TPS60231 SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 VIN = 2.7 V to 6.5 V www.ti.com VIN VOUT C1+ D1 C1- D2 0.47 mF 1 mF D3 0.47 mF C2+ C2- 1 mF EN1 EN2 ISET 6 kW GND V = 0 mV to 600 mV PGND Figure 13. Analog Dimming Connections Using ISET Pin TYPICAL APPLICATION USING 2 WHITE LEDs AND 6 GREEN LEDs FOR LCD BACKLIGHT AND KEYBOARD LIGHTING The TPS60231 can be used to power any kind of LED. It is also possible to mix white LEDs with color LEDs which have a lower forward voltage. The LED with the highest forward voltage (typically the white LED) has to be connected to D1, because the output voltage of the charge pump is regulated in such a way to keep the voltage drop from D1 to GND at 400mV (with EN1 = EN2 = 1). Therefore the output voltage of the charge pump is regulated to: VOUT = VD1 + VFLEDD1 VOUT -- Output voltage at VOUT VD1 -- Voltage from D1 to GND (Vsource at D1 pin, see electrical characteristics) VFLEDD1 -- Forward voltage of the LED connected to D1 Resistor Rg is used to provide current sharing between the 6 green LEDs. The upper value is calculated using: V * V FLEDD1 Fg Rg + Ig VFg -- Forward voltage of a green LED Ig -- Current per green LED 12 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 TPS60231 www.ti.com SLVS544A - OCTOBER 2004 - REVISED FEBRUARY 2010 VIN = 2.7 V to 6.5 V VIN VOUT C1+ D1 C1- D2 0.47 mF 1 mF 2 White LEDs With 25 mA Each D3 0.47 mF 1 mF C2+ C2- 6 Green LEDs With 4 mA Each EN1 EN2 GND ISET Rg = 220 W 6.2 kW Sets Current to 25 mA Per Current Sink (With EN2 = EN1 = 1) Figure 14. LED Connections for LCD Backlight and Keyboard Lighting PROPOSED LAND PATTERN FOR PCB PRODUCTION See the application note SLUA271 for the proposed land pattern of the QFN package. REVISION HISTORY Changes from Original (October 2004) to Revision A * Page Added a Test Condition to the Input voltage range of the ELECTRICAL CHARACTERISTICS - IO = 0 mA to 45 mA, VLED 2.1 V, T = C to 85C .............................................................................................................................................. 3 Submit Documentation Feedback Copyright (c) 2004-2010, Texas Instruments Incorporated Product Folder Link(s): TPS60231 13 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS60231RGTR ACTIVE QFN RGT 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS60231RGTRG4 ACTIVE QFN RGT 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS60231RGTT ACTIVE QFN RGT 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS60231RGTTG4 ACTIVE QFN RGT 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS60231RGTR QFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS60231RGTR QFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS60231RGTT QFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS60231RGTT QFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS60231RGTR QFN RGT 16 3000 367.0 367.0 35.0 TPS60231RGTR QFN RGT 16 3000 367.0 367.0 35.0 TPS60231RGTT QFN RGT 16 250 210.0 185.0 35.0 TPS60231RGTT QFN RGT 16 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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