PHN203
Dual N-channel TrenchMOS logic level FET
Rev. 05 — 27 April 2010 Product data sheet
1. Product profile
1.1 General description
Dual logic level N-channel enhancem ent mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product is designed and qualified for use in
computing, communications, consumer and industria l applications only.
1.2 Features and benefits
Suitable for high frequency
applications due to fast switching
characteristics
Suitable for logic level gate drive
sources
1.3 Applications
DC-to-DC converters Lithium-ion battery applications
1.4 Quick reference data
[1] Single device conducting.
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source
voltage Tj25 °C; Tj150°C --30V
IDdrain current Tamb = 25 °C; pulsed;
see Figure 1; see Figure 3 [1] --6.3A
Ptot total power
dissipation Tamb = 25 °C; pulsed;
see Figure 2 [1] --2W
Static characteristics
RDSon drain-source
on-state
resistance
VGS =10V; I
D=7A; T
j=2C;
see Figure 9; see Figure 10 - 2430m
Dynamic characteristics
QGD gate-drain charge VGS =10V; I
D=7A; V
DS =15V;
Tj=2C; see Figure 11 -3-nC
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 2 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
2. Pinning information
3. Ordering information
4. Limiting values
[1] Single device conducting.
Table 2. Pinning info rmation
Pin Symbol Description Simplified outline Graphi c sy mbol
1S1source1
SOT96-1 (SO8)
2 G1 gate1
3S2source2
4 G2 gate2
5D2drain2
6D2drain2
7D1drain1
8D1drain1
4
5
1
8D1
mbk72
5
G1S1
D1 D2
G2S2
D2
Table 3. Orderi ng information
Type number Package
Name Description Version
PHN203 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
Table 4. Limiting values
In accordance with the Absolute Maxi mum Rating System (IEC 60134).
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source voltage Tj25 °C; Tj150°C --30V
VDGR drain-gate voltage Tj150 °C; Tj25 °C; RGS =20k--30V
VGS gate-source voltage -20 - 20 V
IDdrain current Tamb = 70 °C; pulsed; see Figure 1 [1] --5A
Tamb = 25 °C; pulsed; see Figure 1;
see Figure 3 [1] --6.3A
IDM peak drain current tp10 µs; pul sed; Tamb =2C;
see Figure 3 [1] --18A
Ptot total power dissipation Tamb = 25 ° C; pulsed; see Figure 2 [1] --2W
Tstg storage temperature -55 - 150 °C
Tjjunction temperature -55 - 150 °C
Source-drain diode
ISsource current Tamb = 25 °C; pulsed [1] --2A
ISM peak source current tp10 µs; pulsed; Tamb =2C [1] --4.1A
Avalanche rugg edness
EDS(AL)S non-repetitive
drain-source
avalanche energy
VGS =10V; T
j(init) =2C; I
D=8.7A;
Vsup 30 V; unclamped; tp= 0.2 ms;
RGS =50
- - 37.8 mJ
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 3 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
Fig 1. Normalized continuous drain current as a
function of ambient temperature Fig 2. Normalized total po we r dis sipa tion as a
function of ambient temperature
Fig 3. Safe operating area; continuous and peak drain currents as a fun ction of drain-source voltage
03aa19
0
40
80
120
0 50 100 150 200
Tamb (°C)
Ider
(%)
03aa11
0
40
80
120
0 50 100 150 200
Tamb (°C)
Pder
(%)
03an69
102
101
1
10
102
101 1 10 102
DC
1 ms
1 s
100 ms
10 s
ID
(A)
VDS (V)
Limit RDSon = VDS / ID
tp = 10 μs
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 4 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-sp) thermal resistance from
junction to solder point ---K/W
Rth(j-a) thermal resistance from
junction to ambient mounted on a printed-circuit board;
minimum footprint; see Figure 4 - - 62.5 K/W
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration
101
1
10
102
103
105104103102101 1 10
single pulse
δ = 0.5
0.2
0.1
0.05
0.02
03an68
Zth(j-a)
(K/W)
tp (s)
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 5 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source
breakdown voltage ID=25A; V
GS =0V; T
j= -55 °C 27 - - V
ID=25A; V
GS =0V; T
j=25°C 30--V
VGS(th) gate-source threshold
voltage ID=1mA; V
DS =V
GS; Tj=-5C;
see Figure 8 --2.2V
ID=1mA; V
DS =V
GS; Tj= 150 °C;
see Figure 8 0.6--V
ID=1mA; V
DS =V
GS; Tj=2C;
see Figure 8 11.52V
IDSS drain leakage current VDS =24V; V
GS =0V; T
j=25°C --1µA
VDS =24V; V
GS =0V; T
j=150°C --10µA
IGSS gate leakage current VGS =20V; V
DS =0V; T
j= 25 °C - 10 100 nA
VGS =-20V; V
DS =0V; T
j= 25 °C - 10 100 nA
RDSon drain-source on-state
resistance VGS =10V; I
D=7A; T
j=2C;
see Figure 9; see Figure 10 - 2430m
VGS =4.5V; I
D= 3.5 A; Tj=2C;
see Figure 9; see Figure 10 - 3055m
VGS =10V; I
D=7A; T
j= 150 °C;
see Figure 9; see Figure 10 - 40.8 51 m
Dynamic characteristics
QG(tot) total gate charge ID=7A; V
DS =15V; V
GS =10V;
Tj=2C; see Figure 11 - 14.6 - nC
QGS gate-source charge - 2 - nC
QGD gate-drain charge - 3 - nC
Ciss input capacitance VDS =20V; V
GS = 0 V; f = 1 MHz;
Tj=2C; see Figure 12 - 560 - pF
Coss output capacitance - 125 - pF
Crss reverse transfer
capacitance VDS 20 V; VGS =0V; f=1MHz; T
j=2C;
see Figure 12 -85-pF
td(on) turn-on delay time VDS =25V; R
L=25; VGS =10V;
RG(ext) =6; Tj=2C -5-ns
trrise time - 6 - ns
td(off) turn-off delay time - 21 - ns
tffall time - 11 - ns
Source-drain diode
VSD source-drain voltage IS= 1.25 A; VGS =0V; T
j=2C;
see Figure 13 -0.751V
trr reverse recovery time IS=2A; dI
S/dt = -100 A/µs; VGS =0V;
VDS =25V; T
j=2C -30-ns
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 6 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical value Fig 6. Transfer character istics: drain current as a
function of gate-s ourc e volt ag e ; typi ca l v al ue s
Fig 7. Sub-threshold drain current as a function of
gate-source voltage Fig 8. Gate-source threshold voltage as a func tion of
junction temperature
03ao26
0
10
20
30
0 0.5 1 1.5
2.6 V
10 V
2.8 V
3 V
3.4 V
3.2 V
4 V4.5 V6 V
3.6 V
ID
(A)
VDS (V)
VGS = 2.4 V
Tj = 25 °C
03ae49
0
10
20
30
01234
VGS (V)
ID
(A)
VDS > ID x RDSon
Tj = 25 °C
150 °C
03aa36
10-6
10-5
10-4
10-3
10-2
10-1
0123
VGS (V)
ID
(A)
maxtypmin
03aa33
0
0.5
1
1.5
2
2.5
-60 0 60 120 180
Tj (°C)
VGS(th)
(V)
max
typ
min
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 7 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
Fig 9. Drain-source on-state resistance as a function
of drain current; typical values Fig 10. Normalized drain-source on-state resistance
factor as a function of junction temperature
Fig 11. Gate-source voltage as a function of gate
charge; typical values Fig 12. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
0
20
40
60
80
0102030
ID (A)
RDSon
(mΩ)
VGS = 3.2 V
4 V
10 V
6 V
4.5 V
3.6 V
3.4 V
03ao27
Tj = 25 °C
03ad57
60 0 60 120 180
Tj (°C)
0
0.5
1
1.5
2
a
03ae53
0
2
4
6
8
10
0 5 10 15
QG (nC)
VGS
(V)
ID = 7 A
Tj = 25 °C
VDD = 15 V
03ae52
10
102
103
101 1 10 102
VDS (V)
C
(pF)
Ciss
Coss
Crss
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 8 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
Fig 13. Source current as a function of sourc e-drain voltage; typical values
03ae51
0
10
20
30
0 0.3 0.6 0.9 1.2
V
SD
(V)
I
S
(A)
T
j
= 25 °C
150 °C
V
GS
= 0 V
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 9 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
7. Package outline
Fig 14. Package outline SOT96-1 (SO8)
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10
1.45
1.25 0.25 0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6
0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004
0.057
0.049 0.01 0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15 0.05 0.244
0.228
0.028
0.024
0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
S
O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96
-1
99-12-27
03-02-18
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 10 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PHN203 _5 20100427 Product data sheet - PHN203 _4
Modifications: Various changes to content.
PHN203 _4 20091208 Product data sheet - PHN203-03
PHN203 -03 20040126 Product data - PHN203 _2
PHN203_2 19990101 Product specification - PHN203 _1
PHN203 _1 19980204 Objective specification - -
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 11 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The p r oduct status of device(s) des cribed in this document may hav e changed sinc e this document was publish ed and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict wit h the short data sheet, the
full data sheet shall pre va il.
Product specificat io n The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this d ocument is be lieved to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for useNXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applicati ons where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application /use or t he application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Appl ica tion plann ed. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and t he
product. NXP Semiconductors does not accept any liability in this respect.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defin ed in the
Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter m s and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Export control — This document as well as the item(s) de scribed herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product deve lopment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
PHN203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 05 — 27 April 2010 12 of 13
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omotive use. It i s neither qua lified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such au tomotive applications, use and specificatio ns, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive appl ications beyond NXP Semiconductors’
standard warrant y and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFAR E Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PHN203
Dual N-channel TrenchMOS logic level FET
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 April 2010
Document identifier: PHN203
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .10
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .11
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .11
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10 Contact information. . . . . . . . . . . . . . . . . . . . . .12