08FMS-1.0SP-TF(LF)(SN) - JST

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

±16.5kV ESD, Large Output Swing, 5V, Full

Fail-Safe, 1/8 Unit Load, RS-485/RS-422

Transceivers

ISL3150E, ISL3152E, ISL3153E,

ISL3155E, ISL3156E, ISL3158E

The ISL315xE are IEC61000 ESD protected, 5V

powered transceivers that meet the RS-485 and RS-422

standards for balanced communication. Driver outputs

and receiv er in puts a re pr otected against ±16.5kV ESD

strike s withou t latc h-u p.

Transmitters in this family deliver exceptional differential

output voltages (2.4V min), into the RS-485 required

54Ω load, for better noise immunity, or to allow up to

eight 120Ω terminations in “star” topologies.

These devices have very low bus currents so they

present a true “1 /8 unit loa d” to the RS-4 85 bus. This

allows up to 256 transceivers on the network without

using repeaters.

Rec eiver ( Rx) inputs feature a “Full Fail-Safe” design,

which ensures a logic high Rx outpu t if Rx inputs are

floating, shorted, or on a terminated but undriven bus.

Rx outputs feature high drive levels - typically 28mA @

VOL = 1V (to ease the design of optocoupled isolated

interfaces).

Half duplex (Rx inputs and Tx outputs multiplexed

together) and full duplex pinouts are available. See

Table 1 on page 2 for key features and configur ations by

device number.

Features

•High Driver V

OD . . . . . . . 2.4V (Min) @ RD = 54Ω

Better Noise Immunity, or Drive Up to 8 Terminations

• ±16.5kV IEC61000 ESD Protection on I/O Bus Pins

• High Transient Overvoltage Tolerance. . . . ±100V

• Full Fail-safe (Open, Short, Terminated) Receivers

•High Rx I

OL for Opto-Couplers in Isolated Designs

• Hot Plug Circuitry - Tx and Rx Outputs Remain

Three-State During Power-up/Power-down

• True 1/8 Unit Load for up to 256 Devices on the Bus

• High Data Rates. . . . . . . . . . . . . . up to 20Mbps

• Low Quiescent Supply Current . . . . . . . . . 600µA

Ultra Low Shutdown Supply Current . . . . . . 70nA

Applications*(see page 17)

• Utility Meters/Automated Meter Reading S y stems

• High Node Count Systems

• PROFIBUS® and Field Bus Networks, and Factory

Automation

• Security Camera Networks

• Building Lighting and Environmental Control S ystems

• Industrial/Process Control Networks

Exceptional Tx Drives Up To 8

Terminations While Still

Delivering 1.5V VOD

Large VOD Delivers Superior

Signal At Cable End For

Enhanced Noise Immunity

DIFFERENTIAL OUTPUT VOLTAGE (V)

DRIVER OUTPUT CURRENT (mA)

012345

100

120

140

110

130

8 TERMS

6 TERMS

2 TERMS

1 TERM

1.5 20ns/DIV

-3

-1

-2

OUTPUT VOLTAGE (V)

20Mbps, 150’ UTP, DOUBLE 120Ω TERMS

ISL3158E

STANDARD

1.5V TX

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a regi s tered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

July 30, 2009

FN6363.2

2FN6363.2

July 30, 2009

TABLE 1. SUMMARY OF FEATURES

PART

NUMBER HALF/FULL

DUPLEX

DATA

RATE

(Mbps)

SLEW-

RATE

LIMITED? HOT

PLUG

DEVICES

ON BUS Rx/Tx

ENABLE? QUIESCENT

ICC (µA) LOW POWER

SHUTDOWN? PIN

COUNT

ISL3150E Full 0.115 Yes Yes 256 Yes 600 Yes 10, 14

ISL3152E Half 0.115 Yes Yes 256 Yes 600 Yes 8

ISL3153E Full 1 Yes Yes 256 Yes 600 Yes 10, 14

ISL3155E Half 1 Yes Yes 256 Yes 600 Yes 8

ISL3156E Full 20 No Yes 256 Yes 600 Yes 10, 14

ISL3158E Half 20 No Yes 256 Yes 600 Yes 8

Ordering Information

PART NUMBER PART MARKING TEMP. RANGE

(°C) PACKAGE

(Pb-Free) PKG.

DWG. #

ISL3150EIBZ (Notes 1, 3) 3150EIBZ -40 to +85 14 Ld SOIC M14.15

ISL3150EIUZ (Notes 1, 3) 3150Z -40 to +85 10 Ld MSOP M10.118

ISL3152EIBZ (Notes 1, 3) 3152EIBZ -40 to +85 8 Ld SOIC M8.15

ISL3152EIPZ (Notes 2, 3) ISL3152 EIPZ -40 to +85 8 Ld PDIP E8.3

ISL3152EIUZ (Notes 1, 3) 3152Z -40 to +85 8 Ld MSOP M8.118

ISL3153EIBZ (Notes 1, 3) 3153EIBZ -40 to +85 14 Ld SOIC M14.15

ISL3153EIUZ (Notes 1, 3) 3153Z -40 to +85 10 Ld MSOP M10.118

ISL3155EIBZ (Notes 1, 3) 3155EIBZ -40 to +85 8 Ld SOIC M8.15

ISL3155EIUZ (Notes 1, 3) 3155Z -40 to +85 8 Ld MSOP M8.118

ISL3156EIBZ (Notes 1, 3) 3156EIBZ -40 to +85 14 Ld SOIC M14.15

ISL3156EIUZ (Notes 1, 3) 3156Z -40 to +85 10 Ld MSOP M10.118

ISL3158EIBZ (Notes 1, 3) 3158EIBZ -40 to +85 8 Ld SOIC M8.15

ISL3158EIUZ (Notes 1, 3) 3158Z -40 to +85 8 Ld MSOP M8.118

1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder

processing applications.

3. These Intersil Pb-free plastic packaged products employ special Pb-fr ee material sets, mol ding compou nds/die at tach

materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both

SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that

meet or exceed the Pb-free requirements of IPC/J EDEC J STD-020.

4. For Moisture Sensitivity Level (MSL), please see device information pages for ISL3150E, ISL3152E , ISL3153E, ISL3155E,

ISL3156E and ISL3158E. For more information on MSL please see techbrief TB363.

Pin Configurations

ISL3152E, ISL3155E, ISL3158E

(8 LD MSOP, 8 LD SOIC, 8 LD PDIP)

TOP V IEW

ISL3150E, ISL3153E, ISL3156E

(10 LD MSOP)

TOP V IEW

ISL3150E, ISL3153E, ISL3156E

(14 LD SOIC)

TOP V IEW

VCC

B/Z

A/Y

GND

RRO

GND

VCC

RNC

GND

VCC

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

3FN6363.2

July 30, 2009

Pin Descriptions

PIN FUNCTION

RO Rec e i v e r o utput: I f A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected

(floating) or shorted.

RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.

DE Driver output enable. The driv er outputs, Y and Z, are enabled by bringing DE high. They are high impedance when

DE is low.

DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and

output Z low .

GND Ground connection.

A/Y ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and non inverting driver

output. Pin is an input if DE = 0; pin is an output if DE = 1.

B/Z ±16.5kV IEC61000 ESD Prot ected RS- 485/RS- 422 le ve l, in v erti ng receiv er i nput and in v erting driv er output. Pin is

an input if DE = 0; pin is an output if DE = 1.

A ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input.

B ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input.

Y ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting driver output.

Z ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting driver output.

VCC System power supply input (4.5V to 5.5V).

NC No Connection.

Truth Tables

TRANSMITTING

INPUTS OUTPUTS

RE DE DI Z Y

X1101

X1010

0 0 X High-Z High-Z

10XHigh-Z*High-Z*

NOTE: *Shutdown Mode (See Note 11).

RECEIVING

INPUTS OUTPUT

RE DE

Half

Duplex

Full

Duplex

A-B RO

00 X≥ -0.05V 1

00 X≤ -0.2V 0

0 0 X Inputs

Open/Shorted 1

10 0 XHigh-Z*

11 1 XHigh-Z

NOTE: *Shutdown Mode (See Note 11).

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

4FN6363.2

July 30, 2009

Typical Operating Circuit

ISL3152E, ISL3155E, ISL3158E

ISL3150E, ISL3153E, ISL3156E (SOIC PIN NUMB ERS SHOWN)

0.1µF

VCC

GND

A/Y

B/Z

+5V

0.1µF+

VCC

GND

A/Y

B/Z

+5V

RTRT

0.1µF

R12

6, 7

VCC

GND

+5V

0.1µF+

6, 7

VCC

GND

+5V

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

5FN6363.2

July 30, 2009

Absolute Maximum Ratings Thermal Information

VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V

Input Voltages

DI, DE, RE . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)

Input/Output Voltages

A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . -9V to +13V

A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω,

Note 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100V

RO. . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)

Short Circuit Duration

Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous

ESD Rating . . . . . . . . . . . . . . . . . See Specification Table

Recommended Operating Conditions

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V

Temperature Range . . . . . . . . . . . . . . . . -40°C to +85°C

Bus Pin Common Mode Voltage Range . . . . . -7V to +12V

Thermal Resistance (Typical, Note 5) θJA (°C/W)

8 Ld SOIC . . . . . . . . . . . . . . . . . 105

8 Ld MSOP, PDIP* . . . . . . . . . . . . 140

10 Ld MSOP . . . . . . . . . . . . . . . . 130

14 Ld SOIC . . . . . . . . . . . . . . . . 130

Maximum Junction Temperature (Plasti c Package) . +150°C

Maximum Storage Temperature Range . . -65°C to +150°C

Pb-Free Reflow Profile. . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

*Pb-free PDIPs can be used for through-hole wave solder

processing only. They are not intended for use in Reflow

solder processing applications.

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact

product reliability and result in failures not covere d by warranty.

NOTE:

5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief

TB379 for details.

Electrical Specifications Test Con d itions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,

TA=+25°C (Note6). Boldface limits apply over the operating temperature range,

-40°C to +85°C.

PARAMETER SYMBOL TEST CONDITIONS TEMP

(°C) MIN

(Note 14) TYP MAX

(Note 14) UNITS

DC CHARACTERISTICS

Driver Differential VOUT

(No load) VOD1 Full - - VCC V

Driver Differential VOUT

(Loaded) VOD2 RL = 100Ω (RS-422) (Figure 1A) Full 2.8 3.6 - V

RL = 54Ω (RS-485) (Figure 1A) Full 2.4 3.1 VCC V

RL = 15Ω (Eight 120Ω terminations)

(Note 15) 25 - 1.65 - V

RL = 60Ω, -7V ≤ VCM ≤ 12V

(Figure 1B) Full 2.4 3- V

Change in Magnitude of

Driver Differential VOUT for

Complementary Output

States

ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V

Driver Common-Mode VOUT VOC RL = 54Ω or 100Ω (Figure 1A) Full - - 3.15 V

Change in Magnitude of

Driver Common-Mode VOUT

for Complementary Output

States

ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V

Logic Input High Voltage VIH DE, DI, RE Full 2--V

Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V

DI Input Hysteresis Voltage VHYS 25 - 100 - mV

Logic Input Current IIN1 DE, DI, RE Full -2 -2µA

Input Current (A, B, A/Y,

B/Z) IIN2 DE = 0V, VCC = 0V or

5.5V VIN = 12V Full - 70 125 µA

VIN = -7V Full -75 55 - µA

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

6FN6363.2

July 30, 2009

Output Leakage Current

(Y, Z) (Full Duplex Versions

Only)

IIN3 RE = 0V, DE = 0V,

VCC = 0V or 5.5V VIN = 12V Full - 1 40 µA

VIN = -7V Full -40 -9 - µA

Output Leakage Current

(Y, Z) in Shutdown Mode

(Full Duplex)

IIN4 RE = VCC, DE = 0V,

VCC = 0V or 5.5V VIN = 12V Full - 1 20 µA

VIN = -7V Full -20 -9 - µA

Driver Short-Circuit Current,

VO = High or Low IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note

8) Full - - ±250 mA

Receiver Differential

Threshold Voltage VTH -7V ≤ VCM ≤ 12V Full -200 -90 -50 mV

Receiver Input Hysteresis ΔVTH VCM = 0V 25 - 20 - mV

Re ceiver Outpu t High

Voltage VOH IO = -8mA, VID = -50mV Full VCC - 1.2 4.3 - V

Re ceiver Outpu t Low Voltage VOL IO = -8mA, VID = -200mV Full - 0.25 0.4 V

Receiver Output Low Current IOL VO = 1V, VID = -200mV Full 20 28 - mA

Three-State (High

Impedance) Receiver Output

Current

IOZR 0.4V ≤ VO ≤ 2.4V Full -1 0.03 1µA

Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 96 160 - kΩ

Receiver Short-Circuit

Current IOSR 0V ≤ VO ≤ VCC Full ±7 65 ±85 mA

SUPPLY CURRENT

No-Load Supply Current

(Note 7) ICC Half Duplex Versions, DE = VCC,

RE = X, DI = 0V or VCC Full - 650 800 µA

All Versions, DE = 0V, RE = 0V, or Full

Duplex Versions, DE = VCC, RE = X.

DI = 0V or VCC

Full - 550 700 µA

Shutdown Supply Current ISHDN DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.07 3µA

ESD PERFORMANCE

RS-485 Pins (A, Y, B, Z, A/Y,

B/Z) IEC61000-4-2,

Air-Gap Discharge

Method

1/2 Duplex 25 - ±16.5 - kV

Full Duplex 25 - ±10 - kV

IEC61000-4-2, Contact Discharge

Method 25 - ±9 - kV

Human Body Model, From Bus Pins to

GND 25 - ±16.5 - kV

All Pins Human Body Model, per MIL-STD-883

Method 3015 25 - ±7 - kV

Machine Model 25 - 400 - V

Electrical Specifications Test Con d itions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,

TA=+25°C (Note6). Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER SYMBOL TEST CONDITIONS TEMP

(°C) MIN

(Note 14) TYP MAX

(Note 14) UNITS

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

7FN6363.2

July 30, 2009

DRIVER SWITCHING CHARACTERISTICS (115kbps Versions; ISL3150E, ISL3152E)

Driver Differential Output

Delay tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2) Full 500 970 1300 ns

Driver Differential Output

Skew tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 12 50 ns

Driver Differential Rise or

Fall Time tR, tFRDIFF = 54Ω, CL = 100pF (Figure 2) Full 700 1100 1600 ns

Maximum Data Rate fMAX CD = 820pF (Figure 4) (Note 17) Full 115 2000 -kbps

Driver Enable to Output High tZH RL = 500Ω, CL = 100pF, SW = GND

(Figure 3), (Note 9) Full - 300 600 ns

Driver Enable to Output Low tZL RL = 500Ω, CL = 100pF, SW = VCC

(Figure 3), (Note 9) Full - 130 500 ns

Driver Disable from Output

Low tLZ RL = 500Ω, CL = 15pF, SW = VCC

(Figure 3) Full - 50 65 ns

Driver Disable from Output

High tHZ RL = 500Ω, CL = 15pF, SW = GND

(Figure 3) Full - 35 60 ns

Time to Shutdown tSHDN (Note 11) Full 60 160 600 ns

Driver Enable from

Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND

(Figure 3), (Notes 11, 12) Full - - 250 ns

Driver Enable from

Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC

(Figure 3), (Notes 11, 12) Full - - 250 ns

DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL3153E, ISL3155E)

Driver Differential Output

Delay tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2) Full 150 270 400 ns

Driver Differential Output

Skew tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 3 10 ns

Driver Differential Rise or

Fall Time tR, tFRDIFF = 54Ω, CL = 100pF (Figure 2) Full 150 325 450 ns

Maximum Data Rate fMAX CD = 820pF (Figure 4) (Note 17) Full 18-Mbps

Driver Enable to Output High tZH RL = 500Ω, CL = 100pF, SW = GND

(Figure 3), (Note 9) Full - 110 200 ns

Driver Enable to Output Low tZL RL = 500Ω, CL = 100pF, SW = VCC

(Figure 3), (Note 9) Full - 60 200 ns

Driver Disable from Output

Low tLZ RL = 500Ω, CL = 15pF, SW = VCC

(Figure 3) Full - 50 65 ns

Driver Disable from Output

High tHZ RL = 500Ω, CL = 15pF, SW = GND

(Figure 3) Full - 35 60 ns

Time to Shutdown tSHDN (Note 11) Full 60 160 600 ns

Driver Enable from

Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND

(Figure 3), (Notes 11, 12) Full - - 250 ns

Driver Enable from

Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC

(Figure 3), (Notes 11, 12) Full - - 250 ns

Electrical Specifications Test Con d itions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,

TA=+25°C (Note6). Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER SYMBOL TEST CONDITIONS TEMP

(°C) MIN

(Note 14) TYP MAX

(Note 14) UNITS

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

8FN6363.2

July 30, 2009

DRIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3 156E, ISL3158E)

Driver Differential Output

Delay tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 21 30 ns

Driver Differential Output

Skew tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 0.2 3ns

Driver Differential Rise or Fall

Time tR, tFRDIFF = 54Ω, CL = 100pF (Figure 2) Full - 12 16 ns

Maximum Data Rate fMAX CD = 470pF (Figure 4) (Note 17) Full 20 55 -Mbps

Driver Enable to Output High tZH RL = 500Ω, CL = 100pF, SW = GND

(Figure 3), (Note 9) Full - 30 45 ns

Driver Enable to Output Low tZL RL = 500Ω, CL = 100pF, SW = VCC

(Figure 3), (Note 9) Full - 28 45 ns

Driver Disable from Output

Low tLZ RL = 500Ω, CL = 15pF, SW = VCC

(Figure 3) Full - 50 65 ns

Driver Disable from Output

High tHZ RL = 500Ω, CL = 15pF, SW = GND

(Figure 3) Full - 38 60 ns

Time to Shutdown tSHDN (Note 11) Full 60 160 600 ns

Driver Enable from

Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND

(Figure 3), (Notes 11, 12) Full - - 200 ns

Driver Enable from

Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC

(Figure 3), (Notes 11, 12) Full - - 200 ns

RECEIVER SWITCHING CHARACTERISTICS (115kbps and 1Mbps Versions; ISL3150E through ISL3155E)

Maximum Data Rate fMAX (Figure 5) (Note 17) Full 112 -Mbps

Receiver Input to Output

Delay tPLH, tPHL (Figure 5) Full - 100 150 ns

Receiver Skew | tPLH - tPHL |t

SKD (Figure 5) Full - 4 10 ns

Receiver Enable to Output

Low tZL RL = 1kΩ, CL = 15pF, SW = VCC

(Figure 6), (Note 10) Full - 9 20 ns

Receiver Enable to Output

High tZH RL = 1kΩ, CL = 15pF, SW = GND

(Figure 6), (Note 10) Full - 7 20 ns

Receiver Disable from

Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC

(Figure 6) Full - 8 15 ns

Receiver Disable from

Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND

(Figure 6) Full - 8 15 ns

Time to Shutdown tSHDN (Note 11) Full 60 160 600 ns

Receiver Enable from

Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND

(Figure 6), (Notes 11, 13) Full - - 200 ns

Receiver Enable from

Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC

(Figure 6), (Notes 11, 13) Full - - 200 ns

RECEIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3 156E, ISL3158E)

Maximum Data Rate fMAX (Figure 5) (Note 17) Full 20 30 -Mbps

Receiver Input to Output

Delay tPLH, tPHL (Figure 5) Full - 33 45 ns

Electrical Specifications Test Con d itions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,

TA=+25°C (Note6). Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER SYMBOL TEST CONDITIONS TEMP

(°C) MIN

(Note 14) TYP MAX

(Note 14) UNITS

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

9FN6363.2

July 30, 2009

Receiver Skew | tPLH - tPHL |t

SKD (Figure 5) Full - 2.5 5ns

Receiver Enable to Output

Low tZL RL = 1kΩ, CL = 15pF, SW = VCC

(Figure 6), (Note 10) Full - 8 15 ns

Receiver Enable to Output

High tZH RL = 1kΩ, CL = 15pF, SW = GND

(Figure 6), (Note 10) Full - 7 15 ns

Receiver Disable from

Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC

(Figure 6) Full - 8 15 ns

Receiver Disable from

Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND

(Figure 6) Full - 8 15 ns

Time to Shutdown tSHDN (Note 11) Full 60 160 600 ns

Receiver Enable from

Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND

(Figure 6), (Notes 11, 13) Full - - 200 ns

Receiver Enable from

Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC

(Figure 6), (Notes 11, 13) Full - - 200 ns

NOTES:

6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground

unless otherwise speci fied.

7. Supply current specification is valid for loaded drivers when DE = 0V.

8. Applies to peak current. See “Typical Performance Curves” beginning on page 14 for more information.

9. Keep RE = 0 to prevent the device from entering SHDN.

10. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.

11. Transceiv ers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts

are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns , the parts are guaranteed to have ente red

shutdown. See “Low Power Shutdown Mode” on page 13.

12. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.

13. Set the RE signal high time >600ns to ensure that the device enters SHDN.

14. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established

by characterization and are not production tested.

15. See Figure 8 for more information, and for performance over-temperature.

16. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle).

17. Limits established by characterization and are not production tested.

Test Circuits and Waveforms

FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD

FIGURE 1. DC DRIVER TEST CIRCUITS

Electrical Specifications Test Con d itions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,

TA=+25°C (Note6). Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER SYMBOL TEST CONDITIONS TEMP

(°C) MIN

(Note 14) TYP MAX

(Note 14) UNITS

VCC

VOD

VOC

RL/2

VCC

VOD

375Ω

RL = 60ΩVCM

-7V TO +12V

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

10 FN6363.2

July 30, 2009

FIGURE 2A . TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS

FIGURE 2. DRIVER PROPAGAT ION DELAY AND DIFFERENTIAL TRANSITION TIMES

FIGURE 3A . TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS

FIGURE 3. DRIVER ENABLE AND DISABLE TIMES

FIGURE 4A . TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS

FIGURE 4. DRIVER DATA RATE

Test Circuits and Waveforms (Continued)

VCC

SIGNAL

GENERATOR

CL = 100pF

RDIFF

YCL = 10 0pF

OUT (Z)

1.5V1.5V

VOH

VOL

OUT (Y)

tPLH tPHL

DIFF OUT (Y - Z)

+VOD

-VOD

90% 90%

10% 10%

SKEW = |tPLH - tPHL|

DI Z

VCC

GND

PARAMETER OUTPUT RE DI SW CL

(pF)

tHZ Y/Z X 1/0 GND 15

tLZ Y/Z X 0/1 VCC 15

tZH Y/Z 0 (Note 9) 1/0 GND 100

tZL Y/Z 0 (Note 9) 0/1 VCC 100

tZH(SHDN) Y/Z 1 (Note 12) 1/0 GND 100

tZL(SHDN) Y/Z 1 (Note 12) 0/1 VCC 100

SIGNAL

GENERATOR

500Ω

OUT (Y, Z)

1.5V1.5V

VOH

VOH - 0.5V

tHZ

OUT (Y, Z)

VCC

VOL

VOL + 0.5V

tLZ

OUTPUT HIGH

OUTPUT LOW

tZL, tZL(SHDN)

tZH, tZH(SHDN)

NOTE 10

2.3V

NOTE 10

VCC

SIGNAL

GENERATOR

YCDVOD

60Ω

DIFF OUT (Y - Z) +VOD

-VOD

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

11 FN6363.2

July 30, 2009

FIGURE 5A . TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS

FIGURE 5. RECEIVER PROPAGAT I ON DELAY AND DATA RATE

FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS

FIGURE 6. R ECEIVER ENABLE AND DISABLE TIMES

Test Circuits and Waveforms (Continued)

SIGNAL

GENERATOR

RRO

0V 15pF

+1.5V

-1.5V

tPLH

0V0V

VCC

1.5V 1.5V

tPHL

1kΩVCC

GND

PARAMETER DE A SW

tHZ 0 +1.5V GND

tLZ 0 -1.5V VCC

tZH (Note 10) 0 +1.5V GND

tZL (Note 10) 0 -1.5V VCC

tZH(SHDN) (Note 13) 0 +1.5V GND

tZL(SHDN) (Note 13) 0 -1.5V VCC

SIGNAL

GENERATOR

RRO

GND

15pF

1.5V1.5V

VOH

1.5V VOH - 0.5V

tHZ

VCC

VOL

1.5V VOL + 0.5V

tLZ

OUTPUT HIGH

OUTPUT LOW

tZL, tZL(SHDN)

tZH, tZH(SHDN)

NOTE 10

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

12 FN6363.2

July 30, 2009

Application Information

RS-485 and RS-422 are differential (balanced) data

transmission standards used for long haul or noisy

environments. RS-422 is a subset of RS-485, so RS-485

transceivers are also RS-422 compliant. RS-422 is a

point-to-multipoint (multidrop) standard, which allows

only one driver and up to 10 (assuming one unit load

devices) receivers on each bus. RS-485 is a true

multipoint standard, which allows up to 32 one unit load

devices (any combination of drivers and receivers) on

each bus. To allow for multipoint oper ation, the RS-485

specification requires that drivers must handle bus

contention without sustaining any damage.

Another important advantage of RS-485 is the extended

common mode range (CMR), which specifies that the

driver outputs and receiver inputs withstand signals that

range from +12V to -7V. RS-422 and RS-485 are

intended for runs as long as 4000’, so the wide CMR is

necessary to handle ground potential differences, as well

as voltages induced in the cable by external fields.

Receiver (Rx) Features

These devices utilize a differenti al input receiver for

maximum noise immunity and common mode rejection.

Input sensitivity is better than ±200mV, as required by

the RS-422 and RS-485 spec ifications .

Rx outputs feature hi gh driv e lev e ls (typi cally 28 mA @

VOL = 1V) to ease the design of optica lly c ouple d

isolated interfaces.

Receiv er input resistance of 96kΩ surpasses the RS-422

specification of 4kΩ, and is eight times the RS-485 “Unit

Load (UL)” requirement of 12kΩ minimum. Thus, these

products are known as “one-eighth UL” transceivers, and

there can be up to 256 of these devices on a network

while still complying with the RS-485 loading

specification.

Rx inputs function with common mode vo ltages as great

as ±7V outside the power supplies (i.e. , +12V and -7V),

making them ideal for long networks where induced

voltages are a realistic concern .

All the receivers include a “full fail-safe” function that

guarantees a high level receiv er output if the receiver

inputs are unconnected (floating), shorted together, or

connected to a terminated bus with all the tr ansmitters

disabled.

R eceivers easily meet the data r ates supported by the

corresponding driver, and all receiv er outputs are

three-statable via the active low RE input.

Driver (Tx) Features

The RS-485/RS-422 driver is a differential output device

that delivers at least 2.4V across a 54Ω load (RS-485),

and at least 2.8V across a 100Ω load (RS-422). The

drivers feature low propagation delay skew to maximiz e

bit width, and to minimize EMI, and all drivers are

three-statable via the active high DE input.

The 115kbps and 1Mbps driver outputs are slew rate

limited to minimize EMI, and to minimize reflection s in

unterminated or improperly terminated networks.

Outputs of the ISL3156E and ISL3158E drivers are not

limited, so faster output transition times allow data rates

of at least 20Mbps.

HIGH VOD IMPROVES NOISE IMMUNITY AND

FLEXIBILITY

The ISL315xE driver design delivers larger differential

output voltages (VOD) than the RS-485 standard

requires, or than most RS-485 tr ansmitters can deliv er.

The minimum ±2.4V VOD guarantees at least ±900mV

more noise immunity than networks built using standard

1.5V VOD transmitters.

Another advantage of th e large VOD is the ability to drive

more than two bus terminations, which allows for

utilizing the ISL315xE in “star” and other

multi-terminated, “nonstandard” network topologies.

Figure 8, details the transmitter’ s VOD vs IOUT

characteristic, and includes load lines for six (20 Ω) and

eight (15Ω) 120Ω terminations. The figure shows that

the driver typically delivers 1.65/1.5V into 6/8

terminations, even at the worst case temperature of

+85°C. The RS-485 standard requires a minimu m 1.5V

VOD into two terminations, but the ISL315xE deliv ers

RS-485 voltage levels with 3x to 4x the number of

terminations.

Hot Plug Function

When a piece of equipment powers up, there is a period

of time where the processor or ASIC driving the RS-485

control lines (DE, RE) is unable to ensure that the

RS-485 Tx and Rx outputs are kept disabled. If the

equipment is connected to the bus, a driver activating

prematurely during power-up ma y cr ash the bus. To

avoid this scenario , the ISL315xE devices incorpor ate a

“Hot Plug” function. Circuitry monitoring V CC ensures

that, during power-up and power- down, the T x and Rx

outputs remain disabled, regardless of the state of DE

and RE, if VCC is less than ~3.4V. This gives the

processor/ASIC a chance to stabilize and drive the

RS-485 control lines to the proper states.

TIME (40

s/DIV)

VCC

RECEIVER OUTPU T (V)

DRIVER Y OUTPUT (V)

2.5

5.0

2.5

5.0

VCC (V)

RL = 1k

2.5

5.0

RL = 1k

3.3V

3.5V

ISL315xE

RE = GND

DE, DI = VCC

FIGURE 7 . HOT PLUG PERF ORMANCE (ISL315x E) vs

ISL83088E WITHOUT HOT PLUG

CIRCUITRY

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

13 FN6363.2

July 30, 2009

ESD Protection

All pins on these devices include class 3 (>7kV)

Human Body Model (HBM) ESD protection structures,

but the RS-485 pins (dri ver outpu ts an d rec eiver

inputs) incorporate advanced structures allowing

them to survive ESD events in excess of ±16.5kV

HBM and ±16.5kV (1/2 duplex) IEC61000-4-2. The

RS-485 pins a re particular ly vulner able to ESD st rikes

because they typica lly co nnec t to an exposed port on

the exterior of th e finis hed pro duct . Simply to uc hing

the port pins, or connecting a cable, can cause an

ESD event that might destroy unprotected ICs. These

new ESD structures protect the device whether or not

it is powered up, and without degrading the RS-485

common mode range of -7V to +12V. This bu ilt-in

ESD protection eliminates the need for board level

protection structures (e.g., transient suppression

diodes), and the associated, undesirable capacitive

load they present.

IEC61000-4-2 Testing

The IEC61000 test method applies to finished

equipment, r ather than to an in dividual IC. Th erefore,

the pins most likely to suffer an ESD event are those that

are exposed to the outside world (the RS-485 pins in this

case), and the IC is tested in its typical application

configuration (power applied) rather than testing each

pin-to-pin combination. The IEC61000 standard’s lower

current limiting resistor coupled with the larger charge

storage capacitor yields a test that is much more severe

than the HBM test. The extr a ESD protection built into

this device’ s RS-485 pins allows the design of equipment

meeting level 4 criteria without the need for additional

board level protection on the RS-485 port.

AIR-GAP DISCHARGE TEST METHOD

For this test m ethod, a charged probe tip mov es toward

the IC pin until the voltage arcs to it. The current

wav eform delivered to the IC pin depends on approach

speed, humidity, temperature, etc., so it is difficult to

obtain repeatable results. The ISL315xE 1/2 duplex

RS-485 pins withstand ±16.5kV air-gap discharges.

CONTACT DISCHARGE TEST METHOD

During the contact discharge test, the probe contacts the

tested pin before the probe tip is energized, thereby

eliminating the variables associated with the air-gap

discharge. The result is a more repeatable and

predictable test, but equipment limits prevent testing

devices at voltages higher than ±9kV. The RS-485 pins of

all the ISL315xE versions survive ±9kV contact

discharges.

Data Rate, Cables, and Terminations

RS-485/RS-422 are intended for network lengths up to

4000’, but the maximum system data rate decreases as

the transmission length increases. Devices operating at

20Mbps are limited to lengths less than 100’, while the

115kbps versions can oper ate at full data r ates with

lengths of several 1000’.

Twisted pair is the cable of choice for RS-485/RS-422

networks. Twisted pair cables tend to pick up noise and

other electromagnetically induced voltages as common

mode signals, which are effectively rejected by the

differential receivers in these ICs.

Proper termination is imperative, when using the 20Mbps

devices, to minimize reflec tions. Short networks using

the 115kbps versions need not be terminated, but,

terminations are recommended unless power dissipation

is an overriding concern.

In point-to-point, or point -to-multipoint (single driv er on

bus) networks, the main cable should be terminated in

its characteristic impedance (typically 120Ω) at the end

farthest from the driver. In multi-receiver applications,

stubs connecting receivers to the main cable should be

kept as short as possible. Multipoint (multi-driv er)

systems require that the main cable be terminated in its

characteristic impedance at both ends. Stubs connecting

a transceiver to the main cable should be k ept as short

as possible.

Built-In Driver Overload Protection

As stated previously, the RS-485 specification requires

that drivers survive worst case bus contentions

undamaged. These devices meet this requirement via

driver output short circuit current limits, and on-chip

thermal shutdown circuitry.

The driver output stages incorporate short circuit current

limiting circuitry which ensures that the output current

never exceeds the RS-485 specification, even at the

common mode voltage range extremes.

In the event of a major short circuit condition, devices

also include a thermal shutdown feature that disables the

drivers whenever the die temperature becomes

excessive. This eliminates the power dissipation, allowing

the die to cool. The drivers automatically re-enable after

the die temperature drops about 15°C. If the contention

persists, the thermal shutdown/re-enable cycle repeats

until the fault is cleared. R eceivers sta y operational

during thermal shutdown.

Low Power Shutdown Mode

These CMOS transceivers all use a fr action of the power

required by their bipolar counterparts, but they also

include a shutdown feature that reduces the already low

quiescent ICC to a 70nA trickle. These devices enter

shutdown when ev er the rec eiv er and dr iver are

simultaneously disabled (RE =V

CC and DE = GND)

for a period of at least 600ns. Disabling both the driver

and the receiver for less than 60ns guarantees that the

transceiver will not enter shutdown.

Note that receiver and driver enable times increase when

the transceiver enables from shutdown. R efer to Notes 9,

10, 11, 12 and 13, at the end of the “Electrical

Specification” table on page 9, for more information.

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

14 FN6363.2

July 30, 2009

Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified.

FIGURE 8. DRIVER OUTPUT CURRENT vs

DIFFERENTIAL OUTPUT VOLTAGE FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE

vs TEMPERATURE

FIGURE 1 0. DRIVER OUTPU T CURRENT vs SHOR T

CIRCUIT VOLTAGE FIGURE 11. SUPPLY CURRENT vs TEMPERATURE

FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION

DELAY vs TEMPERATURE (ISL3150E,

ISL3152E)

FIGURE 13. DRIVER DIFFERENTIAL SKEW vs

TEMPERATURE (ISL3150E, ISL3152E)

DIFFERENTIAL OUTPUT VOLTAGE (V)

DRIVER OUTPUT CURRENT (mA)

012345

100

120

140

110

130

+25°C

+85°C

RD = 15Ω

RD = 20Ω

RD = 54Ω

RD = 100Ω

-40 0 50 85

TEMPERATURE (°C)

DIFFERENTIAL OUTPUT VOLTAGE (V)

-25 25 75

2.9

3.1

3.2

3.3

3.4

3.5

3.6

3.7

RDIFF = 54Ω

RDIFF = 100Ω

3.0

OUTPUT VOLTAGE (V)

-7 -6 -4 -2 0 2 4 6 8 10 12

OUTPUT CURRENT (mA)

-50

100

150

200

-100

-200

-150 Y OR Z = HIGH

Y OR Z = LOW

-40 0 50 85

TEMPERATURE (°C)

ICC (µA)

-25 25 75

500

540

580

600

620

640

660

520

560

DE = VCC, RE = X

DE = GND, RE = GND

-40 0 50 85

TEMPERATURE (°C)

-25 25 75

PROPAGATION DELAY (ns)

960

980

985

990

995

1000

1005

1010

tPLH

tPHL

965

970

975

-40 0 50 85

TEMPERATURE (°C)

SKEW (ns)

-25 25 75

|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

15 FN6363.2

July 30, 2009

FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION

DELAY vs TEMPERATURE (ISL3153E,

ISL3155E)

FIGURE 15. DRIVER DIFFERENTIAL SKEW vs

TEMPERATURE (ISL3153E, ISL3155E)

FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION

DELAY vs TEMPERATURE (ISL3156E,

ISL3158E)

FIGURE 17. DRIVER DIFFERENTIAL SKEW vs

TEMPERATURE (ISL3156E, ISL3158E)

FIGURE 18. DRIVER AND RECEIVER WAVEFORMS,

(ISL3150E, ISL3152E) FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,

(ISL3153E, ISL3155E)

Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued)

-40 0 50 85

TEMPERATURE (°C)

-25 25 75

PROPAGATION DELAY (ns)

270

280

282

284

286

288

290

272

274

276

278

-40 0 50 85

TEMPERATURE (°C)

SKEW (ns)

-25 25 75

3.5

3.0

2.5

2.0

1.5

1.0

|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|

-40 0 50 85

TEMPERATURE (°C)

-25 25 75

PROPAGATION DELAY (n s)

-40 0 50 85

TEMPERATURE (°C)

SKEW (ns)

-25 25 75

0.28

0.18

0.16

0.14

0.12

0.10

|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|

0.26

0.24

0.22

0.20

TIME (1μs/DIV)

RECEIVER OUTPUT (V)

RDIFF = 54Ω, CL = 100pF

DRIVER OUTPUT (V)

DRIVER INPUT (V)

A/Y

B/Z

TIME (400ns/DIV)

RECEIVER OUTPUT (V)

RDIFF = 54Ω, CL = 100pF

DRIVER OUTPUT (V)

DRIVER INPUT (V)

B/Z

A/Y

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

16 FN6363.2

July 30, 2009

FIGURE 20. DRIVER AND RECEIVER WAVEFORMS,

(ISL3156E, ISL3158E) FIGURE 21. RECEIVER OUTPUT CURRENT vs

RECEIVER OUTPUT VOLTAGE

Die Characteristics

SUBSTRATE POTENTIAL (POWERED UP):

GND

TRANSISTOR COUNT:

530

PROCESS:

Si Gate BiCMOS

Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued)

TIME (20ns

DIV)

RECEIVER OUTPUT (V)

RDIFF = 54

, CL = 100pF

DRIVER OUTPUT (V)

DRIVER INPUT (V)

RECEIVER OUTPUT VOLTAGE (V)

RECEIVER OUTPUT CURRENT (mA)

012345

VOH, +25°C

VOH, +85°C

VOL, +25°C

VOL, +85°C

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

17 FN6363.2

July 30, 2009

Products

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processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.

*For a complete listing of Applications, Related Documentation and Related P arts, please see the respective device

information page on intersil.com: ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff

FITs are available from our website at http://rel.intersil.com/reports/search.php

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to

web to make sure you have the latest Rev.

DATE REVISION CHANGE

6/30/09 FN6363.2 Converted to New Intersil Template. Re v 2 Changes are as follows:

Page 1 - Introduction was reworded in order to fit graphs. Features Section by listing only key

features. Added performance graphs.

Page 2 - Updated Ordering information by numbering al l notes and referenc ing them on each

part. Added MSL Note as new standard with linked parts to device info page. Updated Pinout

name to Pin Configurations with Pin Descriptions following on page 3.

Page 5 - Added Boldface limit verbiage in Elect. spec table and bolded Min and Max over-temp

limits.

Page 17 - Added Revision History and Products information with all links inc luded.

1/17/08 FN6363.1 Added 8 Ld PDIP to ordering information, POD and Thermal resistance. Applied Intersil

Standards as follows: Updated ordering information with Notes for tape and reel reference,

pb-free PDIP and lead finish. Added pb-free reflow link and pb-free note to Thermal

Information. Added E8.3 POD.

2/20/07 F N6363.0 Cosmetic edit to the ISL315xE data sheet, no rev, no date change, no formal per Denise

Scarborough. Removed both commas in this sentence in the first paragraph : "Each driver

output, and receiver input, is protected against ±16.5kV ESD strikes without latch-u p."

12/14/06 FN6363.0 Initial Release to web

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

18 FN6363.2

July 30, 2009

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Mini Small Outline Plastic Packages (MSOP)

NOTES:

1. These package dimensions are within allowable dimensions of

JEDEC MO-187BA.

2. Dimensioning and tolerancing per ANSI Y14.5M-1994.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs and are measured at Datum Plane. Mold flash, protrusion

and gate burrs shall not exceed 0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions

and are measured at Datum Plane. Interlead flash and

protrusions shall not exceed 0.15mm (0.006 inch) per side.

5. Formed leads shall be planar with respect to one another within

0.10mm (0.004) at seating Plane.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable

dambar protrusion shall be 0.08mm (0.003 inch) total in excess

of “b” dimension at maximum material condition. Minimum space

between protrusion and adjacent lead is 0.07mm (0.0027 inch).

10. Datums and to be determined at Datum plane

11. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are for reference only.

0.25

(0.010)

4X θ

GAUGE

PLANE

SEATING

PLANE

EE1

TOP VIEW

INDEX

AREA

-C-

-B-

0.20 (0.008) ABC

SEATING

PLANE

0.20 (0.008) C

0.10 (0.004) C

-A-

-H-

SIDE VIEW

-B-

END VIEW

0.20 (0.008) CD

- H -

-A - - B -

- H -

M8.118 (JEDEC MO-187AA)

8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.037 0.043 0.94 1.10 -

A1 0.002 0.006 0.05 0.15 -

A2 0.030 0.037 0.75 0.95 -

b 0.010 0.014 0.25 0.36 9

c 0.004 0.008 0.09 0.20 -

D 0.116 0.120 2.95 3.05 3

E1 0.116 0.120 2.95 3.05 4

e 0.026 BSC 0.65 BSC -

E 0.187 0.199 4.75 5.05 -

L 0.016 0.028 0.40 0.70 6

L1 0.037 REF 0.95 REF -

N8 87

R 0.003 - 0.07 - -

R1 0.003 - 0.07 - -

o15o5o15o-

α0o6o0o6o-

Rev. 2 01/03

19 FN6363.2

July 30, 2009

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Mini Small Outline Plastic Packages (MSOP)

NOTES:

1. These package dimensions are within allowable dimensions of

JEDEC MO-187BA.

2. Dimensioning and tolerancing per ANSI Y14.5M-1994.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs and are measured at Datum Plane. Mold flash, protrusion

and gate burrs shall not exceed 0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions

and are measured at Datum Plane. Interlead flash and

protrusions shall not exceed 0.15mm (0.006 inch) per side.

5. Formed leads shall be planar with respect to one another within

0.10mm (.004) at seating Plane.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable

dambar protrusion shall be 0.08mm (0.003 inch) total in excess

of “b” dimension at maximum material condition. Minimum space

between protrusion and adjacent lead is 0.07mm (0.0027 inch).

10. Datums and to be determined at Datum plane

11. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are for reference only

0.25

(0.010)

4X θ

GAUGE

PLANE

SEATING

PLANE

EE1

TOP VIEW

INDEX

AREA

-C-

-B-

0.20 (0.008) ABC

SEATING

PLANE

0.20 (0.008) C

0.10 (0.004) C

-A-

-H-

SIDE VIEW

-B-

END VIEW

0.20 (0.008) CD

- H -

-A - - B -

- H -

M10.118 (JEDEC MO-187BA)

10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.037 0.043 0.94 1.10 -

A1 0.002 0.006 0.05 0.15 -

A2 0.030 0.037 0.75 0.95 -

b 0.007 0.011 0.18 0.27 9

c 0.004 0.008 0.09 0.20 -

D 0.116 0.120 2.95 3.05 3

E1 0.116 0.120 2.95 3.05 4

e 0.020 BSC 0.50 BSC -

E 0.187 0.199 4.75 5.05 -

L 0.016 0.028 0.40 0.70 6

L1 0.037 REF 0.95 REF -

N10 107

R 0.003 - 0.07 - -

R1 0.003 - 0.07 - -

5o15o5o15o-

α0o6o0o6o-

Rev. 0 12/02

20 FN6363.2

July 30, 2009

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Small Outline Plastic Packages (SOIC)

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

INDEX

AREA

123

-B-

0.25(0.010) C AMBS

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45o

H0.25(0.010) BM M

M14.15 (JEDEC MS-012-AB ISSUE C)

14 LEAD NARROW BODY SMALL OUTLINE PLASTIC

PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.0532 0.0688 1.35 1.75 -

A1 0.0040 0.0098 0.10 0.25 -

B 0.013 0.020 0.33 0.51 9

C 0.0075 0.0098 0.19 0.25 -

D 0.3367 0.3444 8.55 8.75 3

E 0.1497 0.1574 3.80 4.00 4

e 0.050 BSC 1.27 BSC -

H 0.2284 0.2440 5.80 6.20 -

h 0.0099 0.0196 0.25 0.50 5

L 0.016 0.050 0.40 1.27 6

N14 147

α0o8o0o8o-

Rev. 0 12/93

21 FN6363.2

July 30, 2009

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Dual-In-Line Plastic Packages (PDIP)

-B-

INDEX 12 3 N/2

AREA

EATING

BASE

PLANE

-C-

-A-

0.010 (0.25) C AMBS

NOTES:

1. Controlling Dimensions: INCH. In case of conflict between

English and Metric dimensions, the inch dimensions control.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the “MO Series Symbol List” in Section

2.2 of Publication No. 95.

4. Dimensions A, A1 and L are measured with the package seated

in JEDEC seating plane gauge GS-3.

5. D, D1, and E1 dimensions do not include mold flash or protru-

sions. Mold flash or protrusions shall not exceed 0.010 inch

(0.25mm).

6. E and are measured with the leads constrained to be per-

pendicular to datum .

7. eB and eC are measured at the lead tips with the leads uncon-

strained. eC must be zero or greater.

8. B1 maximum dimensions do not include dambar protrusions.

Dambar protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,

E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch

(0.76 - 1.14mm).

-C-

E8.3 (JEDEC MS-001-BA ISSUE D)

8 LEAD DUAL-IN-LINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A - 0.210 - 5.33 4

A1 0.015 - 0.39 - 4

A2 0.115 0.195 2.93 4.95 -

B 0.014 0.022 0.356 0.558 -

B1 0.045 0.070 1.15 1.77 8, 10

C 0.008 0.014 0.204 0.355 -

D 0.355 0.400 9.01 10.16 5

D1 0.005 - 0.13 - 5

E 0.300 0.325 7.62 8.25 6

E1 0.240 0.280 6.10 7.11 5

e 0.100 BSC 2.54 BSC -

eA0.300 BSC 7.62 BSC 6

eB- 0.430 - 10.92 7

L 0.115 0.150 2.93 3.81 4

N8 89

Rev. 0 12/93

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

in the quality certifications found at www.intersil.com/design/quality

Intersil produc ts are sol d by desc rip tio n o nly . Intersil Corp or ati on reserves the right to make ch ang e s in c irc uit de sign , software and/or specifications

at any time without n oti ce. Acco rdin gly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by

Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any

infringements of patents or other rights of t hird parties which may result from its use. No license is granted by implication or otherwise under any

patent or patent rights of Inters il o r its subsidiarie s .

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6363.2

July 30, 2009

For additional products, see www.intersil.com/product_tree

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Small Outline Plastic Packages (SOIC)

INDEX

AREA E

123

-B-

0.25(0.010) C AMBS

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45°

H0.25(0.010) BM M

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

M8.15 (JEDEC MS-012-AA ISSUE C)

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.0532 0.0688 1.35 1.75 -

A1 0.0040 0.0098 0.10 0.25 -

B 0.013 0.020 0.33 0.51 9

C 0.0075 0.0098 0.19 0.25 -

D 0.1890 0.1968 4.80 5.00 3

E 0.1497 0.1574 3.80 4.00 4

e 0.050 BSC 1.27 BSC -

H 0.2284 0.2440 5.80 6.20 -

h 0.0099 0.0196 0.25 0.50 5

L 0.016 0.050 0.40 1.27 6

N8 87

α0° 8° 0° 8° -

Rev. 1 6/05