General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire Bondable
Ceramic Resistors
WBA Series
• High resistor density
• Lower stray capacitance
• Proven TaNFilm® on ceramic technology
0.004˝ min
Bond Pads
Physical Data
T0303 - Tapped network
IRC’s WBA series wire bondable ceramic resistors are ideally suited for
your most demanding hybrid application. IRC’s TaNFilm® tantalum nitride
thin film technology has years of proven stability, reliability and moisture performance.
IRC’s WBA series of ceramic chip resistors offer a wide range of tolerances and temperature coefficients to fit
a variety of hybrid circuit applications. Custom resistance values, sizes and schematics are also available on
request to the factory.
For high performance wire bondable ceramic resistors for hybrid circuit application, specify IRC WBA series
resistors.
½R ½R
Absolute Tolerance to ±0.1%
Ratio Tolerance to ±0.05%
Absolute TCR to ±25ppm/°C
Tracking TCR to ±2ppm/°C
Package Power Rating (@ 70°C) 250mW
Rated Operating Voltage
(not to exceed P x R ) 100V
Operating Temperature -55°C to +150°C
Noise <-30dB
Substrate Material 99.6% Alumina
Substrate Thickness 0.015˝ ±0.002
(0.381mm ±0.05)
Bond Pad Metallization Gold: 30KÅ minimum
Backside Ceramic (gold available)
Electrical Data
0.030˝ ±0.001
(0.762mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
√
WBA Series Issue January 2009 Sheet 1 of 3