Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 10
1Publication Order Number:
MC74LCX138/D
MC74LCX138
Low-Voltage CMOS 3-to-8
Decoder/Demultiplexer
With 5 V−Tolerant Inputs
The MC74LCX138 is a high performance, 3−to−8
decoder/demultiplexer operating from a 2.3 to 3.6 V supply. High
impedance TTL compatible inputs significantly reduce current
loading to input drivers while TTL compatible outputs offer improved
switching noise performance. A VI specification of 5.5 V allows
MC74LCX138 inputs to be safely driven from 5 V devices. The
MC74LCX138 is suitable for memory address decoding and other
TTL level bus−oriented applications.
The MC74LCX138 high−speed 3−to−8 decoder/demultiplexer
accepts three binary weighted inputs (A0, A1, A2) and, when enabled,
provides eight mutually exclusive active−LOW outputs (O0−O7). The
LCX138 features three Enable inputs, two active−LOW (E1, E2) and
one active−HIGH (E3). All outputs will be HIGH unless E1 and E2 are
LOW, and E3 is HIGH. This multiple enabled function allows easy
parallel expansion of the device to a 1−of−32 (5 lines to 32 lines)
decoder with just four LCX138 devices and one inverter (see
Figure 1). The LCX138 can be used as an 8−output demultiplexer by
using one of the active−LOW Enable inputs as the data input and the
other Enable inputs as strobes. The Enable inputs which are not used
must be permanently tied to their appropriate active−HIGH or
active−LOW state.
Current drive capability is 24 mA at the outputs.
Features
Designed for 2.3 V to 3.6 V VCC Operation
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance: Human Body Model >2000 V
Machine Model >200 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MARKING
DIAGRAMS
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G= Pb−Free Package
SOIC−16
D SUFFIX
CASE 751B
LCX138G
AWLYWW
LCX
138
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
16
16
1
1
16
1
16
1
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
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(Note: Microdot may be in either location)
MC74LCX138
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2
Figure 1. Pinout: 16−Lead (Top View)
Figure 2. Logic Diagram
1516 14 13 12 11 10
21 34567
VCC O0 O1 O2 O3 O4 O5
A0 A1 A2 E1 E2 E3 O7
8
GND
9
O6
O7 O6 O5 O4 O3 O2 O1 O0
A2 A1 A0 E1 E2 E3
654123
7 9 10 11 12 13 14 15
PIN NAMES
Pins Function
A0−A2 Address Inputs
E1−E2 Enable Inputs
E3 Enable Input
O0−O7 Outputs
TRUTH TABLE
Inputs Outputs
E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7
H X X X X X H H H H H H H H
X H X X X X H H H H H H H H
X X L X X X H H H H H H H H
L L H L L L L H H H H H H H
L L H H L L H L H H H H H H
L L H L H L H H L H H H H H
L L H H H L H H H L H H H H
L L H L L H H H H H L H H H
L L H H L H H H H H H L H H
L L H L H H H H H H H H L H
L L H H H H H H H H H H H L
H = High Voltage Level
L = Low Voltage Level
X = High or Low Voltage Level and Transitions are Acceptable
For ICC reasons, DO NOT FLOAT Inputs
MC74LCX138
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3
Figure 3. Expansion to 1−of−32 Decoding
O0
O0 O1 O2 O3 O4 O5 O6 O7
A0 A1 A2 E
O0 O1 O2 O3 O4 O5 O6 O7
A0 A1 A2 E
O0 O1 O2 O3 O4 O5 O6 O7
A0 A1 A2 E
O31
O0 O1 O2 O3 O4 O5 O6 O7
A0 A1 A2 E
H
A4
A3
A2
A1
A0
‘04
123 123 123 123
ORDERING INFORMATION
Device Package Shipping†
MC74LCX138DR2G SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LCX138DTG TSSOP−16
(Pb−Free)
96 Units / Rail
MC74LCX138DTR2G TSSOP−16
(Pb−Free)
2500 Tape & Reel
NLV74LCX138DR2G* SOIC−16
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MAXIMUM RATINGS
Symbol Parameter Value Condition Units
VCC DC Supply Voltage −0.5 to +7.0 V
VIDC Input Voltage −0.5 VI +7.0 V
VODC Output Voltage −0.5 VO VCC + 0.5 Output in HIGH or LOW State (Note 1) V
IIK DC Input Diode Current −50 VI < GND mA
IOK DC Output Diode Current −50 VO < GND mA
+50 VO > VCC mA
IODC Output Source/Sink Current 50 mA
ICC DC Supply Current Per Supply Pin 100 mA
IGND DC Ground Current Per Ground Pin 100 mA
TSTG Storage Temperature Range −65 to +150 C
MSL Moisture Sensitivity Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
MC74LCX138
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4
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Units
VCC Supply Voltage Operating Data Retention Only 2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
VIInput Voltage 0 5.5 V
VOOutput Voltage (HIGH or LOW State) (3−State) 0 VCC V
IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
mA
IOL LOW Level Output Voltage VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
mA
TAOperating Free−Air Temperature −40 +85 C
Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V
DC ELECTRICAL CHARACTERISTICS
TA = −40C to +85C
Symbol Characteristic Condition Min Max Units
VIH HIGH Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 1.7 V
2.7 V VCC 3.6 V 2.0
VIL LOW Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 0.7 V
2.7 V VCC 3.6 V 0.8
VOH HIGH Level Output Voltage 2.3 V VCC 3.6 V; IOH = −100 mAVCC −0.2 V
VCC = 2.3 V; IOH = −8 mA 1.8
VCC = 2.7 V; IOH = −12 mA 2.2
VCC = 3.0 V; IOH = −18 mA 2.4
VCC = 3.0 V; IOH = −24 mA 2.2
VOL LOW Level Output Voltage 2.3 V VCC 3.6 V; IOL = 100 mA0.2 V
VCC = 2.3 V; IOL = 8 mA 0.6
VCC = 2.7 V; IOL = 12 mA 0.4
VCC = 3.0 V; IOL = 16 mA 0.4
VCC = 3.0 V; IOL = 24 mA 0.55
IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA
IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND 5mA
ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA
DICC Increase in ICC per Input 2.3 VCC 3.6 V; VIH = VCC − 0.6 V 500 mA
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W)
Limits
TA = −40C to +85C
VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 2.5 V 0.2 V
CL = 50 pF CL = 50 pF CL = 30 pF
Symbol Parameter Waveform Min Max Min Max Min Max Units
tPLH
tPHL
Propagation Delay
An to On
1, 2 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
tPLH
tPHL
Propagation Delay
E1, E2 to On
2 1.5
1.5
6.5
6.5
1.5
1.5
7.5
7.5
1.5
1.5
8.4
8.4
ns
tPLH
tPHL
Propagation Delay
E3 to On
1 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
tOSHL
tOSLH
Output−to−Output Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
MC74LCX138
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5
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF
COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF
CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF
VCC
0 V
VOH
VOL
An, E3
On
tPLH
tPHL
Vmi
Vmo
Vmo
Vmi
WAVEFORM 2: PROPAGATION DELAYS FOR NON−INVERTING OUTPUTS
2.7 V
0 V
VOH
VOL
An, E1, E2
On
tPLH
tPHL
WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS
Vmi
Vmo Vmo
Vmi
Vcc
Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V
Vmi 1.5 V 1.5 V Vcc/2
Vmo 1.5 V 1.5 V Vcc/2
Figure 4. AC Waveforms
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
Figure 5. Test Circuit
CL= 50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance)
CL= 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance)
RL= R1 = 500 W or equivalent
RT= ZOUT of pulse generator (typically 50 W)
MC74LCX138
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6
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36 16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74LCX138
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7
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X 1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
16
89
8X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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