HLMP-AG64/65, HLMP-AM64/65, HLMP-AB64/65
Precision Optical Performance Red Green and Blue
New 5mm Mini Oval LEDs
Data Sheet
Caution: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
Description
These Precision Optical Performance Oval LEDs are spe-
ci cally designed for full color/video and passenger infor-
mation signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide eld of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the e ects of long term exposure to direct
sunlight.
Features
Well de ned spatial radiation pattern
High brightness material
Available in red, green and blue color
Red AlInGaP 626 nm
Green InGaN 525nm
Blue InGaN 470nm
Superior resistance to moisture
Stando Package
Tinted and di used
Typical viewing angle 30° x 70°
Applications
Full color signs
Package Dimensions
Package drawing A
Package drawing B
Notes:
All dimensions in millimeters (inches).
5.20 ± 0.20
0.205 ± 0.008
8.70 ± 0.20
0.342 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
1.00
0.038
3.80 ± 0.200
0.150 ± 0.008
min.
0.8
0.032
cathode lead
24.00
0.945
0.50 ± 0.10
0.020 ± 0.004
1.50 ± 0.15
0.0591 ± 0.006
11.70 ± 0.50
0.4606 ± 0.020
sq. typ.
8.70 ± 0.20
0.342 ± 0.008
5.20 ± 0.200
0.205 ± 0.008
24.00
0.945
0.70
0.028
0.8
0.032 0.50 ± 0.10
0.020 ± 0.004
sq. typ.
2.54 ± 0.3
0.100 ± 0.012
1.00
0.038
min.
cathode lead
max.
max.
max.
min.
min.
0.70
0.028
max.
3.80 ± 0.200
0.150 ± 0.008
2
Device Selection Guide
Part Number
Color and Dominant
Wavelength d (nm) Typ
Luminous Intensity Iv
(mcd) at 20 mA-Min
Luminous Intensity Iv
(mcd) at 20 mA-Max Stando
Package
Drawing
HLMP-AG64-X10xx Red 626 1660 3500 No A
HLMP-AG65-X10xx Red 626 1660 3500 Yes B
HLMP-AM64-140xx Green 525 2900 6050 No A
HLMP-AM65-140xx Green 525 2900 6050 Yes B
HLMP-AB64-TW0xx Blue 470 800 1660 No A
HLMP-AB65-TW0xx Blue 470 800 1660 Yes B
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
Part Numbering System
Note:
Please refer to AB 5337 for complete information about part numbering system.
Packaging Option
DD: Ammopack
ZZ: Flexi Ammopack
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Standoff/ Non Standoff
4: Non Standoff
5: Standoff
Color
G: Red 626
M: Green 525
B: Blue 470
Package
A: 5mm Mini Oval 30° x 70°
HLMP-A x 6x – x x x xx
3
Absolute Maximum Ratings
TA = 25°C
Parameter Red Green and Blue Unit
DC Forward Current [1] 50 30 mA
Peak Forward Current 100 [2] 100 [3] mA
Power Dissipation 120 116 mW
Reverse Voltage 5 (IR = 100 μA) 5 (IR = 10 μA) V
LED Junction Temperature 130 110 °C
Operating Temperature Range -40 to +100 -40 to +85 °C
Storage Temperature Range -40 to +100 -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 8
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics
TA = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Green
Blue
VF
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
VI
F = 20 mA
Reverse Voltage
Red
Green & blue
VR
5
5
V
IF = 100 μA
IF = 10 μA
Dominant Wavelength [1]
Red
Green
Blue
d618
520
460
626
525
470
630
540
480
nm IF = 20 mA
Peak Wavelength
Red
Green
Blue
PEAK 634
516
464
nm Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Thermal Resistance RJ-PIN 240 °C/W LED Junction-to-Pin
Luminous E cacy [2]
Red
Green
Blue
V150
530
65
lm/W Emitted Luminous Power/
Emitted Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is
the luminous e cacy in lumens/watt.
4
0
10
20
30
40
50
0 0.5 1 1.5 2 2.5
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0
0.5
1
1.5
2
2.5
0 10 20 30 40 50
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
10
20
30
40
50
60
0 20406080100
TA- AMBIENT TEMPERATURE - -C
IF MAX
.
- MAXIMUM FORWARD CURRENT - mA
0
0.2
0.4
0.6
0.8
1
550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
AlInGaP Red
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREENBLUE
0
5
10
15
20
25
30
0 1 2 3 4
FORWARD VOLTAGE -V
FORWARD CURRENT - mA
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 5 10 15 20 25 30 35
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
GREEN
BLUE
0
5
10
15
20
25
30
35
0 20 40 60 80 100
T
A
- AMBIENTTEMPERATURE - °C
IFmax - MAXIMUM FORWARD
CURRENT - mA
(NORMALIZE AT 20 mA)
-4
-2
0
2
4
6
8
10
12
14
16
0 5 10 15 20 25 30 35
GREEN
FORWARD CURRENT - mA
DOMINANT WAVELENGHT SHIFT - nm
BLUE
InGaN Blue and Green
Figure 5. Relative Intensity vs Wavelength Figure 6. Forward Current vs Forward Voltage
Figure 7. Relative Intensity vs Forward Current Figure 8. Maximum Forward Current vs Ambient Temperature
Figure 9. Relative dominant wavelength vs Forward Current
6
Figure 10. Radiation Pattern-Major Axis Figure 11. Radiation Pattern-Minor Axis
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREE
NORMALIZED INTENSITY
Green
Blue
Red
Green
Blue
Red
7
Green Color Bin Table
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 520.0 524.0 0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
2 524.0 528.0 0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
3 528.0 532.0 0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
4 532.0 536.0 0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
5 536.0 540.0 0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
Tolerance for each bin limit is ± 0.5nm.
Blue Color Bin Table
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is ± 0.5nm
Note:
1. All bin categories are established for classi cation of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Bin
Intensity (mcd) at 20 mA
Min Max
T 800 960
U 960 1150
V 1150 1380
W 1380 1660
X 1660 1990
Y 1990 2400
Z 2400 2900
1 2900 3500
2 3500 4200
3 4200 5040
4 5040 6050
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20mA)
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Notes:
1. Tolerance for each bin limit is ±0.05V
2. VF binning only applicable to Red color.
Red Color Range
Min Dom
Max
Dom Xmin Ymin Xmax Ymax
618 630 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5nm
8
Relative Light Output vs Junction Temperature
Avago Color Bin on CIE 1931 Chromaticity Diagram
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ = 25°C)
0.1
1
10
-40 -20 0 20 40 60 80 100 120 140
Red
Blue
Green
4
Green 5
4
3
2
1
Red
Blue
5
3
21
0.000
0.200
0.400
0.600
0.800
1.000
0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800
X
Y
9
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 260 °C Max. 260 °C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering pro le to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with di erent size and design (component density) will have
di erent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
pro le again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
e ciency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260°C and the
solder contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED con guration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.
1.59mm
AlInGaP Device
CATHODE
InGaN Device
ANDOE
10
Example of Wave Soldering Temperature Pro le for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)
Ammo Packs Drawing
6.35 ± 1.30
0.250 ± 0.051
9.125 ± 0.625
0.3595 ± 0.0245
18.00 ± 0.50
0.7085 ± 0.0195
12.70 ± 0.30
0.500 ± 0.012
20.5 ± 1.00
0.8070 ± 0.0394
12.70 ± 1.00
0.500 ± 0.039
CATHODE
VIEW A - A
0.70 ± 0.20
0.276 ± 0.0075
4.00 ± 0.20
0.1575 ± 0.0075 TYP.
Note: All dimensions in millimeters (inches)
11
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
LABEL ON THIS
SIDE OF BOX
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
ANODE LEAD LEAVES
THE BOX FIRST.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1510EN - April 18, 2011
Acronyms and De nition:
BIN:
(i) Color bin only or VF bin only (Applicable for part
number with color bins but without VF bin OR part
number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin (Applicable for part
number that have both color bin and VF bin)
(ii) Avago Baby Label (Only available on bulk packaging)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-
CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
