AS91L1002
July 2004
JTAG Test Sequencer
Description
The AS91L1002 device provides a solution
to perform stand alone IEEE1149.1 tests with out
any third party test hardware.
The device executes tests that have been
translated from the Serial Vector Format (SVF) to
the compact binary format, BVI which is stored in a
Flash memory. Upon completion of the test run the
user is presented with PASS/FAIL information,
thus enabling a high degree of confidence in the
operation of the PCB.
The AS91L1002 can be controlled by
using one of two different sources: a power-on
reset circuit or a front panel switch. Any one of
these can cause the AS91L1002 to execute tests
that have been loaded into the Flash memory.
When the AS91L1002 is running and performing
the tests, status lines are fed off chip to enable
the user to hold the PCB in a safe state until
completion of the tests.
When the tests have completed, the
status of the execution is presented off chip
through a status line to indicate the PASS/FAIL
condition.
Key Features
Performs IEEE1149.1 tests in standalone mode
without any 3rd Party test hardware
Eliminates the need for firmware development,
thereby speeding up time to market
AS91L1002 can be used to perform self tests on
multiple PCBs on a system in parall el
Pinout and feature set compatible (complete
second source) with the Firecron JTS02 device
Available in a 100-pin LQFP or a 100-pin
FPBGA lead free package
Device Block Diagram
TMS Parallel to serial conver sion
TDO Paralle l to serial conversion
TDI Serial to parallel conversion
TCK Control Logic containing
16 Bit RTI Counters
Mode Control Registers
FLASH Interface logic
Address and Data IEEE 1149.1
Interface Logic
LFSR Signature
compactor
Power on ResetR or AS91L1002 run switch
BVF Execution
State Machines AS91L1002 running flag
AS91L1002 PASS/FAIL flag
IEEE1149.1 Inter face Port
Figure 1 - AS91L1002 JTAG Test Sequencer
Alliance Semiconductor
2575 Augustine Drive Santa Clara, CA 95054 T: 408-855-4900 F: 408-855-4999 www.alsc.com
July 2004 AS91L1002
BIST Sequencer Power On Operation
Test Pa ss /Fa il
PCB Asserts signal to
reset AS91L1002 (Low).
Signal JTS02_RST
BIST Se quence r
Device Resets Asserts
AS91L1002 _RST_OUT
(Low) BIST status bits (0
& 1)
Status (0) (Low) Busy/Idle
Status (1) (Low) Pass/Fail
PCB De-asserts signal to
reset AS91 L1002 (High )
Signal AS91L1002 _RST
BIST Se quence r
Device exi ts reset
Deasserts
AS91L1002 _RST_OUT
(High)
Asserts
AS91L1002 _RUN_OUT
(High)
BIST status bits (0 & 1)
Status ( 0 ) (High) Busy Idle
Status (1) (Low) Pass/Fail
BIST Sequen cer Device
waits 150us for BIST flash
to become available
BIST Sequen cer Device
acces s es BIST F l a sh
and start s IEEE 1149.1
stored test s
BIST Sequencer
Stored programmable
delay pri or to IEEE 1149.1
bus access
BIST Sequencer Load &
run IEEE 1149. 1 test
Generate CRC,
Store & Compare
End of stored
tests
BIST Sequencer
BIST status bits (0 & 1)
Status (0) (H ig h) Busy/ Id l e
Status (1) (H ig h) Pass/ F ail
BIST Sequencer
De-asserts
AS91L1008 _Run_Out
(Low)
BIST status bits (0 & 1)
Status (0) (Low) Busy/Idle
PCB reacts to AS91L1002
I/O and or BIST status bits
Board continues to boot
Fail
Pass
No
Yes
Figure 2 - AS91L1002 Power On Sequence
The AS91L1002 does not require a
microprocessor to operate and run IEEE1149.1
tests. It can be used to perform diagnostics on the
PCB. In systems with multiple cards, all cards can
simultaneously execute self tests without
processor intervention, thereby significantly
reducing test time. AS91L1002 utilizes IEEE1149.1
tests generated by industry standard ATPG tools,
thereby eliminating the need for custom firmware
development resulting in faster time to market.
In the AS91L1002, the IEEE1149.1 test
preparation is a two-step process. The first step is
to convert the industry standard SVF format into
the compact Alliance binary BVF file. One or more
IEEE1149.1 tests represented as Alliance BVF
files can then be further compressed into an
Alliance BVI file which is then exported to a binary
file for programming into the flash device, and
then used by the AS91L1002 for test execution.
The user is able to specify the TCK rate
for each individual test execution based on a
programmable divider within the AS91L1002,
along with a programmable test start delay time
based upon the number of TCKs.
These features enable multiple tests to be
stored, in the AS91L1002 test flash. It allows each
test to operate at different TCK rate, and allows
for sufficient settling time before each test starts
to ensure that the PCB is in a stable condition.
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July 2004 AS91L1002
Signal Description
PIN NAME PIN NUMBER
LQFP PIN NUMBER
FPBGA DESCRIPTION
TOE 88 B6 Test Output Enable: When this signal i s taken to
logic ‘0’, all I/O on the device is placed in HighZ.
POR 14 F4 Power on Reset: This signal when taken to logic
‘0’ causes the AS91L1002 to reset. When the
signal returns to logic ‘1’ the AS91L1002 starts
test execution.
SW_RUN 10 E3 Switch AS91L1002 Run: This signal when taken
to logic ‘0’ causes the AS91L1002 to reset. When
the signal returns to logic ‘ 1’ the AS91L1002 starts
test execution.
OSC_IN 16 F1 Oscillator Input: Provides the master clock into the
AS91L1002, Max freq 66 MHz.
BUSY_IDLE 25 K1 BUSY IDLE: This output indicates the state of the
AS91L1002. When High, it indicates that the
AS91L1002 is active.
PASS_FAIL 24 J1 PASS FAIL: This output provides status of the test
execution. When at logic’1’ after test execution the
stored IEEE1149.1 test has failed due to data
errors.
FLASH_ADD[0..23] 70, 69, 67, 65,
64, 63, ,61,
60, 57, 28, 29,
30, 31, 32, 35,
36, 37, 40, 41,
42, 45, 46, 47,
48
D10, D9, E8,
E10, E9, F7,
F10, F9,
G10, J2, K3,
J3, H4, J4,
H5, J5, K5,
K6, J6, H6,
J7, H7, J8, K8
FLASH ADD: These outputs provide the address
pins to the flash device that is used to store the
IEEE1149.1 tests.
FLASH_DB[0..15] 72, 75, 76, 78,
79, 80, 81, 83,
84, 85, 92, 93,
94, 96, 97, 98
C9, C10, B10,
A9, A8, B8,
A7, B7, C7,
C6, C5, C4,
B4, A4, B3,
A3
FLASH DB: These inputs provide the stored
IEEE1149.1 test data within the flash device to the
AS91L1002 sequencer.
FLASH_RD 50 K10 FLASH READ: This output provides an active ‘0’
signal to indicate that the AS91L1002 wishes to
read data from the flash device.
TRST 22 H2 TRST: This output signal provides the IEEE1149.1
TRST signal for the devices to be tested.
TMS 21 G2 TMS: This output signal provides the IEEE1149.1
TMS signal for the devices to be tested.
TCK 87 A6 TCK: This output signal provides the IEEE1149.1
TCK signal for the devices to be tested. The clock
frequency is based upon the frequency of
oscillator to the AS91L1002 and is programmabl e
for each tests execution.
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July 2004 AS91L1002
PIN NAME PIN NUMBER
LQFP PIN NUMBER
FPBGA DESCRIPTION
TDO 20 G1 TDO: This output signal provides the IEEE1149.1
data for the devices to be tested. It should be
connected to the TDI pin on the first device in the
IEEE1149.1 chain.
TDI 19 G3 TDI: This input signal receives the IEEE1149.1
data from the devices to be tested. It should be
connected to the TDO pin on the last device in the
IEEE1149.1 chain.
DEVICE_TCK
62 F8 Silicon TAP Port Signal
DEVICE_TDI
4 A1 Silicon TAP Port Signal
DEVICE_TDO
73 A10 Silicon TAP Port Signal
DEVICE_TMS
15 F3 Silicon TAP Port Signal
Signal Ground 55,56, 89, 38,
86, 11, 26, 43,
59, 74, 95, 2,
17, 90
J9,G9,B5, D6,
G5, C3, D7,
E5, F6,
G4,H8, A5,
F2, B1
3.3 V Supply 39, 91,23, 3,
18, 34, 51, 66,
82,54
H9, C8, D4,
E6, F5, G7,
H3, H1, D5,
G6
Table 1 - Signal Description
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July 2004 AS91L1002
Signal Functions
Signal Name Signal Function
TRST TRST: This output signal provides the IEEE1149.1 TRST signal for the devices to be
tested.
TOE Test Output Enable: When this signal i s take n to logic ‘0’ all I/O on the device is
placed in HighZ.
TMS TMS: This output signal provides the IEEE1149.1 TMS signal for the devices to be
tested.
TDO TDO: This output signal provides the IEEE1149.1 data for the devices to be tested. It
should be connected to the TDI pin on t he first device in the IEEE1149.1 chain.
TDI TDI: This input signal receives the IEEE1149.1 data from the devices to be tested. It
should be connected to the TDO pin on the last device in the IEEE1149.1 chain.
TCK TCK: This output signal provides the IEEE1149.1 TCK signal for the devices to be
tested. The clock frequency is based upon the frequency of oscillator to the
AS91L1002 and is programmable for each tests execution.
SW_RUN Switch AS91L1002 Run: This signal when taken to logic ‘0’ causes the AS91L1002 to
reset. When the signal returns to logic ‘1’ the AS91L10 02 starts test execution.
RST_OUT RESET OUT: This output signal pulses low before the start of each test execution. It is
used to reset the Flash device to ensure that they are in a stable state before the
AS91L1002 access the stored data.
POR Power on Reset: This signal whe n taken to logic ‘0’ causes the AS91L1002 to reset.
When the signal returns to logic ‘1’ the AS 91L1002 starts test execution.
PASS_FAIL PASS FAIL: This output provides status of the test execution. When at logic’1’ after
test execution, the stored IEEE1149.1 test has failed due to data erro rs.
OSC_IN Oscillator Input: Provides the maste r clock into the AS91L1002, M ax freq 66 MHz.
FLASH_RD FLASH READ: This output provides an active ‘0’ signal to indicate that the
AS91L1002 wishes to read data from the flash device.
FLASH_DB[0..15] FLASH DB: These inputs provide the stored IEEE1149.1 test data within the flash.
FLASH_ADD[0..23] FLASH ADD: These outputs provid e the address pins to the flash device that is used
to store the IEEE1149.1 tests.
BUSY_IDLE BUSY IDLE: This output indicates the state of the AS91L1002. When Hig h, it indicates
the AS91L1002 is active.
Table 2 - Signal Functions
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July 2004 AS91L1002
Absolute Maximum Ratings
Parameter Maximum Range
Supply Voltage (Vcc) -0.3V to 5.5V
DC Input Voltage (Vi) -0.5V to Vcc +0.5V
Max sink current when Vi = -0.5V -20mA
Max source current when Vi = Vcc + 0.5V +20mA
Max Junction Temperature with power applied Tj +125 degrees C
Max Storage temperature -55 to +150 degree C
Table 3 - Absolute Maximum Ratings
Note: Stress above the stated maximum values may cause irreparable damage to the device,
correct operation of the dev i ce at these values is not guaranteed.
Recommended Operating Conditions
Parameter Operating Range
Supply Voltage (Vcc) 3.0V to 3.6V
Input Voltage (Vi) 0V to Vcc
Output Voltage (Vo) 0V to Vcc
Operating Temperature (Ta)
Commercial 0 C to 70 C
Industrial (Ta) -40 deg C to +85 d eg C, 3.00V to 3.6V
Table 4 - Recommended Operating Conditions
DC Electrical Characteristics
Symbol Parameter Min Max Condition
VIH Minimum High Input
Voltage 2.0 5.25
VIL Maximum Low Input
Voltage -0.3V 0.8V
Symbol Parameter Value Condition
VOH Minimum High Output
Voltage 2.4V Ioh=24mA or 8mA as
defined by pin
VOL Minimum Low Output
Voltage 0.4V Iol=24mA or 8mA as
defined by pin
Ioz Tristate output leakage -10 or 10 mA
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July 2004 AS91L1002
Symbol Parameter Min Max Condition
Icc Maximum quiescent
supply current 2mA
Iccd Maximum dynamic
supply current 80mA TCK freq equal to 10 MHz
Table 5 - AS91L1002 DC Electrical Ch aracteristics
Packaging Information
The AS91L1002 is available in a 100-pin LQFP or a 1 00-pin FPBGA lead free package.
D1
Square
1D
Square
3
D1BASIC 14.00
DBASIC 18.00
L0.15 0.60
A2MIN NOM MAX 1.35 1.40 1.45
L1 REF 1.00
AMAX. 1.60
bMIN MAX 0.1 7 0 .2 7
A10.05 0.15
eBASIC 0.50
JEDEC REF # MS-026
ccc MAX 0.08
ddd NOM 0.08
SYMBOL 100 LEA D
TOL. LEADS
MIN MAX
NOTES:
1. A L L LINEA R DIMEN S IONS A RE IN MIL L IM ETE R S .
2. PLASTIC BODY DIMENSIO NS DO NO T INC LUDE FLASH OR PROTUSIO N.
MAX ALLOWABLE 0.25 PER SIDE.
3. LEAD COUN T O N DRA W ING NOT REPRESENTATIVE OF ACTUAL PACKAGE.
3.
M
A
0.25
0.09/0.20 TYP
0 - 7
TYP
LL1 b
A1
- C -
CCC
LEAD COPLAN A R ITY
al al al A-B S D S
A2 A
12 NOM
12 NOM
e
Figure 4 - LQFP-100
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July 2004 AS91L1002
Revisions
REV. DESCRIPTION ECN DATE
A Initial document release. 91253 12-04-01
B Updated ball coplanarity limits from
0.20mm to 0.15mm.
D
E
A
B
2
C
0.15 C
D1
E1
C
D
G
H
I
K
1 2 3 4 5 6 7 8 9 10
F
E
B
A
b 0.25 M C
0.25 M C A B
DIMENSIONS
SYMBOL MIN. NOM. MAX.
A -- -- 1.70
A1 0.30 -- --
A2 0.25 -- 1.10
b 0.50 0.60 0.70
D 11.00 BSC
D1 9.00 BSC
E 11.00 BSC
E1 9.00 BSC
e 1.00
PACKAGE NUMBER FBGA0100-11F
JEDEC REF # MO-192 VAR. AAC-1
Figure 5 - FPBGA-100
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July 2004 AS91L1002
Device Selector Guide and Ordering Information
AS91L XXXX UU - CC PP - TEMP - L
Aliance Semiconductor
system solution
Device family
1001
1002
1003
1006
Product version
S = standard
U = 16-bit user code
BU = 8-bit status/user code
E = enhanced
C = Commercial (0 to 70 degrees C)
I = Industrial (-40 to 85 degrees C)
Package
L100 = 100 pin LQFP
F100 = 100 pin FP BGA
Clock speed
10 = 10 MHz TCK
40 = 40 MHz TCK
Blank = le aded
F = lead free
G = green
Figure 6 - Part Numbering Guide
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July 2004 AS91L1002
Part Number Description
AS91L1002S – 10L100-C
JTAG Test Sequencer, 100-pin LQFP
package, commercial
AS91L1002S – 10L100-CF JTAG Test Sequencer, 100-pin LQFP
package, commercial, lead free
AS91L1002S – 10L100-I
JTAG Test Sequencer, 100-pin LQFP
package, industrial
AS91L1002S – 10L100-IF JTAG Test Sequencer, 100-pin LQFP
package, industrial, lead free
AS91L1002S – 10F100-C
JTAG Test Sequencer 100-pin FPBGA
package, commercial
AS91L1002S – 10F100-CG JTAG Test Sequencer 100-pin FPBGA,
commercial, green package
AS91L1002S – 10F100-I
JTAG Test Sequencer 100-pin FPBGA
package, industrial
AS91L1002S – 10F100-IG JTAG Test Sequencer 100-pin FPBGA,
industrial, green package
AS91L1002S – 40L100-CF JTAG Test Sequencer, 100-pin LQFP
package, commercial, lead free, 40 MHz
TCK
AS91L1002S – 40L100-IF JTAG Test Sequencer, 100-pin LQFP
package, industrial, lead free, 40 MHz
TCK
AS91L1002S – 40F100-CG JTAG Test Sequencer 100-pin FPBGA,
commercial, green package, 40 MHz TCK
AS91L1002S – 40F100-IG JTAG Test Sequencer 100-pin FPBGA,
industrial, green package, 40 MHz TCK
Table 6 - Valid Part Number Combinations
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July 2004 AS91L1002
Package Options
Device
Master Description
FPBGA-100
(1mm pitch) LQFP-100
AS91L1001 JTAG Test Controller x x
AS91L1002 JTAG Test Sequencer x x
AS91L1003U 3-Port Gateway x x
AS91L1006BU 6-Port Gateway x x
Table 7 - JTAG Controller Product Family
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July 2004 AS91L1002
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