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ADC128S022
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ADC128S022 8-Channel, 50 kSPS to 200 kSPS, 12-Bit A/D Converter
1 Features 3 Description
The ADC128S022 device is a low-power, eight-
1• Eight Input Channels channel CMOS 12-bit analog-to-digital converter
• Variable Power Management specified for conversion throughput rates of 50 ksps
• Independent Analog and Digital Supplies to 200 ksps. The converter is based on a successive-
approximation register architecture with an internal
• SPI™/QSPI™/MICROWIRE/DSP Compatible track-and-hold circuit. It can be configured to accept
• Packaged in 16-lead TSSOP up to eight input signals at inputs IN0 through IN7.
• Conversion Rate: 50 ksps to 200ksps The output serial data is straight binary and is
• DNL (VA= VD= 5 V): +1 / −0.7 LSB (Maximum) compatible with several standards, such as SPI,
• INL (VA= VD= 5 V): ±1 LSB (Maximum) QSPI, MICROWIRE, and many common DSP serial
interfaces.
• Power Consumption
– 3V Supply: 1.2 mW (Typical) The ADC128S022 may be operated with independent
analog and digital supplies. The analog supply (VA)
– 5V Supply: 7.5 mW (Typical) can range from 2.7 V to 5.25 V, and the digital supply
(VD) can range from 2.7 V to VA. Normal power
2 Applications consumption using a 3-V or 5-V supply is 1.2 mW
• Automotive Navigation and 7.5 mW, respectively. The power-down feature
reduces the power consumption to 0.06 µW using a
• Portable Systems 3-V supply and 0.25 µW using a 5-V supply.
• Medical Instruments The ADC128S022 is packaged in a 16-lead TSSOP
• Mobile Communications package. Operation over the extended industrial
• Instrumentation and Control Systems temperature range of −40°C to +105°C is ensured.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
ADC128S022 TSSOP (16) 4.40 mm × 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADC128S022
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
www.ti.com
Table of Contents
7.5 Register Maps......................................................... 17
1 Features.................................................................. 18 Application and Implementation ........................ 18
2 Applications ........................................................... 18.1 Application Information............................................ 18
3 Description............................................................. 18.2 Typical Application.................................................. 18
4 Revision History..................................................... 29 Power Supply Recommendations...................... 20
5 Pin Configuration and Functions......................... 39.1 Power Supply Sequence......................................... 20
6 Specifications......................................................... 49.2 Power Supply Noise Considerations....................... 20
6.1 Absolute Maximum Ratings ...................................... 410 Layout................................................................... 21
6.2 ESD Ratings.............................................................. 410.1 Layout Guidelines ................................................. 21
6.3 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 21
6.4 Thermal Information.................................................. 511 Device and Documentation Support................. 22
6.5 Electrical Characteristics........................................... 511.1 Device Support...................................................... 22
6.6 Timing Specifications ............................................... 711.2 Community Resources.......................................... 23
6.7 Typical Characteristics.............................................. 911.3 Trademarks........................................................... 23
7 Detailed Description............................................ 14 11.4 Electrostatic Discharge Caution............................ 23
7.1 Overview................................................................. 14 11.5 Glossary................................................................ 23
7.2 Functional Block Diagram....................................... 15 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 15 Information ........................................................... 23
7.4 Device Functional Modes........................................ 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2013) to Revision F Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 21
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1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
CS SCLK
VADOUT
AGND DIN
IN0 VD
IN1 DGND
IN2 IN7
IN3 IN6
IN4 IN5
ADC128S022
ADC128S022
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SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
5 Pin Configuration and Functions
PW Package
16-Pin TSSOP
Top View
Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
Chip select. On the falling edge of CS, a conversion process begins. Conversions continue
CS 1 Digital I/O as long as CS is held low.
Positive analog supply pin. This voltage is also used as the reference voltage. This pin
Power
VA2 should be connected to a quiet +2.7-V to +5.25-V source and bypassed to GND with 1-µF
Supply and 0.1-µF monolithic ceramic capacitors located within 1 cm of the power pin.
Power
AGND 3 The ground return for the analog supply and signals.
Supply
IN0 to IN7 4-11 Analog I/O Analog inputs. These signals can range from 0 V to VREF.
Power
DGND 12 The ground return for the digital supply and signals.
Supply Positive digital supply pin. This pin should be connected to a +2.7-V to VAsupply, and
Power
VD13 bypassed to GND with a 0.1-µF monolithic ceramic capacitor located within 1 cm of the
Supply power pin.
Digital data input. The ADC128S022's Control Register is loaded through this pin on rising
DIN 14 Digital I/O edges of the SCLK pin.
Digital data output. The output samples are clocked out of this pin on the falling edges of
DOUT 15 Digital I/O the SCLK pin.
Digital clock input. The specified performance range of frequencies for this input is 0.8 MHz
SCLK 16 Digital I/O to 3.2 MHz. This clock directly controls the conversion and readout processes.
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6 Specifications
6.1 Absolute Maximum Ratings
See (1)(2)(3).MIN MAX UNIT
Analog supply voltage VA–0.3 6.5 V
Digital supply voltage VD–0.3 to VA+ 0.3 6.5 V
Voltage on any pin to GND –0.3 VA+ 0.3 V
Input current at any pin(4) ±10 mA
Package input current(4) ±20 mA
Power dissipation at TA= 25°C See(5)
Junction temperature 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering specifications see product folder at www.ti.com and SNOA549
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND or VIN > VAor VD), the current at that pin should be
limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 10 mA to two.
(5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax −TA)/θJA. In the 16-pin TSSOP, θJA is 96°C/W, so PDMAX = 1,200 mW at 25°C and 625 mW at the maximum
operating ambient temperature of 105°C. Note that the power consumption of this device under normal operation is a maximum of 12
mW. The values for maximum power dissipation listed above will be reached only when the ADC128S022 is operated in a severe fault
condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Obviously, such conditions should always be avoided.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2500
Electrostatic
V(ESD) V
discharge Machine Model(3) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human body model is 100-pF capacitor discharged through a 1.5-kΩresistor.
(3) Machine model is 220 pF discharged through ZERO ohms
6.3 Recommended Operating Conditions
See (1).MIN NOM MAX UNIT
Operating temperature –40 TA105 °C
VAsupply voltage 2.7 5.25 V
VDsupply voltage 2.7 VAV
Digital input voltage 0 VAV
Analog input voltage 0 VAV
Clock frequency 50 1600 kHz
(1) All voltages are measured with respect to GND = 0V, unless otherwise specified.
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6.4 Thermal Information ADC128S022
THERMAL METRIC(1) PW (TSSOP) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance 110 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42 °C/W
RθJB Junction-to-board thermal resistance 56 °C/W
ψJT Junction-to-top characterization parameter 5 °C/W
ψJB Junction-to-board characterization parameter 55 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
The following specifications apply for AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, CL=
50 pF, unless otherwise noted. Maximum and minimum limits apply for TA= TMIN to TMAX: all other limits TA= 25°C.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX(2) UNIT
STATIC CONVERTER CHARACTERISTICS
Resolution with no missing codes 12 Bits
VA= VD= 3 V ±0.3 ±1 LSB
Integral non-linearity (end-point
INL method) VA= VD= 5 V ±0.4 ±1 LSB
0.3 0.9 LSB
VA= VD= 3 V −0.7 −0.2 LSB
DNL Differential non-linearity 0.5 1 LSB
VA= VD= 5 V −0.7 −0.3 LSB
VA= VD= 3 V 0.8 ±2.3 LSB
VOFF Offset error VA= VD= 5 V 1.2 ±2.3 LSB
VA= VD= 3 V ±0.05 ±1.5 LSB
OEM Offset error match VA= VD= 5 V ±0.2 ±1.5 LSB
VA= VD= 3 V 0.5 ±2 LSB
FSE Full scale error VA= VD= 5 V 0.3 ±2 LSB
VA= VD= 3 V ±0.05 ±1.5 LSB
FSEM Full scale error match VA= VD= 5 V ±0.2 ±1.5 LSB
DYNAMIC CONVERTER CHARACTERISTICS
VA= VD= 3 V 8 MHz
FPBW Full power bandwidth (−3 dB) VA= VD= 5 V 11 MHz
VA= VD= 3 V, 70 73 dB
fIN = 39.9 kHz, −0.02 dBFS
SINAD Signal-to-noise plus distortion ratio VA= VD= 5 V, 70 73 dB
fIN = 39.9 kHz, −0.02 dBFS
VA= VD= 3 V, 70.8 73 dB
fIN = 39.9 kHz, −0.02 dBFS
SNR Signal-to-noise ratio VA= VD= 5 V, 70.8 73 dB
fIN = 39.9 kHz, −0.02 dBFS
VA= VD= 3 V, −89 −74 dB
fIN = 39.9 kHz, −0.02 dBFS
THD Total harmonic distortion VA= VD= 5 V, −90 −74 dB
fIN = 39.9 kHz, −0.02 dBFS
VA= VD= 3 V, 75 91 dB
fIN = 39.9 kHz, −0.02 dBFS
SFDR Spurious-free dynamic range VA= VD= 5 V, 75 91 dB
fIN = 39.9 kHz, −0.02 dBFS
VA= VD= 3 V, fIN = 39.9 kHz 11.3 11.8 Bits
ENOB Effective number of bits VA= VD= 5 V, fIN = 39.9 kHz, −0.02 dBFS 11.3 11.8 Bits
(1) Data sheet minimum and maximum specification limits are specified by design, test, or statistical analysis.
(2) Tested limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level).
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Electrical Characteristics (continued)
The following specifications apply for AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, CL=
50 pF, unless otherwise noted. Maximum and minimum limits apply for TA= TMIN to TMAX: all other limits TA= 25°C.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX(2) UNIT
VA= VD= 3 V, fIN = 20 kHz 81 dB
ISO Channel-to-channel isolation VA= VD= 5 V, fIN = 20 kHz, −0.02 dBFS 80 dB
VA= VD= 3 V, −97 dB
fa= 19.5 kHz, fb= 20.5 kHz
Intermodulation distortion, second
order terms VA= VD= 5 V, −94 dB
fa= 19.5 kHz, fb= 20.5 kHz
IMD VA= VD= 3 V, −88 dB
fa= 19.5 kHz, fb= 20.5 kHz
Intermodulation distortion, third order
terms VA= VD= 5 V, −88 dB
fa= 19.5 kHz, fb= 20.5 kHz
ANALOG INPUT CHARACTERISTICS
VIN Rail-to-rail input 0 VAV
IDCL DC leakage current ±1 µA
Track mode 33 pF
CINA Input capacitance Hold mode 3 pF
DIGITAL INPUT CHARACTERISTICS
VA= VD= 2.7 V to 3.6 V 2.1 V
VIH Input high voltage VA= VD= 4.75 V to 5.25 V 2.4 V
VIL Input low voltage VA= VD= 2.7 V to 5.25 V 0.8 V
IIN Input current VIN = 0 V or VD±0.01 ±1 µA
CIND Digital input capacitance 2 4 pF
DIGITAL OUTPUT CHARACTERISTICS
ISOURCE = 200 µA,
VOH Output high voltage VD−0.5 V
VA= VD= 2.7 V to 5.25 V
ISINK = 200 µA to 1 mA,
VOL Output low voltage 0.4 V
VA= VD= 2.7 V to 5.25 V
IOZH, IOZL Hi-impedance output leakage current VA= VD= 2.7 V to 5.25 V ±1 µA
COUT Hi-impedance output capacitance(1) 2 4 pF
Output coding Straight (Natural) Binary
POWER SUPPLY CHARACTERISTICS (CL= 10 pF)
VA, VDAnalog and digital supply voltages VA≥VD2.7 5.25 V
VA= VD= +2.7 V to +3.6 V, 0.41 1.1 mA
fSAMPLE = 200 ksps, fIN = 39.9 kHz
Total supply current
Normal mode ( CS low) VA= VD= +4.75 V to +5.25 V, 1.5 2.3 mA
fSAMPLE = 200 ksps, fIN = 39.9 kHz
IA+ IDVA= VD= +2.7 V to +3.6 V, 20 nA
Total supply current fSCLK = 0 ksps
Shutdown mode (CS high) VA= VD= 4.75 V to 5.25 V, fSCLK = 0 ksps 50 nA
VA= VD= 3 V, fSAMPLE = 200 ksps, fIN = 39.9 1.2 3.3 mW
kHz
Power consumption
Normal mode ( CS low) VA= VD= 5 V, fSAMPLE = 200 ksps, fIN = 39.9 7.5 11.5 mW
PCkHz
VA= VD= 3 V, fSCLK = 0 ksps 0.06 µW
Power consumption
Shutdown mode (CS high) VA= VD= 5 V, fSCLK = 0 ksps 0.25 µW
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8 9 10 11 12 13 14 15 16
Track Hold
Power Up
ADD2 ADD1 ADD0
DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2
DIN
DOUT
SCLK
CS
Control register
1 2 3 4 5 6 7
1 2 3 4 5 6 7
ADD2 ADD1 ADD0
8
DB11 DB10 DB9
Power
Down
Power Up
Track Hold
FOUR ZEROS FOUR ZEROS
DB1 DB0
ADC128S022
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Electrical Characteristics (continued)
The following specifications apply for AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, CL=
50 pF, unless otherwise noted. Maximum and minimum limits apply for TA= TMIN to TMAX: all other limits TA= 25°C.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX(2) UNIT
AC ELECTRICAL CHARACTERISTICS
fSCLKMIN Minimum clock frequency VA= VD= 2.7 V to 5.25 V 0.8 MHz
fSCLK Maximum clock frequency VA= VD= 2.7 V to 5.25 V 16 3.2 MHz
50 ksps
fSSample rate continuous mode VA= VD= 2.7 V to 5.25 V 1000 200 ksps
tCONVERT Conversion (hold) time VA= VD= 2.7 V to 5.25 V 13 SCLK cycles
40% 30%
DC SCLK duty cycle VA= VD= 2.7 V to 5.25 V 70% 60%
tACQ Acquisition (track) time VA= VD= 2.7 V to 5.25 V 3 SCLK cycles
Acquisition time + conversion time
Throughput time 16 SCLK cycles
VA= VD= 2.7 V to 5.25 V
tAD Aperture delay VA= VD= 2.7 V to 5.25 V 4 ns
6.6 Timing Specifications
The following specifications apply for VA= VD= 2.7 V to 5.25 V, AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE =
50 ksps to 200 ksps, and CL= 50 pF. Maximum and minimum limits apply for TA= TMIN to TMAX: all other limits TA= 25°C.
PARAMETER TEST CONDITIONS MIN NOM MAX(1) UNIT
tCSH CS hold time after SCLK rising edge 10 0 ns
tCSS CS set-up time prior to SCLK rising edge 10 4.5 ns
tEN CS falling edge to DOUT enabled 5 30 ns
tDACC DOUT access time after SCLK falling edge 17 27 ns
tDHLD DOUT hold time after SCLK falling edge 4 ns
tDS DIN set-up time prior to SCLK rising edge 10 3 ns
tDH DIN hold time after SCLK rising edge 10 3 ns
tCH SCLK high time 0.4 × tSCLK ns
tCL SCLK low time 0.4 × tSCLK ns
DOUT falling 2.4 20 ns
tDIS CS rising Edge to DOUT high-impedance DOUT rising 0.9 20 ns
(1) Data sheet min/max specification limits are specified by design, test, or statistical analysis.
Figure 1. ADC128S022 Operational Timing Diagram
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tCSH
SCLK
CS
tCSS
CS
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Figure 2. ADC128S022 Serial Timing Diagram
Figure 3. SCLK and CS Timing Parameters
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6.7 Typical Characteristics
TA= 25°C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
Figure 4. DNL Figure 5. DNL
Figure 6. INL Figure 7. INL
Figure 8. DNL vs Supply Figure 9. INL vs Supply
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Typical Characteristics (continued)
TA= 25°C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
Figure 10. SNR vs Supply Figure 11. THD vs Supply
Figure 12. ENOB vs Supply Figure 13. DNL vs VDWith VA= 5 V
Figure 14. INL vs VDWith VA= 5 V Figure 15. DNL vs SCLK Duty Cycle
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Typical Characteristics (continued)
TA= 25°C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
Figure 16. INL vs SCLK Duty Cycle Figure 17. SNR vs SCLK Duty Cycle
Figure 18. THD vs SCLK Duty Cycle Figure 19. ENOB vs SCLK Duty Cycle
Figure 20. DNL vs SCLK Figure 21. INL vs SCLK
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Typical Characteristics (continued)
TA= 25°C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
Figure 22. SNR vs SCLK Figure 23. THD vs SCLK
Figure 24. ENOB vs SCLK Figure 25. DNL vs Temperature
Figure 26. INL vs Temperature Figure 27. SNR vs Temperature
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Typical Characteristics (continued)
TA= 25°C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
Figure 28. THD vs Temperature Figure 29. ENOB vs Temperature
Figure 30. SNR vs Input Frequency Figure 31. THD vs Input Frequency
Figure 32. ENOB vs Input Frequency Figure 33. Power Consumption vs SCLK
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IN0
MUX
AGND
SAMPLING
CAPACITOR
SW1
-
+CONTROL
LOGIC
CHARGE
REDISTRIBUTION
DAC
SW2
IN7
VA/2
IN0
MUX
AGND
SAMPLING
CAPACITOR
SW1
-
+CONTRO
L
LOGI
C
CHARGE
REDISTRIBUTION
DAC
VA/2
SW2
IN7
ADC128S022
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7 Detailed Description
7.1 Overview
The ADC128S022 is a successive-approximation analog-to-digital converter designed around a charge-
redistribution digital-to-analog converter.
Simplified schematics of the ADC128S022 in both track and hold operation are shown in Figure 34 and Figure 35
respectively. In Figure 34, the ADC128S022 is in track mode: switch SW1 connects the sampling capacitor to
one of eight analog input channels through the multiplexer, and SW2 balances the comparator inputs. The
ADC128S022 is in this state for the first three SCLK cycles after CS is brought low.
Figure 35 shows the ADC128S022 in hold mode: switch SW1 connects the sampling capacitor to ground,
maintaining the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs
the charge-redistribution DAC to add or subtract fixed amounts of charge to or from the sampling capacitor until
the comparator is balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital
representation of the analog input voltage. The ADC128S022 is in this state for the last thirteen SCLK cycles
after CS is brought low.
Figure 34. ADC128S022 in Track Mode
Figure 35. ADC128S022 in Hold Mode
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IN0
IN7
MUX T/H
ADC128S022 SCLK
VA
AGND
DGND
VD
CS
DIN
DOUT
CONTROL
LOGIC
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
.
.
.
AGND
ADC128S022
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7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Serial Interface
An operational timing diagram and a serial interface timing diagram for the ADC128S022 are shown in the
Specifications section. CS, chip select, initiates conversions and frames the serial data transfers. SCLK (serial
clock) controls both the conversion process and the timing of serial data. DOUT is the serial data output pin,
where a conversion result is sent as a serial data stream, MSB first. Data to be written to the ADC128S022's
Control Register is placed on DIN, the serial data input pin. New data is written to DIN with each conversion.
A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. Each frame must contain
an integer multiple of 16 rising SCLK edges. The ADC's DOUT pin is in a high impedance state when CS is high
and is active when CS is low. Thus, CS acts as an output enable. Similarly, SCLK is internally gated off when CS
is brought high.
During the first 3 cycles of SCLK, the ADC is in the track mode, acquiring the input voltage. For the next 13
SCLK cycles the conversion is accomplished and the data is clocked out. SCLK falling edges 1 through 4 clock
out leading zeros while falling edges 5 through 16 clock out the conversion result, MSB first. If there is more than
one conversion in a frame (continuous conversion mode), the ADC will re-enter the track mode on the falling
edge of SCLK after the N*16th rising edge of SCLK and re-enter the hold/convert mode on the N*16+4th falling
edge of SCLK. "N" is an integer value.
The ADC128S022 enters track mode under three different conditions. In Figure 1, CS goes low with SCLK high
and the ADC enters track mode on the first falling edge of SCLK. In the second condition, CS goes low with
SCLK low. Under this condition, the ADC automatically enters track mode and the falling edge of CS is seen as
the first falling edge of SCLK. In the third condition, CS and SCLK go low simultaneously and the ADC enters
track mode. While there is no timing restriction with respect to the rising edges of CS and SCLK, see Figure 3 for
set-up and hold time requirements for the falling edge of CS with respect to the rising edge of SCLK.
While a conversion is in progress, the address of the next input for conversion is clocked into a control register
through the DIN pin on the first 8 rising edges of SCLK after the fall of CS. See Table 1,Table 2, and Table 3.
There is no need to incorporate a power-up delay or dummy conversion as the ADC128S022 is able to acquire
the input signal to full resolution in the first conversion immediately following power up. The first conversion result
after power up will be that of IN0.
7.3.2 ADC128S022 Transfer Function
The output format of the ADC128S022 is straight binary. Code transitions occur midway between successive
integer LSB values. The LSB width for the ADC128S022 is VA/ 4096. The ideal transfer characteristic is shown
in Figure 36. The transition from an output code of 0000 0000 0000 to a code of 0000 0000 0001 is at 1/2 LSB,
or a voltage of VA/ 8192. Other code transitions occur at steps of one LSB.
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Product Folder Links: ADC128S022
VIN
D1
R1
C2
30 pF
VA
D2
C1
3 pF
Conversion Phase - Switch Open
Track Phase - Switch Closed
|
|
|
0V +VA - 1.5LSB
0.5LSB ANALOG INPUT
1LSB = VA/4096
ADC CODE
111...111
111...110
111...000
011...111
000...010
000...001
000...000
ADC128S022
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
www.ti.com
Feature Description (continued)
Figure 36. Ideal Transfer Characteristic
7.3.3 Analog Inputs
An equivalent circuit for one of the input channels of the ADC128S022 is shown in Figure 37. Diodes D1 and D2
provide ESD protection for the analog inputs. The operating range for the analog inputs is 0 V to VA. Going
beyond this range will cause the ESD diodes to conduct and result in erratic operation.
The capacitor C1 in Figure 37 has a typical value of 3 pF and is mainly the package pin capacitance. Resistor R1
is the ON-resistance of the multiplexer and track / hold switch and is typically 500 Ω. Capacitor C2 is the
ADC128S022 sampling capacitor, and is typically 30 pF. The ADC128S022 will deliver best performance when
driven by a low-impedance source (less than 100 Ω). This is especially important when using the ADC128S022
to sample dynamic signals. Also important when sampling dynamic signals is a bandpass or lowpass filter which
reduces harmonics and noise in the input. These filters are often referred to as anti-aliasing filters.
Figure 37. Equivalent Input Circuit
7.3.4 Digital Inputs and Outputs
The digital inputs of the ADC128S022 (SCLK, CS, and DIN) have an operating range of –0.3 V to VA. They are
not prone to latch-up and may be asserted before the digital supply (VD) without any risk. The digital output
(DOUT) operating range is controlled by VD. The output high voltage is VD– 0.5V (minimum) while the output low
voltage is 0.4 V (maximum).
7.4 Device Functional Modes
The ADC128S022 is fully powered-up whenever CS is low and fully powered-down whenever CS is high, with
one exception. If operating in continuous conversion mode, the ADC128S022 automatically enters power-down
mode between SCLK's 16th falling edge of a conversion and SCLK's 1st falling edge of the subsequent
conversion (see Figure 1).
16 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: ADC128S022
S
SN
S
N
SN
N
CP
tt t
P
tt t
P++
=xx
+
ADC128S022
www.ti.com
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
Device Functional Modes (continued)
In continuous conversion mode, the ADC128S022 can perform multiple conversions back to back. Each
conversion requires 16 SCLK cycles and the ADC128S022 will perform conversions continuously as long as CS
is held low. Continuous mode offers maximum throughput.
In burst mode, the user may trade off throughput for power consumption by performing fewer conversions per
unit time. This means spending more time in power-down mode and less time in normal mode. By using this
technique, the user can achieve very low sample rates while still using an SCLK frequency within the electrical
specifications. The Power Consumption vs SCLK curve in the Typical Characteristics section shows the typical
power consumption of the ADC128S022. To calculate the power consumption (PC), simply multiply the fraction of
time spent in the normal mode (tN) by the normal mode power consumption (PN), and add the fraction of time
spent in shutdown mode (tS) multiplied by the shutdown mode power consumption (PS) as shown in Equation 1.
(1)
7.5 Register Maps
Table 1. Control Register Bits
Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
DONTC DONTC ADD2 ADD1 ADD0 DONTC DONTC DONTC
Table 2. Control Register Bit Descriptions
BIT #: SYMBOL: DESCRIPTION
7, 6, 2, 1, 0 DONTC Don't care. The values of these bits do not affect the device.
5 ADD2 These three bits determine which input channel will be sampled and converted at the next
4 ADD1 conversion cycle. The mapping between codes and channels is shown in Table 3.
3 ADD0
Table 3. Input Channel Selection
ADD2 ADD1 ADD0 INPUT CHANNEL
0 0 0 IN0 (Default)
0 0 1 IN1
0 1 0 IN2
0 1 1 IN3
1 0 0 IN4
1 0 1 IN5
1 1 0 IN6
1 1 1 IN7
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: ADC128S022
ADC128S022
IN7
IN0
SCLK
CS
DOUT
DIN
DGN
D
AGN
D
V
AVD
MCU
VDD
GND
LMV612
+
1uF 0.1uF 1uF0.1uF
3.3V5V
Schottky
Diode
(optional)
Low
Impedance
Source
High
Impedance
Source
IN3
100
100
100
100
GPIOa
GPIOb
GPIOc
GPIOd
33n
100
100
33n
ADC128S022
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The ADC128S022 is a successive-approximation analog-to-digital converter designed around a charge-
redistribution digital-to-analog converter. Because the ADC128S022 integrates an 8 to 1 MUX on the front end,
the device is typically used in applications where multiple voltages need to be monitored. In addition to having 8
input channels, the ADC128S022 can operate at sampling rates up to 200 kSPS. As a result, the ADC128S022
is typically run in burst fashion where a voltage is sampled for several times and then the ADC128S022 can be
powered down. This is a common technique for applications that are power limited. Due to the high bandwidth
and sampling rate, the ADC128S022 is suitable for monitoring AC waveforms as well as DC inputs. The following
example shows a common configuration for monitoring AC inputs.
8.2 Typical Application
The following sections outline the design principles of data acquisition system based on the ADC128S022.
A typical application is shown in Figure 38. The analog supply is bypassed with a capacitor network located close
to the ADC128S022. The ADC128S022 uses the analog supply (VA) as its reference voltage, so it is very
important that VAbe kept as clean as possible. Due to the low power requirements of the ADC128S022, it is also
possible to use a precision reference as a power supply.
Figure 38. Typical Application Circuit
8.2.1 Design Requirements
A positive supply only data acquisition system capable of digitizing signals ranging 0 to 5 V, BW = 10 kHz, and a
throughput of 125 kSPS.
The ADC128S022 has to interface to an MCU whose supply is set at 3.3 V.
8.2.2 Detailed Design Procedure
The signal range requirement forces the design to use 5-V analog supply at VA, analog supply. This follows from
the fact that VA is also a reference potential for the ADC.
The requirement of interfacing to the MCU which is powered by 3.3-V supply, forces the choice of 3.3-V as a VD
supply.
18 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: ADC128S022
SCLK
128
R C
F
´ ³
p ´
SCLK1 F
R C 16 8
£
p ´ ´ ´
s
signal
F
BW 2
£
SCLK
s _ sin gle
F
F16
=
SCLK
s
F
F
16 8
=
´
ADC128S022
www.ti.com
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
Typical Application (continued)
Sampling is in fact a modulation process which may result in aliasing of the input signal, if the input signal is not
adequately band limited. The maximum sampling rate of the ADC128S022 when all channels are enabled is, Fs
is calculated by Equation 2:
(2)
Note that faster sampling rates can be achieved when fewer channels are sampled. Single channel can be
sampled at the maximum rate of Equation 3:
(3)
In order to avoid the aliasing, the Nyquist criterion has to be met by Equation 4:
(4)
Therefore it is necessary to place anti-aliasing filters at all inputs of the ADC. These filters may be single-pole
lowpass filters whose pole location has to satisfy, assuming all channels sampled in sequence of Equation 5 and
Equation 6:
(5)
(6)
With Fsclk = 16 MHz, a good choice for the single-pole filter is:
• R = 100
• C = 33 nF
This reduces the input BWsignal = 48 kHz. The capacitor at the INx input of the device provides not only the
filtering of the input signal, but it also absorbs the charge kick-back from the ADC. The kick-back is the result of
the internal switches opening at the end of the acquisition period.
The VA and VD sources are already separated in this example, due to the design requirements. This also
benefits the overall performance of the ADC, as the potentially noisy VD supply does not contaminate the VA. In
the same vain, further consideration could be given to the SPI interface, especially when the master MCU is
capable of producing fast rising edges on the digital bus signals. Inserting small resistances in the digital signal
path may help in reducing the ground bounce, and thus improve the overall noise performance of the system.
Take care when the signal source is capable of producing voltages beyond VA. In such instances the internal
ESD diodes may start conducting. The ESD diodes are not intended as input signal clamps. To provide the
desired clamping action use Schottky diodes as shown in Figure 38.
8.2.3 Application Curve
Figure 39. Typical Performance
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: ADC128S022
ADC128S022
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
www.ti.com
9 Power Supply Recommendations
There are three major power supply concerns with this product: power supply sequencing, power management,
and the effect of digital supply noise on the analog supply.
9.1 Power Supply Sequence
The ADC128S022 is a dual-supply device. The two supply pins share ESD resources, so take care to ensure
that the power is applied in the correct sequence. To avoid turning on the ESD diodes, the digital supply (VD)
cannot exceed the analog supply (VA) by more than 300 mV, not even on a transient basis. Therefore, VAmust
ramp up before or concurrently with VD.
9.2 Power Supply Noise Considerations
The charging of any output load capacitance requires current from the digital supply, VD. The current pulses
required from the supply to charge the output capacitance will cause voltage variations on the digital supply. If
these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore, if
the analog and digital supplies are tied directly together, the noise on the digital supply will be coupled directly
into the analog supply, causing greater performance degradation than would noise on the digital supply alone.
Similarly, discharging the output capacitance when the digital output goes from a logic high to a logic low will
dump current into the die substrate, which is resistive. Load discharge currents will cause ground bounce noise
in the substrate that will degrade noise performance if that current is large enough. The larger the output
capacitance, the more current flows through the die substrate and the greater the noise coupled into the analog
channel.
The first solution to keeping digital noise out of the analog supply is to decouple the analog and digital supplies
from each other or use separate supplies for them. To keep noise out of the digital supply, keep the output load
capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100-Ωseries resistor at
the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge
current of the output capacitance and improve noise performance. Because the series resistor and the load
capacitor form a low-frequency pole, verify the signal integrity once the series resistor has been added.
20 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: ADC128S022
CS
VA
AGND
IN0
IN1
IN2
IN3
IN4
SCLK
DOUT
DIN
VD
DGND
IN7
IN6
IN5
GROUND PLANE
VIA to GROUND PLANE
“DIGITAL” SUPPLY RAIL
ANALOG
SUPPLY
RAIL
toMCU
to analog
signal sources
ADC128S022
www.ti.com
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
10 Layout
10.1 Layout Guidelines
Capacitive coupling between the noisy digital circuitry and the sensitive analog circuitry can lead to poor
performance. The solution is to keep the analog circuitry separated from the digital circuitry and the clock line as
short as possible.
Digital circuits create substantial supply and ground current transients. The logic noise generated could have
significant impact upon system noise performance. To avoid performance degradation of the ADC128S022 due
to supply noise, do not use the same supply for the ADC128S022 that is used for digital logic.
Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. However, to maximize
accuracy in high resolution systems, avoid crossing analog and digital lines altogether. It is important to keep
clock lines as short as possible and isolated from ALL other lines, including other digital lines. In addition, the
clock line should also be treated as a transmission line and be properly terminated.
The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input.
Any external component (for example, a filter capacitor) connected between the input pins and ground of the
converter or to the reference input pin and ground should be connected to a very clean point in the ground plane.
TI recommends the use of a single, uniform ground plane and the use of split power planes. The power planes
should be located within the same board layer. All analog circuitry (input amplifiers, filters, reference
components, and so forth) should be placed over the analog power plane. All digital circuitry and I/O lines should
be placed over the digital power plane. Furthermore, all components in the reference circuitry and the input
signal chain that are connected to ground should be connected together with short traces and enter the analog
ground plane at a single, quiet point.
10.2 Layout Example
Figure 40. Layout Schematic
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: ADC128S022
ADC128S022
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
www.ti.com
11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
11.1.1.1 Specification Definitions
ACQUISITION TIME is the time required for the ADC to acquire the input voltage. During this time, the hold
capacitor is charged by the input voltage.
APERTURE DELAY is the time between the fourth falling edge of SCLK and the time when the input signal is
internally acquired or held for conversion.
CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input
voltage to a digital word.
CHANNEL-TO-CHANNEL ISOLATION is resistance to coupling of energy from one channel into another
channel
CROSSTALK is the coupling of energy from one channel into another channel. This is similar to Channel-to-
Channel Isolation, except for the sign of the data.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The
specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a
perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
FULL SCALE ERROR (FSE) is a measure of how far the last code transition is from the ideal 1½ LSB below
VREF+and is defined as:
VFSE = Vmax + 1.5 LSB – VREF+(7)
where Vmax is the voltage at which the transition to the maximum code occurs. FSE can be expressed in Volts,
LSB or percent of full scale range.
GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF - 1.5
LSB), after adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code
transition). The deviation of any given code from this straight line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to an individual ADC input at the same time. It is defined as the ratio of the
power in both the second and the third order intermodulation products to the power in one of the original
frequencies. Second order products are fa± fb, where faand fbare the two sine wave input frequencies. Third
order products are (2fa± fb) and (fa± 2fb). IMD is usually expressed in dB.
MISSING CODES are those output codes that will never appear at the ADC outputs. These codes cannot be
reached with any input value. The ADC128S022 is ensured not to have any missing codes.
OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND +
0.5 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms
value of the sum of all other spectral components below one-half the sampling frequency, not including d.c. or
the harmonics included in THD.
22 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: ADC128S022
2
f1
2
f10
2
f2
10
‡A
A++A
logTHD = 20
ADC128S022
www.ti.com
SNAS334F –AUGUST 2005–REVISED NOVEMBER 2015
Device Support (continued)
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral components below half the clock frequency, including
harmonics but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal
amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is
any signal present in the output spectrum that is not present at the input and may or may not be a harmonic.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first five harmonic
components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated
as
(8)
where Af1 is the RMS power of the input frequency at the output and Af2 through Af10 are the RMS power in the
first 9 harmonic frequencies.
THROUGHPUT TIME is the minimum time required between the start of two successive conversions. It is the
acquisition time plus the conversion and read out times. In the case of the ADC128S022, this is 16 SCLK
periods.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
SPI, QSPI are trademarks of Motorola, Inc..
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Links: ADC128S022
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ADC128S022CIMT/NOPB ACTIVE TSSOP PW 16 92 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 105 128S022
CIMT
ADC128S022CIMTX/NOPB ACTIVE TSSOP PW 16 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 105 128S022
CIMT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ADC128S022CIMTX/NOP
BTSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADC128S022CIMTX/NOP
BTSSOP PW 16 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2015
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
BNOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
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