1996 Oct 17 18 - 2
Philips Semiconductors
Small-signal and Medium-power Diodes Packing and
packing quantities
SCOPE
This chapter covers packing and packing quantity details
for surface-mount and leaded diodes in the following
packages:
Table 1 Survey of packages
PACKAGE
SURFACE-MOUNT THROUGH-HOLE
SC59 (SOT346) SOD27 (DO-35)
SC70-3 (SOT323) SOD57
SOD80(C) SOD61
SOD87 SOD64
SOD106 (DO-214AC) SOD66 (DO-41)
SOD106A SOD68 (DO-34)
SOD110 SOD81
SOD323 SOD83A
SOT23 SOD88A
SOT89 SOD91
SOT143 SOT18/15 (TO-18)
SOT223
SO20 (SOT163-1)
SURFACE-MOUNT DEVICES
Tape and reel packing for surface-mount devices meets
the feed requirements for automatic pick and place
equipment (packing conforms to IEC publication 286-3).
Tape is an ideal shipping container making handling easy
and providing secure blister cavities in which the devices
are sealed with peel-off cover tape.
Tape specification
Tape dimensions are specified in Tables 3 and 4 and in
Figs.1 through 7 for 8, 12 and 24 mm tape respectively.
For diodes with only two terminations, the cathode side of
the device is adjacent to the sprocket holes in the tape.
Table 2 Carrier tape widths
8 mm 12 mm 24 mm
SC59 (SOT346) SOD106(A) SO20
SC70 (SOT323) SOT89
SOD80(C) SOT223
SOD87
SOD110
SOD323
SOT23
SOT143
Table 3 Variable tape dimensions
PACKAGE SYMBOL
W
(mm) F
(mm) P
(mm) K
(mm) B1
(mm) D1
(mm)
SO20 24.0 11.5 12.0 3.6 14.1 1.5
Tolerance ±0.3 ±0.1 ±0.1 max. max. min.
SC59 (SOT346) 8.0 3.5 4.0 1.5 4.2 1.0
SC70 (SOT323) 8.0 3.5 4.0 1.5 4.2 1.0
SOD80(C) 8.0 3.5 4.0 2.0 4.2 1.0
SOD87 8.0 3.5 4.0 2.5 4.2 1.0
SOD106(A) 12.0 5.5 4.0 3.0 6.0 1.5
SOD110 8.0 3.5 4.0 2.5 4.2 1.0
SOD323 8.0 3.5 4.0 1.5 4.2 1.0
SOT23 8.0 3.5 4.0 1.5 4.2 1.0
SOT89 12.0 5.5 8.0 2.3 8.2 1.5
SOT143 8.0 3.5 4.0 1.5 4.2 1.0
SOT223 12.0 5.5 8.0 2.4 8.2 1.5
Tolerance ±0.2 0.05 ±0.1 max. max. min.