(R) ADS ADS7824 782 4 ADS 782 4 www.burr-brown.com/databook/ADS7824.html 4 Channel, 12-Bit Sampling CMOS A/D Converter FEATURES DESCRIPTION 25s max SAMPLING AND CONVERSION SINGLE +5V SUPPLY OPERATION The ADS7824 can acquire and convert 12 bits to within 0.5 LSB in 25s max while consuming only 50mW max. Laser-trimmed scaling resistors provide the standard industrial 10V input range and channelto-channel matching of 0.1%. The ADS7824 is a low-power 12-bit sampling A/D with a four channel input multiplexer, S/H, clock, reference, and a parallel/serial microprocessor interface. It can be configured in a continuous conversion mode to sequentially digitize all four channels. The 28-pin ADS7824 is available in a plastic 0.3" DIP and in a SOIC, both fully specified for operation over the industrial -40C to +85C range. PIN-COMPATIBLE WITH 16-BIT ADS7825 PARALLEL AND SERIAL DATA OUTPUT 28-PIN 0.3" PLASTIC DIP AND SOIC 0.5 LSB max INL AND DNL 50mW max POWER DISSIPATION 50W POWER DOWN MODE 10V INPUT RANGE, FOUR CHANNEL MULTIPLEXER CONTINUOUS CONVERSION MODE Channel Continuous Conversion CONTC A0 A1 40k AIN0 R/C CS Successive Approximation Register Clock and Control Logic 20k PWRD 8k 40k CDAC AIN1 BUSY 20k 8k Serial 40k AIN2 Comparator DATACLK Data Out 20k Parallel 40k Data AIN3 Out 20k SDATA or 8k 8k Buffer CAP Internal +2.5V Ref 8 D7-D0 BYTE 6k REF International Airport Industrial Park * Mailing Address: PO Box 11400, Tucson, AZ 85734 * Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 * Tel: (520) 746-1111 * Twx: 910-952-1111 Internet: http://www.burr-brown.com/ * FAXLine: (800) 548-6133 (US/Canada Only) * Cable: BBRCORP * Telex: 066-6491 * FAX: (520) 889-1510 * Immediate Product Info: (800) 548-6132 (R) (c) SBAS044 1996 Burr-Brown Corporation PDS-1303B 1 Printed in U.S.A. October, 1997 ADS7824 SPECIFICATIONS ELECTRICAL At TA = -40C to +85C, f S = 40kHz, VS1 = VS2 = VS = +5V 5%, using external reference, CONTC = 0V, unless otherwise specified. ADS7824P, U PARAMETER CONDITIONS MIN TYP RESOLUTION ADS7824PB, UB MAX MIN TYP 12 ANALOG INPUT Voltage Range Impedance Capacitance Channel On or Off THROUGHPUT SPEED Conversion Time Acquisition Time Multiplexer Settling Time Complete Cycle (Acquire and Convert) Complete Cycle (Acquire and Convert) Throughput Rate DC ACCURACY Integral Linearity Error Differential Linearity Error No Missing Codes Transition Noise(3) Full Scale Error(4) Full Scale Error Drift Full Scale Error(4) Full Scale Error Drift Bipolar Zero Error Bipolar Zero Error Drift Channel-to-Channel Mismatch Power Supply Sensitivity AC ACCURACY Spurious-Free Dynamic Range(5) Total Harmonic Distortion Signal-to-(Noise+Distortion) Signal-to-Noise Channel Separation(6) -3dB Bandwidth Useable Bandwidth(7) SAMPLING DYNAMICS Aperture Delay Transient Response(8) Overvoltage Recovery(9) REFERENCE Internal Reference Voltage Internal Reference Source Current (Must use external buffer) External Reference Voltage Range for Specified Linearity External Reference Current Drain Includes Acquisition 20 5 5 s s s s s kHz 0.15 0.15 Guaranteed 0.1 7 2 2 +4.75 < VS < +5.25 80 70 70 90 90 -90 73 73 100 2 90 1 1 0.5 5 0.5 0.5 0.5 0.25 0.25 10 0.1 0.5 0.1 -80 72 72 40 5 1 FS Step LSB (2) LSB LSB % ppm/C % ppm/C mV ppm/C % LSB dB dB dB dB dB MHz kHz ns s s 2.48 2.5 1 2.52 V A 2.3 2.5 2.7 V A V V A A V V A pF VREF = +2.5V DIGITAL INPUTS Logic Levels VIL VIH IIL IIH 100 -0.3 +2.4 DIGITAL OUTPUTS Data Format Data Coding VOL VOH Leakage Current Output Capacitance V k pF 25 40 1kHz 1kHz 1kHz 1kHz 1kHz Bits 40 fIN = fIN = fIN = fIN = fIN = UNITS (1) 10V 45.7 35 CONTC = +5V Internal Reference Internal Reference MAX +0.8 VS +0.3V 10 10 Parallel in two bytes; Serial Binary Two's Complement +0.4 +4 5 15 ISINK = 1.6mA ISOURCE = 500A High-Z State, VOUT = 0V to VS High-Z State The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. (R) ADS7824 2 SPECIFICATIONS (CONT) ELECTRICAL At TA = -40C to +85C, fS = 40kHz, VS1 = VS2 = V S = +5V 5%, using external reference, CONTC = 0V, unless otherwise specified. ADS7824P, U PARAMETER CONDITIONS DIGITAL TIMING Bus Access Time Bus Relinquish Time Data Clock Internal Clock (Output only when transmitting data) External Clock POWER SUPPLIES VS1 = VS2 = VS Power Dissipation MIN TYP ADS7824PB, UB MAX MIN TYP MAX UNITS ns ns PAR/SER = +5V PAR/SER = +5V PAR/SER = 0V EXT/INT LOW 83 83 0.5 1.5 MHz EXT/INT HIGH 0.1 10 MHz +5.25 50 V mW W C C +4.75 +5 fS = 40kHz PWRD HIGH 50 TEMPERATURE RANGE Specified Performance Storage Thermal Resistance (JA) Plastic DIP SOIC -40 -65 +85 +150 C/W C/W 75 75 NOTES: (1) An asterik () specifies same value as grade to the left. (2) LSB means Least Significant Bit. For the 12-bit, 10V input ADS7824, one LSB is 4.88mV. (3) Typical rms noise at worst case transitions and temperatures. (4) Full scale error is the worst case of -Full Scale or +Full Scale untrimmed deviation from ideal first and last code transitions, divided by the transition voltage (not divided by the full-scale range) and includes the effect of offset error. (5) All specifications in dB are referred to a full-scale 10V input. (6) A full scale sinewave input on one channel will be attenuated by this amount on the other channels. (7) Useable Bandwidth defined as Full-Scale input frequency at which Signal-to-(Noise+Distortion) degrades to 60dB, or 10 bits of accuracy. (8) The ADS7824 will accurately acquire any input step if given a full acquisition period after the step. (9) Recovers to specified performance after 2 x FS input overvoltage, and normal acquisitions can begin. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) ADS7824P ADS7824PB ADS7824U ADS7824UB Plastic Dip Plastic Dip SOIC SOIC 246 246 217 217 TEMPERATURE RANGE MAXIMUM INTEGRAL LINEARITY ERROR (LSB) MINIMUM SIGNALTO-(NOISE + DISTORTION) RATIO (dB) -40C to +85C -40C to +85C -40C to +85C -40C to +85C 1 0.5 1 0.5 70 72 70 72 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS Analog Inputs: AIN0, AIN1, AIN2, AIN3 .............................................. 15V REF ................................... (AGND2 -0.3V) to (VS + 0.3V) CAP ........................................ Indefinite Short to AGND2, Momentary Short to VS VS1 and VS2 to AGND2 ........................................................................... 7V VS1 to VS2 .......................................................................................... 0.3V Difference between AGND1, AGND2 and DGND ............................. 0.3V Digital Inputs and Outputs .......................................... -0.3V to (VS + 0.3V) Maximum Junction Temperature ..................................................... 150C Internal Power Dissipation ............................................................. 825mW Lead Temperature (soldering, 10s) ................................................ +300C Maximum Input Current to Any Pin ................................................. 100mA Top View ELECTROSTATIC DISCHARGE SENSITIVITY DIP/SOIC AGND1 1 28 VS1 AIN0 2 27 VS2 AIN1 3 26 PWRD AIN2 4 25 CONTC AIN3 5 24 BUSY CAP 6 23 CS REF 7 AGND2 8 21 BYTE 9 20 PAR/SER ADS7824 22 R/C This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. TRI-STATE D7 TRI-STATE D6 10 19 A0 TRI-STATE D5 11 18 A1 ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. EXT/INT D4 12 17 D0 TAG SYNC D3 13 16 D1 SDATA DGND 14 15 D2 DATACLK (R) 3 ADS7824 PIN ASSIGNMENTS PIN # NAME 1 AGND1 I/O DESCRIPTION 2 AIN0 Analog Input Channel 0. Full-scale input range is 10V. 3 AIN 1 Analog Input Channel 1. Full-scale input range is 10V. 4 AIN 2 Analog Input Channel 2. Full-scale input range is 10V. 5 AIN 3 Analog Input Channel 3. Full-scale input range is 10V. 6 CAP Internal Reference Output Buffer. 2.2F Tantalum to ground. 7 REF Reference Input/Output. Outputs +2.5V nominal. If used externally, must be buffered to maintain ADS7825 accuracy. Can also be driven by external system reference. In both cases, bypass to ground with a 2.2F Tantalum capacitor. 8 AGND2 9 D7 O Parallel Data Bit 7 if PAR/SER HIGH; Tri-state if PAR/SER LOW. See Table I. 10 D6 O Parallel Data Bit 6 if PAR/SER HIGH; Tri-state if PAR/SER LOW. See Table I. 11 D5 O Parallel Data Bit 5 if PAR/SER HIGH; Tri-state if PAR/SER LOW. See Table I. 12 D4 I/O Parallel Data Bit 4 if PAR/SER HIGH; if PAR/SER LOW, a LOW level input here will transmit serial data on SDATA from the previous conversion using the internal serial clock; a HIGH input here will transmit serial data using an external serial clock input on DATACLK (D2). See Table I. 13 D3 O Parallel Data Bit 3 if PAR/SER HIGH; SYNC output if PAR/SER LOW. See Table I. 14 DGND 15 D2 I/O Parallel Data Bit 2 if PAR/SER HIGH; if PAR/SER LOW, this will output the internal serial clock if EXT/INT (D4) is LOW; will be an input for an external serial clock if EXT/INT (D4) is HIGH. See Table I. 16 D1 O Parallel Data Bit 1 if PAR/SER HIGH; SDATA serial data output if PAR/SER LOW. See Table I. 17 D0 I/O Parallel Data Bit 0 if PAR/SER HIGH; TAG data input if PAR/SER LOW. See Table I. 18 A1 I/O Channel Address. Input if CONTC LOW, output if CONTC HIGH. See Table I. 19 A0 I/O 20 PAR/SER I Select Parallel or Serial Output. If HIGH, parallel data will be output on D0 thru D7. If LOW, serial data will be output on SDATA. See Table I and Figure 1. 21 BYTE I Byte Select. Only used with parallel data, when PAR/SER HIGH. Determines which byte is available on D0 thru D7. Changing BYTE with CS LOW and R/C HIGH will cause the data bus to change accordingly. LOW selects the 8 MSBs; HIGH selects the 4 LSBs, see Figures 2 and 3. 22 R/C I Read/Convert Input. With CS LOW, a falling edge on R/C puts the internal sample/hold into the hold state and starts a conversion. With CS LOW, a rising edge on R/C enables the output data bits if PAR/SER HIGH, or starts transmission of serial data if PAR/SER LOW and EXT/INT HIGH. 23 CS I Chip Select. Internally OR'd with R/C. With CONTC LOW and R/C LOW, a falling edge on CS will initiate a conversion. With R/C HIGH, a falling edge on CS will enable the output data bits if PAR/SER HIGH, or starts transmission of serial data if PAR/SER LOW and EXT/INT HIGH. 24 BUSY O Busy Output. Falls when conversion is started; remains LOW until the conversion is completed and the data is latched into the output register. In parallel output mode, output data will be valid when BUSY rises, so that the rising edge can be used to latch the data. 25 CONTC I Continuous Conversion Input. If LOW, conversions will occur normally when initiated using CS and R/C; if HIGH, acquisition and conversions will take place continually, cycling through all four input channels, as long as CS, R/C and PWRD are LOW. See Table I. For serial mode only. 26 PWRD I Power Down Input. If HIGH, conversions are inhibited and power consumption is significantly reduced. Results from the previous conversion are maintained in the output register. In the continuous conversion mode, the multiplexer address channel is reset to channel 0 27 VS2 Supply Input. Nominally +5V. Connect directly to pin 28. Decouple to ground with 0.1F ceramic and 10F Tantalum capacitors. 28 VS1 Supply Input. Nominally +5V. Connect directly to pin 27. Analog Ground. Used internally as ground reference point. Analog Ground. Digital Ground. Channel Address. Input if CONTC LOW, output if CONTC HIGH. See Table I. (R) ADS7824 4 TYPICAL PERFORMANCE CURVES At TA = +25C, fS = 40kHz, VS1 = VS2 = +5V, using internal reference, unless otherwise noted. ADJACENT CHANNEL CROSSTALK, WORST PAIR (8192 Point FFT; AIN3 = 1.02kHz, -0.1dB; AIN2 = AGND) 0 0 -10.0 -10.0 -20.0 -20.0 -30.0 -30.0 Amplitude (dB) Amplitude (dB) FREQUENCY SPECTRUM (8192 Point FFT; fIN = 1.02kHz, -0.5dB) -40.0 -50.0 -60.0 -70.0 -40.0 -50.0 -60.0 -70.0 -80.0 -80.0 -90.0 -90.0 -100.0 -100.0 -110.0 -110.0 0 5 10 Frequency (kHz) 15 20 0 5 10 Frequency (kHz) 15 20 ADJACENT CHANNEL CROSSTALK, WORST PAIR (8192 Point FFT; AIN3 = 10.1kHz, -0.1dB; AIN2 = AGND) 0 12-Bit LSBs -10.0 -30.0 -40.0 -50.0 All Codes INL 0 512 1024 1536 -60.0 2048 2560 3072 3584 4095 3072 3584 4095 Decimal Code -70.0 12-Bit LSBs -80.0 -90.0 -100.0 -110.0 0 5 10 Frequency (kHz) 15 20 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 All Codes DNL 0 512 1024 1536 2048 2560 Decimal Code ENDPOINT ERRORS 2 mV From Ideal POWER SUPPLY RIPPLE SENSITIVITY INL/DNL DEGRADATION PER LSB OF P-P RIPPLE 1 10-1 BPZ Error 1 0 -1 -2 0.2 Percent From Ideal 10-2 INL 10-3 +FS Error 0 -0.2 10-4 0.2 -FS Error DNL Percent From Ideal Linearity Degradation (LSB/LSB) Amplitude (dB) -20.0 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 10-5 101 102 103 104 105 106 107 0 Power Supply Ripple Frequency (Hz) -0.2 -50 -25 0 25 50 75 100 Temperature (C) (R) 5 ADS7824 TYPICAL PERFORMANCE CURVES (CONT) At TA = +25C, fS = 40kHz, VS1 = VS2 = +5V, using internal reference, unless otherwise noted. CONVERSION TIME vs TEMPERATURE 2.520 15.7 2.515 15.6 2.510 Conversion Time (s) Internal Reference (V) INTERNAL REFERENCE VOLTAGE vs TEMPERATURE 2.505 2.500 2.495 2.490 2.485 15.5 15.4 15.3 15.2 15.1 15.0 14.9 2.480 -50 -25 0 25 50 75 14.8 -50 100 Temperature (C) 0 25 50 Temperature (C) (R) ADS7824 -25 6 75 100 BASIC OPERATION PARALLEL OUTPUT Figure 1a shows a basic circuit to operate the ADS7824 with parallel output (Channel 0 selected). Taking R/C (pin 22) LOW for 40ns (12s max) will initiate a conversion. BUSY (pin 24) will go LOW and stay LOW until the conversion is completed and the output register is updated. If BYTE (pin 21) is LOW, the 8 most significant bits will be valid when pin 24 rises; if BYTE is HIGH, the 4 least significant bits will be valid when BUSY rises. Data will be output in Binary Two's Complement format. BUSY going HIGH can be used to latch the data. After the first byte has been read, BYTE can be toggled allowing the remaining byte to be read. All convert commands will be ignored while BUSY is LOW. SERIAL OUTPUT Figure 1b shows a basic circuit to operate the ADS7824 with serial output (Channel 0 selected). Taking R/C (pin 22) LOW for 40ns (12s max) will initiate a conversion and output valid data from the previous conversion on SDATA (pin 16) synchronized to 12 clock pulses output on DATACLK (pin 15). BUSY (pin 24) will go LOW and stay LOW until the conversion is completed and the serial data has been transmitted. Data will be output in Binary Two's Complement format, MSB first, and will be valid on both the rising and falling edges of the data clock. BUSY going HIGH can be used to latch the data. All convert commands will be ignored while BUSY is LOW. The ADS7824 will begin tracking the input signal at the end of the conversion. Allowing 25s between convert commands assures accurate acquisition of a new signal. The ADS7824 will begin tracking the input signal at the end of the conversion. Allowing 25s between convert commands assures accurate acquisition of a new signal. Parallel Output 10V 1 28 2 27 3 26 4 25 5 24 6 23 7 22 0.1F 10F + + +5V BUSY + Convert Pulse R/C 2.2F + ADS7824 2.2F BYTE 8 21 9 20 10 19 11 18 12 17 13 16 14 15 40ns min +5V(1) Serial Output Pin 21 LOW D11 D10 D9 D8 D7 D6 Pin 21 HIGH D3 D1 D0 LOW LOW LOW LOW D2 D5 D4 10V 1 28 2 27 3 26 4 25 5 24 6 23 NOTE: (1) PAR/SER = 5V + 0.1F 10F + + +5V BUSY Convert Pulse 2.2F 7 + R/C 22 ADS7824 2.2F 8 21 9 20 NC(2) 10 19 NC(2) 11 18 EXT/INT 12 17 SYNC 13 16 SDATA 14 15 DATACLK(1) NC(2) 40ns min (3) NOTES: (1) DATACLK (pin 15) is an output when EXT/INT (pin 12) is LOW and an input when EXT/INT is HIGH. (2) NC = no connection. (3) PAR/SER = 0V. FIGURE 1. Basic Connection Diagram, (a) Parallel Output, (b) Serial Output. (R) 7 ADS7824 STARTING A CONVERSION initiating a conversion. If, however, it is critical that CS or R/C initiates conversion `n', be sure the less critical input is LOW at least 10ns prior to the initiating input. If EXT/INT (pin 12) is LOW when initiating conversion `n', serial data from conversion `n - 1' will be output on SDATA (pin 16) following the start of conversion `n'. See Internal Data Clock in the Reading Data section. To reduce the number of control pins, CS can be tied LOW using R/C to control the read and convert modes. This will have no effect when using the internal data clock in the serial output mode. However, the parallel output and the serial output (only when using an external data clock) will be affected whenever R/C goes HIGH. Refer to the Reading Data section and Figures 2, 3, 5, and 6. The combination of CS (pin 23) and R/C (pin 22) LOW for a minimum of 40ns places the sample/hold of the ADS7824 in the hold state and starts conversion `n'. BUSY (pin 24) will go LOW and stay LOW until conversion `n' is completed and the internal output register has been updated. All new convert commands during BUSY LOW will be ignored. CS and/or R/C must go HIGH before BUSY goes HIGH or a new conversion will be initiated without sufficient time to acquire a new signal. The ADS7824 will begin tracking the input signal at the end of the conversion. Allowing 25s between convert commands assures accurate acquisition of a new signal. Refer to Tables Ia and Ib for a summary of CS, R/C, and BUSY states and Figures 2 through 6 and Table II for timing information. CS and R/C are internally OR'd and level triggered. There is not a requirement which input goes LOW first when INPUTS OUTPUTS CS R/C BYTE CONTC PWRD BUSY D7 D6 D5 D4 D3 D2 D1 D0 1 X 0 X 0 1 X X 0 X X X X X X X X X Hi-Z Hi-Z D10 Hi-Z Hi-Z D9 Hi-Z Hi-Z D8 Hi-Z Hi-Z D7 Hi-Z Hi-Z D6 Hi-Z Hi-Z D5 Hi-Z Hi-Z D4 0 1 1 X X X Hi-Z Hi-Z D11 (MSB) D3 D2 D1 LOW LOW LOW LOW 0 1 X X X D0 (LSB) COMMENTS Results from last completed conversion. Results from last completed conversion. Data will change at the end of a conversion. TABLE Ia. Read Control for Parallel Data (PAR/SER = 5V.) D3 SYNC D2 DATACLK D1 SDATA D0 TAG Input LOW LOW LOW Output LOW LOW LOW I/O Output Output Output Output Hi-Z Hi-Z Output Input X X X Hi-Z LOW LOW Output Output X X Hi-Z HIGH LOW Input Output Input X Hi-Z HIGH LOW Input Output Input 0 X 1 Hi-Z HIGH LOW Input Output X 1 0 X 1 Hi-Z HIGH LOW Input Output X 0 0 1 0 Hi-Z LOW LOW Output Output X 1 X X X Hi-Z HIGH Output Input Output X 0 X X X Hi-Z HIGH Output Input Output X 0 1 X X Hi-Z LOW LOW Output Output X 0 1 X X Hi-Z LOW LOW Output Output X CONTC PWRD BUSY D7, D6, D5 D4 LOW EXT/INT CS R/C Input 1 X 0 Input X 0 Input X X 0 Input X X X Output 1 1 1 Output Hi-Z Hi-Z Hi-Z 0 0 X 1 0 1 0 X 0 1 0 0 TABLE Ib. Read Control for Serial Data (PAR/SER = 0V.) (R) ADS7824 8 COMMENTS Starts transmission of data from previous conversion on SDATA synchronized to 12 pulses output on DATACLK. Starts transmission of data from previous conversion on SDATA synchronized to 12 pulses output on DATACLK. The level output on SDATA will be the level input on TAG 12 DATACLK input cycles earlier. At the end of the conversion, when BUSY rises, data from the conversion will be shifted into the output registers. If DATACLK is HIGH, valid data will be lost. Initiates transmission of a HIGH pulse on SYNC followed by data from last completed conversion on SDATA synchronized to the input on DATACLK. Initiates transmission of a HIGH pulse on SYNC followed by data from last completed conversion on SDATA synchronized to the input on DATACLK. Starts transmission of data from previous conversion on SDATA synchronized to 12 pulses output on DATACLK SDATA becomes active. Inputs on DATACLK shift out data. SDATA becomes active. Inputs on DATACLK shift out data. Restarts continuous conversion mode (n - 1 data transmitted when BUSY is LOW). Restarts continuous conversion mode (n - 1 data transmitted when BUSY is LOW). t1 t1 R/C t3 t3 t4 BUSY t5 t6 t6 t7 Convert Acquire MODE t8 t12 Acquire Convert t12 t11 t10 Parallel Data Bus Previous High Byte Valid Previous High Byte Valid Hi-Z Previous Low Byte Valid Low Byte Valid High Byte Valid Not Valid High Byte Valid t9 t2 t12 t12 t9 Hi-Z t12 t12 BYTE FIGURE 2. Conversion Timing with Parallel Output (CS LOW). t21 t21 t21 t21 t21 t21 t21 t21 t21 t21 R/C t1 CS t3 t4 BUSY BYTE DATA BUS Hi-Z State High Byte Hi-Z State t9 t12 Low Byte t12 Hi-Z State t9 FIGURE 3. Using CS to Control Conversion and Read Timing with Parallel Outputs. t7 + t8 CS or R/C(1) t14 1 t13 DATACLK 2 3 11 12 Bit 9 Valid Bit 1 Valid LSB Valid 1 2 MSB Valid Bit 10 Valid t16 t15 SDATA MSB Valid Hi-Z t25 Bit 10 Valid Hi-Z (Results from previous conversion.) BUSY t26 NOTE: (1) If controlling with CS, tie R/C LOW. If controlling with R/C, tie CS LOW. FIGURE 4. Serial Data Timing Using Internal Data Clock (TAG LOW). (R) 9 ADS7824 (R) ADS7824 10 t21 t3 t1 t27 t21 t17 t19 t23 t20 1 t17 Tag 0 t24 2 Tag 1 Bit 11 (MSB) 3 Tag 2 Bit 10 4 FIGURE 5. Conversion and Read Timing with External Clock (EXT/INT HIGH). Read After Conversion. TAG SDATA SYNC BUSY R/C CS EXTERNAL DATACLK 0 t18 Tag 11 Bit 1 13 Tag 12 Bit 0 (LSB) 14 Tag 13 Tag 0 t22 t28 11 ADS7824 (R) t21 t3 t17 t1 t19 t20 t27 t23 Tag 0 t17 t24 Tag 1 Bit 11 (MSB) t11 Tag 12 Bit 0 (LSB) Tag 13 Tag 0 t22 t28 FIGURE 6. Conversion and Read Timing with External Clock (EXT/INT HIGH). Read During Conversion (Previous Conversion Results). TAG SDATA SYNC BUSY R/C CS EXTERNAL DATACLK t18 READING DATA after the start of conversion `n'. Do not attempt to read data beyond 12s after the start of conversion `n' until BUSY (pin 24) goes HIGH; this may result in reading invalid data. Refer to Table II and Figures 2 and 3 for timing constraints. PARALLEL OUTPUT To use the parallel output, tie PAR/SER (pin 20) HIGH. The parallel output will be active when R/C (pin 22) is HIGH and CS (pin 23) is LOW. Any other combination of CS and R/C will tri-state the parallel output. Valid conversion data can be read in two 8-bit bytes on D7-D0 (pins 9-13 and 15-17). When BYTE (pin 21) is LOW, the 8 most significant bits will be valid with the MSB on D7. When BYTE is HIGH, the 4 least significant bits will be valid with the LSB on D4. BYTE can be toggled to read both bytes within one conversion cycle. SERIAL OUTPUT When PAR/SER (pin 20) is LOW, data can be clocked out serially with the internal data clock or an external data clock. When EXT/INT (pin 12) is LOW, DATACLK (pin 15) is an output and is always active regardless of the state of CS (pin 23) and R/C (pin 22). The SDATA output is active when BUSY (pin 24) is LOW. Otherwise, it is in a tri-state condition. When EXT/INT is HIGH, DATACLK is an input. The SDATA output is active when CS is LOW and R/C is HIGH. Otherwise, it is in a tri-state condition. Regardless of the state of EXT/INT, SYNC (pin 13) is an output and always active, while TAG (pin 17) is always an input. Upon initial power up, the parallel output will contain indeterminate data. PARALLEL OUTPUT (After a Conversion) After conversion `n' is completed and the output registers have been updated, BUSY (pin 24) will go HIGH. Valid data from conversion `n' will be available on D7-D0 (pins 9-13 and 15-17). BUSY going HIGH can be used to latch the data. Refer to Table II and Figures 2 and 3 for timing constraints. INTERNAL DATA CLOCK (During A Conversion) To use the internal data clock, tie EXT/INT (pin 12) LOW. The combination of R/C (pin 22) and CS (pin 23) LOW will initiate conversion `n' and activate the internal data clock (typically 900kHz clock rate). The ADS7824 will output 12 bits of valid data, MSB first, from conversion `n - 1' on SDATA (pin 16), synchronized to 12 clock pulses output on DATACLK (pin 15). The data will be valid on both the PARALLEL OUTPUT (During a Conversion) After conversion `n' has been initiated, valid data from conversion `n - 1' can be read and will be valid up to 12s SYMBOL DESCRIPTION MIN t1 Convert Pulse Width 0.04 TYP t2 Start of Conversion to New Data Valid t3 Start of Conversion to BUSY LOW t4 BUSY LOW 15 t5 End of Conversion to BUSY HIGH 90 t6 Aperture Delay 40 t7 Conversion Time 15 t8 Acquisition Time 3 t7 + t8 Throughput Time 15 t9 Bus Relinquish Time 10 t10 Data Valid to BUSY HIGH 20 60 12 15 MAX UNITS 12 s 21 s 85 ns 21 s ns ns 21 s 5 s 25 s 83 ns ns s t11 Start of Conversion to Previous Data Not Valid t12 Bus Access Time and BYTE Delay t13 Start of Conversion to DATACLK Delay t14 DATACLK Period t15 Data Valid to DATACLK HIGH 20 t16 DATACLK LOW to Data Not Valid 400 600 t17 External DATACLK Period 100 ns t18 External DATACLK HIGH 50 ns t19 External DATACLK LOW 40 ns t20 CS LOW and R/C HIGH to External DATACLK HIGH (Enable Clock) 25 ns t21 R/C to CS Setup Time 10 ns t22 CS HIGH or R/C LOW to External DATACLK HIGH (Disable Clock) 25 ns t23 DATACLK HIGH to SYNC HIGH 15 35 ns t24 DATACLK HIGH to Valid Data 25 55 ns t25 Start of Conversion to SDATA Active 83 ns t26 End of Conversion to SDATA Tri-State 83 ns t27 CS LOW and R/C HIGH to SDATA Active 83 ns t28 CS HIGH or R/C LOW to SDATA Tri-State 83 ns t29 BUSY HIGH to Address Valid 20 ns t30 Address Valid to BUSY LOW 83 500 TABLE II. Conversion, Data, and Address Timing. TA = -40C to +85C. (R) ADS7824 12 ns 1.4 s 1.1 s 75 ns ns ns rising and falling edges of the internal data clock. The rising edge of BUSY (pin 24) can be used to latch the data. After the 12th clock pulse, DATACLK will remain LOW until the next conversion is initiated, while SDATA will go to whatever logic level was input on TAG (pin 17) during the first clock pulse. The SDATA output will tri-state when BUSY returns HIGH. Refer to Table II and Figure 4 for timing information. 14th falling edge and the 15th rising edge of DATACLK; the second input bit will be valid on the 15th falling edge and the 16th rising edge, etc. With a continuous data clock, TAG data will be output on DATA until the internal output registers are updated with the results from the next conversion. Refer to Table II and Figure 5 for timing information. EXTERNAL DATA CLOCK (During a Conversion) After conversion `n' has been initiated, valid data from conversion `n - 1' can be read and will be valid up to 12s after the start of conversion `n'. Do not attempt to clock out data from 12s after the start of conversion `n' until BUSY (pin 24) rises; this will result in data loss. EXTERNAL DATA CLOCK To use an external clock, tie EXT/INT (pin 12) HIGH. The external clock is not a conversion clock; it can only be used as a data clock. To enable the output mode of the ADS7824, CS (pin 23) must be LOW and R/C (pin 22) must be HIGH. DATACLK must be HIGH for 20% to 70% of the total data clock period; the clock rate can be between DC and 10MHz. Serial data from conversion `n' can be output on SDATA (pin 16) after conversion `n' is completed or during conversion `n + 1'. NOTE: For the best possible performance when using an external data clock, data should not be clocked out during a conversion. The switching noise of the asynchronous data clock can cause digital feedthrough degrading the converter's performance. Refer to Table II and Figure 6 for timing information. An obvious way to simplify control of the converter is to tie CS LOW while using R/C to initiate conversions. While this is perfectly acceptable, there is a possible problem when using an external data clock. At an indeterminate point from 12s after the start of conversion `n' until BUSY rises, the internal logic will shift the results of conversion `n' into the output register. If CS is LOW, R/C is HIGH and the external clock is HIGH at this point, data will be lost. So, with CS LOW, either R/C and/or DATACLK must be LOW during this period to avoid losing valid data. TAG FEATURE TAG (pin 17) inputs serial data synchronized to the external or internal data clock. When using an external data clock, the serial bit stream input on TAG will follow the LSB output on SDATA (pin 16) until the internal output register is updated with new conversion results. See Table II and Figures 5 and 6. The logic level input on TAG for the first rising edge of the internal data clock will be valid on SDATA after all 12 bits of valid data have been output. EXTERNAL DATA CLOCK (After a Conversion) After conversion `n' is completed and the output registers have been updated, BUSY (pin 24) will go HIGH. With CS LOW (pin 23) and R/C HIGH (pin 22), valid data from conversion `n' will be output on SDATA (pin 16) synchronized to the external data clock input on DATACLK (pin 15). Between 15 and 35ns following the rising edge of the first external data clock, the SYNC output pin will go HIGH for one full data clock period (100ns minimum). The MSB will be valid between 25 and 55ns after the rising edge of the second data clock. The LSB will be valid on the 13th falling edge and the 14th rising edge of the data clock. TAG (pin 17) will input a bit of data for every external clock pulse. The first bit input on TAG will be valid on SDATA on the CONTC CS R/C BUSY PWRD 0 X X X X Inputs 0 0 0 0 X 0 X X 0 X 0 1 1 X 0 0 0 1 Inputs Inputs Inputs Inputs 1 X X X X Outputs 1 1 1 1 X 0 X X 0 X 0 1 1 X 0 0 0 1 Outputs Outputs Outputs Outputs MULTIPLEXER TIMING The four channel input multiplexer may be addressed manually or placed in a continuous conversion mode where all four channels are sequentially addressed. CONTINUOUS CONVERSION MODE (CONTC= 5V) To place the ADS7824 in the continuous conversion mode, CONTC (pin 25) must be tied HIGH. In this mode, acquisition and conversions will take place continually, cycling through all four channels as long as CS, R/C and PWRD are LOW (See Table III). Whichever address was last loaded A0 and A1 OPERATION Initiating conversion n latches in the levels input on A0 and A1 to select the channel for conversion 'n + 1'. Conversion in process. New convert commands ignored. Initiates conversion on channel selected at start of previous conversion. Initiates conversion on channel selected at start of previous conversion. All analog functions powered down. Conversions in process or initiated will yield meaningless data. The end of conversion n (when BUSY rises) increments the internal channel latches and outputs the channel address for conversion 'n + 1' on A0 and A1. Conversion in process. Restarts continuous conversion process on next input channel. Restarts continuous conversion process on next input channel. All analog functions powered down. Conversions in process or initiated will yield meaningless data. Resets selected input channel for next conversion to AIN0. TABLE III. Conversion Control. (R) 13 ADS7824 into the A0 and A1 registers (pins 19 and 18, respectively) prior to CONTC being raised HIGH, becomes the first address in the sequential continuous conversion mode (e.g., if Channel 1 was the last address selected then Channel 2 will follow, then Channel 3, and so on). The A0 and A1 address inputs become outputs when the device is in this mode. When BUSY rises at the end of a conversion, A0 and A1 will output the address of the channel that will be converted when BUSY goes LOW at the beginning of the next conversion. Data will be valid for the previous channel after BUSY rises. The address lines are updated when BUSY rises. See Table IVa and Figure 7 for channel selection timing in continuous conversion mode. PWRD (pin 26) can be used to reset the multiplexer address to zero. With the ADS7824 configured for no conversion, PWRD can be taken HIGH for a minimum of 200ns. When PWRD returns LOW, the multiplexer address will be reset to zero. When the continuous conversion mode is enabled, the first conversion will be done on Channel 0. Subsequent conversions will proceed through each higher channel, cycling back to zero after Channel 3. If PWRD is held HIGH for a significant period of time, the REF (pin 7) bypass capacitor may discharge (if the internal reference is being utilized) and the CAP (pin 6) bypass capacitor will discharge (for both internal and external references). The continuous conversion mode should not be enabled until the bypass capacitor(s) have recharged and stabilized (1ms for 2.2F capacitors recommended). In addition, the continuous conversion mode should not be enabled even with a short pulse on PWRD until the minimum acquisition time has been met. MANUAL CHANNEL SELECTION (CONTC= 0V) The channels of the ADS7824 can be selected manually by using the A0 and A1 address pins (pins 19 and 18, respectively). See Table IVb for the multiplexer truth table and Figure 8 for channel selection timing. ADS7824 TIMING AND CONTROL A1 A0 DATA AVAILABLE FROM CHANNEL CHANNEL TO BE OR BEING CONVERTED 0 0 1 1 0 1 0 1 AIN3 AIN0 AIN1 AIN2 AIN0 AIN1 AIN2 AIN3 DESCRIPTION OF OPERATION Channel being acquired or converted is output on these address lines. Data is valid for the previous channel. These lines are updated when BUSY rises. TABLE IVa. A0 and A1 Outputs (CONTC HIGH). A1 A0 CHANNEL SELECTED WHEN BUSY GOES HIGH 0 0 1 1 0 1 0 1 AIN0 AIN1 AIN2 AIN3 DESCRIPTION OF OPERATION Channel to be converted during conversion 'n + 1' is latched when conversion 'n' is initiated (BUSY goes LOW). The selected input starts being acquired as soon as conversion 'n' is done (BUSY goes HIGH). TABLE IVb. A0 and A1 Inputs (CONTC LOW). Conversion Currently in Progress: BUSY n-2 n-1 n n+1 n+2 n+3 n+4 Channel Address for Conversion: A0, A1 (Output) n-2 n-1 n n+1 n+2 n+3 n+4 n+5 t29 Results from Conversion: D7-D0 n-3 n-2 n-1 n n+1 n+2 n+3 n+4 FIGURE 7. Channel Addressing in Continuous Conversion Mode (CONTC HIGH, CS and R/C LOW). R/C Conversion Currently in Progress: BUSY n-2 n-1 n n+1 n+2 n+3 n+4 Channel Address for Conversion: A0, A1 (Input) n-1 n n+1 n+2 n+3 n+4 n+5 t30 Results from Conversion: D7-D0 n-3 n-2 n-1 n n+1 n+2 FIGURE 8. Channel Addressing in Normal Conversion Mode (CONTC and CS LOW). (R) ADS7824 14 n+3 n+4 CALIBRATION CDAC. Capacitor values larger than 2.2(F will have little affect on improving performance. The ADS7824 has no internal provision for correcting the individual bipolar zero error or full-scale error for each individual channel. Instead, the bipolar zero error of each channel is guaranteed to be below a level which is quite small for a converter with a 10V input range (slightly more than 2 LSBs). In addition, the channel errors should match each other to within 1 LSB. For the full-scale error, the circuit of Figure 9 can be used. This will allow the reference to be adjusted such that the full-scale error for any single channel can be set to zero. Again, the close matching of the channels will ensure that the full-scale errors on the other channels will be small. The output of the buffer is capable of driving up to 1mA of current to a DC load. Using an external buffer will allow the internal reference to be used for larger DC loads and AC loads. Do not attempt to directly drive an AC load with the output voltage on CAP. This will cause performance degradation of the converter. PWRD PWRD (pin 26) HIGH will power down all of the analog circuitry including the reference. Data from the previous conversion will be maintained in the internal registers and can still be read. With PWRD HIGH, a convert command yields meaningless data. When PWRD is returned LOW, adequate time must be provided in order for the capacitors on REF (pin 7) and CAP (pin 6) to recharge. For 2.2F capacitors, a minimum recharge/settling time of 1ms is recommended before the conversion results should be considered valid. AIN2 AIN3 +5V CAP R1 1M + P1 50k 2.2F LAYOUT REF 2.2F + POWER The ADS7824 uses 90% of its power for the analog circuitry, and the converter should be considered an analog component. For optimum performance, tie both power pins to the same +5V power supply and tie the analog and digital grounds together. The +5V power for the converter should be separate from the +5V used for the system's digital logic. Connecting VS1 and VS2 (pins 28 and 27) directly to a digital supply can reduce converter performance due to switching noise from the digital logic. For best performance, the +5V supply can be produced from whatever analog supply is used for the rest of the analog signal conditioning. If +12V or +15V supplies are present, a simple +5V regulator can be used. Although it is not suggested, if the digital supply must be used to power the converter, be sure to properly filter the supply. Either using a filtered digital supply or a regulated analog supply, both VS1 and VS2 should be tied to the same +5V source. AGND2 FIGURE 9. Full Scale Trim. REFERENCE The ADS7824 can operate with its internal 2.5V reference or an external reference. By applying an external reference to pin 7, the internal reference can be bypassed. REF REF (pin 7) is an input for an external reference or the output for the internal 2.5V reference. A 2.2F capacitor should be connected as close to the REF pin as possible. This capacitor and the output resistance of REF create a low pass filter to bandlimit noise on the reference. Using a smaller value capacitor will introduce more noise to the reference degrading the SNR and SINAD. The REF pin should not be used to drive external AC or DC loads. The range for the external reference is 2.3V to 2.7V and determines the actual LSB size. Increasing the reference voltage will increase the full scale range and the LSB size of the converter which can improve the SNR. GROUNDING Three ground pins are present on the ADS7824. DGND is the digital supply ground. AGND2 is the analog supply ground. AGND1 is the ground which all analog signals internal to the A/D are referenced. AGND1 is more susceptible to current induced voltage drops and must have the path of least resistance back to the power supply. All the ground pins of the A/D should be tied to an analog ground plane, separated from the system's digital logic ground, to achieve optimum performance. Both analog and digital ground planes should be tied to the `system' ground as near to the power supplies as possible. This helps to prevent dynamic digital ground currents from modulating the analog ground through a common impedance to power ground. CAP CAP (pin 6) is the output of the internal reference buffer. A 2.2F capacitor should be placed as close to the CAP pin as possible to provide optimum switching currents for the CDAC throughout the conversion cycle. This capacitor also provides compensation for the output of the buffer. Using a capacitor any smaller than 1F can cause the output buffer to oscillate and may not have sufficient charge for the (R) 15 ADS7824 CROSSTALK With a full-scale 1kHz input signal, worst case crosstalk on the ADS7824 is better than -95dB. This should be adequate for even the most demanding applications. However, if crosstalk is a concern, the following items should be kept in mind: The worst case crosstalk is generally from Channel 3 to 2. In addition, crosstalk from Channel 3 to any other channel is worse than from those channels to Channel 3. The reason for this is that channel three is nearer to the reference on the ADS7824. This allows two coupling modes: channel-tochannel and Channel 3 to the reference. In general, when crosstalk is a concern, avoid placing signals with higher frequency components on Channel 3. If a particular channel should be as immune as possible from crosstalk, Channel 0 would be the best channel for the signal and Channel 1 should have the signal with the lowest frequency content. If two signals are to have as little crosstalk as possible, they should be placed on Channel 0 and Channel 2 with lower frequency, less-sensitive inputs on the other channels. minimal requirement for the drive capability on the signal conditioning preceding the A/D. Any op amp sufficient for the signal in an application will be sufficient to drive the ADS7824. The resistive front end of the ADS7824 also provides a guaranteed 15V overvoltage protection. In most cases, this eliminates the need for external over voltage protection circuitry. INTERMEDIATE LATCHES The ADS7824 does have tri-state outputs for the parallel port, but intermediate latches should be used if the bus will be active during conversions. If the bus is not active during conversions, the tri-state outputs can be used to isolate the A/D from other peripherals on the same bus. Intermediate latches are beneficial on any monolithic A/D converter. The ADS7824 has an internal LSB size of 610V. Transients from fast switching signals on the parallel port, even when the A/D is tri-stated, can be coupled through the substrate to the analog circuitry causing degradation of converter performance. The effect of this phenomenon will be more obvious when using the pin-compatible ADS7825 or any of the other 16-bit converters in the ADS Family. This is due to the smaller LSB size of 38V. For an ADS7824 with proper layout, grounding, and bypassing; the effect should only be a few tenths of an LSB at the most. In those cases where this is not true, it is possible for the conversion results to exhibit random errors of many LSBs. Poor grounding, poor bypassing, and high-speed digital signals will increase the magnitude of the errors. SIGNAL CONDITIONING The FET switches used for the sample hold on many CMOS A/D converters release a significant amount of charge injection which can cause the driving op amp to oscillate. The amount of charge injection due to the sampling FET switch on the ADS7824 is approximately 5-10% of the amount on similar ADCs with the charge redistribution DAC (CDAC) architecture. There is also a resistive front end which attenuates any charge which is released. The end result is a (R) ADS7824 16 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ADS7824P ACTIVE PDIP NT 28 13 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type ADS7824PB ACTIVE PDIP NT 28 13 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type ADS7824PBG4 ACTIVE PDIP NT 28 13 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type ADS7824PG4 ACTIVE PDIP NT 28 13 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type ADS7824U ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824U/1K ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824U/1KE4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824UB ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824UB/1K ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824UB/1KE4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824UBE4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS7824UE4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2010 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS7824U/1K SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 ADS7824UB/1K SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS7824U/1K SOIC DW 28 1000 367.0 367.0 55.0 ADS7824UB/1K SOIC DW 28 1000 367.0 367.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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