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IECQ-CECC QC 88000-C003
COMPONENT ISSUE 4
SPECIFICATION
March 2007
Component Specification
For
Ceramic Hermetically Sealed
High Gain Optocouplers
Up-to-date lists and bibliographical references of IEQC-CECC publications may be downloaded from www.iecq.org
Further copies of this document may be obtained from:
IEC
International Electrotechnical Commission
Commission Electrotechnique Internationale
Box 131, rue de Varembé, CH 1211 Geneva 20, Switzerland
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©2007 Copyright reserved to Isocom Limited Page 2 of 12 QC 88000-C001: 2007
FOREWORD
The IECQ Quality Assessment System for Electronic Components (IECQ) is composed of those member countries of
the International Electrotechnical Commission (IEC) who wish to take part in a harmonized system for electronic
components of assessed quality. IECQ is also known in some European member countries as IECQ-CECC.
The object of the System is to facilitate international trade by the harmonization of the specifications and quality
assessment procedures for electronic components, and by the grant of an internationally recognised Mark, or
Certificate of Conformity. The components produced or services provided under the system are thereby acceptable in
all member countries without further testing.
This Component Specification is based upon the requirements of IEC Publication QC 001002-2, and has been
prepared by:
Isocom Ltd
Hutton Close
Crowther Industrial Estate
Washington
Tyne and Wear
NE38 0AH
Tel: +44 0191 4166 546
Fax: +44 0191 4155 055
and published under the authority of:
BSI Product Services
Maylands Avenue
Hemel Hempstead
Hertfordshire
HP2 4SQ
United Kingdom
AMENDMENT RECORD
Issue 1 – Changed Pages 4, 9 & 10 – Amendments 25/06/10
Issue 2 – Changed Pages 3, 4 & 5 – Amendments 05/07/10
Issue 3 – Changed Pages 3, 4, 5 & 6 – RoHS Compliant, Added CSM160/161/162-2 & Amendments 13/07/10
REQUIREMENTS
The requirements for IECQ-CECC Component Specifications as detailed in QC 001002-2 Amendment 1 clause 5.4 are
satisfied by the following data sheet.
It should note that IECQ-CECC are not responsible for manufacturers declarations made in data sheets which fall
outside the limits of approved detailed in IECQ-CECC certificates.
This Component Specification is intended for use with applicable IECQ-CECC Assessment Specifications. Eg: QC
88000-A0001
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©2007 Copyright reserved to Isocom Limited Page 3 of 12 QC 88000-C001: 2007
Ceramic Hermetically Sealed High Gain Optocouplers
■ 6N140A ■ CS5700
■ CD750 ■ CSM141/A
■ CD5731 ■ CSM160/161/162-2
■ CH370 ■ CSM160/161/162-4
■ CS700 ■ CSM1700
Features Applications
▪ Release to IECQ-CECC ▪ Military, high reliability system
▪ Hermetically Sealed ▪ Medical instruments
▪ High Density Packaging ▪ Mos, Cmos Applications
▪ 1500V DC withstand Test Voltage ▪ Logic Interfacing
▪ Low Input Requirements: 0.5mA ▪ Data Transmission
▪ High Current Transfer Ratio: 1000% Typical ▪ Transportation
▪ RoHS Compliant
Description
Each channel contains a light emitting diode which is optically coupled to an integrated high gain
photon detector. The high gain output stage features an open collector output providing both lower
saturation voltage and higher signalling speed than a conventional Photo-Darlington optocoupler.
The supply voltage can be operated as low as 2.0V without adversely affecting the parametric
performance. The High Current Transfer Ratio of the optocouplers makes them ideal for low input
current, min 0.5mA, applications.
The radiation immunity of the optocouplers compared to conventional photo transistor optocouplers
is due to the shallow depth and small junctions offered by the IC process.
The optocoupler family is also available in various package styles including 6, 8 and 16 pin DIP
through hole, 16 pin surface mount DIP flat pack and a 6 Pin leadless ceramic chip carrier. The
devices can be purchased with lead bend and plating options.
ISOCOM optocouplers are offered on the basis of similarity of emitter and detector therefore the
performance characterization is identical, subject to the limitations of the packages. The wafer die
similarities apply to the optocouplers for high reliability screening and radiation testing.
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©2007 Copyright reserved to Isocom Limited Page 4 of 12 QC 88000-C001: 2007
Selection Guide Package Styles and Configuration Options
Package
5 pin
Hybrid 6 Pad LCC 8 pin DIP 8 pin DIP 16 pin DIP
16 pin
Flat Pack
Lead Style
Channels 1 1 1 2 4 2/4
Common Channel Wiring
Isocom Part Numbers and Options
Commercial
CH370
CSM141A
CSM1700
CS5700
CS700
CD750
CD5731 6N140A
CSM160/161/
162
Defense Level
CH370/L2
CSM141A/L2
CSM1700/L2
CS5700/L2
CS700/L2
CD750/L2
CD5731/L2 6N140A/L2
CSM160/161/
162/L2
Space Level
CH370/L2S
CSM141A/L2S
CSM1700/L2S
CS5700/L2S
CS700/L2S
CD750/L2S
CD5731/L2S 6N140A/L2S
CSM160/161/
162/L2S
Standard Gold Plate Finish Gold Plate Gold Plate Gold Plate Gold Plate Gold Plate
Solder Dipped Option 20 Option 20 Option 20
Butt Cut/Gold Plate Option 10 Option 10 Option 10
Gull Wing/Soldered Option 30 Option 30 Option 30
Crew Cut/Gold Plate Option 60 Option 60 Option 60
Functional Diagrams
CH370 CSM141A CS5700
CS700
CD750
CD5731 6N140A CSM160/161
/162-2
5 pin Hybrid 6 Pad LCC 8 pin DIP 8 pin DIP 16 pin DIP 16 pin Flat Pack
1 Channel 1 Channel 1 Channel 2 Channel 4 Channel 2 Channel
6
1
2 3
4
5
CSM1700
CSM160/161
/162-4
6 Pad LCC
16 pin Flat Pack
1 Channel
4 Channel
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©2007 Copyright reserved to Isocom Limited Page 5 of 12 QC 88000-C001: 2007
Outline Drawings
16 pin DIP, 4 Channel
16 pin Flat Pack, 2 and 4 Channel
NOTE: DIMENSIONS IN MILLIMETERS
8 pin DIP 1 and 2 Channel
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©2007 Copyright reserved to Isocom Limited Page 6 of 12 QC 88000-C001: 2007
6 Terminal LCC Surface Mount, 1 Channel
4.318
CSM141A
6.223
5
4
3 2
1.651
0.635
1
6
2.286
R = .2286
1.27
2.54
1.67
Device Marking
XXXXXXX
ISOCOM
XXXX
Isocom Part Number
Manufacturer
Date Code (XX year XX week)
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Hermetic Optocoupler Options
Option
Description
10
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial hi-rel product in 8 and 16 pin DIP
20
30
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP.
60
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial hi-rel product in 8 and 16 pin DIP
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©2007 Copyright reserved to Isocom Limited Page 8 of 12 QC 88000-C001: 2007
Absolute Maximum Ratings
Storage Temperature -65°C to +150°C
Operating Temperature -55°C to +125°C
Lead Soldering Temperature 260C for 10S, 1.6mm below seating plane where appropriate
Input Diode
Peak Forward Current 20mA ≤ 1 mS duration, 500pps
Average Forward Current 10mA (See note 3)
Reverse Voltage 5V
Power Dissipation 35mW
Output Detector
Supply Voltage -0.5 to 20V V
CC
(See note 1)
Current 40mA I
O
Collector Power Dissipation 50mW (See note 2)
Voltage -0.5 to 20V V
O
(See note 1)
Single Channel Schematic
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Electrical Characteristics
T
A =
-55°C to +125°C U.O.S.
All typical values at V
CC
= 5V, T
A
= 25°C (each channel where appropriate).
Parameter Symbol Test Conditions Device Min Type Max Units
High Level Output
Current (See notes 4 & 6)
I
OH
I
OHX
I
F
= 2µA,
V
O
= V
CC
= 5.5V
- 0.001 250 µA
I
F
= 0.5mA, I
OL
= 1.5mA, V
CC
= 4.5V - 0.1 0.4 Lower Level Output
Voltage (See note 4)
V
OL
I
F
= 5mA, I
OL
= 10mA, V
CC
= 4.5V
- 0.15 0.4
V
V
CC
= 18V, I
F1
= I
F2
= I
F3
= I
F4
= 0 40 High Level Supply
Current
I
CCH
V
CC
= 5.5, I
F1
= I
F2
= I
F3
= I
F4
= 0 CSM160/1
- 0.1
60
µA
V
CC
= 18V, I
F1
= I
F2
= I
F3
= I
F4
=
1.6mA
- 1.4 4 Low Level Supply Current
(See note 4)
I
CCL
V
CC
= 5.5V, I
F1
= I
F2
= I
F3
= I
F4
= 4mA CSM160/1 8
mA
Input-Output Insulation
Leakage Current
(See notes 7 & 13)
I
I-O
RH = 45%, T
A
= 25°C, t = 5S
V
IO
= 1500Vdc
- - 1.0 µA
I
F
= 1.6mA, T
A
= 25°C Input Forward Voltage
(See note 4)
V
F
I
F
= 4.0mA CSM160/1
- 1.45 1.9 V
Input Reverse Breakdown
Voltage (See note 4)
B
VR
I
R
= 10µA, T
A
= 25°C 5 - - V
6N140
CS5700
CSM6730
CH370
CD750
CSM1700
- 8 60 R
L
= 4.7KΩ, V
CC
= 5V, I
F
= 0.5mA,
T
A
= 25°C
CSM160/1 100
6N140 - 8 20
CS5700
CSM6730
30
Propagation Delay Time
to Logic High Output
(See note 4)
t
PLH
R
L
= 680Ω, V
CC
= 5V, I
F
= 5mA,
T
A
= 25°C
CH390
CD750
CSM1700
60
µS
CH370
CD750
CSM1700
- 35 100
RL = 4.7KΩ, VCC = 5V, IF = 0.5mA,
TA = 25°C
CSM160
CSM161
CS5700
CSM6730
100
CH390
CD750
CSM1700
- 3 12
CS5700
CSM6730
10
Propagation Delay Time
to Logic Low Output
(See note 4)
tPHL
RL = 680Ω, VCC = 5V, IF = 5mA,
TA = 25°C
CSM160/1 5
µS
IF = 0.5mA, VO = 0.4V, VCC = 4.5V 300 700 -
IF = 1.6mA, VO = 0.4V, VCC = 4.5V 200 1000 -
Current Transfer Ratio
(See notes 4 & 5)
CTR
IF = 5mA, VO = 0.4V, VCC = 4.5V
200 600 -
%
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Electrical Characteristics (Continued)
V
CC
= 5V, T
A
= 25°C, V
CM
= 50V p-p
R
L
= 1.5KΩ, I
F
= 0Ma
Common Mode Transient
Immunity at Logical High
Output Level
(See notes 4, 10 & 12)
CM
H
R
L
= 2.2KΩ, I
F
= 0mA CH370
CS700
CSM1700
CSM6730
500 1000 - V/µS
V
CC
= 5V, T
A
= 25°C, V
CM
= 50V p-p
R
L
= 1.5KΩ, I
F
= 1.6mA
Common Mode Transient
Immunity at Logical Low
Output Level
(See notes 4, 10 & 12)
CM
L
R
L
= 2.2KΩ, I
F
= 1.6mA CH370
CS700
CSM1700
CSM6730
500 -1000 - V/µS
Typical Characteristics
T
A
= 25°C
Parameter Symbol Test Conditions Notes Min Type Max Units
Resistance R
IO
V
10
= 500Vdc 4 & 8 - 10
12
- Ω
Capacitance C
IO
f = 1MHz 4 & 8 - 1.5 - pF
Input Capacitance C
IN
f = 1MHz, V
F
= 0 4 - 60 - pF
Temperature Coefficient
of Forward Voltage
∆
VF
∆
TA
I
F
= 1.6mA 1 - -1.8 - mV/°
C
Input-Input Insulation
Leakage Current
I
I-I
45% Relative Humidity
V
II
= 500Vdc, t = 5S
9 - 0.6 - nA
Resistance R
I-I
V
II
= 500Vdc 9 - 10
12
- Ω
Capacitance C
I-I
f = 1MHz 9 - 1 - pF
Notes:
1. The ground pin should be the most negative voltage at the detector side. Keeping V
CC
as low as possible, but
greater than 2.0V, will provide lowest total I
OH
over temperature.
2. Output power is collector output plus one fourth of total supply power. Derate at 1.66mW/°C above 110°C.
3. Derate I
F
at 0.33mA/°C above 110°C.
4. Each channel.
5. Current Transfer Ratio is defined as the ratio of output collector current, I
O
, to the forward LED input current, I
F
, times
100%.
6. I
OHX
is the leakage current resulting from channel to channel optical crosstalk. I
F
= 2µA for channel under test. For all
other channels, I
F
= 10mA.
7. Input pins are shorted together, and output pins are shorted together.
8. Measured between the LED anode and cathode shorted together and pins at output shorted together.
9. Measured between adjacent input pairs shorted together.
10. CM
H
is the maximum tolerable common mode transient to assure that the output will remain in a high logic state
(i.e., V
O
> 2.0V).
11. CM
L
is the maximum tolerable common mode transient to assure that the output will remain in the logic low state
(i.e., V
O
< 0.8V).
12. In applications where dV/dt may exceed 50,000V/µS (such as a static discharge), a series resistor, R
CC
, should be
included to protect the detector IC’s from destructively high surge currents. The recommended value is
R
CC
= 1V kΩ
0.6I
F
(mA)
13. This is a momentary withstand test, not an operating condition.
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Electrical Characteristics
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©2007 Copyright reserved to Isocom Limited Page 12 of 12 QC 88000-C001: 2007