PPS-1 Series
•1 watt performance, standard 2010 footprint
•Flat ceramic package
•0R1 to 348K range
•Low inductance
•Superior surge handling capability
•150°C maximum operating temperature
•Flameproof
•Ceramic package provides superior
temperature rise profile
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Issue C · 04.03
A subsidiary of
TT electronics plc
Welwyn Components
PPS-1
Industry footprint 2010
Maximum power rating at 70°C watts 1
Working voltage1volts 350
Maximum voltage volts 700
Resistance range ohms 0.1 to 0.99
1.0 to 348K
Tolerance ±%21, 2, 5
1, 2, 5
TCR ppm/°C2100
50, 100
49
1Not to exceed (PxR)1/2
2Consult factory for tighter tolerance or TCR
Physical Data
Dimensions (mm)
abcdef
PPS-1 4.32 ±0.25 3.30 ±0.13 2.01 ±0.15 5.08 ±0.25 3.30 ±0.13 2.67 ±0.13
a
d
b c
e
f
PPS-1 Applications
The PPS-1 will dissipate 1 watt at 70°C on a 2010 footprint.
The PPS-1 is recommended for applications where board real
estate or component/board TCE mismatch is a major concern.
It is also recommended in circuits where a standard 2010
resistor exhibits marginal or unacceptable performance due to
high power density/surge handling demands.
Top view Side view
Metal Glaze™Power Pack Surface Mount
High Power Density Ceramic Package
PPS-1_C.qxd 28/4/03 10:06 am Page 1
Metal Glaze™Power Pack Surface Mount
High Power Density Ceramic Package
PPS-1 Series
© Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Issue C · 04.03
Welwyn Components
50
Performance Data
Test Method Maximum Change
Temperature coefficient MIL-R-55342E Par 4.7.9 (-55°C +125°C) As specified above
Thermal Shock MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) ±(0.5% +0.01 ohm)
Low temperature MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) ±(0.25% +0.01 ohm)
Short time overload MIL-R55342E Par 4.7.5 (2.5 x (PxR)1/2) ±(1.0% +0.01 ohm)
High temperature exposure MIL-R55342E Par 4.7.6 (+150°C for 100 hours) ±(0.5% +0.01 ohm)
Resistance to bonding exposure MIL-R55342E Par 4.7.7 ±(0.5% +0.01 ohm)
(Reflow soldered to board at 260°C for 10 sec.)
Solderability MIL-STD-202, Method 208 (245°C for 5 seconds) 95% minimum coverage
Moisture resistance MIL-R55342E Par 4.7.8 (10 cycles, total 2240 hours) ±(0.5% +0.01 ohm)
Life test MIL-R55342E Par 4.7.10
(2000 hours at 70°C intermittent ±(1.0% +0.01 ohm)
Terminal adhesion strength 1200 gram push from underside
of mounted chip for 60 seconds ±(1% +0.01 ohm)
Resistance to board bending Chip mounted in centre of 90mm long board
deflected 5mm so as to extent pull on chip
contacts for 10 seconds +(1% +0.01 ohm)
PPS-1_C.qxd 28/4/03 10:06 am Page 2
