Did you mean: CL31B473KBND
Product Datasheet Search Results:
- CL31B473KBCNNNC
- Samsung
- Cap Ceramic 0.047uF 50V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KBCNNNC-
- Samsung
- CL31B473KBCNNNC-
- CL31B473KBCNNND
- Samsung
- Cap Ceramic 0.047uF 50V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KBCNNNL
- Samsung
- Cap Ceramic 0.047uF 50V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KBND
- Samsung Semiconductor Division
- CAP,CERAMIC,47NF,50VDC,10% -TOL,10% +TOL,X7R TC CODE,-15,15% TC,1206 CASE
- CL31B473KCCNNNC
- Samsung
- Cap Ceramic 0.047uF 100V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KCND
- Samsung Semiconductor Division
- CAP,CERAMIC,47NF,100VDC,10% -TOL,10% +TOL,X7R TC CODE,-15,15% TC,1206 CASE
- CL31B473KDFNNNE
- Samsung
- Cap Ceramic 0.047uF 200V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KDFNNNF
- Samsung
- Cap Ceramic 0.047uF 200V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KEHNNNE
- Samsung
- Cap Ceramic 0.047uF 250V X7R 10% Pad SMD 1206 125C T/R
- CL31B473KACNBNB
- Samsung Electro-mechanics
- ISOLATED C NETWORK, 25V, X7R, 0.047uF, SURFACE MOUNT, CHIP-8
- CL31B473KACNBNC
- Samsung Electro-mechanics
- ISOLATED C NETWORK, 25V, X7R, 0.047uF, SURFACE MOUNT, CHIP-8
Product Details Search Results:
Samsung.com/CL31B473KBCNNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.85(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1756 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KBCNNNC-
847 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KBCNNND
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.85(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1739 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KBCNNNL
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.85(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1740 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KBND
{"Status":"ACTIVE","Lead Free":"Yes","Terminal Finish":"TIN SILVER COPPER","Capacitor Type":"CERAMIC","Manufacturer Series":"CL31(X7R,50V,0.85)","EU RoHS Compliant":"Yes"}...
927 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KCCNNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.85(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1748 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KCND
{"Status":"ACTIVE","Lead Free":"Yes","Terminal Finish":"TIN SILVER COPPER","Capacitor Type":"CERAMIC","Manufacturer Series":"CL31(X7R,100V,0.85)","EU RoHS Compliant":"Yes"}...
924 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KDFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1748 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KDFNNNF
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of ...
1741 Bytes - 19:33:01, 02 November 2024
Samsung.com/CL31B473KEHNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"47000(pF)","Package / Case":"1206","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.6(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of T...
1748 Bytes - 19:33:01, 02 November 2024
Samsungsem.com/CL31B473KACNBNB
{"Status":"ACTIVE","Terminal Finish":"TIN OVER NICKEL","Operating Temperature-Max":"125 Cel","Mfr Package Description":"CHIP","Operating Temperature-Min":"-55 Cel","Terminal Shape":"WRAPAROUND","Number of Terminals":"8","Mounting Feature":"SURFACE MOUNT","Negative Tolerance":"10 %","Temperature Coefficient":"15%","Capacitance":"0.0470 uF","Capacitor Type":"ISOLATED C NETWORK","Manufacturer Series":"CL","Number of Functions":"1","Rated DC Voltage (URdc)":"25 V","Terminal Pitch":"0.8000 mm","Package Shape":"R...
1378 Bytes - 19:33:01, 02 November 2024
Samsungsem.com/CL31B473KACNBNC
{"Status":"ACTIVE","Terminal Finish":"TIN OVER NICKEL","Operating Temperature-Max":"125 Cel","Mfr Package Description":"CHIP","Operating Temperature-Min":"-55 Cel","Terminal Shape":"WRAPAROUND","Number of Terminals":"8","Mounting Feature":"SURFACE MOUNT","Negative Tolerance":"10 %","Temperature Coefficient":"15%","Capacitance":"0.0470 uF","Capacitor Type":"ISOLATED C NETWORK","Manufacturer Series":"CL","Number of Functions":"1","Rated DC Voltage (URdc)":"25 V","Terminal Pitch":"0.8000 mm","Package Shape":"R...
1379 Bytes - 19:33:01, 02 November 2024
Documentation and Support
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CL31B473KHH6PN.pdf | 6.12 | 1 | Request |