Did you mean: CL21B475KAFNNNE
Product Datasheet Search Results:
- CL21B475KAFNNNE
- Samsung
- Cap Ceramic 4.7uF 25V X7R 10% Pad SMD 0805 125C Low ESR T/R
- CL21B475KAFNNNG
- Samsung
- Cap Ceramic 4.7uF 25V X7R 10% Pad SMD 0805 125C T/R
- CL21B475KOFNFNE
- Samsung
- Cap Ceramic 4.7uF 16V X7R 10% PAD SMD 0805 125C T/R
- CL21B475KOFNNNE
- Samsung
- Cap Ceramic 4.7uF 16V X7R 10% Pad SMD 0805 125C Low ESR T/R
- CL21B475KOFNNNG
- Samsung
- Cap Ceramic 4.7uF 16V X7R 10% Pad SMD 0805 125C T/R
- CL21B475KOQVPNE
- Samsung
- Cap Ceramic 4.7uF 16V X7R 10% Pad SMD 0805 Soft Termination 125C Automotive T/R
- CL21B475KPFNNNE
- Samsung
- Cap Ceramic 4.7uF 10V X7R 10% Pad SMD 0805 125C Low ESR T/R
- CL21B475KPFNNNF
- Samsung
- Cap Ceramic 4.7uF 10V X7R 10% Pad SMD 0805 125C T/R
- CL21B475KPFNNNG
- Samsung Semiconductor Division
- CAP,CERAMIC,4.7UF,10VDC,10% -TOL,10% +TOL,X7R TC CODE,-15,15% TC,0805 CASE
- CL21B475KPQVPNE
- Samsung
- Cap Ceramic 4.7uF 10V X7R 10% Pad SMD 0805 Soft Termination 125C Automotive T/R
- CL21B475KQFNNNE
- Samsung
- Cap Ceramic 4.7uF 6.3V X7R 10% Pad SMD 0805 125C T/R
- CL21B475KQQNNNE
- Samsung
- Cap Ceramic 4.7uF 6.3V X7R 10% Pad SMD 0805 125C T/R
Product Details Search Results:
Samsung.com/CL21B475KAFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000PF(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Numbe...
1759 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KAFNNNG
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1741 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KOFNFNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1755 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KOFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000PF(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Programmable":"Yes","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (...
1787 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KOFNNNG
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1738 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KOQVPNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1783 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KPFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000PF(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Numbe...
1766 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KPFNNNF
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1739 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KPFNNNG
{"Status":"ACTIVE","Capacitor Type":"CERAMIC","Manufacturer Series":"CL(HIGHCAPACITANCE)"}...
863 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KPQVPNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number ...
1784 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KQFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1750 Bytes - 04:50:26, 07 March 2025
Samsung.com/CL21B475KQQNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"4700000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1749 Bytes - 04:50:26, 07 March 2025
Documentation and Support
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CL21B475KLB6PJ.pdf | 6.44 | 1 | Request |