Product Datasheet Search Results:

CL21B225KAFNFNE.pdf36 Pages, 1273 KB, Original
CL21B225KAFNFNE
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 0805 125C T/R
CL21B225KAFNNNE.pdf36 Pages, 1334 KB, Original
CL21B225KAFNNNE
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 0805 125C Low ESR T/R
CL21B225KAFNNNF.pdf36 Pages, 1398 KB, Original
CL21B225KAFNNNF
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 0805 125C T/R
CL21B225KAFNNNG.pdf36 Pages, 1398 KB, Original
CL21B225KAFNNNG
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 0805 125C Low ESR T/R
CL21B225KAFNNWE.pdf3 Pages, 363 KB, Original
CL21B225KAFNNWE
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 0805 125C T/R
CL21B225KAFVPNE.pdf36 Pages, 1278 KB, Original
CL21B225KAFVPNE
Samsung
Cap Ceramic 2.2uF 25V X7R 10% Pad SMD 0805 Soft Termination 125C Low ESR Automotive T/R
CL21B225KOFNNNE.pdf36 Pages, 1335 KB, Original
CL21B225KOFNNNE
Samsung
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 0805 125C Low ESR T/R
CL21B225KOFNNNF.pdf36 Pages, 1398 KB, Original
CL21B225KOFNNNF
Samsung
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 0805 125C T/R
CL21B225KOFNNNG.pdf14 Pages, 214 KB, Original
CL21B225KOFNNNG
Samsung Semiconductor Division
CAP,CERAMIC,2.2UF,16VDC,10% -TOL,10% +TOL,X7R TC CODE,-15,15% TC,0805 CASE
CL21B225KOFNNNG-.pdf5 Pages, 154 KB, Original
CL21B225KOFNNNG-
Samsung
CL21B225KOFNNNG-
CL21B225KOFNNWE.pdf3 Pages, 342 KB, Original
CL21B225KOFNNWE
Samsung
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 0805 125C T/R
CL21B225KOFVPNE.pdf36 Pages, 1278 KB, Original
CL21B225KOFVPNE
Samsung
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 0805 125C Automotive T/R

Product Details Search Results:

Samsung.com/CL21B225KAFNFNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1757 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KAFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000PF(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Numbe...
1756 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KAFNNNF
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1739 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KAFNNNG
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number ...
1749 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KAFNNWE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1745 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KAFVPNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number ...
1791 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KOFNNNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000PF(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Numbe...
1764 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KOFNNNF
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1740 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KOFNNNG
{"Status":"ACTIVE","Capacitor Type":"CERAMIC","Manufacturer Series":"CL(HIGHCAPACITANCE)"}...
863 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KOFNNNG-
847 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KOFNNWE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1737 Bytes - 22:45:03, 15 November 2024
Samsung.com/CL21B225KOFVPNE
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"2200000(pF)","Package / Case":"0805","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X7R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"1.25(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 125C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1766 Bytes - 22:45:03, 15 November 2024

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