Product Datasheet Search Results:

CL03A103KA3NNNC.pdf36 Pages, 1334 KB, Original
CL03A103KA3NNNC
Samsung
Cap Ceramic 0.01uF 25V X5R 10% Pad SMD 0201 85C T/R
CL03A103KO3NNNC.pdf36 Pages, 1335 KB, Original
CL03A103KO3NNNC
Samsung
Cap Ceramic 0.01uF 16V X5R 10% Pad SMD 0201 85C T/R
CL03A103KP3NNNC.pdf36 Pages, 1334 KB, Original
CL03A103KP3NNNC
Samsung
Cap Ceramic 0.01uF 10V X5R 10% Pad SMD 0201 85C T/R
CL03A103KQ3NNNC.pdf36 Pages, 1335 KB, Original
CL03A103KQ3NNNC
Samsung
Cap Ceramic 0.01uF 6.3V X5R 10% Pad SMD 0201 85C T/R
CL03A104KA3NNNC.pdf36 Pages, 1335 KB, Original
CL03A104KA3NNNC
Samsung
Cap Ceramic 0.1uF 25V X5R 10% Pad SMD 0201 85C T/R
CL03A104KO3NNNC.pdf36 Pages, 1335 KB, Original
CL03A104KO3NNNC
Samsung
Cap Ceramic 0.1uF 16V X5R 10% Pad SMD 0201 85C T/R
CL03A104KP3NNNC.pdf36 Pages, 1335 KB, Original
CL03A104KP3NNNC
Samsung
Cap Ceramic 0.1uF 10V X5R 10% Pad SMD 0201 85C Low ESR T/R
CL03A104KP3NNND.pdf36 Pages, 1530 KB, Original
CL03A104KP3NNND
Samsung
Cap Ceramic 0.1uF 10V X5R 10% Pad SMD 0201 85C T/R
CL03A104KP3NNNH.pdf4 Pages, 111 KB, Original
CL03A104KP3NNNH
Samsung Semiconductor Division
CAP,CERAMIC,100NF,10VDC,10% -TOL,10% +TOL,X5R TC CODE,-15,15% TC,0201 CASE
CL03A104KQ3NNNC.pdf36 Pages, 1336 KB, Original
CL03A104KQ3NNNC
Samsung
Cap Ceramic 0.1uF 6.3V X5R 10% Pad SMD 0201 85C Low ESR T/R
CL03A104KQ3NNND.pdf36 Pages, 1392 KB, Original
CL03A104KQ3NNND
Samsung
Cap Ceramic 0.1uF 6.3V X5R 10% Pad SMD 0201 85C T/R
CL03A104KQ3NNNH.pdf36 Pages, 1391 KB, Original
CL03A104KQ3NNNH
Samsung
Cap Ceramic 0.1uF 6.3V X5R 10% Pad SMD 0201 85C T/R

Product Details Search Results:

Samsung.com/CL03A103KA3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"10000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of Te...
1752 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A103KO3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"10000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of Te...
1744 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A103KP3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"10000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of Te...
1750 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A103KQ3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"10000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of Te...
1753 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KA3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of T...
1752 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KO3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of T...
1741 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KP3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000PF(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1752 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KP3NNND
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of T...
1742 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KP3NNNH
{"Status":"ACTIVE","Capacitor Type":"CERAMIC","Manufacturer Series":"CL(SUPERSMALLSIZE)"}...
864 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KQ3NNNC
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000PF(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"YES","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number o...
1756 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KQ3NNND
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of T...
1748 Bytes - 08:18:19, 04 January 2025
Samsung.com/CL03A104KQ3NNNH
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Termination Style":"PAD","Capacitance":"100000(pF)","Package / Case":"0201","Case Style":"Ceramic Chip","Lead Diameter (nom)":"Not Required(mm)","Temp Coeff (Dielectric)":"X5R","Seated Plane Height":"Not Required(mm)","Product Height (mm)":"0.3(mm)","Construction":"SMT Chip","Microwave Application":"NO","Wire Form":"Not Required","Operating Temp Range":"-55C to 85C","Product Diameter (mm)":"Not Required(mm)","Tolerance (+ or -)":"10%","Number of T...
1735 Bytes - 08:18:19, 04 January 2025

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