LMP91002 www.ti.com SNIS163A - APRIL 2012 - REVISED MARCH 2013 LMP91002 Sensor AFE System: Configurable AFE Potentiostat for Low-Power Chemical Sensing Applications Check for Samples: LMP91002 FEATURES DESCRIPTION * * * * * The LMP91002 is a programmable Analog Front End (AFE) for use in micro-power electrochemical sensing applications. It provides a complete signal path solution between a not biased gas sensor and a microcontroller generating an output voltage proportional to the cell current. The LMP91002's programmability enables it support not biased electrochemical gas sensor with a single design. The LMP91002 supports gas sensitivities over a range of 0.5 nA/ppm to 9500 nA/ppm. It also allows for an easy conversion of current ranges from 5A to 750A full scale. The LMP91002's transimpedance amplifier (TIA) gain is programmable through the I2C interface. The I2C interface can also be used for sensor diagnostics. The LMP91002 is optimized for micropower applications and operates over a voltage range of 2.7V to 3.6V. The total current consumption can be less than 10A. Further power savings are possible by switching off the TIA amplifier and shorting the reference electrode to the working electrode with an internal switch. 1 * * * * * * * * Typical Values, TA = 25C Supply Voltage 2.7 V to 3.6 V Supply Current (Average Over Time) <10 A Cell Conditioning Current Up to 10 mA Reference Electrode Bias Current (85C) 900pA (Max) Output Drive Current 750A Complete Potentiostat Circuit to Interface to Most Not Biased Gas Sensors Low Bias Voltage Drift Programmable TIA Gain 2.75k to 350k I2C Compatible Digital Interface Ambient Operating Temperature -40C to 85C Package 14 pin WSON Supported by Webench Sensor AFE Designer APPLICATIONS * * * Gas Detector Amperometric Applications Electrochemical Blood Glucose Meter Typical Application VDD VREF SCL LMP91002 3-Lead Electrochemical Cell + CE A1 DIAGNOSTIC VREF DIVIDER I2C INTERFACE AND CONTROL REGISTERS SDA MSP430 MENB - CE RE RE DGND WE + WE - RLoad VOUT TIA RTIA C1 C2 AGND Figure 1. AFE Gas Detector 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2012-2013, Texas Instruments Incorporated LMP91002 SNIS163A - APRIL 2012 - REVISED MARCH 2013 www.ti.com Connection Diagram DGND 1 14 CE MENB RE SCL WE SDA VREF DAP NC C1 VDD C2 AGND 7 8 VOUT Figure 2. 14-Pin WSON - Top View See Package Number NHL0014B PIN DESCRIPTIONS Pin Name Description 1 DGND Connect to ground 2 MENB Module Enable, Active Low 3 SCL Clock signal for I2C compatible interface 4 SDA Data for I2C compatible interface 5 NC 6 VDD Not Internally Connected 7 AGND Ground 8 VOUT Analog Output Supply Voltage 9 C2 External filter connector (Filter between C1 and C2) 10 C1 External filter connector (Filter between C1 and C2) 11 VREF 12 WE Working Electrode. Output to drive the Working Electrode of the chemical sensor 13 RE Reference Electrode. Input to drive Counter Electrode of the chemical sensor 14 CE Counter Electrode. Output to drive Counter Electrode of the chemical sensor DAP Voltage Reference input Connect to AGND These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 LMP91002 www.ti.com SNIS163A - APRIL 2012 - REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) (3) Human Body Model ESD Tolerance (4) 2kV Charge-Device Model 1kV Machine Model 200V Voltage between any two pins 6.0V Current through VDD or VSS 50mA Current sunk and sourced by CE pin 10mA Current out of other pins (5) 5mA Storage Temperature Range -65C to 150C Junction Temperature (6) (1) (2) (3) (4) (5) (6) 150C "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the device is functional and the device should not be operated beyond such conditions. For soldering specifications, see www.ti.com/lit/SNOA549. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). All non-power pins of this device are protected against ESD by snapback devices. Voltage at such pins will rise beyond absmax if current is forced into pin. The maximum power dissipation is a function of TJ(MAX), JA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ JA All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Supply Voltage VS = (VDD - AGND) 2.7V to 3.6V Temperature Range (2) Package Thermal Resistance (2) (1) (2) -40C to 85C 14-Pin WSON (JA) 44 C/W "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the device is functional and the device should not be operated beyond such conditions. The maximum power dissipation is a function of TJ(MAX), JA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ JA All numbers apply for packages soldered directly onto a PC board. Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 3 LMP91002 SNIS163A - APRIL 2012 - REVISED MARCH 2013 www.ti.com Electrical Characteristics (1) Unless otherwise specified, all limits ensured for TA = 25C, VS= (VDD - AGND), VS= 3.3V and AGND = DGND = 0V, VREF = 2.5V, Internal Zero = 20% VREF. Boldface limits apply at the temperature extremes. Symbol Typ (3) Max (2) 3-lead amperometric cell mode MODECN = 0x03 10 15 13.5 Standby mode MODECN = 0x02 6.5 10 8 Deep Sleep mode MODECN = 0x00 0.6 1 0.85 Parameter Min (2) Conditions Units Power Supply Specification IS Supply Current A Potentiostat IRE Input bias current at RE pin Minimum operating current capability ICE Minimum charging capability (4) VDD=2.7V; Internal Zero 50% VDD -90 -800 90 800 VDD=3.6V; Internal Zero 50% VDD -90 -900 90 900 sink 750 source 750 sink 10 source 10 AOL_A1 Open loop voltage gain of control loop op amp (A1) 300mVVCEVs-300mV, -750AICE750A en_RW Low Frequency integrated noise between RE pin and WE pin 0.1Hz to 10Hz (5) VOS_RW WE Voltage Offset referred to RE 104 pA A mA 120 dB 3.4 Vpp 0% VREF, Internal Zero=20% VREF 0% VREF, Internal Zero=50% VREF -550 550 V -4 4 V/C 0% VREF, Internal Zero=67% VREF 0% VREF, Internal Zero=20% VREF TcVOS_RW WE Voltage Offset Drift referred to RE from -40C to 85C (6) 0% VREF, Internal Zero=50% VREF 0% VREF, Internal Zero=67% VREF Transimpedance gain accuracy Linearity TIA_GAIN Programmable TIA Gains (1) (2) (3) (4) (5) (6) 4 5 % 0.05 % 7 programmable gain resistors 2.75 3.5 7 14 35 120 350 Maximum external gain resistor 350 k Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. Limits are 100% production tested at 25C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. At such currents no accuracy of the output voltage can be expected. This parameter includes both A1 and TIA's noise contribution. Offset voltage temperature drift is determined by dividing the change in VOS at the temperature extremes by the total temperature change.Starting from the measured voltage offset at temperature T1 (VOS_RW(T1)), the voltage offset at temperature T2 (VOS_RW(T2)) is calculated according the following formula: VOS_RW(T2)=VOS_RW(T1)+ABS(T2-T1)* TcVOS_RW. Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 LMP91002 www.ti.com SNIS163A - APRIL 2012 - REVISED MARCH 2013 Electrical Characteristics(1) (continued) Unless otherwise specified, all limits ensured for TA = 25C, VS= (VDD - AGND), VS= 3.3V and AGND = DGND = 0V, VREF = 2.5V, Internal Zero = 20% VREF. Boldface limits apply at the temperature extremes. Symbol TIA_ZV Parameter Min (2) Conditions 3 programmable percentages of VREF 20 50 67 3 programmable percentages of VDD 20 50 67 Internal zero voltage Internal zero voltage Accuracy RL Typ (3) Max (2) Units % 0.04 % Load Resistor 10 Load accuracy 5 % 110 dB Internal zero 20% VREF PSRR Power Supply Rejection Ratio at RE pin 2.7 VDD5.25V Internal zero 50% VREF 80 Internal zero 67% VREF External reference specification (7) VREF (7) External Voltage reference range 1.5 VDD Input impedance V 10 M In case of external reference connected, the noise of the reference has to be added. I2C Interface (1) Unless otherwise specified, all limits ensured for at TA = 25C, VS=(VDD - AGND), 2.7V TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. Limits are 100% production tested at 25C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. This parameter is specified by design or characterization. Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 5 LMP91002 SNIS163A - APRIL 2012 - REVISED MARCH 2013 www.ti.com Timing Characteristics (1) Unless otherwise specified, all limits ensured for TA = 25C, VS= (VDD - AGND), VS= 3.3V and AGND = DGND = 0V, VREF = 2.5V, Internal Zero= 20% VREF. Boldface limits apply at the temperature extremes. Refer to timing diagram in Figure 3. Symbol Parameter Conditions Min Typ Max Units 100 kHz fSCL Clock Frequency 10 tLOW Clock Low Time 4.7 s tHIGH Clock High Time 4.0 s 4.0 s After this period, the first clock pulse is generated tHD;STA Data valid tSU;STA Set-up time for a repeated START condition 4.7 s tHD;DAT Data hold time (2) 0 ns tSU;DAT Data Setup time 250 ns (3) IL 3mA, CL 400pF tf SDA fall time tSU;STO Set-up time for STOP condition 4.0 250 s tBUF Bus free time between a STOP and START condition 4.7 s tVD;DAT Data valid time 3.45 s tVD;ACK Data valid acknowledge time 3.45 s tSP Pulse width of spikes that must be suppressed by the input filter (3) 50 ns t_timeout SCL and SDA Timeout 25 100 ms tEN;START I2C Interface Enabling 600 ns 2 ns tEN;STOP I C Interface Disabling 600 ns tEN;HIGH time between consecutive I2C interface enabling and disabling 600 ns (1) (2) (3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. LMP91002 provides an internal 300ns minimum hold time to bridge the undefined region of the falling edge of SCL. This parameter is specified by design or characterization. Timing Diagram MENB 70% 30% tEN;START tEN;HIGH tEN;STOP 70% SDA 30% tf tVD;DAT tLOW tBUF tHD;STA tSP SCL 70% 30% tSU;STA tHD;STA tHIGH tHD;DAT START 1/fSCL tSU;STO tSU;DAT tVD;ACK STOP REPEATED START START Figure 3. I2C Interface Timing Diagram 6 Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 LMP91002 www.ti.com SNIS163A - APRIL 2012 - REVISED MARCH 2013 Typical Performance Characteristics Unless otherwise specified, TA = 25C, VS=(VDD - AGND), 2.7V VWE), VRW= 1% Source reference 2. Put in the [3:0] bit of the register REFCN (0x11) the 0000b value, leaving the other bit unchanged. This operation will remove the potential (VRW) between RE and WE pin (VRE > VWE), VRW= 0V. LMP91000 OUTPUT TEST PULSE INPUT PULSE (50mV/DIV) OUTPUT VOLTTAGE (500mV/DIV) The width of the pulse is simply the time between the two writing operation. TIME (25ms/DIV) Figure 26. TEST PROCEDURE EXAMPLE Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 19 LMP91002 SNIS163A - APRIL 2012 - REVISED MARCH 2013 20 www.ti.com Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 LMP91002 www.ti.com SNIS163A - APRIL 2012 - REVISED MARCH 2013 REVISION HISTORY Changes from Original (March 2013) to Revision A * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 19 Submit Documentation Feedback Copyright (c) 2012-2013, Texas Instruments Incorporated Product Folder Links: LMP91002 21 PACKAGE OPTION ADDENDUM www.ti.com 27-Mar-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LMP91002SD/NOPB ACTIVE WSON NHL 14 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR L91002 LMP91002SDE/NOPB ACTIVE WSON NHL 14 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR L91002 LMP91002SDX/NOPB ACTIVE WSON NHL 14 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR L91002 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing LMP91002SD/NOPB WSON NHL 14 LMP91002SDE/NOPB WSON NHL LMP91002SDX/NOPB WSON NHL SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 14 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 14 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMP91002SD/NOPB WSON NHL 14 1000 213.0 191.0 55.0 LMP91002SDE/NOPB WSON NHL 14 250 213.0 191.0 55.0 LMP91002SDX/NOPB WSON NHL 14 4500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NHL0014B SDA14B (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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