PRECAUTIONS
CAPACITORS
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Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
1.Circuit Design Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.(larger fillets which extend above the component
end terminations)
Examples of improper pattern designs are also shown.
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
2.PCB Design Pattern configurations
(Design of Land-patterns)
1. When capacitors are mounted on a PCB, the amount of
solder used (size of fillet) can directly affect capacitor per-
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
(1) The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
(2) When more than one part is jointly soldered onto the
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Recommended land dimensions for wave-soldering (unit: mm)
Recommended land dimensions for reflow-soldering (unit: mm)
Type 107 212 316 325
1.6 2.0 3.2 3.2
0.8 51.25 1.6 2.5
A 0.8〜1.0 1.0〜1.4 1.8〜2.5 1.8〜2.5
B 0.5〜0.8 0.8〜1.5 0.8〜1.7 0.8〜1.7
C 0.6〜0.8 0.9〜1.2 1.2〜1.6 1.8〜2.5
L
W
Excess solder can affect the ability of chips to withstand mechanical stresses. There-
fore, please take proper precautions when designing land-patterns.
L
W
Size
L
W
Type
212(2 circuits)
110(2 circuits)
096(2 circuits)
2.0 1.37 0.9
1.25 1.0 0.6
a 0.5〜0.6 0.35〜0.45 0.25〜0.35
b 0.5〜0.6 0.55〜0.65 0.15〜0.25
c 0.5〜0.6 0.3〜0.4 0.15〜0.25
d 1.0 0.64 0.45
Type 042 063 105 107 212 316 325 432
0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15〜0.25 0.20〜0.30
0.45〜0.55
0.8〜1.0 0.8〜1.2 1.8〜2.5 1.8〜2.5 2.5〜3.5
B
0.10〜0.20 0.20〜0.30
0.40〜0.50
0.6〜0.8 0.8〜1.2 1.0〜1.5 1.0〜1.5 1.5〜1.8
C
0.15〜0.30 0.25〜0.40
0.45〜0.55
0.6〜0.8 0.9〜1.6 1.2〜2.0 1.8〜3.2 2.3〜3.5
Size
L
W
Type
212(4 circuits)
2.0
1.25
a 0.5〜0.6
b 0.5〜0.6
c 0.2〜0.3
d 0.5
Size
Size