PACKAGING INFORMATION ISSI®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
06/13/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Plastic TSOP-Type I
Package Code: T (32-pin)
D
SEATING PLANE
B
eC
1
N
E
A1
A
S
H
Lα
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect
to one another within 0.004 inches at the
seating plane.
MILLIMETERS INCHES
Symbol Min. Max. Min. Max.
No. Leads 32
A — 1.20 — 0.047
A1 0.05 0.25 0.002 0.010
B 0.17 0.23 0.007 0.009
C 0.12 0.17 0.005 0.007
D 7.90 8.10 0.311 0.319
E 18.30 18.50 0.720 0.728
H 19.80 20.20 0.780 0.795
e 0.50 BSC 0.020 BSC
L 0.40 0.60 0.016 0.024
α0° 8° 0° 8°
S 0.25 REF 0.010 REF
