LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
LM185/LM285/LM385 Adjustable Micropower Voltage References
Check for Samples: LM185-ADJ,LM285-ADJ,LM385-ADJ
Careful design of the LM185 has made the device
1FEATURES tolerant of capacitive loading, making it easy to use in
2• Adjustable from 1.24V to 5.30V almost any reference application. The wide dynamic
• Operating Current of 10μA to 20mA operating range allows its use with widely varying
supplies with excellent regulation.
• 1% and 2% Initial Tolerance
• 1ΩDynamic Impedance The extremely low power drain of the LM185 makes it
useful for micropower circuitry. This voltage reference
• Low Temperature Coefficient can be used to make portable meters, regulators or
general purpose analog circuitry with battery life
DESCRIPTION approaching shelf life. Further, the wide operating
The LM185/LM285/LM385 are micropower 3-terminal current allows it to replace older references with a
adjustable band-gap voltage reference diodes. tighter tolerance part.
Operating from 1.24 to 5.3V and over a 10μA to The LM185 is rated for operation over a −55°C to
20mA current range, they feature exceptionally low 125°C temperature range, while the LM285 is rated
dynamic impedance and good temperature stability. −40°C to 85°C and the LM385 0°C to 70°C. The
On-chip trimming is used to provide tight voltage LM185 is available in a hermetic TO package and a
tolerance. Since the LM185 band-gap reference uses LCCC package, while the LM285/LM385 are
only transistors and resistors, low noise and good available in a low-cost TO-92 package, as well as
long-term stability result. SOIC.
Connection Diagram
Figure 1. TO-92 Package Figure 2. TO Package
Bottom View Bottom View
Figure 3. SOIC Package Figure 4. 20-LCCC
Top View Top View
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Block Diagram
Typical Applications
Figure 5. 1.2V Reference
Figure 6. 5.0V Reference
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)(3)
Reverse Current 30mA
Forward Current 10mA
Operating Temperature Range (4)
LM185 Series −55°C to 125°C
LM285 Series −40°C to 85°C
LM385 Series 0°C to 70°C
ESD Susceptibility (5) 2kV
Storage Temperature −55°C to 150°C
Soldering Information
TO-92 Package (10 sec.) 260°C
TO Package (10 sec.) 300°C
SOIC Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
See An-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
(2) Refer to RETS185H for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, see Table 1 and Thermal Characteristics.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.
Table 1. TJ(max) for Elevated Temperature Operation
DEVICE TJ(max) (°C)
LM185 150
LM285 125
LM385 100
Thermal Characteristics
Over operating free-air temperature range (unless otherwise noted)
Thermal Resistance TO-92 TO-46 SOIC
180°C/W (0.4″leads)
θJA (Junction to Ambient) 440°C/W 165°C/W
170°C/W (0.125″leads)
θJC (Junction to Case) N/A 80°C/W N/A
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Electrical Characteristics(1)
LM185, LM285 LM385
LM185BX, LM285 LM385
LM185BY LM385BX,
LM185B, LM385BY Units
Parameter Conditions LM285BX, (Limit)
Typ Typ
LM285BY
Tested Design Tested Design Tested Design Tested Design
Limit Limit Limit Limit Limit Limit Limit Limit
(2) (3) (2) (3) (2) (3) (2) (3)
Reference IR= 100μA 1.240 1.252 1.265 1.270 1.240 1.252 1.255 1.265 1.270 V (max)
Voltage 1.255
1.228 1.215 1.205 1.228 1.215 1.215 1.205 V (min)
1.215
Reference IMIN< IR< 1mA 0.2 1 1.5 11.5 0.2 1 1.5 11.5 mV
Voltage (max)
1mA < IR< 20mA 4 10 20 10 20 5 15 25 15 25
Change with
Current
Dynamic IR= 100μA, f =
Output 100Hz
Impedance IAC = 0.1 IRVOUT = 0.3 0.4 Ω
VREF
VOUT = 0.7 1
5.3V
Reference IR= 100μA
Voltage mV
Change with 1 3 6362 5 10 510 (max)
Output
Voltage
Feedback 13 20 25 20 25 16 30 35 30 35 nA (max)
Current
Minimum VOUT = VREF 6 9 10 910 7 11 13 11 13 μA
Operating (max)
VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60
Current (see
curve)
Output IR= 100μA, 10Hz < f μVrms
Wideband < 10kHz
Noise VOUT = VREF 50 50
VOUT = 5.3V 170 170
Average IR= 100μA X Suffix 30 30
Temperature Y Suffix 50 50 ppm/°c
Coefficient (max)
All 150 150 150 150
(4) Others
Long Term IR= 100μA, T = 1000 20 20 ppm
Stability Hr,
TA= 25°C ± 0.1°C
(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA= TJ= 25°C. Unless otherwise
specified, all parameters apply for VREF < VOUT < 5.3V.
(2) Production tested.
(3) Not production tested. These limits are not to be used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures from TMIN
to TMAX, divided by TMAX −TMIN. The measured temperatures are −55, −40, 0, 25, 70, 85, 125°C.
4Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Typical Performance Characteristics
Temperature Drift of 3
Representative Units Feedback Current
Figure 7. Figure 8.
Minimum Operating Current Reverse Characteristics
Figure 9. Figure 10.
Reverse Characteristics Forward Characteristics
Figure 11. Figure 12.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Output Noise Voltage Dynamic Output Impedance
Figure 13. Figure 14.
Response Time
Figure 15.
Temperature Coefficient Typical
LM185 (left), LM285 (center), LM385 (right)
Figure 16.
6Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
TYPICAL APPLICATIONS
Figure 17. Precision 10V Reference Figure 18. Low AC Noise Reference
Figure 19. 25V Low Current Shunt Regulator Figure 20. 200 mA Shunt Regulator
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Figure 21. Series-Shunt 20 mA Regulator Figure 22. High Efficiency Low Power Regulator
Figure 23. Voltage Level Detector Figure 24. Voltage Level Detector
Figure 25. Fast Positive Clamp Figure 26. Bidirectional Clamp
2.4V + ΔVD1 ±2.4V
8Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Figure 27. Bidirectional Adjustable Clamp Figure 28. Bidirectional Adjustable Clamp
±1.8V to ±2.4V ±2.4V to ±6V
Figure 29. Simple Floating Current Detector
Figure 30. Current Source
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
*D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the
threshold current, except with I=O.
Figure 31. Precision Floating Current Detector
Figure 32. Centigrade Thermometer, 10mV/°C
Figure 33. Freezer Alarm
10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision E (April 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM185BH ACTIVE TO NDV 3 1000 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 ( LM185BH, LM185BH
)
LM185BH/NOPB ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 ( LM185BH, LM185BH
)
LM285BXZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 85 LM285
BXZ
LM285BYM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285
BYM
LM285BYMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285
BYM
LM285BYZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 85 LM285
BYZ
LM285M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285
M
LM285MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285
M
LM285Z/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 85 LM285
Z
LM385BM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385
BM
LM385BMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385
BM
LM385BXZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 LM385
BXZ
LM385BYZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 LM385
BYZ
LM385BZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 LM385
BZ
LM385M NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI 0 to 70 LM385
M
LM385M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385
M
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM385MX NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI 0 to 70 LM385
M
LM385MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385
M
LM385Z/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 LM385
Z
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM285BYMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM285MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385BMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385MX SOIC D 8 2500 367.0 367.0 35.0
LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
( 2.54)
1.16
0.92
4.95
4.55
0.76 MAX 2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
3X 0.483
0.407
-5.565.32
1.22
0.72
45
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
1
2
3
SCALE 1.250
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
TYP
( 1.2)
METAL
2X ( 1.2)
METAL
3X ( 0.7) VIA
(R0.05) TYP
(2.54)
(1.27)
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
2X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
1
2
3
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
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