Microwave Ceramics and Modules Filter
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz B69842N5507B700
Preliminary Data Sheet
ISSUE DATE 19.03.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4
Features
zSMD filter consisting of coupled resonators with stepped impedances
zMgTiO3 - CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
zExcellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2 zComponent drawing
zRecommended footprint
Page 3 zCharacteristics
zMaximum ratings
zTypical passband characteristic
Page 4 zProcessing information
zSoldering requirements
zDelivery mode
Microwave Ceramics and Modules Filter
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz B69842N5507B700
Preliminary Data Sheet
ISSUE DATE 19.03.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 2/4
Component drawing
Recommended footprint
I/O
I/O
G
GG
View from below onto the solder terminals and view from beside
Microwave Ceramics and Modules Filter
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz B69842N5507B700
Preliminary Data Sheet
ISSUE DATE 19.03.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4
Characteristics
min. typ. max.
Center frequency fc5.5 GHz
Insertion loss [5150 – 5850] MHz αIL 1.4 1.5 dB
Passband [5150 – 5850] MHz B700 MHz
Amplitude ripple (peak - peak) [5150 – 5850] MHz ∆α dB
Standing wave ratio [5150 – 5850] MHz SWR 1.8 2.0
Impedance
Power
Z
P
50
1.0 Ω
W
A
ttenuation α
at DC to 2170 MHz
at 2400 to 2500 MHz
at 2500 to 3900 MHz
at 6800 MHz
40
40
30
18
45
43
39
20
dB
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1) - 40/+ 90/56
Operating temperature Top -40 / +85 °C
Typical passband characteristic
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
500 2500 4500 6500 8500 10500 12500
frequency [MHz]
attenuation [dB]
S11 [dB]
S21 [dB]
Microwave Ceramics and Modules Filter
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz B69842N5507B700
Preliminary Data Sheet
ISSUE DATE 19.03.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4
Processing information ZNr.: 577 (FILT95_2)
zWettability acc. to IEC 68-2-58: ≥ 75% (after aging)
Soldering requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type reflow reflow
Maximum solderin
g
tem
p
erature 235
(
max. 2 sec.
)
260
(
max. 2 sec.
)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s > - 5 °C/s
eutectic SnPb solder paste profile leadfree solder paste profile
Delivery mode
zBlister tape acc. to IEC 286-3, PS, grey
zPieces/tape: 4000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
