CAUTION: ASMT-QXBE-Nxxxx LEDs are ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
ASMT-QxBE-Nxxxx
Super 0.5W Power PLCC-4
Surface Mount LED Indicator
Data Sheet
Description
The Super 0.5W Power PLCC-4 SMT LED is first Blue &
Green mid-Power PLCC-4 SMT LEDs using InGaN chip
technology. The package can be driven at high current
due to its superior package design. The product is able
to dissipate the heat more efficiently compared to the
Power PLCC-4 SMT LEDs. These LEDs produce higher light
output with better flux performance compared to the
Power PLCC-4 SMT LED.
The Super 0.5W Power PLCC-4 SMT LEDs are designed for
higher reliability, better performance, and operate under
a wide range of environmental conditions. The perfor-
mance characteristics of these new mid-power LEDs
make them uniquely suitable for use in harsh conditions
such as in automotive applications, and in electronics
signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
Features
x Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
x High reliability package with enhanced silicone resin
encapsulation
x High brightness with optimum flux performance
using InGaN chip technologies
x Available in Blue and Green color
x Available in 8mm carrier tape & 7 inch reel
x Low Thermal Resistance 40°C/W
x Super wide viewing angle at 120 degree
x JEDEC MSL 2a
Applications
1. Electronic signs and signals
a. Decorative/Advertising Lighting
b. Channel Lettering
c. Signs Luminaire
d. RGB Backlighting
2
Package Drawing
Figure 1. Package Drawing
Table 1. Device Selection Guide
Color Part Number
Luminous Flux, )V[1] (lm)
Dice TechnologyMin. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA)
Blue ASMT-QBBE-N0B0E 3.4 4.8 7.0 150 InGaN
Green ASMT-QGBE-NFH0E 15.0 23.0 33.0 150 InGaN
Notes:
1. )V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
Part Numbering System
3.6 ± 0.2
0.7
3.2 ± 0.2
2.8 ± 0.2
2.2 ± 0.21.9 ± 0.20.6 ± 0.3
CC
AA
0.79 ± 0.3
CATHODE
MARKING
Ø 2.4
1.15 ± 0.2
0.41 (TYP.)
0.56 (TYP.)
0.97
Notes:
1. All dimensions in millimeters
2. Lead polarity as shown in figure 13.
3. Terminal finish: Ag plating.
4. Encapsulation material: silicone resin.
ASMT–QX1BE–NX2X3X4X5
Packaging Option
Colour Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
B - Blue
G - Green
3
Table 2. Absolute Maximum Ratings (TA = 25 °C)
Parameters ASMT-QWBE-Nxxxx
DC Forward Current [1] 150 mA
Peak Forward Current [2] 300 mA
Power Dissipation 513 mW
Reverse Voltage -4V
Junction Temperature 125 °C
Operating Temperature -40 °C to +110 °C
Storage Temperature -40 °C to +110 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TJ = 25 °C)
Color Part Number
Dice
Technology
Peak
Wavelength
λPEAK (nm)
Dominant
Wavelength λD
(nm)
Viewing
Angle 2T½[1]
(Degrees)
Luminous
Efficiency
Ke (lm/W)
Total Flux /
Luminous Intensity
ΦV (lm) / IV (cd)
Typ. Typ. Typ. Typ. Typ.
Blue ASMT-QBBE-Nxxxx InGaN 459.0 464.5 120 10 2.75
Green ASMT-QGBE-Nxxxx InGaN 516.5 522.0 120 35 2.75
Notes:
1. T½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (TJ = 25 °C)
Part Number
Forward Voltage VF (Volts) @ IF = 150 mA
Thermal Resistance RTJ-P (°C/W)Typ. Max.
ASMT-QBBE-N0B0E 3.6 4.1 40
ASMT-QGBE-NFH0E 3.6 4.1 40
4
0
0.2
0.4
0.6
0.8
1
1.2
0 30 60 90 120 150
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
JUNCTION TEMPERATURE - °C
RELATIVE LUMINOUS FLUX
0
20
40
60
80
100
120
140
160
0 20406080100 120
TEMPERATURE (°C)
CURRENT - mA
RTJA = 90°C/W
RTJA = 110°C/W
(NORMALIZED AT 150 mA)
(NORMALIZED AT 25°C)
0.6
0.7
0.8
0.9
1
1.1
1.2
-50 0 50 100 150
0
20
40
60
80
100
120
140
160
020406080100 120
TEMPERATURE (°C)
CURRENT - mA
RT = 40°C/W
JP
Figure 4. Relative Flux Vs. Forward Current Figure 5. Relative Flux Vs. Temperature
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
DeratedBased on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RθJ-P=40°C/W.
Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage
0
50
100
150
200
250
300
350
012345
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
Blue Green
5
Figure 10. Radiation Pattern
Figure 9. Forward Voltage Shift Vs. Temperature.
Figure 8. Dominant wavelength Vs. forward current.
-0.25
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
0.25
-50 -25 0 25 50 75 100
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V--
460
470
480
490
500
510
520
530
540
0 30 60 90 120 150
FORWARD CURRENT - mA
DOMINANT WAVELENGTH - nm
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0.00
0.10
0.20
0.30
0.40
0.00001 0.0001 0.001 0.01 0.1 0 10 100
tp - Time - (s)
CURRENT - A
CURRENT - A
0.00001 0.0001 0.001 0.01 0.1 0 10 100
tp - Time - (s)
0.00
0.10
0.20
0.30
0.40
D = tp
T
tp
IF
T
D =
0.05
0.10
0.25
0.50
1
D =
0.05
0.10
0.25
0.50
1
D = tp
T
tp
IF
T
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA = 25°C, RθJ-A=110°C/W.
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA= 85°C, RθJ-P=110°C/W.
6
Figure 13. Recommended Soldering Pad Pattern
Figure 12. Recommended Pick and Place Nozzle Size
Figure 11. Recommended Pb-free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
217ºC
200ºC
150ºC
60 - 120 SEC.
-6ºC/SEC. MAX.
3ºC/SEC. MAX.
3 C/SEC. MAX.
255 - 260ºC
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
Note: Diameter "D" should be smaller than 2.2mm
D
CATHODE
MARKING
CATHODE
MARKING
A
C
A A
C C
C C
SOLDER MASK
ANODE
CATHODE
0.4
0.3
MINIMUM 55 mm2 OF CATHODE PAD
FOR IMPROVED HEAT DISSIPATION
2.4
0.6
0.9 X 6
4.6
1.1
1.3 x 6
AA
CC
7
Figure 15. Tape Dimensions
Figure 16. Reeling Orientation
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.14 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5+0.1
–0
8°
Ø1+0.1
–0
AA
CC
Figure 14. Tape Leader and Trailer Dimensions
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILERCOMPONENTLEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
8
Device Color (X1)
B Blue
G Green
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only
X2Min Flux Bin
X3Max Flux Bin
Flux Bin Limits
Bin ID Min. (lm) Max. (lm)
0 3.40 4.30
A 4.30 5.50
B 5.50 7.00
C 7.00 9.00
D 9.00 11.50
E 11.50 15.00
F 15.00 19.50
G 19.50 25.50
H 25.50 33.00
J 33.00 43.00
K 43.00 56.00
L 56.00 73.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X4)
Individual reel will contain parts from one full bin only.
X4
0 Full Distribution
A 1 and 2 only
B 2 and 3 only
C 3 and 4 only
G 1, 2 and 3 only
H 2, 3 and 4 only
Z Special binning
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly
or handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5%RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
- “10%” is Not Green and “5%” HIC indicator is Azure.
- The LEDs are exposed to condition of >30°C / 60%
RH at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
Color Bin Limits
Blue Min. (nm) Max. (nm)
1 460.0 465.0
2 465.0 470.0
3 470.0 475.0
4 475.0 480.0
Green Min. (nm) Max. (nm)
1 515.0 520.0
2 520.0 525.0
3 525.0 530.0
4 530.0 535.0
Tolerance of each bin limit = ±1 nm
VF Bin Limits
Bin ID Min. Max.
S5 3.20 3.50
S6 3.50 3.80
S7 3.80 4.10
Tolerance of each bin limit = ±0.1V
Packaging Option (X5)
Option Test Current Package Type Reel Size
E 150mA Top Mount 7 Inch
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-0864EN - April 8, 2010
