MAG.LAYERS
GMLB-201209-R Series
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GMLB chip beads can be used in a variety of electronic applications
including:
Computers and Computer Peripherals
Cellular Communication Equipment
Digital Cameras
Digital Televisions
Audio Equipment
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The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
the latest in multilayer technology, we have developed chip beads that are able
to resolve all EMI/EMC issues. High quality, reliability, and versatility make the
GMLB series chip beads suitable for all your design needs.
z High Reliability
The monolithic inorganic materials used to construct GMLB chips restrain magnetic
flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely
effective with unstable grounding.
z Small Chip-Shaped Design
The chip-shaped design makes GMLB chip beads ideal for automatic mounting.
z High Soldering Heat Resistance
High quality termination allows both flow and re-flow soldering methods to be
applied.
z Sharp High Frequency Characteristics
The GMLB high frequency chip series has sharp impedance characteristics, which
make it suitable for high-speed signal lines.
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GMLB - 201209 - 0030 A-N8 □
c d e f g h
c Product Code
d Dimension Code
e Impedance (at 100 MHz)
f Series Type
g Design Code
h Code for Special Specification
MAG.LAYERS
GMLB-201209-R Series
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NOTE：Dimensions in mm
PRODUCT NO. A B C D
GMLB-201209
(0805)
2.0±0.20
(0.079±0.008)
1.2±0.20
(0.047±0.008)
0.9±0.20
(0.035±0.008)
0.5±0.30
(0.020±0.012)
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CU
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In operating temperatures exceeding +85℃, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve
shown below according to the operating temperature.
1
2
3
4
5
6
7
1.5
Operating Temperature(℃)
Rated Current (A)
85 125
MAG.LAYERS
GMLB-201209-R Series
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Part Number Impedance (Ω)
at 100 MHz RDC (Ω) Max. IDC (mA) Max. Operating
Temp. Range (℃)
GMLB-201209-0080R-S2 80±25% 0.2
GMLB-201209-0120R-S2 120±25% 0.3 300
GMLB-201209-0240R-S2 240±25% 0.4
GMLB-201209-0300R-S2 300±25%
GMLB-201209-0430R-S2 430±25%
GMLB-201209-0600R-S2 600±25%
GMLB-201209-1000R-S2 1000±25%
0.5 200
-55 ~ +125
z Temperature rise should be less than 40℃ for P-type and less than 25℃ for other
types when rated current is applied.
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HO
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z Test Instrument:
Z: Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192
Osc. Level: 500mV
RDC: Agilent 34401A
z Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
MAG.LAYERS
GMLB-201209-R Series
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P
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(
(
(
T
T
T＝
＝
＝2
2
25
5
5℃
℃
℃)
)
)
GMLB-201209-0080R-S2
1 10 100 1000
0
30
60
90
120
150
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R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0120R-S2
1 10 100 1000
0
30
60
90
120
150
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R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0240R-S2
1 10 100 1000
0
50
100
150
200
250
300
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0300R-S2
1 10 100 1000
0
50
100
150
200
250
300
350
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0430R-S2
1 10 100 1000
0
100
200
300
400
500
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0600R-S2
1 10 100 1000
0
100
200
300
400
500
600
700
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-1000R-S2
0
200
400
600
800
1000
1200
1 10 100 1000
Z
R
X
MAG.LAYERS
GMLB-201209-R Series
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z
z
z
Peel-off Force
165° TO 180°
TOP COVER TAPE
BASE TAPE
The force for peeling off cover tape is 10 grams in the arrow direction.
z Dimension (Unit: mm)
C
D
A
E
B
F
TYPE SIZE A B W P T CHIPS/REEL
GMLB 201209 1.5 2.3 8 4 1.3, *0.95±0.10 4000
*: For paper reels
TYPE A
B
C D E
F
8 mm 178±1
60 +0.5
-0 - 13 ±0.2 9 ±0.5 12 ±0.5
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1 -
MAG.LAYERS
GMLB-201209-R Series
z Taping Quantity
SERIES 2012
PCS/Reel 4000
z Tape Packing Case
`
W
L
H
Unit: cm
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ABB
C
Land
pattern
Component
Solder-resist
W
L
Component
Unit: mm
Type 2012
L 2.0
Size W1.2
A 0.8~1.2
B 0.8~1.2
C 0.9~1.6
No. of
Reels W L H
2 18±0.5 18±0.5 2.4±0.2
3 18±0.5 18±0.5 3.6±0.2
4 18±0.5 18±0.5 4.8±0.2
5 18±0.5 18±0.5 6.0±0.2
MAG.LAYERS
GMLB-201209-R Series
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•Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF) TIME (SEC)
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
W
GMLB-201209 0.6 30 ± 5
TYPE A(MM) P(KGF)
Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0
R0.5
GMLB-201209 1.4 1.0
• Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Temperature: -55℃~125℃ for 30
minutes each, 100 cycles.
Humidity Resistance
Temperature : 60℃
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance
Impedance shall be within ±20% of the initial
value.
Temperature : 85℃±2℃
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -55 ℃ TO +125℃
2. Storage Condition: The temperature should be within -40℃~85℃ and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.
MAG.LAYERS
GMLB-201209-R Series
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OF
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Ts
min
Ts
max
tL
tP
tS
Preheat
TP
TL
Critical Zone
T
L
to T
P
Ramp-down
Ramp-up
t=25
℃
to Peak Time
Temperature
Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Tsmin 100℃ 150℃
Preheat
Tsmax 150℃ 200℃
Average ramp-up rate (Tsmax to TP) 3℃/second max. 3℃/second max.
Temperature (TL)183℃ 217℃
Time main above Time (tL) 60~150 seconds 60~150 seconds
Peak temperature (TP) 230℃ 250~260℃
Time within 5℃ of actual peak
temperature (tP) 10 seconds 10 seconds
Ramp-down rate 6℃/sec max. 6℃/sec max.
Time 25℃ to peak temperature 6 minutes max. 8 minutes max.
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The contents of this data sheet are subject to change without notice. Please
confirm the specifications and delivery conditions when placing your order.
