1
FEATURES
1
2
3
45
6
7
8
2IN+
2IN–
2OUT
VCC+
VCC–
1IN+
1IN–
1OUT
NE5532, NE5532A . . . D, P, OR PS PACKAGE
SA5532, SA5532A . . . D OR P PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
NE5532 , NE5532ASA5532 , SA5532A
www.ti.com
................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009
DUAL LOW-NOISE OPERATIONAL AMPLIFIERS
•Equivalent Input Noise Voltage:5 nV/ √Hz Typ at 1 kHz•Unity-Gain Bandwidth: 10 MHz Typ•Common-Mode Rejection Ratio: 100 dB Typ•High DC Voltage Gain: 100 V/mV Typ•Peak-to-Peak Output Voltage Swing 26 V TypWith V
CC ±
= ± 15 V and R
L
= 600 Ω
•High Slew Rate: 9 V/ µs Typ
The NE5532, NE5532A, SA5532, and SA5532A are high-performance operational amplifiers combining excellentdc and ac characteristics. They feature very low noise, high output-drive capability, high unity-gain andmaximum-output-swing bandwidths, low distortion, high slew rate, input-protection diodes, and outputshort-circuit protection. These operational amplifiers are compensated internally for unity-gain operation. Thesedevices have specified maximum limits for equivalent input noise voltage.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
NE5532P NE5532PPDIP – P Tube of 50
NE5532AP NE5532APTube of 75 NE5532D
N5532Reel of 2500 NE5532DR0 ° C to 70 ° C SOIC – D
Tube of 75 NE5532AD
N5532AReel of 2500 NE5532ADR
NE5532PSR N5532SOP – PS Reel of 2000
NE5532APSR N5532ASA5532P SA5532PPDIP – P Tube of 50
SA5532AP SA5532APTube of 75 SA5532D– 40 ° C to 85 ° C SA5532Reel of 2500 SA5532DRSOIC – D
Tube of 75 SA5532AD
SA5532AReel of 2500 SA5532ADR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1979 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
OUT
VCC–
VCC+
36 pF
37 pF
14 pF
7 pF
15 W
460 W
15 W
IN+
IN–
Component values shown are nominal.
ABSOLUTE MAXIMUM RATINGS
(1)
NE5532 , NE5532ASA5532 , SA5532A
SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009 ...................................................................................................................................................
www.ti.com
SCHEMATIC (EACH AMPLIFIER)
over operating free-air temperature range (unless otherwise noted)
V
CC+
22 VV
CC
Supply voltage
(2)
V
CC –
– 22 VInput voltage, either input
(2) (3)
V
CC ±
Input current
(4)
± 10 mADuration of output short circuit
(5)
UnlimitedD package 97 ° C/Wθ
JA
Package thermal impedance
(6) (7)
P package 85 ° C/WPS package 95 ° C/WT
J
Operating virtual-junction temperature 150 ° CT
stg
Storage temperature range – 65 ° C to 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential voltages, are with respect to the midpoint between V
CC+
and V
CC –
.(3) The magnitude of the input voltage must never exceed the magnitude of the supply voltage.(4) Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unlesssome limiting resistance is used.(5) The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure themaximum dissipation rating is not exceeded.(6) The package thermal impedance is calculated in accordance with JESD 51-7.(7) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) - T
A
)/ θ
JA.
Operating at the absolute maximum T
J
of 150 ° C can affect reliability.
2Submit Documentation Feedback Copyright © 1979 – 2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
NE5532 , NE5532ASA5532 , SA5532A
www.ti.com
................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009
MIN MAX UNIT
V
CC+
Supply voltage 5 15 VV
CC –
Supply voltage – 5 – 15 VNE5532, NE5532A 0 70T
A
Operating free-air temperature ° CSA5532, SA5532A – 40 85
V
CC ±
= ± 15 V, T
A
= 25 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS
(1)
MIN TYP MAX UNIT
T
A
= 25 ° C 0.5 4V
IO
Input offset voltage V
O
= 0 mVT
A
= Full range
(2)
5T
A
= 25 ° C 10 150I
IO
Input offset current nAT
A
= Full range
(2)
200T
A
= 25 ° C 200 800I
IB
Input bias current nAT
A
= Full range
(2)
1000V
ICR
Common-mode input-voltage range ± 12 ± 13 VMaximum peak-to-peak output-voltageV
OPP
R
L
≥600 Ω, V
CC ±
= ± 15 V 24 26 Vswing
T
A
= 25 ° C 15 50R
L
≥600 Ω, V
O
= ± 10 V
T
A
= Full range
(2)
10Large-signal differential-voltageA
VD
V/mVamplification
T
A
= 25 ° C 25 100R
L
≥2 k Ω, V
O
± 10 V
T
A
= Full range
(2)
15Small-signal differential-voltageA
vd
f = 10 kHz 2.2 V/mVamplification
B
OM
Maximum output-swing bandwidth R
L
= 600 Ω, V
O
= ± 10 V 140 kHzB
1
Unity-gain bandwidth R
L
= 600 Ω, C
L
= 100 pF 10 MHzr
i
Input resistance 30 300 k Ω
z
o
Output impedance A
VD
= 30 dB, R
L
= 600 Ω, f = 10 kHz 0.3 Ω
CMRR Common-mode rejection ratio V
IC
= V
ICR
min 70 100 dBSupply-voltage rejection ratiok
SVR
V
CC ±
= ± 9 V to ± 15 V, V
O
= 0 80 100 dB(ΔV
CC ±
/ΔV
IO
)I
OS
Output short-circuit current 10 38 60 mAI
CC
Total supply curent V
O
= 0, No load 8 16 mACrosstalk attenuation (V
O1
/V
O2
) V
01
= 10 V peak, f = 1 kHz 110 dB
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.(2) Full temperature ranges are: – 40 ° C to 85 ° C for the SA5532 and SA5532A, and 0 ° C to 70 ° C for the NE5532 and NE5532A.
Copyright © 1979 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
OPERATING CHARACTERISTICS
NE5532 , NE5532ASA5532 , SA5532A
SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009 ...................................................................................................................................................
www.ti.com
V
CC ±
= ± 15 V, T
A
= 25 ° C (unless otherwise noted)
NE5532, SA5532 NE5532A, SA5532APARAMETER TEST CONDITIONS UNITMIN TYP MAX MIN TYP MAX
SR Slew rate at unity gain 9 9 V/ µsV
I
= 100 mV, R
L
= 600 Ω,Overshoot factor 10 10 %A
VD
= 1, C
L
= 100 pFf = 30 Hz 8 8 10V
n
Equivalent input noise voltage nV/ √Hzf = 1 kHz 5 5 6f = 30 Hz 2.7 2.7I
n
Equivalent input noise current pA/ √Hzf = 1 kHz 0.7 0.7
4Submit Documentation Feedback Copyright © 1979 – 2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jun-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
NE5532AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532AIP OBSOLETE PDIP P 8 TBD Call TI Call TI
NE5532AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5532APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5532APSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532APSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532APSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jun-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
NE5532IP OBSOLETE PDIP P 8 TBD Call TI Call TI
NE5532P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5532PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5532PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532PSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE5532PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5532APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5532D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5532DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jun-2011
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SA5532P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5532PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
NE5532ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
NE5532APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
NE5532DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
NE5532PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SA5532ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SA5532DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
NE5532ADR SOIC D 8 2500 340.5 338.1 20.6
NE5532APSR SO PS 8 2000 367.0 367.0 38.0
NE5532DR SOIC D 8 2500 340.5 338.1 20.6
NE5532PSR SO PS 8 2000 367.0 367.0 38.0
SA5532ADR SOIC D 8 2500 340.5 338.1 20.6
SA5532DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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