©2004 Fairchild Semiconductor Corporation Rev. B, October 2004
MPF102
Absolute Maximum Ratings *
T
a
=25°C unless otherwise noted
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations
Electrical Characteristics
T
a
=25°C unless otherwise noted
Thermal Charac t eris ti cs
T
a
=25°C unless otherwise noted
Symbol Parameter Value Units
V
DG
Drain-Gate Voltage 25 V
V
GS
Gate-So urce Voltage -25 V
I
GF
Forward Gate Current 10 mA
T
J
, T
STG
Operating and Storage Junction Temperature Range - 55 ~ +155 °C
Symbol Parameter Test Condition Min. Max. Units
Off Characteristics
V
(BR)GSS
Gate-Source Breakdown Voltage I
G
= -1. 0 µA, V
DS
= 0 -25 V
I
GSS
Gate Reverse Current V
GS
= -15V, V
DS
= 0 -2.0 nA
V
gs(off)
Gate-Source C utoff Voltage V
DS
= 15V, I
D
= 2nA -8.0 V
V
gs
Gate-Source Voltage V
DS
= 15V, I
D
= 200µA-0.5-7.5V
On Characteristics *
I
DSS
Zero-Gate Voltage Drain Current V
DS
= 15V, V
GS
= 0 2.0 20 mA
g
fs
Forward Transconductance V
GS
= 0V, V
DS
= 15V, f = 1kHz 2000 7500 µS
Small Signal Characteristics
C
iss
Common-Sour ce Input Capacitance V
GS
= 0, V
DS
= 15V, f = 1MHz 7.0 pF
C
rss
Comm on-Sour ce Revers e Transfer
Capacitance V
GS
= 0, V
DS
= 15V, f = 1MHz 3.0 pF
Symbol Parameter Max. Units
P
D
Total Device Dissipation
Derate above 25°C350
2.8 mW
mW/°C
R
θJC
Thermal Resistance, Junction to Case 125 °C/W
R
θJA
Thermal Resistance, Junction to Ambient 357 °C/W
MPF102
TO-92
N-Channel RF Amplifier
• This device is designed for electronic switching applications such as
low ON resistance analog switching.
• Sourced from process 50.
1. Drain 2. Source 3. Gate
1
Package Dimensions
MPF102
0.46 ±0.10
1.27TYP
(R2.29)
3.86MAX
[1.27 ±0.20]1.27TYP
[1.27 ±0.20]
3.60 ±0.20
14.47 ±0.40
1.02 ±0.10
(0.25) 4.58 ±0.20
4.58 +0.25
–0.15
0.38 +0.10
–0.05
0.38 +0.10
–0.05
TO-92
Dimensions in Millimeters
Rev. B, October 2004©2004 Fairchild Semiconductor Corporation
©2004 Fairchild Semiconductor Corporation
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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
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when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notic e in order to improve
design.
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Semiconductor reserves the right to make changes at
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Rev. I13
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