MIC3001
FOM Management IC with Internal
Calibration
Consider MIC3003 for New Designs
MLF and MicroLeadFrame are registered trademarks of Amkor Technology
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
August 2004 M9999-082404-A
hbwhelp@micrel.com or (40 8) 955-1690
General Description
The MIC3001 enables the implementation of sophisticated,
hot-pluggable fiber optic transceivers with intelligent laser
control and an internally calibrated digital diagnostic
monitoring interface per SFF-8472. It essentially integrates
all non-data path functions of an SFP transceiver into a
tiny (4mm × 4mm) QFN package.
A highly-configurable automatic power control (APC)
circuit controls laser bias. Bias and modulation are
temperature compensated using dual DACs, an on-chip
temperature sensor, and NVRAM look-up tables. A
programmable internal feedback resistor provides
unprecedented dynamic range for APC. Controlled laser
turn-on facilitates hot plugging.
An analog-to-digital converter converts the measured
temperature, voltage, bias current, transmit power, and
received power from analog to digital. An EEPOT provides
front-end adjustment of RX power. Each parameter is
compared against user-programmed warning and alarm
thresholds. Analog comparators and DACs provide high-
speed monitoring of received power and critical laser
operating parameters. Data can be reported as either
internally calibrated or externally calibrated.
An interrupt output, power-on hour meter, and data-ready
bits add user friendliness beyond SFF-8472. The interrupt
output and data-ready bits reduce overhead in the host
system. The power-on hour meter logs operating hours
using an internal real-time clock and stores the result in
NVRAM.
Communication with the MIC3001 is via an industry
standard 2-wire serial interface. Nonvolatile memory is
provided for serial ID, configuration, and separate OEM
and user scratchpad spaces. Two-level password
protection guards against data co rruption.
Data sheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
Features
APC or constant-current laser bias
Turbo mode for APC loop start-up and shorter laser turn
on time
Supports multiple laser types and bias circuit topologies
Drives external low-cost BJT for laser bias
Integrated digital temperature sensor
Temperature compensation of modulation, bias, and
fault levels via NVRAM look-up tables
Direct interface to SY88932, SY88982, SY89307 and
other drivers
NVRAM to support GBIC/SFP serial ID function
User writable EEPROM scratchpad
Diagnostic monitori ng interface per SFF-8472
Monitors and reports criti ca l parameters:
temperature, bias current, TX and RX optical
power, and supply voltage
S/W control and monitoring of TXFAULT, RXLOS,
RATESELECT, and TXDISABLE
Internal or external calibration
EEPOT for adjusting RX power measurement
Power-on hour meter
Interrupt capability
Extensive test and calibration features
2-wire, I2C-compatible serial interface
SFP MSA and SFF-8472 compliant
3.0V to 3.6V power supply range
5V-tolerant I/O
4mm × 4mm 24-pin QFN package
Applications
SFF/SFP optical transceivers
SONET/SDH transceivers and transponders
Fibre channel transceivers
10Gbps transceivers
Free space optical c ommunications
Proprietary optical links
Micrel, Inc. MIC3001
August 2004 3 M9999-082404-A
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Ordering Information
Part Number Package Type Junction Temperature Range Package Marking Lead
Finish
MIC3001BML 24-Pin QFN 45°C to +105°C 3001 Sn-Pb or
NiPdAu
MIC3001BMLTR(1) 24-Pin QFN 45°C to +105°C 3001 Sn-Pb or
NiPdAu
MIC3001GML 24-Pin QFN 45°C to +105°C 3001 with Pb-Free Bar-Line
Indicator NiPdAu
MIC3001GMLTR(1) 24-Pin QFN 45°C to +105°C 3001 with Pb-Free Bar-Line
Indicator NiPdAu
Note:
1. Tape and Reel.
Micrel, Inc.
MIC3001
August 2004 3 M9999-082404-A
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Contents
General Description ...................................................................................................................................................... 1
Applications ................................................................................................................................................................... 1
Orderi n g Information .................................................................................................................................................... 2
Pin Configu ration .......................................................................................................................................................... 7
Pin Description .............................................................................................................................................................. 7
Absolute Maximum Ratings ......................................................................................................................................... 9
Operating Ratings ......................................................................................................................................................... 9
Electrical Characteristics ............................................................................................................................................. 9
Timing Diagram ........................................................................................................................................................... 14
Address Map ................................................................................................................................................................ 15
Block Diagram ............................................................................................................................................................. 17
MIC3000 Capability...................................................................................................................................................... 17
Analog-to-Digital Converter/Signal Monitoring.......................................................................................................... 17
Internal/External Calibration...................................................................................................................................... 19
A/ External Calibration .............................................................................................................................................. 19
Voltage .................................................................................................................................................................. 19
Temperature ......................................................................................................................................................... 19
Bias Current .......................................................................................................................................................... 19
TX Power .............................................................................................................................................................. 19
RX Power .............................................................................................................................................................. 20
B/ Internal Calibration ................................................................................................................................................. 20
C/ ADC Result Registers Reading ............................................................................................................................. 22
RXPOT ...................................................................................................................................................................... 22
Laser Diode Bias Control .......................................................................................................................................... 22
Laser Modulation Control .......................................................................................................................................... 23
Power ON and Laser Start-Up .................................................................................................................................. 24
Fault Com parat ors .................................................................................................................................................... 25
SHDN and TXFIN ..................................................................................................................................................... 26
Temperature Measurement ...................................................................................................................................... 26
Diode Faults .............................................................................................................................................................. 26
Temperature Compensation ..................................................................................................................................... 26
Alarms and Warning Flags........................................................................................................................................ 31
Control and Status I/O .............................................................................................................................................. 31
System Timing ............................................................................................................................................................. 32
Warm Resets ............................................................................................................................................................ 35
Power-On Hour Meter ............................................................................................................................................... 35
Test and Calibration Features .................................................................................................................................. 35
Serial Port Operation ................................................................................................................................................ 36
Page Writes .............................................................................................................................................................. 36
Acknowledge Polling ................................................................................................................................................. 37
Write Protection and Data Security ........................................................................................................................... 37
OEM Passwor d ..................................................................................................................................................... 37
User Password ..................................................................................................................................................... 37
Detailed Register Descriptions .................................................................................................................................. 38
Alarm Threshold Registers ........................................................................................................................................ 38
Warning Thres h o ld Registers .................................................................................................................................... 43
ADC Result Registers ................................................................................................................................................. 49
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Alarm Flags .................................................................................................................................................................. 52
Warning Flags .............................................................................................................................................................. 53
Applications Information ............................................................................................................................................ 69
Controlling Laser Di o de Bias ..................................................................................................................................... 69
Choosing CCOMP ........................................................................................................................................................ 70
Measuring Laser Bias Current .................................................................................................................................. 70
Interfacing To Laser Drivers...................................................................................................................................... 70
SY88912 3.3V 3.2Gbps SONET/SDH Laser Driver ................................................................................................. 71
Modulation Current ................................................................................................................................................... 71
SY88932 3.3V 3.2Gbps SONET/SDH Laser Driver ................................................................................................. 71
SY89307 5.0V/ 3.3V 2.5Gbps VCSEL Driver ........................................................................................................... 72
Laser Drivers Programmed via a Sink Current ......................................................................................................... 72
Drivers with Mon itor O utpu t s .................................................................................................................................... 72
Shutdown Output ...................................................................................................................................................... 72
Temperature Sensing ............................................................................................................................................... 73
Remote Sensing ....................................................................................................................................................... 73
Minimizing Errors ........................................................................................................................................................ 73
Self-Heating .............................................................................................................................................................. 73
Series Resistance with External Temperature Sensor ............................................................................................. 74
XPN Filter Capacitor Selection ................................................................................................................................. 74
XPN Layout Considerations ...................................................................................................................................... 74
Layout Consi derations .............................................................................................................................................. 75
Small Form-Factor Pluggable (SFP) Transceivers............................................................................................... 75
Power Suppl ies ......................................................................................................................................................... 75
Using the MIC3001 In a 5V System .......................................................................................................................... 75
Package Information ................................................................................................................................................... 76
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MIC3001
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List of Figures
Figure 1. MIC3001 Block Diagram ................................................................................................................................................... 17
Figure 2. Anal og-to-Digital Converter Block Diagram ....................................................................................................................... 18
Figure 3. RXPOT Block Diagram ..................................................................................................................................................... 22
Figure 4. MIC3001 APC and Modulation Control Block Diagram .................................................................................................... 22
Figure 5. Programmable Feedback Resi s tor .................................................................................................................................... 22
Figure 6. Transmitter Configurations Supported by MIC3001 ......................................................................................................... 23
Figure 7. VMOD Configured as Voltage Output with Gain ................................................................................................................. 23
Figure 9. Fault Comparator Logic..................................................................................................................................................... 25
Figure 10. Saturation Detector ......................................................................................................................................................... 26
Figure 11. RXLOS Comparator Logic .............................................................................................................................................. 26
Figure 12. Examples of LUTOFF Operati on ..................................................................................................................................... 29
Figure 13. Temperature Compensation Examples ........................................................................................................................... 30
Figure 14. Control and Status I/O Logic ........................................................................................................................................... 32
Figure 15. Transmitter ON-OFF Timing ........................................................................................................................................... 32
Figure 16. Initialization Timing with TXDISABLE Asserted .............................................................................................................. 32
Figure 17. Initialization Timing with TXDISABLE Not Asserted ........................................................................................................ 33
Figure 18. Loss-of-Signal (LOS) Ti m i ng ........................................................................................................................................... 33
Figure 20. Successfully Clearing a Fault Condition .......................................................................................................................... 34
Figure 21. Uns uccessful Attempt to Clear a Fault ............................................................................................................................ 34
Figure 22. Write Byte Protocol ......................................................................................................................................................... 36
Figure 23. Read Byte Protocol ......................................................................................................................................................... 36
Figure 24. Read_Word Protocol ....................................................................................................................................................... 36
Figure 25. Four-Byte Page_White Protocol ...................................................................................................................................... 37
Figure 26. Example APC Circuit for Common-Cathode TOSA ........................................................................................................
69
Figure 27. Example APC Circuit for Common Anode TOSA ............................................................................................................ 69
Figure 28. Slew Rate vs. CCOMP Value ............................................................................................................................................. 70
Figure 29. Open Loop Unity-Gain Bandwidth vs. CCOMP ................................................................................................................. 70
Figure 31. Controlling the SY88932 Modulation Current .................................................................................................................. 71
Figure 32. Controlling the SY89307 Modulation Current .................................................................................................................. 72
Figure 33. Controlling the Modulation Current via a Sink Current ................................................................................................... 72
Figure 34. Redundant Switch Circuits .............................................................................................................................................. 73
Figure 35. Guard Traces and Kelvin Return for Remote Thermal Diode ......................................................................................... 75
Figure 36. Typical SFP Control and Status I/O Signal Routing (not to scale) ................................................................................. 75
Figure 37. Power Supply Routing and Bypassing ............................................................................................................................ 75
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MIC3001
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List of Tables
Table 1. MIC3001 Address Map, Serial Address = A0h ................................................................................................ 15
Table 2. MIC3001 Address Map, Serial Address = A2h ................................................................................................ 15
Table 3. Temperature Compensation Tables, Serial Address = A4h ............................................................................ 15
Table 4. OEM Configuration Registers, Serial Address = A6h ...................................................................................... 16
Table 5. A/D Input Sig nal R anges and R esol uti ons ...................................................................................................... 18
Table 6. VAUX Input Signal Ranges and Resolutions ..................................................................................................... 18
Table 7. LSB Values of Offset Coefficients ................................................................................................................... 20
Table 8. Internal Cal ibrat io n Coef f icient Memory Map Part I ..................................................................................... 21
Table 9. Internal Calibration Coefficient Memory Map Part II .................................................................................... 21
Table 10. Shutdown State of SHDN vs. Configuration Bits ......................................................................................... 24
Table 11. Shutdown State of VBIAS vs. Configuration Bits ............................................................................................ 24
Table 12. Shutdown State of VMOD vs. Configur at ion Bits ............................................................................................ 24
Table 13. Temperature Compensation Look-up Tables, Serial Address I2CADR + 4h ............................................... 27
Table 14. APC Temperature Compensation Look-Up Table, Serial Address 12C ADR+4h ......................................... 28
Table 15. VMOD Temperature Compensation Look-Up Table, Serial Address 12C ADR+4h ........................................ 28
Table 16. IBIAS Comparator Temperature Compensation Look-Up Table, Serial Address 12C ADR+4h ...................... 28
Table 17. BIAS Current High Alarm Temperature Compensation Table, Serial Address 12C ADR+4h ....................... 28
Table 18. Range of Temperature Compensation Table vs. LUTOFF .......................................................................... 29
Table 19. MIC3001 Events ............................................................................................................................................ 31
Table 20. Power-On Hour Meter Result Format ........................................................................................................... 35
Table 21. Test and Diagnostic Features ....................................................................................................................... 35
Table 22. Typical Values for CCOMP ............................................................................................................................... 70
Table 23. Control Range of SY88912 Modulation Control Circuit ............................................................................... 71
Table 24. Transistors Suitable for Use as Remote Diodes .......................................................................................... 73
Table 25. Contributors to Self-Heating .......................................................................................................................... 74
Micrel, Inc.
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Pin Configuration
24-Pin QFN
Pin Description
Pin Number Pin Name Pin Function
1 FB Analog Input. Feedback voltage for the APC loop op-amp. Polarity and scale are
programmable via the APC configuration bits. Connect to VBIAS if APC is not used.
2 VMPD Analog Input. Multiplexed A/D converter input for monitoring transmitted optical power via
a monitor photodiode. In most applications, VMPD will be connected directly to FB. The
input range is 0 - VREF or 0 - VREF/4 depending on the setting of the APC configuration
bits
3 GNDA Ground return for analog functions.
4 VDDA Power supply input for analog functions.
5 VILD– Analog Input. Reference terminal for the multiplexed pseudo-differenti al A/D conv ert er
inputs for monitoring laser bias current via a sense resistor (VILD+ is the sensing input).
Tie to VDD or GND to reference the voltage sensed on VILD+ to VDD or GND
respectively. Limited common-mode voltage range, see “Applications Information” section
for more details.
6 VILD+ Analog Input. Multiplexed A/D input for monitoring laser bias current via a sense resistor
(signal input); accommodates inputs referenced to VDD or GND (see pin 5 description).
Limited common-mode voltage range, see “Applications Information” section for more
details.
7 SHDN (TXFIN) Digital output; Programmable polarity. When used as shutdown output (SHDN), as s erted
at the detection of a fault condition that can be us ed to activate a second series transistor
in the laser current path, enhancing protection against single-point failure s. When
programmed as TXFIN, it is an input for external fault signals to be ORed with the internal
fault sources to drive TXFAULT.
8 SHDN (TXFIN) Analog Input. Multiplexed A/D converter input for monitoring received optical power. The
input range is 0 to VREF. A 5-bit programmable EEPOT on this pin provides for coarse
calibration and ranging of the RX power measurement.
9 XPN Analog Input/Output. Optional c onnection to an external PN junction for sensing
temperature at a remote location. The Zone bit in OEMCFG1 determines whether
temperature is measured using the on-chip sensor or the remote PN junction.
10 TXFAULT Digital Output; Open-Drain. A high level indi c ates a hardware fault impeding transmitter
operation. The state of this input is always reflected in the TXFLT bit.
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Pin Description
Pin Number Pin Name Pin Function
11 TXDISABLE Digital Input; Active High. The transmitter is disabled when thi s line is high or the STXDIS bit
is set. The s tate of this input is always reflected in the TXDIS bit.
12 DATA Digital I/O; Open-drain. Bi-dire ctio nal ser ial data input/output.
13 CLK Digital Input; Serial bit cl ock input.
14 VIN If bit 4 (IE) in USRCTL register is set to 0 (default), this pin is configured as analog input. If
IE bit is set to 1, this pin is configured as open-drain outp ut. Analo g Input: Multiplexed A/D
input for monitoring supply voltage. 0V to 5.5V input range. Open-drain output: outputs the
internally generated interrupt signal /INT.
15 RSIN Digital Input; Rate Select Input; ORed with rate select bit to determine the stat e of the
RSOUT pin. The state of this pin is always reflected in the RSEL bit.
16 GNDD Ground return for digital functions.
17 NC No connection. This pin is used for test purposes and must be left unconnected.
18 VDDD Power supply input for digital func tions.
19 RXLOS Digital Output; Active-High/Open-Drain. Indicates the loss of the received signal as indicated
by a level of received optical power below the programmed RXLOS comparator threshold;
may be wire-ORed with external signals. Low indicates normal operation. RXLOS is de-
asserted when VRX > LOSFLTn. The LOS bit reflects the state of RXLOS whether driven by
the MIC3001 or an external circuit.
20 RSOUT (GPO) Digital Output. Open-Drain or push-pull. When used as rate select output, this output is
controlled by the SRSEL bit ORed with RSIN input and is open drain only. When used as a
general-purpose, non-volatile output, it is controlled by the GPO configuration bits in
OEMCFG3.
21 COMP Analog Output, compensation terminal. Connect a capacitor between this pin and GNDA or
VDDA with appropriate value to tune the APC loop time constant to a desirable value.
22 VBIAS Analog Output. Buffered DAC output capable of sourcing or sinking up to 10mA under
control of the APC function to drive an external transistor for laser diode D.C. bias. The
output and feedback polarity are programmable to accommodate either a NPN or an PNP
transist or to drive a comm on-a node or com mon-cathode laser diode.
23 VMOD Analog Input. Inverting terminal of VMOD buffer op-amp. Connect to VMOD+ (gain = 1) or
feedback resi stors network to set a different gain
24 VMOD+ Analog Output. Buffered DAC output to set the modulation current on the laser driver IC.
Operates with either a 0– VREF or a (VDDVREF) – VDD output swing so as to generate
either a ground-referenced or a VDD referenced programmed voltage. A simple external
circuit can be used to generate a programmable current for those drivers that require a
current rather than a voltage input. See “Applications Infor ma tion” se ctio n for mor e detail s.
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Absolute Maximum Ratings(1)
Power Supply Voltage, VDD ................................. +3.8V
Voltage on CLK, DATA, TXFAULT, VIN, RXLOS,
DISABL E, RSIN ................................. –0.3V to +6.0V
Voltage On Any Other Pin ............... 0.3V to VDD+0.3V
Power Dissipation, TA = 85°C ............................... 1.5W
Junction Temperature (TJ) .................................. 150°C
Storage Temperature (TS) .................. 65°C to +150°C
ESD Ratings(3)
Human Body Model ............................................. 2kV
Machine Mod el .................................................. 300V
Soldering (20sec) .................................................260ºC
Operating Ratings(2)
Power Supply Voltage, VDDA/VDDD ..... +3.0V to +3.6V
Ambient Temperature Range (TA) ... 40°C to +105°C
Package Thermal Resistance
QFN (θJA) ............................................... 43°C/W
Electrical Characteristics
For typical values, TA = 2 5°C, VDDA = VDDD = +3.3V, unless otherwise noted. Bold values are guaranteed for +3.0V
(VDDA = VDDD) ≤ 3.6V, T(min) ≤ TA ≤ T(max)(8)
Symbol Parameter Condition Min Typ Max Units
Power Supply
IDD Supply Current CLK = DATA = VDDD = VDDA;
TXDISABLE low; all DACs at full-scale;
all A/D inputs at full-scale; all o t her pins
open.
2.3 3.5 mA
CLK = DATA = VDDD = VDDA;
TXDISABLE high; FLTDAC at full-scale;
all A/D inputs at full-scale; all other pins
open.
2.3 3.5 mA
VPOR Power-on Reset Voltage All registers reset to default values;
A/D conversions initiated. 2.9 2.98 V
VUVLO Under-Voltage Loc k out Threshold Note 5 2.5 2.73 V
VHYST Power-on Reset Hysteresis Voltage 170 mV
tPOR Power-on Reset Time VDD > VPOR(4) 50 µs
VREF Reference Voltage 1.210 1.225 1.24
0 V
VREF/VDDA Voltage Reference Line Regulation 1.7 mV/V
Temperature-to-Digital Converter Characteristics
Local Temperature Measurement
Error 40°C ≤ TA ≤ +105°C(6) ±1 ±3 °C
Remote Temperature
Measurement Error 40°C ≤ TA ≤ +105°C(6) ±1 ±3 °C
tCONV Conversion Time Note 4 60 ms
tSAMPLE Sample Period 100 ms
Remote Temperature Input, XPN
IF Current to External Diode(4) XPN at high level, clamped to 0.6V. 192 400 µA
XPN at low level, clamped to 0.6V. 7 12 µA
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Voltage-to-Digital Converter Characteristics (VRX, VAUX, VBIAS, VMPD, VILD±)
Symbol Parameter Condition Min Typ Max Units
Voltage Measurement Error 40°C ≤ TA ≤ +105°C(6) ±1 ±2.0 %fs
tCONV Conversion Time Note 4 10 ms
tSAMPLE Sample Period Note 4 100 ms
Voltage Input, VIN (Pin 14 used as an ADC Input)
VIN Input Voltage Range 0.3 VDD ≤ 3.6V GNDA 5.5 V
ILEAK Input Current VIN = VDD or GND; VAUX = VIN 55 µA
CIN nput Capacitance 10 pF
Digital-to-Voltage Converter Characteristics (VMOD, VBIAS)
Accuracy 40°C ≤ TA ≤ +105°C(6) ±1 2.0 %fs
tCONV Conversion Time Note 4 20 ms
DNL Differential Non-linearity Error Note 4 ±0.5 ±1 LSB
Bias Current Sense Inputs, VILD+, VILD
VILD Differ ential Input Signal Range,
| VILD+ – VILD | 0 VREF/4 mV
IIN+ VILD+ input current ±1 µA
IIN VILD input current
| VILD+ – VILD | = 0.3V
VILD referred to VDDA +150 µA
VILD referred to GND -150 µA
CIN Input Capacitance 10 pF
APC Op Amp, FB, VBIAS, COMP
GBW Gain Bandwidth Product CCOMP = 20pF; Gain = 1 1 MHz
TCVOS Input Offset Voltage Temperature
Coefficient(4) 1 µV/°C
VOUT Output Voltage Swing IOUT = 10mA, SRCE bit = 1 GNDA 1.25 V
IOUT = -10mA, SRCE bit = 0 VDDA -1.25 VDDA V
ISC Output Short-Circuit Current 55 mA
tSC Short Circuit Withstand Time TJ 150°C(4) sec
PSRR Power Supply Rejection Ratio CCOMP = 20pF; Gain = 1, to GND 55 dB
CCOMP = 20pF; Gain = 1, to VDD 40
AMIN Minimum Stable Gain CCOMP = 20pF, Note 4 1 V/V
V/t Slew Rate CCOMP = 20pF; Gain = 1 3 V/µs
RFB Intern al Feedba ck Resist or Toler ance ±20 %
RFB/t Internal Feedback Resistor
Temperature Coeffici ent 25 ppm/C
ISTART Laser Start-up Current Magnitude START = 01 h 0.375 mA
START = 02h 0.750 mA
START = 04h 1.500 mA
START = 08h 3.000 mA
CIN Pin Capacitance 10 pF
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Electrical Characteristics
Symbol Parameter Condition Min Typ Max Units
VMOD Buffer Op -Amp, VMOD+, VMOD
GBW Gain Bandwidth CCOMP = 20pF; Gain = 1 1 MHz
TCVOS Input Offset Voltage
Temperature Coeffici ent 1 µV/°C
IBIAS VMODInput Current ±0.1 ±1 µA
VOUT Output Voltage Swing IOUT = ±1mA GNDA+75 VDDA-75 mV
ISC Output Short-Circuit Current 35 mA
tSC Short Circuit Withstand Time TJ 150°C(4) sec
PSRR Power Supply Rejection Ratio CCOMP = 20pF; Gain = 1, to GND 65 dB
CCOMP = 20pF; Gain = 1, to VDD 44 dB
AMIN Minimum Stable Gain CCOMP = 20pF 1 V/V
V/T Slew Rate CCOMP = 20pF; Gain = 1 1 V/µs
CIN Pin Capacitance 10 pF
Control and Status I/O, TXDISABLE, TXFAULT, RSIN, RSOUT(GPO), SHDN(TXFIN), RXLOS, /INT
VIL Low Input Voltage 0.8 V
VIH High Input Voltage 2.0 V
VOL Low Output Voltage IOL ≤ 3mA 0.3 V
VOH High Output Voltage
(applies to SHDN only) IOH ≤ 3mA VDDD0.3 V
ILEAK Input Current ±1 µA
CIN Input Capacitance 10 pF
Transmit Optical Power Input, V
MPD
VIN Input Voltage Range Note 4 GNDA VDDA V
VRX Input Signal Range BIASREF=0 VREF V
BIASREF=1 VDDAVREF VDDA V
CIN Input Capacitance Note 4 10 pF
ILEAK Input Current ±1 µA
Received Optical Power Input, VRX, RXPOT
Input Voltage Range Note 4 GNDA VDDA V
VRX Valid Input Signal Range
(ADC Input Range) 0 VREF V
RRXPOT(32) End-to-End Resistance RXPOT = 1Fh 32 K
RXPOT Resistor Tolerance ±20 %
RXPOT/T Resistor Temperature
Coefficient 25 ppm/C
VRX/VRXPOT Divider Ratio Accuracy 00 ≤ RXPOT ≤ 1Fh -5 +5 %
ILEAK Input Current RXP OT = 0 (disconnected) ±1 µA
CIN Input Capacitance Note 4 10 pF
ILEAK Input Current ±1 µA
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Electrical Characteristics
Symbol Parameter Condition Min Typ Max Units
Control and Sta tus I/O Timing, TXFAULT, TXDISABLE, RSIN, RSOUT, and RXLOS
tOFF TXDISABLE Asse rt Time From input asserted to optical output
at 10% of nominal, CCOMP = 10nF. 10 µs
tON TXDISABLE De-assert Time From input de-asserted to opti cal
output at 90% of nominal, CCOMP =
10nF.
1 ms
tINIT Initialization Time From power on or transmitter enabled
to optical output at 90% of nominal
and TX_FAULT de-asserted.(4)
300 ms
tINIT2 Power-on Initialization Time From power on to APC loop enabled. 200 ms
tFAULT TXFAULT Assert Time From fault condition to TXFAULT
assertion.(4) 95 µs
tRESET Fault Reset Time Length of time TXDISABLE must be
asserted to reset fault condi tion. 10 µs
tLOSS_ON RXLOS Assert Time From loss of signal to RXLOS
asserted. 95 µs
tLOSS_OFF RXLOS De-assert Time From signal ac quisition to LOS de-
asserted. 100 µs
tDATA Analog Param eter Data Ready From power on to valid analog
parameter data avail abl e.(4) 400 ms
tPROP_IN TXFAULT, TXDISABLE, RXLOS,
RSIN Input Propagation Time Time from input change to
corresponding internal regis ter bit set
or cleared.(4)
1 µs
tPROP_OUT TXFAULT, RSOUT, /INT Output
Propagation Time From an internal re gi ster bit se t or
cleared to corresponding output
change.(4)
1 µs
Fault Comparators
φFLTTMR Fault Suppression Ti m er Clock
Period Note 4 0.475 0.5 0.525 ms
Accuracy -3 +3 %/F.S.
tREJECT Glitch Rejection Maximum length pulse that will not
cause output to change stat e. (4) 4.5 µs
VSAT Saturation Detection Threshold High level 95 %VDDA
Low level 5 %VDDA
Power-On Hour Meter
Timebase Accuracy 0°C ≤ TA ≤ +70°C(4) +5 -5 %
40°C ≤ TA ≤ +105°C +10 -10 %
Resolution Note 4 10 hours
Non-Volatile (FLASH) Memory
tWR Write Cyc le Time(7) From STOP of a one to four-byte write
transaction.(4) 13 ms
Data Retention 100 years
Endurance Minimum Permitted Number
Write Cycles 10,000 cycles
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Serial Data I/O Pin, Data
Symbol Parameter Condition Min Typ Max Units
VOL Low Output Voltage IOL = 3mA 0.4 V
IOL = 6m A 0.6 V
VIL Low Input Voltage 0.8 V
VIH High Input Voltage 2.1 V
ILEAK Input Current ±1 µA
CIN Input Capacitance Note 4 10 pF
Serial Clock Input, CLK
VIL Low Input Voltage 2.7V ≤ VDD ≤ 3.6V 0.8 V
VIH High Input Voltage 2.7V ≤ VDD ≤ 3.6V 2.1 V
ILEAK Input Current ±1 µA
CIN Input Capacitance Note 4 10 pF
Serial Interf ace Timing(4)
t1 CLK (clock) Period 2.5 µs
t2 Data In Setup Time to CLK High 100 ns
t3 Data Out Stable After CLK Low 300 ns
t4 Data Low Setup Time to CLK
Low Start Condi tion 100 ns
t5 Data High Hold Time After CLK
High Stop Condition 100 ns
tDATA Data Ready Time From power on to completion of one
set of ADC conversions; analog data
available via ser ial int erf a ce.
400 ms
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to functi on outside its operat i ng rating.
3. Devices are ESD sensitive. Handling
4. precauti ons rec ommended.
5. Guaranteed by desi gni ng and/or testing of related parameters. Not 100% tested in production.
6. The MIC3000 will att empt to enter its shutdown stat e when VDD falls below VUVLO. This operation requires time to complete. If the supply
voltage falls too rapidl y, the operation may not be completed.
7. Does not include quanti zation error.
8. The MIC3001 will not respond to serial bus transactions during an EEPROM write-cycle. The host will receive a NACK during tWR.
9. Final t est on outgoing product is performed at TA = +25°C.
Micrel, Inc.
MIC3001
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Timing Diagram
Serial Interf ace Timing
Micrel, Inc.
MIC3001
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Address Map
Address(s) Field Size
(Bytes) Name Description
0 –95 96 Serial ID defined by SEP MSA G-P NVRAM; R/W under valid OEM password.
96 127 32 Vendor Specific Vendor specific EEPROM
128 255 128 Reserved Reserved for future use. G-P NVRAM; R/W under valid
OEM password.
Table 1. MIC3001 Address Map, Serial Address = A0h
Address(s) Field Size
(Bytes)
HEX DEC Name Description
00-27 0-39 40 Alar m and Warning
Threshold High/low limits for warning and alarms; writeable using OEM p/w;
read-only otherwise.
28-37 40-55 16 Reserved Reserved do not write; reads undefined.
38-5B 56-91 36 Calibration Constants Numerical constants for external calibration; writeable using OEM
p/w; read-only otherwise.
5C-5E 92-94 3 Reserved Reserved do not write; reads undefined.
5F 95 1 Checksum G-P NVRAM; writeable using OEM p/w; ready only otherwi se.
60-69 96-105 10 Analog Data Real time ana log par a met er data.
6A-6D 106-109 4 Reserved Reserved do not write; reads undefined.
6E 110 1 Control/Status Bits Control and sta tus bit s.
6F 111 1 Reserved Reserved do not write; reads undefined.
70-71 112-113 2 Alarm Flags Alarm status bit s; read only .
72-73 114-115 2 Reserved Reserved do not write; reads undefined.
74-75 116-117 2 Warning Flags Warning status bits; read o nly.
76-77 118-119 2 Reserved Reserved do not write; reads undefined.
78-7B 120-123 4 OEMPW OEM password entry field.
7C-7F 124-127 4 Vendor Specific Vendor specif ic. Res erv ed do not write; reads undefined.
80-F7 128-247 120 User Scratchpad User writeable EEPROM. G-P NVRAM; R/W using any valid
password.
F8-F9 248-249 2 Reserved Reserved do not write; reads undefined.
FA 250 1 USRPWSET User password setting; read/write using any p/w; returns zero
otherwise.
FB 251 1 USRPW Entry field for user password.
FC-FD 252-253 2 POH Power-on hour meter result; ready only.
FE 254 1 Data Ready Flags Data ready bits for each measured parameter; read only.
FF 255 1 User Control End-user control and status bits .
Table 2. MIC3001 Address Map, Serial Address = A2h
Address(s) Field Size
(Bytes)
HEX DEC Name Description
00-3F 0-63 64 APCLUTn A.P.C temperature compensation L.U.T.
40-7F 64-127 64 MODLUTn VMOD temperature compensation L.U.T.
80-BF 128-191 64 IFLTUT Bias current fault thre sho ld tempera t ure co mpe nsa tion L.U. T .
C0-FF 192-255 64 EOLLUTn Bias current high alarm threshold temperature compensation L.U.T.
Table 3. Temperature Compensation Tables, Serial Address = A4h
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Address(s) Field Size
(Bytes)
HEX DEC Name Description
00 0 40 OEMCFG0 Control/status bit s
01 1 16 OEMCFG1 Control/status bit s
02 2 36 OEMCFG2 Control/status bit s
03 3 3 APCSET0 A PC setpoint 0
04 4 1 APCSET1 A PC setpoint 1
05 5 10 APCSET2 AP C setpoint 2
06 6 4 MODSET Nominal modulat ion DAC setp oint
07 7 1 IBFLT Bias current fault-c omparator threshold
08 8 1 TXPFLT TX power fault threshold
09 9 2 LOSFLT RX LOS fault-comparator threshold
0A 10 2 FLTTMR Fault comparator masking interval timer setting
0B 11 2 FLTMSK Fault source mask bits
0C-0F 12-15 2 OEMPWSET Password for access to OEM areas
10 16 4 OEMCAL0 OEM calibration register 0
11 17 4 OEMCAL1 OEM calibration register 1
12 18 120 LUTINDX Look-up table index read-back
13 19 2 RESERVED Reserved do not write; reads undefined.
14 20 1 APCDAC Reads back current APC DAC setting
15 21 1 MODDAC Reads back current modulation DAC setting
16 22 2 OEMREAD Reads back OEM calibration data
17 23 1 LOSFLTn LOS De-assert threshold
18 24 1 RXPOT RXPOT tap selection
19 25 1 OEMCFG4 I START selection bits
1A-1F 26-31 6 RESERVED Reserved do not write; reads undefined.
20-27 32-39 8 POHDATA Power-on hour meter scratchpad
28-47 40-71 32 RXLUT RX power calibration look-up table
48-49 72-73 2 RESERVED Reserved do not write; reads undefined.
4A-57 74-87 18 CAL Internal calibration slope/offset data
59-7D 88-125 37 RESERVED Reserved do not write; reads undefined.
7E-FD 126-253 128 SCRATCH OEM scratchpad area
FE 254 1 MFG_ID Manufacturer identification (Micrel = 42)
FF 255 1 DEV_ID Device and die revision
Table 4. OEM Configur atio n Reg ister s, Serial A ddr ess = A 6h
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MIC3001
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Block Diagram
Figure 1. MIC3001 Block Diagram
MIC3000 Capability
In general, the MIC3001 is completely hardware and
software backward compatible with the MIC3000. Every
feature available in the MIC3000 is still present in the
MIC3001. New features have, of course, been added.
The following differences between the MIC3000 and
MIC300 1 w oul d b e evide nt to ho st so ftw a re:
1. Faults do not set alarm or warning bits as in the
MIC3000.
2. RXOPI at register address 69h at serial address
x2h now contains four bits of data rather then
being fixed at zero as in the MIC3000.
Analog-to-Digital Converter/Signal Monitoring
A block diagram of the monitoring circuit is shown below.
Each of the five analog parameters monitored by the
MIC3001 are samp led in sequence. All five parameters are
sampled and the results updated within the tCONV internal
given in the “Electrical Characteristics” section. In OEM,
Mode, the channel that is normally used to measure VIN
may be assigned to measure the level of the VDDA pin or
one of five other nodes. This provides a kind of analog
loopback for debug and test purposes. The VAUX bits in
OEMCFG0 control which voltage source is being sampled.
The various VAUX channels are level-shifted differently
depending on the signal source, resulting in different LSB
value s and signal ranges . See Table 5.
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MIC3001
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Figure 2. Analog-to-Digital Converter Block Diagram
Channel ADC Resolution
(bits) Conditions Input Range (V) LSB(1)
TEMP 8 N/A 1°C
VAUX 8 See Table 6
VMPD 8 GAIN = 0; BIASREF = 0 GNDA - VREF 4.77mV
GAIN = 0; BIASREF = 1 VDDA – (VDDA – VREF)
GAIN = 1; BIASREF = 0 GNDA - VREF/4 1.17mV
GAIN = 1; BIASREF = 1 VDDA – (VDDA – VREF/4)
VILD 8 VILD- = VDDA VDDA – (VDDA – VREF) 4.77mV
VILD- = GNDA GNDA - VREF
VRX 12 RXP OT = 00 0 - VREF 0.298mV
Table 5. A/D Input Signal Ranges and Resolutions
Note:
1. Assum es typic al VREF value of 1.22V.
Channel VAUX [2:0] Input Range (V) LSB(1) (mV)
VIN 000 = 00h 0.5V to 5.5V 25.6mV
VDDA 0001 = 01h 0.5V to 5.5V 25.6mV
VBIAS 010 = 02h 0.5V to 5.5V 25.6mV
VMOD 011 = 03h 0.5V to 5.5V 25.6mV
APCDAC 100 = 04h 0V to VREF 4.77mV
MODDAC 101 = 05h 0V to VREF 4.77mV
FLTDAC 110 = 06h 0V to VREF 4.77mV
Table 6. VAUX Input Signal Ranges and Resolutions
Note:
1. Assumes typical VREF value of 1.22V.
Micrel, Inc.
MIC3001
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Interna l/External Calibration
The default mode of calibration in the MIC3001 is
external calibration, for which INTCAL bit (bit 0 in
OEMCF3 register) is set to 0. This mode is backward
compatible with MIC3000. The internal calibration mode
is selected by setting INTCAL bit to 1.
A/ External Calibration
The voltage and temperature values returned by the
MIC3001’s A/D converter are internally calibrated. The
binary values of TEMPh:TEMPl and VOLTh:VOLTl are
in the format called for by SFF-8472 under Internal
Calibration.
SFF-8472 calls for a set of calibration constants to be
stored by the transceiver OEM at specific non-volatile
memory locations, refer to SFF-8472 specifications for
memory map of calibration coefficient. The MIC3001
provides the non-volatile memory required for the
storage of these constants. The Digital Diagnostic
Monitoring Interface specification should be consulted for
full details. Slopes and offsets are stored for use with
voltage, temperature, bias current, and transmitted
power measurements. Coefficients for a fourth-order
polynomial are provided for use with received power
measurements. The host system can retrieve these
constants and use them to process the measured data.
Since voltage and temperature require no calibration, the
corresponding slopes should generally be set to unity
and th e o ffse t s t o z er o.
Voltage
The voltage values returned by the MIC3001’s A/D
converter are internally calibrated. The binary values of
VOLTh:VOLTl are in the format called for by SFF-8472
under Internal Calibration. Since VINh:VINl requires no
processing, the corresponding slope should be set to
unity and the offset to zero.
Temperature
The temperature values returned by the MIC3001’s A/D
converter are internally calibrated. The binary values of
TEMPh:TEMPl are in the form at called for b y SFF-8472
under I nt erna l C a l ib ra t io n. S i nc e T E M P h:TEMPl requi r es
no pr ocess ing, the c orresp ond ing sl ope s hould be set to
unity an d the offset to zero.
Bias Current
Bias current is sensed via an external sense resistor as
a voltage appearing at VILD+ and VILD-. The value
returned by the A/D is therefore a voltage analogous to
bias current. Bias current, IBIAS, is simply VVILD/RSENSE.
The binary value in IBIASh (IBIASl is always zero) is
relat ed to bias cu rrent by:
(1)
The value of the least significant bit (LSB) of IBIASh is
given by :
(2)
Per SFF-8472, the va lue of the b ias curr ent L SB is 2 µA.
The conversion factor, “slope”, needed is therefore:
The tolerance of the sense resistor directly impacts the
accuracy of the bias current measurement. It is
recommended that the sense resistor chosen be 1%
accurate or better. The offset correction, if needed, can
be determ ined by shutting d own the las er, i.e. , assert ing
TXDISABLE, and measuring the bias current. Any non-
zero result gives the offset required. The offset will be
equal and opposite to the result of the “zero current”
measurement.
TX Power
Transmit power is sens ed via an exter nal se nse res ist or
as a vo ltage app earin g at VMPD. It is as sumed t hat this
voltage is generated by a sense resistor carrying the
monitor photodiode current. In most applications, the
signal at VMPD will be feedback voltage on FB. The
VMPD voltage may be measured relative to GND or
VDDA depending on the setting of the BIASREF bit in
OEMC F G1 . The val u e r et urned by th e A /D is th er efor e a
voltage analogous to tr ansmit power. T he binary value in
TXOPh (TXOPl is always zero) is related to transmit
power by :
(3)
For a given implementation, the value of RSENSE is
kno wn. I t is e it h er th e v alue of th e ext ern al res is t or or t he
chosen value of RFB used in the application. The
constant, K, will likely have to be determined through
exper im ent at ion or cl osed -loop c al ibra tion, as it de pends
on the monitoring photodiode responsivity and coupling
efficiency.
It should be noted that the APC circuit acts to hold the
trans mit ted po wer cons tant. The val ue of tr ansm it powe r
reported by the circuit should only vary by a small
amount as long as APC is functioning correctly.
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RX Power
Received power is sensed as a voltage appearing at
VRX. It is assumed that this voltage is generated by a
sense resistor carrying the receiver photodiode current.
The value returned by the A/D is therefore a voltage
analogous to received power. The binary value in
RXOPh (RXOPl is always zero) is related to received
power by :
(4)
For a given implementation, the constant, K, will likely
have to be determined through experimentation or closed-
loop calibration, as it depends on the gain and efficiencies
of the components upstream. In SFF-8472
implementations, the external calibration constants can
describe up to a fourth-order polynomial in case K is
nonlinear.
B/ Internal Calibration
If the INTCAL bit in OEMCFG3 is set to 1 (internal
calibration selected), the MIC3001 will process each
piece of data coming out of the A/D converter before
storing the result in memory. Linear slope/offset correction
will be applied on a per-channel basis to the measured
value s fo r volt age , bia s cu rren t, TX pow e r, and RX pow er.
Only offset correction is applied to temperature.
The user must store the appropriate slope/offset
parameters in memory at the time of transceiver
calibration. In the case of RX power, a look-up table is
provided that implements eight-segment piecewise-linear
correction. This correction may be performed as
temperature compensation or as simple slope/offset
corr ection . If static slope/of fset c orrect ion for RX power is
desir ed, t h e eight coef f ici ent s ets ca n sim p l y be made t h e
same. The memory maps for these coefficients are
shown in Table 8 and Table 9.
The slopes allow for the correction of gain errors. Each
slope coefficient is an unsigned, sixteen-bit, fixed-point
binary number in the format:
[mmmmmmmm.l l l llll l ], whe re m i s a da ta bi t (5)
in the most-signifi cant by te an d l i s a dat a
bit in th e least sig nifi cant byte
Slopes are al ways positive. The binary point is in between
the two bytes, i.e., between bits 7 and 8. This provides a
numerical range of 1/256 (0.00391) to 255 in steps of
1/256. The most significant byte is always stored in
memory at the lower numerical address.
The offsets correct for constant errors in the measured
data. Each offset is a signed, sixteen-bit, fixed-point
binary number. The bit-weights of the offsets are the
same as that of the final results. In the case of
temperature, the offset’s least significant byte (LSB) is
always zero since the MIC3001 does not deal with
fractional temperature values. The sixteen bit offsets
provide a numerical range of 32768 to +32767 for
voltage, bias current, transmit power, and receive power.
The numerical range for the temperature offset is 32513
(–128°) to +32512 (+127°) in increments of 256 (1°). The
format for offsets is:
[Smmmmmmmll lll lll] , where S i s the sign bit (6)
(1 = posi tive, 0 = negati ve ), m is a data bit in
the most-signific ant byte and l is a da ta bit in
the l eas t signi fi ca nt by te
The m ost sig nifica nt b yte is a lwa ys store d in mem ory at th e
lower numerical address.
Calibration of voltage, bias current, and TX power are
performed using the following calculation:
RESULTn = ADC_RESULTn x SLOPEn + (7)
OFFSETn
Calibration of temperature is performed using the following
calculation:
RESULT = ADC_RESULT + OFFSET (8)
Calibration of RX power is performed using the following
calculation:
RESULT = ADC_RESULT x SLOPE(m) + (9)
OFFSET(m)
where m is the appropriate value from the RX power
calibration look-up tabl e .
The res u lts of thes e ca lc ula ti ons ar e ro und ed t o six tee n bits
in len gt h. If t h e se ve nt e enth mos t si gn ifica nt bi t is a one, the
result is rounded up to the next higher value. If the
seventeenth most significant bit is zero, the upper sixteen
bits remain unchanged. The bit-weights of the offsets are
the same as that of the final results. For SFF-8472
compatible applications, these bit-weights are given in Table
7.
Parameter Magnitude of LSB
Temperature 1.0°C(1)
Voltage 100µV
Bias Current 2µA
TX Power 0.1µW
RX P ower 0.1µW
Table 7. LSB Values of Offset Coefficients
Note:
1. The LSBytes of the temperat ure is always zero.
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Address(s) Field
Size
HEX DEC Name Description
48-49 72-73 2 RESERVED Reserved. (There is no slope for temperatur e.) D o not write; reads undefined.
4A-4B 74-75 2 TOFFh:TOFFl Temperature offset; signed fix ed point; LS B is always zero; MSB is at lower
physical address.
4C-4D 76-77 2 VSLPh:VSLPl Voltage slope; unsigned fix ed-point; MSB is at low er physical a ddr ess.
4E-4F 78-79 2 VOFFh:VOFFl Voltage offset; signed fixed point; MSB is at low er physical addr ess.
50-61 80-81 2 ISLPh:ISLPl Bias current slope; unsigned fixed-point; MSB is at lower phy sical address.
52-63 82-83 2 IOFFh:IOFFl Bias current offset; signed f ixed point; MSB is at lower physical address.
54-65 84-85 2 TXSLPh: TXSLPl TX power slope; unsigned fix ed-point; MSB is at lower physical address.
56-67 86-87 2 TXOFFh: TXOFFl TX pow er offset; signed fixed point; MSB is at low er physical addr ess.
Table 8. Internal Calibration Coefficient Memory Map Part I
Address(s) Field
Size
HEX DEC Name Description
28-29 40-41 2 RXSLP0h:
RXSLP0l RX power slope 0; unsigned fix ed-point; MSB is at lower phy sical address.
2A-2B 42-43 2 RXOFF0h:
RXOFF0l RX power offset 0; signed twos-complement; M SB is at lower physical
address.
2C-2D 44-45 2 RXSLP1h:
RXSLP1l RX power slope 1; unsigned fix ed-point; MSB is at lower phy sical address.
2E-2F 46-47 2 RXOFF1h:
RXOFF1l RX power offset 1; signed twos-complement; M SB is at lower physical
address.
30-31 48-49 2 RXSLP2h:
RXSLP2l RX power slope 2; unsigned fix ed-point; MSB is at lower phy sical address.
32-33 50-51 2 RXOFF2h:
RXOFF2l RX power offset 2; signed twos-complement; M SB is at lower physical
address.
34-35 52-53 2 RXSLP3h:
RXSLP3l RX power slope 3; unsigned fix ed-point; MSB is at lower phy sical address.
36-37 54-55 2 RXOFF3h:
RXOFF3l RX power offset 3; signed twos-complement; M SB is at lower physical
address.
38-39 56-57 2 RXSLP4h:
RXSLP4l RX power slope 4; unsigned fix ed-point; MSB is at lower phy sical address.
3A-3B 58-59 2 RXOFF4h:
RXOFF4l RX power offset 4; signed twos-complement; M SB is at lower physical
address.
3C-3D 60-61 2 RXSLP5h:
RXSLP5l RX power slope 5; unsigned fix ed-point; MSB is at lower phy sical address.
3E-3F 62-63 2 RXOFF5h:
RXOFF5l RX power offset 5; signed twos-complement; M S B is at low er physical
address.
40-41 64-65 2 RXSLP6h:
RXSLP6l RX power slope 6; unsigned fix ed-point; MSB is at lower phy sical address.
42-43 66-67 2 RXOFF6h:
RXOFF6l RX power offset 6; signed twos-complement; M SB is at lower physical
address.
44-45 68-69 2 RXOFF7h:
RXOFF7l RX power slope 7; signed twos-complement; M S B is at low er physical
address.
46-47 70-71 2 RXSLP7h:
RXSLP7l RX power slope 7; signed fixed-point; MSB is at low er phy sical address.
Table 9. Internal Cal ibr ati on Co effi cient Memory Map Part II
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C/ ADC Result Registers Reading
In the present revision of MIC3001, the ADC result
regis ters should be read as 16 bit regis ters under internal
cali brati on whi le und er ext erna l cali brati on the y shou ld be
read as 8 bit re gisters a t the MSB address. For exam ple,
TX power should be read under internal calibration as 16
bits at address A2h: 6667 and under external calibration
as 8 bits at address A2h: 66h.
RXPOT
A programmable, non-volatile digitally controlled
potentiometer is provided for adjusting the gain of the
receive power measurement signal chain in the analog
domain. Five bits in the RXPOT register are used to set
and adjust the position of potentiometer. RXPOT
functions as a programmable divider or attenuator. It is
adjustable in steps from 1:1 (no divider action) down to
1/32 i n steps of 1/32. If RXPO T is set t o zero , the div ider
is bypassed completely. There will be no scaling of the
input si g na l , a n d t he res is t or ne twork wil l be d isc onn ect ed
from the VRX pin. At all other settings of RXPOT, there
will be a 32k Ω (typical) load seen on VRX.
Figure 3. RXPOT Block Diagram
Laser Diode Bias Control
The MIC3001 can be configured to generate a constant
bias current using electrical feedback, or regulate average
transmitted optical power using a feedback signal from a
monitor photodiode, see Figure 4. An operational
ampl if i er is used to co n tr o l la ser b ias c ur re n t vi a th e VBIAS
output. The VBIAS pin can drive a maximum of ±10mA.
An external bipolar transistor provides current gain. The
polarity of the op amp’s output is programmable
BIASREF in OEMCFG1 in order to accommodate either
NPN or PNP transistors that drive common anode and
common cathode laser, respectively. Additionally, the
polarity of the feedback signal is programmable for use
with either common-emitter or emitter-follower transistor
circuits.
Furthermore, the reference level for the APC circuit is
selectable to ac c ommodate elec trica l , i. e. , c urrent feedback,
or optical feedback via a monitor photodiode. Finally, any
one of seven different internal feedback resistors can be
selected. This internal resistor can be used alone or in
parallel with an external resistor. This wide range of
adjustability (50:1) accommodates a wide range of
photodiode current, i.e, wide range of transmitter output
power. The APC operatin g point can be kept near the mid-
scale value of the APC DAC, insuring maximum SNR,
max imum ef f ec ti v e r eso lu t io n f or d i g it a l d i a gn ostics, and the
widest possible DAC adjustment range for temperature
compensation, etc. See Figure 5.
The APCCAL bit in OEMCAL0 is used to turn the APC
function on and off. It will be turned off in the MIC3001’s
defau lt stat e as shi pped fro m the fac tor y. W hen A PC is on ,
the va lue in the s elect ed APCSET x regis ter is ad ded to the
signed value tak en from the APC look -up table and loaded
into the VBIAS DAC. When APC is off, the VBIAS DAC may
be writ t en d irect ly via th e VBIAS regist er, b ypas sing th e l o ok-
up table entirely. This provides direct control of the laser
diode bias during setup and calibration. In either case, the
VBIAS DAC se tting is repor te d in the APCD AC reg ister . The
APCCFG bits determine the DACs response to higher or
lower numeric values.
Figure 4. MIC3001 APC and Modulation Control
Block Diagram
Figure 5. Programmable Feedback Resistor
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Laser Modulation Control
As shown in Figure 4, a temperature-compensated DAC
is pro v i d ed t o set a nd c o ntrol th e las er modu l at i o n c u r re n t
via an external laser driver circuit. MODREF in
OEMCFG0 selects whether the VMOD DAC output swings
up from ground or down from VDD. If the laser driver
requ ires a voltag e inp ut to s et the m odu latio n curr ent, th e
MIC3001’s VMOD output can drive it directly. If a current
input is required, a fixed resistor can be used between the
driver and the VMOD output. Several different
configurations are possibl e as shown in Figu re 7.
When APC is on, i.e., the APCCAL bit in OEMCAL0 is set
to 0, the value corresponding to the current temperature is
taken from the MODLUT look-up table, added to
MODS ET, and lo aded int o t he VMOD DAC . When A PC is
off, the value in VMOD is loaded directly into the VMOD
DAC, bypassing the look-up table entirely. This provides
for dir ect modu l at i on c ontro l f or set up and c a l i bra tion . The
MODR EF b it det ermin es th e DACs resp onse to hi gher o r
lower numeric values.
Figure 6. Transmitter Configurations
Supported by MIC3001
Figure 7. VMOD Configured as Voltage Output
with Gain
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Power ON and Laser Start-Up
When power is applied, the MIC3001 initializes its
internal registers and state m achine. This proc ess takes
tPOR, about 50ms. Following tPOR, analog-to-digital
conve rsio n s begin, se rial commun i cati on is po ssib le, and
the POR bit and data r eady bits may be polled. The first
set of analog data will be available tCONV after tPOR.
MIC3001s are shipped from the factory with the output
enab le bi t, OE , set t o zero, off. The MIC3001’s power-up
default state, therefore, is APC off, VBIAS, VMOD, and
SHDN outputs disabled. VBIAS, VMOD, and SHDN will
be floating (high impedance) and the laser diode, if
connected, will be off. Once the device is incorporated
into a tr ans ce iv er an d pr o per ly c onf igu red, t he s hut do wn
states of SHDN, VBIAS and VMOD will be determined
by the s ta te of the APC c onf i gur atio n a nd OE bits . T able
10, Table 11, and Table 12 illustrate the shutdown states
of the various laser control outputs versus the control
bits.
Configuration Bits Shutdown State
OE SPOL SHDN
0 Don’t Care Hi-Z
1 0 ≈GND
1 1 ≈VDD
Table 10. Shutdown State of SHDN vs.
Configuration Bits
Configuration Bits VBIAS Shutdown State
OE INV BIASREF VBIAS
0 Don’t Care Don’t Care Hi-Z
1 Don’t Care 0 ≈GND
1 Don’t Care 1 ≈VDD
Table 11. Shutdown State of VBIAS vs.
Configuration Bits
Configuration Bits VMOD Shutdown State
OE MODREF VMOD
0 Don’t Care Hi-Z
1 0 ≈GND
1 1 ≈VDD
Table 12. Shutdown State of VMOD vs.
Configuration Bits
In order to facilitate hot-plugging, the laser diode is not
turn ed o n u nt i l tINIT2 after po wer-on. Following tINIT2, and
assum ing T XDIS ABL E is no t ass erted, the D ACs will be
loaded with their initial values. Since tCONV is m uch less
than tINIT2, the first set of analog data, including
temperature, is available at tINIT2. Temperature
compensation will be applied to the DAC values if
enabled. APC will begin if OE is asserted. (If the output
enable bit, OE, is not set, the VMOD, VBIAS, and SHDN
outpu ts wil l float indefinitely.) Figure 8 shows the power-
up timing of the MIC3001. If TXDISABLE is asserted at
power-up, the VMOD and VBIAS outputs will stay in their
shutdown states following MIC3001 initialization. A/D
conversions will begin, but the laser will remain off.
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Figure 8. MIC3001 Power-On Timing (OE = 1)
Fault Compa rators
In add ition to detec tin g and r epor ting t he eve nts sp ecif ied
in SFF-8472, the MIC3001 also monitors five fault
conditions: inadequate supply voltage, thermal diode
faults, excessive bias current, excessive transmit power,
and APC op-amp saturation. Comparators monitor these
param eters in order to respon d quickl y to fault cond ition s
that c ould i ndica te link fai lure or s afet y issu es, s ee Figur e
9. When a fault is detected, the laser is shut down and
TXFAULT is asserted. Each fault source may be
independently disabled using the FLTMSK register.
FLTMSK is non-volatile, allowing faults to be masked only
during calibration and testing or permanently.
Figure 9. Fault Comparator Logic
Thermal diode faults are detected within the temperature
measurement subsystem when an out-of-range signal is
detec ted. A window c omparat or circu it mon itors th e voltag e
on the compensation capacitor to detect APC op-amp
saturation (Figure 10). Op-amp saturation indicates that
some fault has occurred in the control loop such as loss of
feedback. The saturation detector is blanked for a time,
tFLTTMR, following laser turn-on since the compensation
voltage will essentially be zero at turn-on. The FLTTMR
interval is programmable from 0.5ms to 127ms (typical) in
increments of 0.5ms (fFLTTMR). Note that a saturation
comparator cannot be relied upon to meet certain eye-
safety st a nd ar ds t ha t r e qu ire 10 0ms r espo ns e t imes . T hi s is
because the operation of a saturation detector is limited by
the loop bandwidth, i.e., the choice of CCOMP. Even if the
comparator itself was very fast, it would be subject to the
limited slew-rate of the APC op-amp. Only the other fault
comparator channels will meet <100ms timing
requirements.
The MIC3001 can also except and respond to fault inputs
from external devices. See “SHDN and TXFIN” section.
A similar comparator circuit monitors received signal
strength and asserts RXLOS when loss-of-signal is
detected (Figure 11). RXLOS will be asserted when and if
VRX drops below the level programmed in LOSFLT.
Hysteresis is implemented such that RXLOS will be de-
asserted when VRX subsequently rises above the level
programmed in LOSFLTn. The loss-of-signal comparator
may be disabled completely by setting the LOSDIS bit in
OEMCFG3. Once the LOS comparator is disabled, an
exter na l d evic e m a y driv e R XLO S. T he s ta te of th e RX LO S
pin is rep orted in the CN TRL reg ister regar dless of whet her
it is driven by the internal comparator or by an external
device. A programmable digital-to-analog converter
provides the comparator reference voltages for monitoring
received signal strength, transmit power, and bias current.
Glitches less than 10ms (typical) in length are rejected by
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the fault comparators. Since laser bias current varies
greatly with temperature, there is a temperature
com pens at ion l ook -up tab le f or the b ias curr e nt fa ult D AC
value.
When a fault condition is detected, the laser will be
immediately shutdown and TXFAULT will be asserted.
The VMOD, VBIAS, and SHDN (if enabled) outputs will be
driven to their shutdown state according to the state of the
configuration bits. The shutdown states of VMOD, VBIAS,
and SHDN versus the configuration bit settings are shown
in Table 10, Table 11 , and Table 12.
SHDN and TXFIN
SHDN and TXFIN are optional functions of pin 7. SHDN
is an out put f unc tio n and is des i gne d to dr ive a r edu nda nt
safety switch in the laser current path. TXFIN is an input
function and serves as an input for fault signals from
external devices that must be reported to the host via
TXFAULT. The SHDN function is designed for
applications in which the MIC3001 is performing all APC
and laser management tasks. The TXFIN function is for
situations in which an external device such as a laser
diode driver IC is performing laser management tasks,
including fault detection.
If the TXFIN bit in OEMCFG3 is zero (t he default mode),
SHDN will be activated anytime the laser is supposed to
be off. T h us , i t wi l l b e ac t i ve if 1) T X DISA BL E is as ser te d ,
2) STXDIS in CNTRL, is set, or 3) a fault is detected.
SHDN is a push-pull logic output. Its polarity is
prog rammabl e via the SPOL bit in OEMCFG1.
If TXFIN is set to one, pin 7 serves as an input that
accepts fault signals from external devices such as laser
diode driver ICs. Multiple TXFAULT signals cannot simply
be wir e-O Red t ogeth er as t he y are o pen-drai n and activ e
high. T he input po larit y is progr amm able via the TXFP OL
bit in OEMCFG3. TXFIN is logically ORed with the
MIC3001’s internal fault sources to produce TXFAULT
and determine the value of the transmit fault bit in
CNTRL. See Figu re 9 .
Figure 10. Saturation Detec tor
Figure 11. RXLOS Comparator Logic
Temperature Measurement
The temperature-to-digital converter for both internal and
exter na l tem per atur e da ta is bu ilt ar ou nd a s wi tc hed c urr ent
source and an eight-bit analog-to-digital converter. The
temper atur e is ca lculate d by measur ing the f orward vol tage
of a diode junction at two different bias current levels. An
internal multiplexer directs the current source’s output to
eith er an int e rnal or exte rn al diode jun cti on . The val ue of the
ZONE bit in OEMCFG1 determines whether readings are
taken from the on-chip sensor or from the XPN input. The
external PN junction may be embedded in an integrated
circuit, or it may be a diode-connected discrete transistor.
This data is also used as the input to the temperature
compensation look-up tables. Each time temperature is
sampled and an updated value acquired, new corrective
values for IMOD and the APC setpoint are read from the
corresponding tables, added to the set values, and
transferred to DACs.
Diode Faults
The MIC3001 is designed to respond in a failsafe manner to
hardware faults in the temperature sensing circuitry. If the
connection to the sensing diode is lost or the sense line is
shorted to VDD or gro und, th e temper ature da ta rep orted by
the A/D converter will be forced to its full-scale value
(+127°C). The diode fault flag, DFLT, will be set in
OEMCFG1, TXFAULT will be asserted, and the high
temperature alarm and warning flags will be set. The
reported temperature will remain +127°C until the fault
condition is cleared. Diode faults may be reset by toggling
TXDISABLE, as with any other fault. Diode faults will not be
detected at power up until the first A/D conversion cycle is
completed. Diode faults are not reported while TXDISABLE
is asserted.
Temperature Compensation
Since the performance characteristics of laser diodes and
photodiodes change with operating temperature, the
MIC3001 provides a facility for temperature compensation
of the A.P.C. loop setpoint, laser modulation current, bias
current fault comparator threshold, and bias current high
alarm flag threshold. Temperature compensation is
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performed using a look-up table (LUT) that stores values
corresponding to each measured temperature over a
128°C span. Four identical tables reside at serial address
A4h as summarized in Table 13. The range of
temper atur es sp anned b y the tables is program mable via
the LUTOFF register. Each table entry is a signed twos
complement number that is used as an offset to the
parameter being compensated. The default value of all
table entries is zero, giving a flat response.
The A/D converter reports a new temperature sample
each tCONV. This occurs at roughly 10Hz. To prevent
temperature oscillation due to thermal or electrical noise,
sixteen successive temperature samples are averaged
together and used to index the LUTs. Temperature
compensation results are therefore updated at 16xtCONV
intervals, or about 1.6 seconds. This can be ex pr es sed a s
shown i n Eq uat ion 10.
(10)
Each time an updated average value is acquired, a new
offset value for the APC setpoint is read from the
corresponding look-up table (see Table 14) and
transferred to the APC circuitry. This is illustrated in
Equat ion 11. I n a sam e way, ne w offset values are tak en
from similar look-up tables (see Table 15 and Table 16),
added to the nominal values and transferred into the
modulation and fault comparator DACs. The bias current
high a larm thr es hol d, is c om pens at ed us ing a f ourth look -
up table (see Table 17). This compensation happens
internally and does not affect any host-accessible
registers.
(11)
If the measured temperature is greater than the maximum
table value, the highest value in each table is used. If the
measured temperature is less than the minimum, the
minimum value is used. Hysteresis is employed to further
enhance noise immunity and prevent oscillation about a
table t hr es hold. Eac h ta ble entry spans t wo degr ees C . T he
table index will not change unless the new temperature
average resu lts in a table index be yond the midpoint of the
next entr y in either direction. There is therefore 2 to 3°C of
hysteresis on temperature compensation changes. The
table index will never oscillate due to quantization noise as
the hysteresis is much larger than ±1 ⁄2 LSB.
Byte Addresses Function
00h–3Fh APC Look-up Table
40h–7Fh IMOD Look-up Table
80h–BFh IFLT Look-up Table
C0h–FFh Bias High Alarm Look-up Table
Table 13. Temperature Compensation Look-up Tables,
Serial Address I2CADR + 4h
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Register
Address Table Offset Temperature
Offset (°C)
00h 0 0
1
01h 1 2
3
02h 2 4
5
3Eh 62 124
125
3Fh 63 126
127
Table 14. APC Temperature Compensation Look-Up
Table, Serial Address 12C ADR+4h
Register
Address Table Offset Temperature
Offset (°C)
40h 0 0
1
41h 1 2
3
42h 2 4
5
7Eh 62 124
125
7Fh 63 126
127
Table 15. VMOD Temperature Compensatio n Look-Up
Table, Serial Address 12C ADR+4h
Register
Address Table Offset Temperature
Offset (°C)
80h 0 0
1
81h 1 2
3
82h 2 4
5
8Eh 62 124
125
8Fh 63 126
127
Table 16. IBIAS Comparat or Temperature Compensation
Look-Up Table, Serial Address 12C ADR+4h
Register
Address Table Offset Temperature
Offset (°C)
C0h 0 0
1
C1h 1 2
3
C2h 2 4
5
FEh 62 124
125
FFh 63 126
127
Table 17. BIAS Current High Alarm Temperature
Compensation Table, Serial Address 12C ADR+4h
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The LUTOFF regist er deter mines the range of measured
temperatures that are actually spanned by the tables. The
temperature span of the tables versus the value of
LUTOFF is given in Table 18.
LUTOFF Temperature Span
tCOMP (min) – tCOMP (max)
00h 0°C to 127°C
01h 2°C to 125°C
02h 4°C to +123°C
0Fh 30°C to 97°C
Table 18. Range of Temperature Compensation
Table vs. LUTOFF
The internal state machine calculates a new table index
each time a new average temperature value becomes
available. This table index is derived from the average
temperature value and LUTOFF. The table index is then
converted into a table address for each of the four look-up
tables. These operations can be expressed as:
(12)
where TAVG(n) is the current average temperature; and
TABLE_ADDRESS=INDEX+BASE_ADDRES
where BASE_ADDRESS is the physical base address of
each table, i.e., 00h, 40h, 80h, or C0h (all ta b l es reside i n th e
I2CADR+4 page of memory).
At any given time, the current table index can be read in the
LUTINDX register.
Figures 12 and 13 illustrate the operation of the temperature
compensation tables.
Figure 12 is a graphical illustration of the use of the
LUTO FF re gist er to c ontr ol t he tem perat ure range spanned
by the temperature compensation tables. Note that, if the
LUTINDX becomes greater than 63 or less than zero, the
maximum or minimum table value is used, respectively. The
tabl es do not “roll over.
Figu re 1 3 ll ustra t es th at the tab l e v a l ues ar e used as of fs ets
to the nom inal v alue of the paramet er in qu estion . APCS ET
is used as an example, but all four tables function
identically. Note that the shape and magnitude of the
compensation curve do not change as the nominal value
changes.
Figure 12. Examples of LUTOFF Operation
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Figure 13. Temperature Compensation Examples
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Alarms and Warning Flags
There are twenty different conditions that will cause the
MIC3 0 01 t o set on e of t he bits i n th e WARNx or A LA R Mx
registers. These conditions are listed in Table 19. The
less critical of these events generate warning flags by
setting a bit in WARN0 or WARN1. The more critical
event s cau se bi ts t o be s et in ALA RM0 o r ALA RM1 .
An event occurs when any alarm or warning condition
becomes true. Each event causes its corresponding
status bit in ALARM0, ALARM1, WARN0, or WARN1 to
be set. This action cannot be masked by the host. The
status bit will remain set until the host reads that particular
status register, a power on-off cycle occurs, or the host
toggle s TXDISABLE.
If TXDISABLE is asserted at any time during normal
operation, A/D conversions continue. The A/D results for
all parameters will continue to be reported. All events will
be reported in the normal way. If they have not already
been individually cleared by read operations, when
TXDISABLE is de-asserted, all status registers will be
cleared.
Control an d Status I/O
The l ogic f or the tra nsc ei ver c ontr ol a nd s tat us I/O is s ho wn
schematicall y in Figure 14. Note that the internal drivers on
RXLO S , R ATE_S E L ECT, a nd T X F AU LT are a ll op e n-drain.
These signals may be driven either by the internal logic or
external drivers connected to the corresponding MIC3001
pins. In any case, the signal level appearing at the pins of
the MIC3001 will be reported in the control register status
bits.
Note that the control bits for TX_DISABLE and
RATE_SELECT and the status bits for TXFAULT and
RXLOS do not meet the timing requirements specified in the
SFP MSA or the GBIC Specification, revision 5.5 (SFF-
8053) for the hardware signals. The speed of the serial
interface limits the rate at which these functions can be
manipulated and/or reported. The response time for the
control and status bits is given in the “Electrical
Characteristics” section.
Event Condition MIC3001 Response
Temperature high alarm TEMP > TMAX Set ALARM0[7]
Temperature low alarm TEMP < TMIN Set ALARM0[6]
Voltage high alarm VIN > VMAX Set ALARM0[5]
Voltage low alarm VIN < VMIN Set ALARM0[4]
TX bias high alarm I BI AS > I BMAX Set ALARM0[3]
TX bias low alarm IBIAS < IBMIN Set ALARM0[2]
TX power high alarm TXOP > TXMAX Set ALARM0[1]
TX power low alarm TXOP < TXMIN Set ALARM0[0]
RX power high alarm RXOP > RXMAX Set ALARM1[7]
RX power low alarm RXOP < RXMIN Set ALARM1[6]
Temperature high warning TEMP > THIGH Set WARN 0[7]
Temperature low warning TEMP < TLOW Set WARN0[6]
Voltage high warning VIN > VHIGH Set WARN0[5]
Voltage low warning VIN < VLOW Set WARN0[4]
TX bias high warning IBIAS > IBHIGH Set WARN0[3]
TX bias low warning IBI AS < IBLOW Set WARN0[2]
TX power high warning TXOP > TXHIGH Set WARN0[1]
TX power low warning TXOP < TXLOW Set WARN0[0]
RX power high warning RXOP > RXHIGH Set WARN1[7]
RX power low warning RXOP < RXLOW Set WARN1[6]
Temperatur e high alarm TEMP > TMAX Set ALARM0[7]
Table 19. MIC3001 Ev ents
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Figure 14. Control and Status I/O Logic
System Timing
The timing specifications for MIC3001 control and status I/O are given in the “Electrical Characteristics” section.
Figure 15. Transmitter ON-OFF Timing
Figure 16. Initialization Timing with TXDISABLE Asserted
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Figure 17. Initialization Timing with TXDISABLE Not Asserted
Figure 18. Loss-of-Signal (LOS) Timing
Figure 19. Transmit Fault Tim ing
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Figure 20. Successfully Clearing a Fault Condition
Figure 21. Unsuccessful Attempt to Clear a Fault
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Warm Resets
The MIC3001 can be reset to its power-on default state
during operation by setting the reset bit in OEMCFG0.
When this bit is set, TXFAULT and RXLOS will be de-
asserted, all registers will be restored to their normal
power-on default values, and any A/D conversion in
progress will be halted and the results discarded. The
state of the MIC3001 following this operation is
indistinguishable from a power-on reset.
Power-On Hour Meter
The Pow er-On Ho ur met er l ogs op erat ing h ours us ing an
internal real-time clock and stores the result in NVRAM.
The h our c ou nt is i ncr em ented at t en -hour intervals in t h e
middle of each interval. The first increment therefore
takes place five hours after power-on. Time is
accumulated whenever the MIC3001 is powered. The
hour meter’s timebase is accurate to 5% over all MIC3001
operating conditions. The counter is capable of storing
counts of more than thirty years, but is ultimately limited
by the write-cycle endurance of the non-volatile memory.
This im plies a range of at least twent y years. Actual res ults
will depend on the operating conditions and write-cycle
endurance of the part in question.
Two registers, POHH and POHl, contain a 15-bit power-on
hour measurement and an error flag, POHFLT. Great care
has been taken to make the MIC3001’s hour meter immune
to dat a cor ru ptio n an d to i nsure that va li d d at a is maintained
across p o wer cycles. T h e h our met er em pl oys mult ip l e d at a
copies and error correction codes to maintain data validity.
This data is stored in the POHDATA registers. If POHFLT is
set, however, the power-on hour meter data has been
corru pted and should be ig no red.
It is recommended that a two-by te (or more ) sequ en tial read
operation be performed on POHh and POHl to insure
coherency between the two registers. These registers are
accessible by the OEM using a valid OEM password. The
only operation that should be performed on these registers
is to clear the hour meters initial value, if necessary, at the
time of product shipment. The hour meter result may be
clea red by settin g all eig ht POHDA TA bytes to 00h.
Power-On Hour Result Format
High Byte, POHH Low Byte, POHI
Error Flag Elapsed Time / 10 Hours, MS Bs Elapsed Time / 10 Hours, LSBs
MSB LSB
Table 20. Power-On Hour Meter Result Format
Test and Calibration Features
Numerous features are included in the MIC3001 to
facilitate development, testing, and diagnostics. These
features are available via registers in the OEM area. As
shown in Table 21, these features include:
Function Description Control
Register(s)
Analog loop-back Provides analog visibility of op-amp and DAC outputs via the ADC OEMCFG0
Fault comparator disable control Disables the fault comparator OEMCAL0
Fault comparator spin-on-channel mode Selects a single fault comparator channel OEMCAL0
Fault comparator output read-back Allows host to read individual fault comparator outputs OEMRD
RSOUT, /INT read-back Allows host to read the state of these pins OEMRD
Inhibit EEPROM write cycles Speeds repetitive writes to registers backed up by NVRAM OEMCAL0
APC calibration mode Allows direct writes to MODDAC and APCDAC (temperature
compensation not used) OEMCAL0
Continuity checking Forcing of RXLOS, TXFAULT, /INT OEMCAL0
Halt A/D Stops A/D conversions; ADC in one-shot mode OEMCAL1
ADC idle flag Indicates ADC status OEMCAL1
A/D one-shot mode Performs a single A/D conversion on the selected input channel OEMCAL1
A/D spin-on-channel mode Selects a single input channel OEMCAL1
Channel selection Selects ADC or fault comparator channel for spin-on-channel modes OEMCAL1
LUT index read-back Permits visibility of the LUT index calculated by the state-machine LUTINDX
Manufacturer and device ID registers Facilitates presence detection and version control MFG_ID, DEV_ID
Table 21. Test and Diagnostic Features
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Serial Port Operation
The MIC3001 uses stan dard Write_Byte, Read_Byte, and
Rea d_W ord oper atio ns for c omm unicati on wit h its h ost. I t
also supports Page_Write and Sequential_Read
transactions. The Write_Byte operation involves sending
the device’s s lave address (with the R/W bit low to s ignal
a write operation) , followed by the addr ess of the register
to be operated upon and the data byte. The Read_Byte
operation is a composite write and read operation: the
host first sends the device’s slave address followed by the
register address, as in a write operation. A new start bit
must then be sent to the MIC3001, followed by a repeat of
the slave address with the R/W bit (LSB) set to the high
(read) state. The data to be read from the part may then
be clocked out. A Read_Word is similar, but two
successive data bytes are clocked out rather than one.
These protocols are shown in Figure 22 to 25.
The MIC3001 will respond to up to four sequential slave
addresses depending on whether it is in OEM or User
mode. A m atch be t ween on e of t h e MI C3001 ’s a ddresses
and th e addr ess sp ecif ie d i n th e ser ia l b it str e am mus t be
made to initiate communication. The MIC3001 responds
to slave addresses A0h and A2h in User Mode; it also
responds to A4h and A6h in OEM Mode (assuming
I2CADR = Axh).
Page Writes
To increase the speed of multi-byte writes, the MIC3001
allows up to four consecutive bytes (one page) to be written
before the internal write cycle begins. The entire non-
volatile memory array is organized into four-byte pages.
Each page begins on a register address boundary where
the last two bits of the address are 00b. Thus the page is
composed of any four consecutive bytes having the
addresses xxxxxx00b, xxxxxx01b, xxxxxx10b, and
xxxxxx11b.
The page write sequence begins just like a Write_Byte
operation with the host sending the slave address, R/W bit
low, register address, etc. After the first byte is sent the host
should receive an acknowledge. Up to three more bytes can
be sent in sequence. The MIC3001 will acknowledge each
one and increment its internal address register in
anticipation of the next byte. After the last byte is sent, the
host issues a STOP. The MIC3001’s internal write process
then begins. If more than four bytes are sent, the MIC3001’s
internal address counter wraps around to the beginning of
the four-byte page.
To accelerate calibration and testing, NVRAM write cycles
can be disabled completely by setting the WRINH bit in
OEMCAL0. Writes to registers that do not have NVRAM
backup will not incur write-cycle delays when writes are
inhibited. Write operations on registers that exist only in
NVRAM will s till in cur wr ite cy cle delays.
Figure 22. Write Byte Protocol
Figure 23. Read Byte Protocol
Figure 24. Read_ Word Protocol
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Figure 25. Four-Byte Page_White Protocol
Acknowledge Polling
The MIC3001’s non-volat ile m emor y can not be acc esse d
during the internal write process. To allow for maximum
speed bulk writes, the MIC3001 supports acknowledge
polling. The MIC3001 will not acknowledge serial bus
transactions while internal writes are in progress. The
host may therefore monitor for the end of the write
process by periodically checking for an
acknowledgement.
Write Protection and Data Security
OEM Password
A password is required to access the OEM areas of the
MIC3001, specifically the non-volatile memory, look-up
tables, and registers at serial addresses A4h and A6h. A
four-byte field, OEMPWSET, at serial address A6h is
used for setting the OEM pass word. The OEM password
is set by writing OEMPWSET with the new value. The
password comparison is performed following the write to
the MSB of the OEMPW, address 7Bh at serial address
A2h. Therefore, this byte must be written last! A four-
byte burst-write sequence to ad dre ss 78h may be used as
this will result in the MSB being written last. The new
password will not take effect until after a power-on reset
occurs or a warm reset is p erform ed usin g the RST b it in
OEMCFG0. This allows the new password to be verified
before it takes effect.
The corresponding four-byte field for password entry,
OEMPW, is located at serial address A2h. This field is
therefore always visible to the host system. OEMPW is
compared to the four-byte OEMPWSET field at serial
addr ess A6h. If t he two f iel ds m atch, acces s is a llo wed to
the OEM areas of the MIC3001 non-volatile memory at
serial addresses A4h and A6h. If OEMPWSET is all
zeroes, no password security will exist. The value in
OEMPW wil l be igno red. This helps prevent a deliberately
unsecured MIC3001 from being inadvertently locked.
Once a valid password is entered, the MIC3001 OEM
areas will be accessible. The OEM areas may be re-
secur ed b y wri ting an i nco rr ect p ass wor d val ue at OE MPW ,
e.g., all zeroes. In all cases OEMPW must be written LSB
first t hrough MSB las t. The OEM areas will be inaccess ible
following the final write operation to OEMPW’s LSB. The
OEMPW field is reset to all zeros at power on. Any values
written to these locations will be readable by the host
regardless of the locked/unlocked status of the device. If
OEMPWSET is set to zero (00000000h), the MIC3001 will
rem ain unlock ed reg ardless of the co ntents of the OEMPW
field. This is the factory default security setting.
NOTE: A valid OEM password allows access to the OEM
and user areas of the chip, i.e., the entire memory map,
regardless of any user password that may be in place. Once
the OEM areas are locked, the user password can provide
access and write protection for the user areas.
User Password
A password is required to access the USER areas of the
MIC3001, specifically the non-volatile memory at serial
addresses A0h and A2h. A one-byte field, USRPWSET at
serial address A2h is used for setting the USER password.
USRPWSET is compared to the USRPW field at serial
address A2h. If the two fields match, access is allowed to
the USER areas of the MIC3001 non-volatile memory at
serial addresses A0h and A2h. The USER password is set
by writing USRPWSET with the new value. The new
password will not take effect until after a power-on reset
occurs or a warm reset is performed using the RST bit in
OEMCFG0. This allows the new password to be verified
before it takes effect.
NOTE: A valid OEM password allows access to the OEM
and user areas of the chip, i.e., the entire memory map,
regardless of any user password that may be in place. Once
the OEM areas are locked, the user password can provide
access and write protection for the user areas. If a valid
OEM password is in place, the user password will have no
effect.
Micrel, Inc.
MIC3001
August 2004 38 M9999-082404-A
hbwhelp@micrel.com or (408) 955-1690
Detailed Register Descriptions
Note: Serial bus addresses shown assume that I2CADR = Axh.
Alarm Threshold Registers
Temperature High Alarm Threshold MSB (TMAXh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 00 = 00h
Each LSB represents one degree centigrade. This register is to be used in conjunction with TMAXl to yield a sixteen-bit
temperature value. The value in this register is uncalibrated. The value in TMAXh is compared against TEMPh. Alarm bit Ax is
set if TEMPh > TMA Xh.
Temperature High Alarm Threshold LSB (TMAXh)
D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0] read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 01 = 01h
This register is to be used in conjunction with TMAXh to yield a sixteen-bit temperature value. The value in TMAXh is
compared agai nst TEMPh. Alarm bit Ax is set if TMAXh > TEMPh. Since TEMPl is always zero, it is recommended that this
register always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001
when doing threshold comparisons and setting alarm or warning bits.
Temperature Low Alarm Threshold MSB (TMINh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 02 = 02h
Each LSB represents one degree centigrade. This register is to be used in conjunction with TMINl to yield a sixteen-bit
temperature value. The value in TMINh is compared against TEMPh. Alarm bit Ax is set if TEMPh < TMINh.
Temperature Low Alarm Threshold LSB (TMINl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 03 = 03h
This register is to be used in conjunction with TMINh to yield a sixteen-bit temperature value. The value in TMINh is compared
against TEMPh. Alarm bit Ax is set if TEMPh < TMINh. Since TEMPl is always zero, it i s recommended that this register always
be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when doing
threshold comparisons and setting alarm or warning bits.
Micrel, Inc.
MIC3001
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Voltage High Alarm Threshold MSB(VMAXh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 08 = 08h
Each LSB represents 25.6mV. This register is to be used in conjunction with VMAXl to yield a sixteen-bit value. The value in
TMINh is compared against VINh. Alarm bit Ax is set if VINh > VMAXh.
Voltage High Alarm Threshold LSB(VMAXl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 09 = 09h
Each LSB represents 100µV. This register is to be used in conjunction with VINh to yield a sixteen-bit value. The value in
VMAXh is compared against VINh. Alarm bit Ax is set if VINh > VMAXh. Since VINl is always zero, it is recommended that this
register always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001
when doing threshold comparisons and setting alarm or warning bits.
Voltage Low Alarm Threshold MSB (VMINh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 10 = 0Ah
Each LSB represents 25.6mV. This register is to be used in conjunction with VMINl to yield a sixteen-bit value. The value in this
register is uncalibrated. The value in VMINh is compared against VINh. Alarm bit Ax is set if VINh<VMINh.
Voltage Low Alarm Threshold LSB (VMINl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 11 = 0Bh
Each LSB represents 100µV. This register is to be used in conjunction with VINh to yield a sixteen-bit value. The value in
VMINh is compared against VINh. Alarm bit Ax is set if VINh < VMINh. Since VINl is always zero, it is recommended that this
register always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001
when doing threshold comparisons and setting alarm or warning bits.
Micrel, Inc.
MIC3001
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Bias Current High Alarm Threshold MSB (IMAXh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 16 = 10h
This register is to be used in conjunction with IMAXl to yield a sixteen-bit value. The value in this register is uncalibrated. The
value in IMAXh is compared against ILDh. Alarm bit Ax i s set if ILDh > IMAXh.
Bias Current High Alarm Threshold LSB (IMAXl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 17 = 11h
Each LSB represents 2µA. This register is to be used in conjunction with IMAXh to yield a sixteen-bit value. The value in this
register is uncalibrated. The value in IMAXh is compared against ILDh. Alarm bit Ax is s et if ILDh > IMAXh. Since ILDl is always
zero, it is rec ommend ed that this register always be programmed to zero. This register is provided for compliance with SFF-
8472. It is not used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Bias Current Low Alarm Threshold MSB (IMINh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 18 = 12h
This register is to be used in conjunction with IMINl to yield a sixteen-bit value. The value in this register is uncalibrated. The
value in IMINh is compared against ILDh. Alarm bit Ax is set if ILDh < IMINh.
Bias Current Low Alarm Threshold LSB (IMINl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 19 = 13h
Each LSB represents 2µA. This register is to be used in conjunction with IMINh to yield a sixteen-bit value. The value in this
register is uncalibrated. The value in IMINh is compared against ILDh. Alarm bit Ax is set if ILDh < IMINh. Since ILDl is always
zero, it is rec ommend ed that this register always be programmed to zero. This register is provided for compliance with SFF-
8472. It is not used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Micrel, Inc.
MIC3001
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TX Optical Power High Alarm MSB (TXMAXh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 24 = 18h
Each LSB represents 25.6µW. This register is to be used in conjunction with TXOPl to yield a sixteen-bit value. The values in
TXOPh:TXOPl are in an unsigned binary format. The value in this register is uncalibrated. The val ue in TXMAXh is compared
against TXOPh. Alarm bit Ax is set if T XOPh > TX MAXh.
TX Optical Power High Alarm LSB (TXMAXl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 25 = 19h
Each LSB represents 0.1µW. This register is to be used in conjunction with TXMAXh to yield a sixteen-bit value. The values in
TXOPh:TXOPl are in an unsigned binary format. The value in this register is uncalibrated. The val ue in TXMAXh is compared
against TXOPh. Alarm bit Ax is set if TXOPh > TXMAXh. Since TXOPl is always zero, it is recommended that this register
always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when
doing threshold comparisons and setting alarm or war ning bit s.
TX Optical Power Low Alarm MSB (TXMINh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 26 = 1Ah
Each LSB represents 25.6µW. This register is to be used in conjunction with TXMINl to yield a sixteen-bit value. The values in
TXMINh:TMINl are in an unsigned binary format. The value in this register is uncalibrated. The value in TXMINh is compared
against TXOPh. Alarm bit Ax is set if TXOPh < TXMINh.
TX Optical Power Low Alarm LSB (TXMINl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 27 = 1Bh
Each LSB represents 0.1µW. This register is to be used in conjunction with TXMINh to yield a sixteen-bit value. The values in
TXOPh:TXOPl are in an unsigned binary format. The value in this register is uncalibrated. The val ue in TXMINh is compared
against TXOPh. Alarm bit Ax is set if TXOPh < TXMINh. Since TXOPl is always zero, it is recommended that this register
always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when
doing threshold comparisons and setting alarm or war ning bit s.
Micrel, Inc.
MIC3001
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RX Optical Power High Alarm Threshold MSB (RXMAXh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 32 = 20h
Each LSB represents 25.6µW. This register is to be used in conjunction with RXMAXl to yield a sixteen-bit value. The value in
this register is uncalibrated. The value in RXMAXh is compared against RXOPh. Alarm bit Ax is set if RXOPh > RXMAXh.
RX Optical Power High Alarm Threshold LSB (RXMAXl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 33 = 21h
Each LSB represents 0.1µW. This register is to be used in conjunction with RXMAXh to yield a sixteen-bit value. The values in
RXMAXh:RXMAXl are in an unsigned binary format. The value in this register is uncalibrated. The value in RXMAXh i s
compared agai nst RXOPh. Alarm bit Ax is set if RXOPh > RXMAXh. Since RXOPl is always zero, it is recommended that this
register always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001
when doing threshold comparisons and setting alarm or w arning bit s.
RX Optical Pow er Low Alarm Thre shold MSB (RMINh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 34 = 22h
Each LSB represents 25.6µW. This register is to be used in conjunction with RXMINl to yield a sixteen-bit value. The value in
this register is uncalibrated. The value in RXMINh is compared against RXOPh. Alarm bit Ax is set i f RXOPh < RXMINh.
RX Optical Power Low Alarm Threshold LSB (RMINl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 35 = 23h
Each LSB represents 0.1µW. This register is to be used in conjunction with RXMINh to yield a sixteen-bit value. The values in
RXMINh:RXMINl are in an unsigned binary format. The value in this register is uncalibrated. The value in RXMINh is compared
against RXOPh. Alarm bit Ax is set if RXOPh < RXMINh. Since RXOPl is always zero, it is recommended that this register
always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when
doing threshold comparisons and setting alarm or warning bits.
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MIC3001
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Warning Threshold Registers
Temperature High Warning Threshold M SB (THIGHh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 04 = 04h
Each LSB represents one degree centigrade. This register is to be used in conjunction with THIGHl to yield a sixteen-bit
temperature value. The value in this register is uncalibrated. The value in THIGHh is compared against TEMPh. Warning bit
Wx is s et if TEMPh > THIGHh.
Temperature High Warning Threshold LSB (THIGHl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 05 = 05h
This register is to be used in conjunction with THIGHh to yield a sixteen-bit temperature value. The value in this register is
uncalibrated. The value in THIGHh is compared against TEMPh. Warning bit Wx is set if THIGHh > TEMPh. Since TEMPl is
always zero, it is recommended that this register always be programmed to zero. This register is provi ded for complianc e with
SFF-8472. It is not used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Temperature Low Warning Threshold MSB (TLOWh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 06 = 06h
Each LSB represents one degree centigrade. This register is to be used in conjunction with TLOWl to yiel d a sixteen-bit
temperature value. The value in this register is uncalibrated. The value in TLOWh is compared agains t TEMPh. Warning bit Wx
is set if TEMPh < TLOWh.
Temperature Low Warning Threshold LSB (TLOWl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 07 = 07h
This register is to be used in conjunction with TLOWh to yield a sixteen-bit temperature value. The value in this register is
uncalibrated. The value in TLOWh is compared against TEMPh. Warning bit Wx is set if TEMPh < TLOWh. Since TEMPl is
always zero, it is recommended that this register always be programmed to zero. This register is provi ded for complianc e with
SFF-8472. It is not used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
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Voltage High Warning Threshold MSB (VHIGHh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 12 = 0Ch
Each LSB represents 25.6mV. This register is to be used in conjunction with VHIGHl to yield a sixteen-bit value. The value in
this register is uncalibrated. The value in VHIGHh is compared against VINh. Warning bit W x is set if VINh > VHIGHh.
Voltage High Warning Threshold LSB (VHIGHl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 13 = 0Dh
Each LSB represents 100µV. This register is to be used in conjunction with VHIGHh to yield a sixteen-bit value. The value in
VHIGHh is com pared against VINh. Warning bit Wx is set if VINh > VHIGHh. Since VINl is always zero, it is recommended that
this register always be programmed to zero. This register is provi ded for compliance with SFF-8472. It is not used by the
MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Voltage Low Warning Threshold MSB (VLOWh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 14 = 0Eh
Each LSB represents 25.6mV. This register is to be used in conjunction with VLOWl to yield a sixteen-bit value. The value in
this register is uncalibrated. The value in VLOWh is compared against VINh. Warning bit Wx is set if VINh < VLOWhh.
Voltage Low Warning Threshold LSB (VLOWl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 15 = 0Fh
Each LSB represents 100µV. This register is to be used in conjunction with VLOWh to yield a sixteen-bit value. The value in
VLOWh is compared against VINh. W arning bit Wx is set if VINh < VLOW h. Since VINl is always zero, it is recommended that
this register always be programmed to zero. This register is provided for compliance with SFF-8472. It is not used by the
MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Micrel, Inc.
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Bias Current High Warning Threshold M SB (IHIGHh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 20 = 14h
This register is to be used in conjunction with IHIGHl to yield a sixteen-bit value. The val ue in this register is uncalibrated. The
value in IHIGHh is compared against ILDh. Warning bit Wx is set if ILDh > IHIGHh.
Bias Current High Warning Thresh old LSB (IHIGHl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 21 = 15h
Each LSB represents 2µA. This register is to be used in conjunction with IHIGHh to yield a sixteen-bit value. The value in this
register is uncalibrated. The value in IHIGHh is compared against ILDh. Warning bit Wx is set if ILDh > IHIGHh. Since ILDl is
always zero, it is recommended that this register always be programmed to zero. This register is provi ded for complianc e with
SFF-8472. It is not used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Bias Current Low Warning Threshold MSB (ILOWh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 22 = 16h
This register is to be used in conjunction with ILOWl to yield a sixteen-bit value. The value in this register is uncalibrated. The
value in ILOWh is compared against ILDh. Warning bit Wx is set if ILDh < ILOW h.
Bias Current Low Warning Threshold LSB (ILOWl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 23 = 17h
Each LSB represents 2µA. This register is to be used in conjunction with ILOWh to yield a sixteen-bit value. The value in this
register is uncalibrated. The value in ILOWh is compared against ILDh. Warning bit Wx is set if ILDh < ILOWh. Since ILDl is
always zero, it is recommended that this register always be programmed to zero. This register is provided for compliance with
SFF-8472. It is not used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
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TX Optical Power High Warning MSB (TXHIGHh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 28 = 1Ch
Each LSB represents 25.6µW. This register is to be used in conjunction with TXHIGHl to yiel d a sixteen-bit value. The values in
TXHIGHh:TXHIGHl are in an unsigned binary format. The value in this register is uncalibrated. The value in TXHIGHh is
compared agai nst TXOPh. Warning bit Wx is set if TXOPh > TXHIGHh.
TX Optical Power High Warning LSB (TXHIGHl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 29 = 1Dh
Each LSB represents 0.1µW. This register is to be used in conjunction with TXHIGHh to yield a s ixteen-bit value. The values in
TXHIGHh:TXHIGHl are in an unsigned binary format. The value in this register is uncalibrated. The value in TXHIGHh is
compared agai nst TXOPh. Warning bit Wx is set if TXOPh > TXHIGHh. Since TXOPl is always zero, it is recommended that
this register always be programmed to zero. This register is provi ded for compliance with SFF-8472. It is not used by the
MIC3001 when doing threshold comparisons and setting alarm or warning b.
TX Optical Power Low Warning MSB (TLOWh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 30 = 1Eh
Each LSB represents 25.6µW. This register is to be used in conjunction with TXLOWl to yield a sixteen-bit value. The values in
TXLOWh:TLOWl are in an unsigned binary format. The value in this register is uncalibrated. The value in TXLOWh is
compared agai nst TXOPh. Warning bit Wx is set if TXOPh < TXLOWh.
TX Optical Power Low Warning LSB (TLOWl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 31 = 1Fh
Each LSB represents 0.1µW. This register is to be used in conjunction with TXLOWh to yield a sixteen-bit value. The values in
TXLOWh:TXLOWl are in an unsigned binary format. The value i n this register is uncalibrated. The value in TXLOWh is
compared agai nst TXOPh. Warning bit Wx is set if TXOPh < TXLOWh. Since TXOPl is always zero, it is recommended that
this register always be programmed to zero. This register is provi ded for compliance with SFF-8472. It is not used by the
MIC3001 when doing threshold comparisons and setting alarm or warning bits.
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RX Optical Power High Warning Threshold MSB (RXHIGHh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 36 = 24h
Each LSB represents 25.6µW. This register is to be used in conjunction with RXHIGHl to yield a sixteen-bit value. The value in
this register is uncalibrated. The value in RXHIGHh is compared against RXOPh. Warning bit Wx is set if RXOPh > RXHIGHh.
RX Optical Power High Warning Threshold LSB (RXHIGHl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 37 = 25h
Each LSB represents 0.1µW. This register is to be used in conjunction with RXHIGHh to yield a sixteen-bit value. The values in
RXHIGHh:RXHIGHl are in an unsigned binary format. The value in this regis ter is uncalibrated. The value in RXHIGHh is
compared agai nst RXOPh. Warning bit Wx is set if RXOPh > RXHIGHh. Since RXOPl is always zero, it is recommended that
this register always be programmed to zero. This register is provi ded for compliance with SFF-8472. It is not used by the
MIC3001 when doing threshold comparisons and setting alarm or warning bits.
RX Optical Power Low Warning Threshold MSB (RXLOWh)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 38 = 26h
Each LSB represents 25.6µW. This register is to be used in conjunction with RXLOWl to yield a sixteen-bit value. The value in
this register is uncalibrated. The value in RXLOWh is compared agai nst RXOPh. Warning bit Wx is set if RXOPh < RXLOWh.
RX Optical Power Low Warning Threshold LSB (RXLOWl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 39 = 27h
Each LSB represents 0.1µW. This register is to be used in conjunction with RXLOWh to yield a sixteen-bit value. The values in
RXLOWh:RXLOWl are in an unsigned binary format. The value in this register is uncalibrated. The value in RXLOWh is
compared agai nst RXOPh. Warning bit Wx is set if RXOPh < RXLOWh. Since RXOPl is always zero, it is recommended that
this register always be programmed to zero. This register is provi ded for compliance with SFF-8472. It is not used by the
MIC3001 when doing threshold comparisons and setting alarm or warning bits.
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Checks um (CHKSUM)
Checksum of bytes 0 - 94 at serial address A2h
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 95 = 5Fh
This register is provided for compliance with SFF-8472. It is implemented as general-purpose non-volatile memory. Read/write
access is possible whenever a valid OEM password has been entered. CHKSUM is read-only in USER mode.
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ADC Result Registers
Temperature Result MSB (TEMPh)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0°C)(1)
Serial Address A2h = 1010001b
Byte Address 96 = 60h
Each LSB represents one degree centigrade. This register is to be used in conjunction with TEMPl to yield a sixteen-bit
temperature value. The value in this register is uncalibrated. The host should process the results using the scale factor and
offset provided. See the External Calibration section.
Temperature Result LSB (TEMPl)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0°C)
Serial Address A2h = 1010001b
Byte Address 97 = 61h
This register is to be used in conjunction with TEMPh to yield a sixteen-bit temperature value. The value in this register is
uncalibrated. The host should process the results using the scale factor and offset provided. See the External Calibration
section. In the MIC3001 this register will always return zero. This register is provided for compliance with SFF-8472. It is not
used by the MIC3001 when doing threshold comparisons and setting alarm or warning bits.
Voltage MSB (VINh)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0V)(2)
Serial Address A2h = 1010001b
Byte Address 98 = 62h
Each LSB represents 25.6mV. This register is to be used in conjunction with VINl to yield a sixteen-bit value. The values in
VINh:VlNl are in an unsigned binary form at. The value in this register is uncalibrated. The host should process the results using
the scale factor and offset provided. See the External Calibration section.
Voltage LSB (VINl)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0V)
Serial Address A2h = 1010001b
Byte Address 99 = 63h
Each LSB represents 100µV. This register is to be used in conjunction with VINh to yield a sixteen-bit value. The values in
VINh:VINl are in an unsigned binary format. The value in this regis ter is uncalibrated. The host should process the results using
the scale factor and offset provided. See the External Calibration section. In the MIC3001, this register will always return zero.
This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when doing threshold comparisons and
setting alarm or warning bits.
Notes:
1. TEMPh will cont ai n measured temperature data after the completion of one conversion.
2. VINh will cont ai n measured data after one A/ D conversion cycle.
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Laser Diode Bias Current MSB (ILDh)
D[7]
read-only
D[6]
read-only
D[5]
D[4]
D[3]
read-only
D[2]
read-only
D[1]
read-only
D[0]
read-only
Default Value 0000 0000b = 00h (0mA)(3)
Serial Address A2h = 1010001b
Byte Address 100 = 64h
This register is to be used in conjunction with ILDl to yield a sixteen-bit value. The values in ILDh:ILDl are in an unsigned bi nary
format. The value in this register is uncalibrated. The host should process the results using the scale factor and offset provided.
See the External Calibration sections.
Laser Diode Bias Current LSB (ILDl)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0mA)
Serial Address A2h = 1010001b
Byte Address 101 = 65h
Each LSB represents 2µA. This register is to be used in conjunction with ILDh to yield a sixteen-bit value. The values in
ILDh:ILDl are in an unsigned binary format. The value in this register is uncalibrated. The host should process the results using
the scale factor and offset provided. See the External Calibration section. In the MIC3001, this register will always return zero.
This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when doing threshold comparisons and
setting alarm or warning bits.
Transmitted Optical Power MSB (TXOPh)(4)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000
b
= 00
h
(0mW)(5)
Serial Address A2h = 1010001b
Byte Address 102 = 66h
Each LSB represents 25.6µW. This register is to be used in conjunction with TXOPl to yield a sixteen-bit value. The values in
TXOPh:TXOPl are in an unsigned binary format. The value in this register is uncalibrated. The host s hould process the results
using the scale factor and offset provided. See the External Calibration section.
Transmitted Optical Power LSB (TXOPl)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0mW)
Serial Address A2h = 1010001b
Byte Address 103 = 67h
Each LSB represents 0.1µW. This register is to be used in conjunction with TXOPh to yield a sixteen-bit value. The values in
TXOPh:TXOPl are in an unsigned binary format. The value in this register is uncalibrated. The host s hould process the results
using the scale factor and offset provided. See the External Calibration section. In the MIC3001, this register will always return
zero. This register is provided for compliance with SFF-8472. It is not used by the MIC3001 when doing threshold comparisons
and setting alarm or warning bitsection.
Notes:
3. ILDh will contain measured data after one A/D conversion cycle.
4. The scale factor corresponding to the sense resistor used must be set in the configuration register.
5. TXOPh will contai n measured data after one A/D conversion cycle.
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Received Optical Power MSB (RXOPh)
D[7]
read-only
D[6]
read-only
D[5]
D[4]
D[3]
read-only
D[2]
read-only
D[1]
read-only
D[0]
read-only
Default Value 0000 0000b = 00h (0mW)(6)
Serial Address A2h = 1010001b
Byte Address 104 = 68h
Each LSB represents 25.6µW. This register is to be used in conjunction with RXOPl to yield a sixteen-bit value. The values in
RXOPh:RXOPl are in an unsigned binary format. The value in this register is uncalibrated. The host should process the results
using the scale factor and offset provided. See the External Calibration section.
Received Optical Power LSB (RXOPl)
D[7]
read-only D[6]
read-only D[5]
read-only D[4]
read-only D[3]
read-only D[2]
read-only D[1]
read-only D[0]
read-only
Default Value 0000 0000b = 00h (0mW)(6)
Serial Address A2h = 1010001b
Byte Address 105 = 69h
Each LSB represents 0.1µW. This register is to be used in conjunction with RXOPh to yield a sixteen-bit value. The values in
RXOPh:RXOPl are in an unsigned binary format. The value in this register is uncalibrated. The host should process the results
using the coefficients provided. See the External Calibration sec tion. This register is provided for compliance with SFF-8472. It
is not used by the MIC3001 when doing threshold c omparisons and setting alarm or warning bits.
Control and Sta tus (CNTRL)
D[7]
TXDIS
read-only
D[6]
STXDIS
read/write
D[5]
reserved D[4]
RSEL
read/write
D[3]
SRSEL
read/write
D[2]
XFLT
read-only
D[1]
LOS
read-only
D[0]
POR
read-only
Default Value 0000 0000b = 00h
Serial Address A2h = 1010001b
Byte Address 110 = 6Eh
Bit(s) Function Operation
D[7] TXDIS Reflects the state of the TXDISABLE pin 1 = disabled, 0 = enabled, read only.
D[6] STXDIS Soft transmit disable 1 = disabled; 0 = enabled.
D[5] D[5] Reserved Reserved - always write as zero.
D[4] RSEL Reflects the state of the RSEL pin 1 = high; 0 = low.
D[3] SREL Soft rate select 1 = high (2Gbps); 0 = low (1Gbps).
D[2] TXFLT Reflects the state of the TXFAULT pin 1 = high (fault); 0 = low (no fault).
D[1] LOS Loss of signal. Reflect s the state of the LOS pin 1 = high (loss of signal); 0 = low (no loss
of signal).
D[0] POR MIC3001 power-on status 0 = POR complete, analog data ready;
1 = POR in progress.
Notes:
6. RXOPh will cont ain measured data aft er one A/D conversion cycl e.
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Alarm Flags
Alarm Register 0 (ALARM0)
D[7]
A7
read-only
D[6]
A6
read-only
D[5]
A5
read-only
D[4]
A4
read-only
D[3]
A3
read-only
D[2]
A2
read-only
D[1]
A1
read-only
D[0]
A1
read-only
Default Value 0000 0000b = 00h (no even ts pendi ng)
Serial Address A2h = 1010001b
Byte Address 112 = 70h
The power-up default val ue is 00h. Fol lowing the first A/D conversion, however, any of the bits may be set depending on the
results.
Bit(s) Function Operation
D[7] A7 High temperature alarm, TEMPh > TMAXh. 1 = condition exists, 0 = normal/OK.
D[6] A6 Low temperature alarm, TEMPh < TMINh. 1 = condition exists, 0 = normal/OK.
D[5] A5 High voltage alarm, VINh > VMAXh. 1 = condition exists, 0 = normal/OK.
D[4] A4 Low voltage alarm, VINh < VMINh. 1 = condition exists, 0 = normal/OK.
D[3] A3 High laser diode bias alarm, IBIASh > IMAXh. 1 = condition exi s ts , 0 = normal/OK.
D[2] A2 Low laser diode bias alarm, IBIASh < IMINh. 1 = condition exis ts, 0 = normal/OK.
D[1] A1 High transmit optical power alarm,
TXOPh > TXMAXh. 1 = condition exists, 0 = normal/OK.
D[0] A0 Low transmit optical power alarm,
TXOPh < TXMINh. 1 = condition exists, 0 = normal/OK.
Alarm Register 1 (ALARM1)
D[7]
A15
read-only
D[6]
A14
read-only
D[5]
reserved D[4]
reserved D[3]
reserved D[2]
reserved D[1]
reserved D[0]
reserved
Default Value 0000 0000b = 00h (no even ts pendi ng)
Serial Address A2h = 1010001b
Byte Address 113 = 71h
The power-up default value is 00h. Following the first A/D conversion, however, any of the bits may be set depending on the
results.
Bit(s) Function Operation
D[7] A15 High received power (overload) alarm, RXOPh
> RXMAXh. 1 = condition exists, 0 = normal/OK.
D[6] A14 Low received power (LOS) alarm, RXOPh <
RXMINh. 1 = condition exists, 0 = normal/OK.
D[5:0] Reserved Reserved - always write as zero.
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Warning Flags
Warning Register 0 (WARN0)
D[7]
W7
read-only
D[6]
W6
read-only
D[5]
W5
read-only
D[4]
W4
read-only
D[3]
W3
read-only
D[2]
W2
read-only
D[1]
W1
read-only
D[0]
W1
read-only
Default Value 0000 0000b = 00h (no even ts pendi ng)
Serial Address A2h = 1010001b
Byte Address 116 = 74h
The power-up default value is 00h. Following the first A/D conversion, however, any of the bits may be set depending on the
results.
Bit(s) Function Operation
D[7] W7 High temperature warning, TEMPh > THIGHh. 1 = condition exists, 0 = normal/OK.
D[6] W6 Low temperature warning, TEMPh < TLOWh. 1 = condition exists, 0 = normal/OK.
D[5] W5 High voltage warning, VINh > VHIGHh. 1 = condition exists, 0 = normal /OK.
D[4] W4 Low voltage warning, VINh < VLOWh. 1 = condition exists, 0 = normal/OK.
D[3] W3 High laser diode bias warning, IBIASh >
IHIGHh. 1 = condition exists, 0 = normal/OK.
D[2] W2 Low laser diode bias warning, IBIASh <
ILOWh. 1 = condition exists, 0 = normal/OK.
D[1] W1 High transmit optical power warning,
TXOPh > TXHIGHh. 1 = condition exists, 0 = normal/OK.
D[0] W0 Low transmit optical power warning,
TXOPh < TXLOWh. 1 = condition exi s ts , 0 = normal/OK.
Warning Register 1 (WARN1)
D[7]
W15
read-only
D[6]
W14
read-only
D[5]
read-only
D[4]
read-only
D[3]
read-only
D[2]
read-only
D[1]
read-only
D[0]
read-only
Default Value 0000 0000b = 00h (no even ts pendi ng)
Serial Address A2h = 1010001b
Byte Address 117 = 75h
The power-up default value is 00h. Following the first A/D conversion, however, any of the bits may be set depending on the
results.
Bit(s) Function Operation
D[7] W15 Received power high warning, RXOPh >
RXHIGHh. 1 = condition exists, 0 = normal /OK.
D[6] W14 Received power low warning, RXOPh <
RXMINh. 1 = condition exists, 0 = normal/OK.
D[5:0] Reserved Reserved - always write as zero.
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OEM Password Entry (OEMPW)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h (reset to zero at power-on)
Serial Address A2h = 1010001b
Byte Address 120 123 = 78h - 7Bh (MSB is 7Bh)
This four-byte field is for entry of the password required to access the OEM area of the MIC3001’s memory and registers. A
valid OEM password will also permit access to the user areas of mem ory. The byte at address 123 (7Bh) is the most signific ant
byte. This field is compared to the four-byte OEMPWSET field at serial address A6h, bytes 12 to 15. If the two fields match,
access is allowed to the OEM areas of the MIC3001 non-volatile memory at serial addresses A4h and A6h. The OEM password
is set by writing the new val ue into OEMPWSET. The password comparison is performed following the write to the MSB,
address 7Bh. This byte m ust be written last!
A four-byte burs t -write sequence to address 78h may be used as this will result in the MSB being written last. The new
password will not take effect until after a power-on reset occurs or a warm reset is performed using the RST bit in OEMCFG0.
This allows the new password to be verified before it takes effect. This field is reset to all zeros at power on. Any values written
to these locations will be readable by the host regardless of the locked/unlocked status of the device. If OEMPWSET is set to
zero (00000000h), the MIC3001 will remain unlocked regardless of the contents of the OEMPW field. This is the factory default
security setting.
Byte Weight
3 OEM Pass word Entry, Most Significant Byte (Address = 7Bh)
2 OEM Pass word Entry, 2nd Most Significant Byte (Address = 7Ah)
1 OEM Pass word Entry, 2nd Least Significant Byte (Address = 79h)
0 OEM Pass word Entry, Least Significant Byte (Address = 78h)
USER Password Setting (USRPWSET)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A2h = 1010001b
Byte Address 250 = FAh
This register is for setting the password required to access the USER area of the MIC3001’s memory and registers. This field is
compared to the USRPW field at serial address A2h, byte 251. If the two fields match, access is allowed to the USER areas of
the MIC3001 non-volatile memory at serial addresses A0h and A2h. If a valid USER password has not been entered, writes to
the serial ID fields, USRCTRL, and the user scratchpad areas of A0h and A2h will not be allowed, and USRPWSET will be
unreadable (returns all zeroes).
A USER password is set by writing the new value into USRPWSET. The new password will not take effect until after a power-on
reset occurs or a warm reset is performed using the RST bit in OEMCFG0. This allows the new password to be verified before it
takes effect. This register is non-volatile and will be maintained through power and reset cycles. A valid USER or OEM
password is required for access to this register. Otherwise, this register will read as 00h. Note: a valid OEM password overrides
the USER password setting. If a valid OEM password is currently in place, the user password will have no effect.
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USER Password (USRPW)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A2h = 1010001b
Byte Address 251 = FBh
USER passwords are entered in this field. This field is compared to the USRPWSET field at serial address A2h, byte 250. If the
two fields match, access is allowed to the USER areas of the MIC3001 non-volatile memory at serial addresses A0h and A2h. If
a valid USER password has not been entered, writes to the serial ID fields and user scratchpad areas of A0h and A2h will not be
allowed and USRPWSET will be unreadable (returns all zeroes).
Power-On Hours MSB (POHh )
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A2h = 1010001b
Byte Address 252 = FCh
The lower seven bits of this register contain the most-significant bits of the 15-bit power-on hours measurement. POHFLT is an
error flag. The value in this register should be combined with the Power-on Hours, Low Byte, POHl, to yield the complete result.
If POHFLT is set, the power-on hour meter data has been corrupted and s hould be ignored. It is recommended that a two-byte
(or more) sequential read operation be performed on POHh and POHl to insure coherenc y between the two registers. This
register is non-volati le and will be maintained through power and reset cycl e .
Bit(s) Function Operation
D[7] Power-on hours fault flag 1 = fault; 0 = no fault.
D[6:0] Power-on hours, high byte Non-volatile.
Power-On Hours LSB (POHl)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
POH Fault Fl ag (POHFLT)
Default Value 0000 0000b = 00h
Serial Address A2h = 1010001b
Byte Address 253 = FDh
This register contains the least-significant eight bits of the 15-bit power-on hours measurement. The value in this register should
be combined with the Power-on Hours, High Byte, POHh, to yield the complete result. If POHFLT is set, the power-on hou r
meter data has been corrupted and should be ignored. It is recommended that a two-byte (or more) sequential read operation
be performed on POHh and POHl to insure coherency between the two registers. This register is non-volatile and will be
maintained through power and reset cycles.
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Data Ready Flags (DATARDY)
D[7]
TRDY
read/write
D[6]
VRDY
read/write
D[5]
IRDY
read/write
D[4]
TXRDY
read/write
D[3]
RXDY
read/write
D[2]
reserved D[1]
reserved D[0]
reserved
Default Value 0000 0000b = 00h
Serial Address A2h = 1010001b
Byte Address 254 = FEh
When the A/D conversion for a given parameter is completed and the results available to the host, the corresponding data ready
flag will be set. The flag will be cleared when the host reads the corresponding result register.
Bit(s) Function Operation
D[7] TRDY Temperature data ready flag 0 = old data; 1 = new data ready
D[6] VRDY Voltage data ready flag 0 = old data; 1 = new data ready
D[5] IRDY Bias current data ready flag 0 = old data; 1 = new data ready
D[4] TXRDY Transmit power data ready flag 0 = old data; 1 = new data ready
D[3] RXRDY Receive power data ready flag 0 = old data; 1 = new data ready
D[2:0] Reserved Reserved
USER Control Re gister (USRCTL)
D[7]
read/write
D[6]
PORM
read/write
D[5]
PORS
read/write
D[4]
IE
read/write
D[3]
APCSEL
read/write
D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0010 0000b = 20h
Serial Address A2h = 1010001b
Byte Address 255 = FFh
This register provides for control of the nominal APC setpoint and management of interrupts by the end-user. APCSEL[1:0]
select which of the APC setpoint registers, APCSET0, APCSET1, or APCSET2 are used as the nominal automatic power
control setpoint .
IE must be set for any interrupts to occur. If PORM is set, the power-on event will generate an interrupt and warm resets using
RST will not generate a POR interrupt. When a power-on interrupt occ urs, assuming PORM=1, PORS will be set. PORS will be
cleared and the interrupt output de-asserted when USRCTL is read by the host. If IE is set while /INT is asserted, /INT will be
de-asserted. The host m ust still clear the various status flags by reading them. If PORM is set following the setting of PORS,
PORS will remain set, and /INT will not be de-asserted, until USRCTL is read by the host.
PORM, IE, and APCSEL are non-volatile and w ill be maintai ned through power and reset cycles. A valid USER password is
required for access to this register.
Bit Function Operation
D[7] Reserved Always write as zero; reads undefined.
D[6] PORM Power-on interr upt mas k 1 = POR interrupts enabled; 0 = disabled; read/write;
non-volatile.
D[5] PORS Power-on interrupt flag 1 = POR interrupt occurred; 0 = no POR interrupt;
read-only.
D[4] IE Global interrupt enab le 1 = enabled; 0 = disabled; read/write; non-volatile.
D[3] APCSEL Selects APC setpoint register 00 = APCSET0, 01 = APCSET1, 10 = APCSET2;
11 = reserved; read/write; non-volatile.
D[2:0] Reserved Reserved
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OEM Configuration Register 0 (OEMCFG0)
D[7]
RST
write only
D[6]
ZONE
read/write
D[5]
DFLT
read only
D[4]
OE
reserved
D[3]
MODREF
reserved
D[2]
VAUX[2]
read/write
D[1]
VAUX[1]
read/write
D[0]
VAUX[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 00 = 00h
A write to OEMCFG0 will result in any A/D conversion in progress being aborted and the result discarded. The A/D will begin a
new conversion sequence once the write operation is complete. All bits in OEMCFG0 are non-volatile except DFLT and RST. A
valid OEM password is required for access to this register.
Bit(s) Function Operation
D[7] RST 0 = no action; 1 = reset; write-only.
D[6] ZONE Selects temperature zone. 0 = internal; 1 = external; non-volatile.
D[5] DFLT Diode fault flag. 1 = diode fault; 0 = OK.
D[4] OE Output enable for SHDN, VMOD,
and VBIAS. 1 = enabled; 0 = hi-Z; non-volatile.
D[3] MODREF Selects whether VMOD is
referenced to ground or VDD. 1 = VDD; 0 = GND; non-volatile.
D[2:0] VAUX[2:0] Selects the voltage reported in
VINh:VINl. 000 = VIN; 001 = VDDA; 010 = VBIAS; 011 = VMOD;
100 = APCDAC; 101 = MODDAC; 110 = FLTDAC; non-volatile
OEM Configuration Register 1 (OEMCFG1)
D[7]
INV
read/write
D[6]
GAIN
read/write
D[5]
BIASREF
read/write
D[4]
RFB[2]
read/write
D[3]
RFB[1]
read/write
D[2]
RFB[0]
read/write
D[1]
SRCE
read/write
D[0]
SPOL
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 1 = 01h
A write to OEMCFG1 will result in any A/D conversion in progress being aborted and the result discarded. The A/D will begin a
new conversion sequence once the write operation is complete. All bits in OEMCFG1 are non-volatile and w ill be maint ai n ed
through power and reset cycles. A valid OEM pas s word is required for access to this register.
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Bit(s) Function Operation
D[7] INV Inverts the APC op-amp inputs.
When set to “0” the BIAS DAC
output is connected to the “+”input
and FB is connected to the “–” input
of the op amp. Set to “0” to use the
ADC feedback loop.
0 = emitter follower (no inversion);
1 = common emitter (inverted); read/write; non-volatile.
D[6] GAIN Sets the feedback voltage range by
changing the APCDAC output
swing; 0-VREF for optical feedback,
0-VREF/4 for electrical feedback.
1 = VREF/4 full scale;
0 = VREF full scale; read/write; non-volatile.
D[5] BIASREF Selects whether FB and VMPD are
referenced to ground or VDD and
selects feedbac k resistor termination
voltage (VDDA or GNDA).
1 = VDD; 0 = GND; read/write; non-volatile.
D[4:2] RFB[2:0] Selects inter nal feed ba ck resi s tanc e.
(Resistors will be terminated to VDDA
or GNDA according to BIASREF.)
000 = ∞;
001 = 800Ω,
010 = 1.6kΩ,
011 = 3.2kΩ,
100 = 6.4kΩ,
101 = 12.8kΩ,
110 = 25.6kΩ,
111 = 51.2kΩ;
read/write; non-volatile.
D[1] SRCE VBIAS source vs. sink drive. 1 = source (NPN),
0 = sink (PNP); read/write; non-volatile.
D[0] SPOL Polarity of shutdown output, SHDN,
when active. 1 = high;
0 = low; read/write; non-volatile.
OEM Configuration Register 2 (OEMCFG2)
D[7]
I2CADR[3]
read/write
D[6]
I2CADR[2]
read/write
D[5]
I2CADR[1]
read/write
D[4]
I2CADR[0]
read/write
D[3]
LUTOFF
read/write
D[2]
LUTOFF
read/write
D[1]
LUTOFF
read/write
D[0]
LUTOFF
read/write
Default Value 1010 xxxxb = xxh (slave address = 1010xxxb)
Serial Address A6h = 1010011b
Byte Address 2 = 02h
CAUTION: Changes to I2CADR take effect immediately! Any accesses following a write to I2CADR must be to the newly
programmed serial bus address. A valid OEM password is required for access to this register. This register is non-v ola t il e and
will be maintained through power and reset cycles.
Bit(s) Function Operation
D[7:4] I2CADR[3:0] Upper four MSBs of the serial bus
slave address; writes take effect
immediately.
Read/write; non-volatile.
D[3:0] LUTOFF LUT offset. LUTOFF is added to the
result of the digital tem pera t ur e
sensor to derive the table
index; writes take effect after reset.
Read/write; non-volatile.
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APC Setpoint 0 (APCSET0)
Automatic power control setpoint (unsigned binary) used when APCSEL[1:0] = 00
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 3 = 03h
When A.P.C. is on, i.e., the APCCAL bit in OEMCAL0 is set, the value in APCSETx is added to the signed value taken from the
A.P.C. look-up table and loaded into the VBIAS DAC. When A.P.C. is off, the value in APCSET is loaded direc tly into the VBIAS
DAC, bypassing the loo k-up table entirely. In either case, the VBIAS DAC setting is reported in the VBIAS register. The
APCCFG bits determine the DAC’s response to higher or lower numeric values. A valid OEM password is required for acces s to
this register. This register is non-volatile and will be maintained through power and reset cycles.
APC Setpoint 1 (APCSET1)
Automatic power control setpoint (unsigned binary) used when APCSEL[1:0] = 01
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 4 = 04h
When A.P.C. is on, i.e., the APCCAL bit in OEMCAL0 is set, the value in APCSETx is added to the signed value taken from the
A.P.C. look-up table and loaded into the VBIAS DAC. When A.P.C. is off, the value in APCSET is loaded directly into the VBIAS
DAC, bypassing the loo k-up table entirely. In either case, the VBIAS DAC setting is reported in the VBIAS register. The
APCCFG bits determine the DAC’s response to higher or lower numeric values. A valid OEM password is required for acces s to
this register. This register is non-volatile and will be maintained through power and reset cycles.
APC Setpoint 2 (APCSET2)
Automatic power control setpoint (unsigned binary) used when APCSEL[1:0] = 10
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 5 = 05h
When A.P.C. is on, i.e., the APCCAL bit in OEMCAL0 is set, the value in APCSETx is added to the signed value taken from the
A.P.C. look-up table and loaded into the VBIAS DAC. When A.P.C. is off, the value in APCSET is loaded directly into the VBIAS
DAC, bypassing the loo k-up table entirely. In either case, the VBIAS DAC setting is reported in the VBIAS register. The
APCCFG bits determine the DAC’s response to higher or lower numeric values. This register is non-volatile and will be
maintained through power and reset cycles. A val id OEM password is required for access to this register.
Modulation DAC Setting (MODSET)
Nominal VMOD setpoint
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 6 = 06h
When A.P.C. is on, the value corresponding to the current temperature is taken from the MODLUT look-up table, added to
MODS ET and loaded into the VMOD DAC. This register is non-vol atile and will be maintained through power and reset cycles. A
valid OEM password is required for access to this register.
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IBIAS Fault Threshold (IBFLT)
Bias current fault threshold
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 7 = 07h
A valid OEM password is required for access to this register. This register is non-volatile and will be maintained through power
and reset cycles. A fault is generated if the bias current is higher than IBFLT value set in this register.
Transmit Power Fault Thres hold (TXFL T)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 8 = 08h
A valid OEM password is required for access to this register. This register is non-volatile and will be maintained through power
and reset cycles. A fault is generated if the Transmit power is higher than TXFLT value set in this register.
Loss-Of-Signal Threshold (LOSFLT)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 9 = 09h
A valid OEM password is required for access to this register. This register is non-volati le an d will be maintai ned thr ou gh power
and reset cycles. A fault is generated if the received power is lower than LOSFLT value set in this register.
Byte Function Operation
D[7:4] Receive los s-of-signal thr esh old Read/write; non-volatile.
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Fault Suppression Timer (FLTTMR)
Fault suppression interval in increments of 0.5ms
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 10 = 0Ah
Saturation faults are suppressed for a time, tFLTTMR, following las er turn-on. This avoids nuisance tripping while the APC loop
starts up. The length of this interval is (FLTTMR0.5ms), typic al . A value of zero will result in no fault suppression. A valid OEM
password is required for access to this register. This register is non-volatile and will be maintained through power and reset
cycles.
Fault Mask (FLTMSK)
D[7]
OEMIM
read/write
D[6]
POHE
read/write
D[5]
reserved D[4]
reserved D[3]
SATMSK
read/write
D[2]
TXMSK
read/write
D[1]
IAMSK
read/write
D[0]
DFMSK
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 11 = 0Bh
A valid OEM password is required for access to this register. This register is non-volatile and will be maintained through power
and reset cycles.
Bit Function Operation
D[7] OEMIM OEM interrupt mask bit 1 = masked; 0 = enabled; Read/write; non-volatile.
D[6] POHE OEM Power-on Hour Meter enabl e bit 1 = enabled; 0 = disabled; Read/write; non-volatile.
D[5:4] D[5:4] Reserved Always write as zero; reads undefined.
D[3] SATMSK APC saturation fault mask bit 1 = masked; 0 = enabled; Read/write; non-volatile.
D[2] TXMSK High TX optical power fault mask bit 1 = masked; 0 = enabled; Read/write; non-volatile.
D[1] IAMSK Bias current high alar m mas k bit 1 = masked; 0 = enabled; Read/write; non-volatile.
D[0] DFMSK Diode fault mask bit 1 = masked; 0 = enabled; Read/write; non-volatile.
OEM Password Setting (OEMPWSET)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 12 - 15 = 0Fh - 0Fh; 0Ch = MSB
This four-byte field is the password required for access to the OEM area of the MIC3001’s memory and registers. The byte at
address 250 (FAh) is the most significant byte. This field is compared to the four-byte OEMPW field at serial address A2h, byte
120 to 123. If the two fields match, access is allowed to the OEM areas of the MIC3001 non-volatile memory at serial addresses
A4h and A6h. The OEM password may be set by writing the new value into OEMPWSET. The new password will not take effec t
until after a power-on reset occurs or a warm res et is performed using the RST bit in OEMCFG0. This allows the new password
to be verified before it takes effect. These registers are non-volatile and will be maintained through power and reset cycles. A
valid OEM password is required for access to this register.
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Byte Weight
3 OEM Password, Most Significant Byte
2 OEM Password, 2nd Most Significant Byte
1 OEM Password, 2nd Least Significant Byte
0 OEM Password, Least Significant Byte
OEM Calibration 0 (OEMCAL0)
D[7]
reserved
D[6]
FLTDIS
read/write
D[5]
FSPIN
read/write
D[4]
WRINH
read/write
D[3]
APCCAL
read/write
D[2]
FRCINT
read/write
D[1]
FRCTXF
read/write
D[0]
FRCLOS
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 16 = 10h
A valid OEM password is required for access to this register.
Bit Function Operation
D[7] Reserved Always write as zero; reads undefined.
D[6] FLTDIS Fault comparator disabl e; inhi bits
output of fault comparators when set. 0 = faults enabled; 1 = disabled; Read/write.
D[5] FSPIN Fault compar at or “spi n-on-channel”
mode select; do not enable ADC and
FC spin-on-channel modes
simultaneously.
0 = normal operation; 1 = spin on channel; Read/write.
D[4] WRINH Inhibit NVRAM write cycles. 0 = normal operation; 1 = inhibit writes; Read/write.
D[3] APCCAL Selects APC calibration mode - DACs
may be controlled directly. 0 = normal mode; 1 = calibration mode; Read/write.
D[2] FRCINT Forces the assertion of /INT 0 = normal operation; 1 = asserted; Read/write.
D[1] FRCTXF Forces the assertion of TXFAULT 0 = normal operation; 1 = asserted; Read/write.
D[0] FDCLOS Forces the assertion of RXLOS 0 = normal operation; 1 = asserted; Read/write.
OEM Calibration 1 (OEMCAL1)
D[7]
reserved
D[6]
ADSTP
read/write
D[5]
ADIDL
read/write
D[4]
1SHOT
read/write
D[3]
ADSPIN
read/write
D[2]
SPIN[2]
read/write
D[1]
SPIN[1]
read/write
D[0]
SPIN[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 17 = 11h
A valid OEM password is required for access to this register.
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Bit Function Operation
D[7] Reserved Always write as zero; reads undefined.
D[6] ADSTP Stop ADC Halts the analog to digital
converter 0 = normal operation; 1 = stopped; Read/write.
D[5] ADIDL ADC idle flag 0 = busy; 1 = idle; Read/write.
D[4] 1SHOT Triggers one-shot A/D conversi on
cycle 0 = normal operation; 1 = one-shot; Read/write.
D[3] ADSPIN Selects ADC spin-on-channel mode ;
do not enable ADC and FC spin-on-
channel modes simultaneously
0 = normal operation; 1 = spin-on-channel; Read/write.
D[2],
D[1], D[0] SPIN[2:0] ADC and fault comparator (FC)
channel selec t for spin-on-channel
mode; do not enable ADC and FC
spin-on-channel modes
simultaneously
ADC: 000 = temperature; 001 = voltage; 010 = VILD;
011 = VMPD; 100 = VRX; FC: 001 = VILD;
001 = VMPD; 010 = VRX; Read/write.
OEM Calibration 1 (OEMCAL1)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 18 = 12h
The look-up table index is derived from the current temperature measurement and LUTOFF as follows:
where TAVG(n) is the current average temperature. This register allows the current table index to be read by the host. The table
base address must be added to LUTINDX to form a complete table index in physical memory. A valid OEM password is
required for access to this register. Otherwise, reads are undefine d.
OEM Configuration 3 (OEMCFG3)
D[7]
LUTSEL
read/write
D[6]
TXFPOL
read/write
D[5]
GPOD
read/write
D[4]
GPOM
read/write
D[3]
GPOC
read/write
D[2]
TXFIN
read/write
D[1]
LOSDIS
read/write
D[0]
INTCAL
read/write
Default Value 0000 1000b = 08h
Serial Address A6h = 1010011b
Byte Address 19 = 13h
This register is non-volatile and will be maintained through power and reset cycles. A valid OEM password is required for access
to this register. GPOD and GPOC are ignored when GPOM = 0. TXFPOL is ignored if TXFIN = 0.
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Bit Function Operation
D[7] LUTSEL RX power look-up table input
se lec tion bit 1 = RX power;
0 = temperature; read/write; ignored if INTCAL = 0.
D[6] TXFPOL TXFIN active polarity sel ect; a fault
is indicated when TXFIN = TXFPOL 0 = active-low;
1 = active-high; read/write; ignored if TXFIN = 0.
D[5] GPOD GPO output drive 0 = open drain;
1 = push-pull; read/write; ignored if GPOM = 0.
D[4] GPOM GPO/RSOUT mode select 0 = RSOUT; 1 = GPO; read/write.
D[3] GPOC GPO output control 0 = low; 1 = high; read/write; ignored if GPOM = 0.
D[2] TXFIN TXFIN mode select 0 = SHDN; 1 = TXFIN; read/write.
D[1] LOSDIS RXLOS comparator disabl e 0 = enabled; 1 = disabled; read/write.
D[0] INTCAL Calibratio n mode sel ect 0 = external calibration;
1 = internal calibration; read/write.
BIAS DAC Setting (APCDAC)
Current VBIAS Setting
D[7]
read only D[6]
read only D[5]
read only D[4]
read only D[3]
read only D[2]
read only D[1]
read only D[0]
read only
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 20 = 14h
This register reflects (reads back) the value set in the APC register (APCSET0, APCSET1, or APCSET2 whichever is selected).
A valid OEM password is required for access to this register.
Modulation DAC Setting (MODDAC)
Current VMOD Setting
D[7]
read only D[6]
read only D[5]
read only D[4]
read only D[3]
read only D[2]
read only D[1]
read only D[0]
read only
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 21 = 15h
This register reflects (reads back) the value set in the MODSET register. A valid OEM pas sword is required for ac cess to this
register.
OEM Readback Register (OEMRD)
D[7]
reserved D[6]
reserved D[5]
reserved D[4]
INT
read only
D[3]
APCSAT
read only
D[2]
IBFLT
read only
D[1]
TXFLT
read only
D[0]
RSOUT
read only
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 22 = 16h
This register reflects (reads back) the status of the bits corresponding to the parameters defined below. A valid OEM password
is required for access to this register. Otherwise, reads are undefined and writes are ignored.
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Bit Function Operation
D[7:5] Reserved Always write as zero; reads undefined.
D[4] INT Mirrors state of /INT but active-high;
not state of phy sical pin ! 1 = interrupt; 0 = no interrupt.
D[3] APCSAT APC saturation fault comparator
output state 1 = fault; 0 = normal operation.
D[2] IBFLT State of IBIAS over-curr ent fault
comparator output 1 = fault; 0 = normal operation; read-only.
D[1] TXFLT State of transmit power fault
comparator output 1 = fault; 0 = normal operation; read-only.
D[0] RSOUT State of the rate select output pin,
RSOUT 1 = high; 0 = low; Read-only.
Signal Detect Threshold (LOSFLTn)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 23 = 17h
This register works in conjunction with the LOSFLT register to control the oper atio n of the l oss of signal co mpara t or. The
comparator’s output, RXLOS, is asserted when the input on VRX falls below the level in LOSFLT. The output wi ll then be de-
asserted when the VRX signal rises above LOSFLTn. The input signal is subject to scaling by the RXPOT. If the LOS
comparator is disabled, i.e., LOSDIS = 1, this register is ignored. A valid OEM password is required for access to this register.
This register is non-volatile and will be maintained through power and reset cycles.
RX EEPOT Tap Selection (RXPOT)
D[7]
reserved D[6]
reserved D[5]
reserved D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 24 = 18h
This register is non-volatile and will be maintained through power and reset cycles. A valid OEM password is required for access
to these registers.
Bit(s) Function Operation
D[7:5] Reserved Reserved. Always write as zero; reads undefined.
D[4:0] RXPOT tap selection:
00000 = No divider action; POT
disconnected
00001 = 31/32
00010 = 30/32
11110 = 2/32
11111 = 1/32
Read/write; non-volatile.
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OEM Configuration 4 (OEMCFG4)
D[7]
reserved D[6]
reserved D[5]
reserved D[4]
reserved D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 25 = 19h
This register is non-volatile and will be maintained through power and reset cycles. A valid OEM password is required for access
to these registers.
Bit(s) Function Operation
D[7:5] Reserved Reserved. Always write as zero; reads undefined.
ISTART[3:0] ISTART current lev el sel ect ion :
0000 = No ISTART current
0001 - 1111 = 0.375mA x ISTART[3:0]
ISTART is used to speed up the laser start-up
after a fault accures. The charging current
of the compensation cap starts from ISTART
instead of ramping up from 0.
Read/write; non-volatile.
Power-On Hour Mete r Data (POHDATA)
D[7]
read/write D[6]
read/write D[5]
read/write D[4]
read/write D[3]
read/write D[2]
read/write D[1]
read/write D[0]
read/write
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 32-39 = 20h - 27h
These registers are used for backing up the POH result during power cycles. At power-up, the POH meter selects the larger of
the two values as the initial count. Incremental results are stored in alternate register pairs. The power-on hour meter may be
reset or preset by writing to these registers. These registers are non-volatile and will be ma intai ned thr ou gh power and reset
cycles. A valid OEM password is required for access to these registers.
Byte Weight
3 POHA, high-byte
2 POHA, low-byte
1 POHB, high-byte
0 POHB, low-byte
OEM Scratchpad Registers (SCRATCHn)
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address SCRATCH0: 126 = 7Eh
SCRATCH1: 127 = 7Fh
SCRATCH2: 128 = 80h
.......................................
SCRATCH127: 253 = FDh
The scratchpad registers are general-purpose non-volatile memory locations. They can be freely read from and written to any
time the MIC3001 is in OEM mode.
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RX Power Loo k-up Table (RXLUTn)
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 40-71 = 28h - 47h
These registers are non-volatile and will be maintained through power and reset cycles. A valid OEM password is required for
access to these registers.
Bytes Definition
RXSLP0h RX Slope 0, High Byte.
RXSLP0l RX Slope 0, Low Byte.
RXOFF0h RX Offset 0, High Byte.
RXOFF0l RX Offset 0, Low Byte.
RXSLP1h RX Slope 1, High Byte.
RXSLP1l RX Slope 1, Low Byte.
RXOFF1h RX Offset 1, High Byte.
RXOFF1l RX Offset 1, Low Byte.
RXSLP7h RX Slope 7, High Byte.
RXSLP7l RX Slope 7, Low Byte.
RXOFF7h RX Offset 7, High Byte.
RXOFF7l RX Offset 7, Low Byte.
Calibration Constants (CALn)
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 74 - 87 = 4A h - 57h
These registers are non-volatile and will be maintained through power and reset cycles. A valid OEM password is required for
access to these registers.
Bytes Definition
TOFFh Temperature Offset, High Byte.
TOFF0l Temperature Offset, Low Byte. Always Reads Zero; Writes Ignored.
VSLP0h Voltage Slope, High Byte.
VSLP0l Voltage Slope, Low Byte.
VOFFh Voltage Offset, High Byte.
VOFF0l Voltage Offset, Low Byte.
ISLP0h Bias Current Slope, High Byte.
ISLP0l Bias Current Slope, Low Byte.
IOFFh Bias Current Offset, High Byte.
IOFF0l Bias Current Offset, Low Byte.
TXSLPh TX Power Slope, High Byte.
TXSLPl TX Power Slope, Low Byte.
TXOFFh TX Power Offset, High Byte.
TXOFFl TX Power Offset, Low Byte.
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Manufacturer ID Register (MFG_ID)
Identifies Micrel as the manufacturer of the device. Always returns 2Ah
D[7]
read only D[6]
read only D[5]
read only D[4]
read only D[3]
read only D[2]
read only D[1]
read only D[0]
read only
Default Value 0000 0000b = 00h
Serial Address A6h = 1010011b
Byte Address 32-39 = 20h - 27h
These registers are used for backing up the POH result during power cycles. At power-up, the POH meter selects the larger of
the two values as the initial count. Incremental results are stored in alternate register pairs. The power-on hour meter may be
reset or preset by writing to these registers. These registers are non-volat ile and w ill be maint ai ned throu gh power and reset
cycles. A valid OEM password is required for access to these registers.
Bit(s) Function Operation
D[7:0] Identifies Micrel as the manufacturer of the device.
Always returns 2Ah. Read only. Always returns Ah
Device ID Register (DEV_ID)
D[7]
read only D[6]
read only D[5]
read only D[4]
read only D[3]
read only D[2]
read only D[1]
read only D[0]
read only
MIC3001 DEVICE ID
always reads 0 at D[5-7] and 1 at D[4] DIE REVISION
Default Value 0001 xxxxb = 1xh
Serial Address A6h = 1010011b
Byte Address 255 = FFh
The value in this register, in combination with the MFG_ID register, serve to identify the MIC3001 and its revision number to
software. This register is read-only.
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Applications Information
Controlling Laser Diode Bias
Figure 26. Example APC Circuit for Common -Cathode TOSA
Figure 27. Example APC Circuit for Common Anode TOSA
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Choosing CCOMP
The APC loop is compensated by a capacitor, CCOMP,
connected from COMP to either VDDA or GNDA. This capacitor
adjusts the slew rate and bandwidth of the loop as follows:
where:
ISLEW = 64µA,
GM = 125 µMho
these relationships are shown graphically in Figure 28 and
Figur e 29.
Figure 28. Slew Rate vs. CCOMP Value
Figure 29. Open Loop Unity-Gain Bandwidth
vs. CCOMP
The loop response should be tailored to the data rate,
encoding format and maximum run-lengths, and required
laser turn-on time. Higher data rates and/or shorter
maximum run lengths and/or faster turn-on times call for
small er c ap ac it ors . L o wer d ata r a tes a nd/ or l on ger maxim um
run lengths and/or slower turn-on times call for larger
capacitors. In order to meet the SFP/GBIC turn-on
requirement of 1ms, for example, do not employ a capacitor
larger t han 20nF . Lo w ESR c apacitor s such as ceram ics wil l
give the best results. Excessive ESR will reduce the
effectiveness of CCOMP. The capacitor’s voltage rating must
exceed VDDA. Some typical values are shown in Table 22.
Application CCOMP (nF)
8b/10b encoding, ≥1Gbps, tON ≤ 1ms 10
SONET (62b/64b encoding), ≥1Gbps 22
≥155Mbps, tON ≤ 1ms 22
≥155Mbps 100
Table 22. Typical Values for CCOMP
While there is no theoretical upper limit on the size of
CCOMP, it is desirable for the loop to be able to track the
changes resulting from periodic temperature
compensation. The typical temperature compensation
update period is 1.6s. Therefore, a maximum size of 1mF
is recommended. If laser turn-on time is not a factor, a
value between 100nF and 1mF can be used for virtually
any typical application. The tradeoff is that higher value
capacitors have a larger physical size and cost.
In order to maximize the power supply rejection ratio
(PSRR), CCOMP should be returned to GNDA when the
VBIAS output is sourcing current, e.g., driving an NPN
transistor (SRCE bit = 1). CCOMP should be returned to
VDDA when the VBIAS output is sinking current, e.g., driving
a PNP transistor (SRCE bit =0).
Measuring Laser Bias Current
VILD+ and VILDform a pair of pseudo-differential A/D
inputs for meas uring laser diode bias cur rent v ia a s ense
resistor. The signal applied to these inputs is converted to
a single-ended, ground-referenced signal for input into
the ADC and bias current f ault com parator. Thes e inputs
have lim ited common-mode voltage r ange. The f ull-scale
differential input range is VREF/4 or about 300mV.
Figure 26 and Figure 27 illustrate the typical
implementation of this function. Note that VILDis alw ay s
connected to the circuit’s reference potential: VDD in the
case of a common-anode transmitter optical sub-
assembly (TOSA) and GND in the case of a common-
cathode T OSA. Note that the m onitor photodio de current
will also flow in the sense resistor. This will result in a
small offset in the measured bias current. The APC
function will hold this term constant, so it can be corrected
for in the external calibration constants. The sensing
resistor could also be connected between VDD and the
emitter of Q1 on figure 26 or between the emitter of Q1
and GND on Figure 27.
Interfacing To Laser Drivers
In order for the MIC3001 to control the modulation current
of the laser diode, an interface circuit may be required
depending on the method used by the driver to set its
modulation current level. Generally, most laser diode
driver ICs use one of three methods:
a) A current, ISET, is sourced into a pin on the driver
IC. The m odulation current delivered by the dr iver
is then some fixed m ultiple of ISET. The SY88912 is
an example of this type of driver. A simple circuit
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can be used to cr eate a c urr ent s ourc e c ontrolled b y the
VMOD outputs. The circuit is bas ed on an ex ter nal bipo lar
transistor and a current sensing resistor.
b) A current, ISET, is drawn out of a pin on the driver IC.
The modulation current delivered by the driver is then
som e fi xed multiple of ISET. A simple cir cuit can be used
to create a current source controlled by the VMOD
outputs. The circuit is based on an external bipolar
transistor and a current sensing resistor.
c) A voltage, VSET, is a pplied to a pi n on the driver IC . This
voltage may be referenced to GND or VDD. The
MIC3001’s VMOD+ output c an s upply this v oltage directly.
If a voltage swing wider than VREF is needed, gain can
be applied with a pair of external resistors. The
SY88932, SY88 982, and S Y89307 are exam ples of this
type of driver.
SY88912 3.3V 3.2Gbps SONET/SDH Laser Driver
The modulation level of the SY88912 driver is controlled by the
current sourced into the RSET pin (Type (a) above). The circuit
shown in Figure 30.allows the MIC3001’s VMOD outputs to
control the SY88912’s modulation current from its minimum
value, 5m A, to its max imum value, 60m A. The c ircuit operates
as a DAC-controlled current source. The current source is
formed by the VMOD buffer amplifier, external transistor, and
current sense resistor. The op-amp acts to force the voltage
drop across RSET to be equal to the DAC output voltage.
The current, ISET, through RSET is therefore regulated as
ISET = VMOD+/RSET (In this case, the DAC output and therefore
the op-amp output, are referenced to VDDA.) The SY88912’s
current gain, IMOD/ISET, is 23. A modulation current level of
60mA requires ISET = 60mA/23 = 2.61mA; a modulation current
level of 5mA requires ISET = 5mA/23 = 0.217mA. RFLTR and
CFLTR are optional and act to elim inate an y noise that m ight be
present on VDDA or VMOD. The values shown give a 100ms time
constant. Note that the t ime constant is present whene ver the
laser is turned on or turned off. This must be taken into
account when designing to system specifications such as the
SFP MSA’s tON and tOFF requirements. The values of RFLTR
and/or CFLTR m a y need t o be adj us ted ac cor ding ly. The impact
of the f ilter tim e cons tant on the tur n of f tim e can be eliminated
by using the MIC3001’s SHDN signal to drive the SY88912’s
enable input, /EN.
The use of the SHDN signal is com pletely optional. The m ain
benefit to using SHDN, however, is that it shuts down the
driver very quickly and irrespective of the values of RFLTR and
CFLTR. The values of RFLTR and CFLTR can therefore be
increased, enhancing the ir effect without incurring any turn-off
time penalty. Depending on the polarity chosen for SHDN
using the SPOL bit, an i nver s ion ma y be required bet we en the
MIC3001’s SHDN output and the driver’s /EN input. (The
SHDN output may also be used to drive a redundant safety
switch and the same polarity may not be appropriate for both
functions.)
Figure 30. Controlling the SY88912
Modulation Cur rent
For the circuit of Figure 30, the modulation current control
range and corresponding DAC values are shown in Table
23 below.
DAC VDDA-VMOC ISET IMOD
0 0V 0mA 0mA
19 0.091V 0.216mA 4.98mA
127 0.61V 1.45mA 33.4mA
255 1.22V 2.91mA 66.8mA
Table 23. Control Range of SY88912
Modulation Control Circuit
SY88932 3.3V 3.2Gbps SONET/SDH Laser Driver
The m odulation level of the SY88932 driver is controlled
by the voltage applied to the VCTRL pin (Type (c)
above). The circuit shown in Figure 31 allows the
MIC3001’s VMOD output to control the SY88932’s
modulation current. The circuit operates as a DAC-
controlled voltage source. VCTRL is simply the DAC
output voltag e. S ee s ec tion above on S Y889 12 f or RFLTR,
CFLTR and SHDN.
Figure 31. Controlling the SY88932 Modulation Current
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SY89307 5.0V/ 3.3V 2.5Gbps VCSEL Driver
The m odulation leve l of th e S Y89307 driver is co ntrol led by
the voltage applied to the VCTRL pin (Type (c) above).
The circuit shown in Figure 32 allows the MIC3001’s VMOD
output to control the SY89307’s output swing. VCTRL is
simply the DAC output voltage. The circuit operates as a
DAC-controlled voltage source. See section above on
SY88912 for RFLTR, CFLTR.
Figure 32. Controlling the SY89307
Modulation Current
Laser Drivers Programmed via a Sink Current
The modulation level of some laser diode drivers is
controlled by a current sourced out of the RSET pin (Type
(b) above). The circuit shown in Figure 33 allows the
MIC3001’s VMOD outputs to control the set current, ISET.
The circuit operates as a DAC-controlled current sink. The
current s ink is f ormed b y the VMOD b uffer am plifier, ext ernal
transistor, and current sense resistor. The op-amp acts to
forc e the volt age dr op ac ros s RSET to be equal to t he D AC
output voltag e.
The current through RSET is therefore regulated as
IRSET = VMOD+/RSET. ISET is given by the equation:
(13)
where b is the DC gain of Q1
The higher the gain of the transistor, the closer ISET will be
to the current in RSET. RFLTR and CFLTR act to eliminate any
noise that might be present on VDDA or VMOD. The values
shown give a 100ms time constant. See section above on
SY88912 for RFLTR, CFLTR and SHDN.
Figure 33. Controlling the Modulation Current
via a Sink Current
Drivers with Monitor Outputs
Laser diode driver ICs have been introduced with
monitor o ut pu ts . These o ut p uts pr o v ide grou nd-referred
sig nals th at mirror c rit ic al s i gna ls lik e las er b ias curre nt,
modulation current or monitor photodiode current, an
analog of transmitted power. Generally, these outputs
source a current into an external resistor to generate a
ground-referenced voltage. Using these outputs with
the MIC3001 is straightforward since the MIC3001’s
VILD+/and VMPD inputs are polarity programmable,
Shutdown Output
The shut down out put, SHD N, can be use d in two wa ys:
as an enable or on/off control for the laser driver IC,
and/or t o c o ntrol a r e du nd a nt switch in the l as er current
path. The redundant switch provides a means for the
MIC3001 to shut off the laser current even if the bias
transistor or modulator is damaged or fails. SHDN is
activ e any tim e the MIC 3001 shu ts down t he las er, i.e .,
if the TXDISABLE function is asserted in hardware or
software, or if the fault detection circuits trigger laser
shutdown. The shutdown output, SHDN, is essentially a
logic output with programmable polarity. The
programmable polarity allows SHDN to drive either
high-side or low-side switches or active-high or active-
low enable inputs without the need for external
inversion circuits. If an active-low and an active-high
shutdown signal are required, an external inverter will
be necessary. Examples of redundant switch circuits
are shown in Figure 34.
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Figure 34. Redundant Switch Circuits
Temp eratu re Sensing
The MIC3001 can measure and report its own internal
temperature or the temperature of a remote PN junction or
“thermal diode”. In either case it is important to note that
any board-mounted semiconductor device tends to track
the ground plane temperature around it. The dominant
thermal path to the sensor is often the ground pin. The
ground pin usually connects to the lead-frame paddle on
which the die is mounted. Typical semiconductor packages,
being non-conductive plastic, insulate the device from the
ambient air.
The advantage to using a remote sensor is that the
temperature may be sensed at a specific location, such as
in the proximity of the laser diode, or away from any heat
sources where it will more closely track the transceiver’s
case temperature. The measured temperature is reported
via the digital d iagnost ics registers an d is used to ind ex the
temperature compensation tables. (Note: SFF-8472 does
not specify the meaning of the reported temperature
information or the location from which it is taken. This
information is to be specified in the transceiver vendor’s
datasheet.)
Remote Sensing
For remote temperature sensing using the XPN pin,
most small-signal PNP transistors with characteristics
similar to the JEDEC 2N3906 will perform well as
thermal diodes. Table 24 lists several examples of
such parts that Micrel has tested for use with the
MIC3001. Other tra nsistors equivalent t o these s hould
also work well.
Vendor Par t Number Package
Fairchild Semiconductor MMBT3906 SOT-23
On Semiconduc tor MMBT3906L SOT-23
Infi neon T echnologies SMBT3906/MMBT3906 SOT-23
Samsung
Semiconductor KST3906-TF SOT-23
Table 24. Transistors Suitable for
Use as Remote Diodes
Minimizing Errors
Self-Heating
One concern when measuring t emperature is to avoid
errors induced by self-heating. Self-heating is caused
by power dissipation within the MIC3001. It is directly
proportional to the internal power dissipation and the
junction-to-ambient thermal resistance, θJA. The
dissipation in the MIC3001 must be calculated and
reduced to a temperature offset. The power
dissipation, PDISS, includes the effect of quiescent
current and all currents flowing into or out of any
signal pins, especially VBIAS and VMOD. The
temperature rise caused by self-heating is given by:
(14)
θJA is given in the “Operating Ratings” section above
as 43°C/W. The possible contributors to self-heating
are listed in Table 25.
The numbers given in Table 25 suggest that the
power dissipation in a typical application will be no
more than a few tens of milliwatts, leading to self-
heating on the order of 1°C.
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Table 25. Contributors to Self-Heating
In any application, the best and often easiest
approach is to measure performance in the final
application environment. This is especially true when
dealing with systems for which some temperature
data ma y be p oorly defined or unobtainable exc ept by
empirical means. If desired, the external calibration
constants may be used to correct the temperature
readings.
Series Resistance with External Temperature
Sensor
The operation of the MIC3001 depends upon sensing
the VCB-E of a diode-connected PNP transistor
(“diode”) at two different current levels. For remote
temperature measurements, this is done using an
external diode connected between XPN and ground.
Since this technique relies upon measuring the
relatively small voltage difference resulting from two
levels of current through the external diode, any
resistance in series with the external diode will cause
an error in the t emperatur e readi ng f r om the MIC 300 1.
A good rule of thumb is this: for each ohm in series
with the external transistor, there will be a 0.9°C error
in the MIC3001’s temperature measurement. It is not
difficult to keep the series resistance well below an
ohm (t ypicall y <0.1), so this will rarel y be an issue.
XPN Filter Capacitor Selection
It is desirable to employ a filter capacitor between
XPN and GNDA. The use of this capacitor is
especiall y recomm ended in environments with a lot of
high fr equency no ise (such as dig ital switc hing noise) ,
or if long wires are used to connect to the remote
diode. The maximum recommended total capacitance
from the XPN pin to GND is 2000pF. The
recommended typical capacitor is a 1000pF NP0 or
C0G ceramic capacitor with a 10% tolerance. If the
remote diode is to be at a distance of more than 6" to 12"
from the MIC3001, using twisted pair wiring or shielded
microphone cable for the connections to the diode can
significantly reduce noise pickup. If using a long run of
shielded cable, remember to subtract the cable’s
conductor-to-shield capacitance from the 2000pF
maximu m total capa cita nce.
XPN Layout Co n siderations
The following guidelines should be kept in mind when
designing and laying out circuits using the MIC3001 and
a remote thermal diode:
1. Plac e the MIC3001 as close to the rem ote diode
as possible, while taking care to avoid severe
noise sources such as high speed data busses,
and the like.
2. Since any conductance from the various voltages
on the PC board and the XPN line can induce
errors, it is good practice to guard the remote
diod e’s em itter tr ace wit h a pair of grou nd trac es.
These ground traces should be returned to the
MIC3001’s own ground pin. They should not be
grounded at any other par t of their run. However,
it is highly desirable to use t hese guard traces to
carry the diode‘s own ground return back to the
ground pin of the MIC3001, thereby providing a
Kelvin connection for the base of the diode.
3. When using the MIC3001 to sense the
temper a tur e of a proces sor or oth er dev ice w hic h
has an integral thermal diode, connect the emitter
and base of the remote sensor to the MIC3001
using the guard traces and Kelvin return shown
in F igure 35. Th e co llect or of the r emote diod e is
typically inaccessible to the user on these
devices.
4. Due to the small currents involved in the
Description Magnitude Notes
Quiescent Power IDD x VDD Typically VDD = 3.3V, IDD = 2.7mA 3.3V x 2.7mA = 8.91mW.
SHDN Current IOL x VOL Negligible if MOSFET is used as shutdown device.
TXFAULT Current IOL x VOL Worst case is VDD2/RPULLUP; RPULLUP is 4.7kΩ min. per SFP MSA
3.3V2/4.7kΩ = 2.32mW.
VBIAS Current VBIAS x IVBIAS or (VDD–VBIAS) x IVBIAS Worst-case is VREF x 10mA = 1.22V x 10mA = 12.3mW.
VMOD Current VMOD x IVMOD or (VDD–VMOD) x IVMOD Worst-case is VREF x 10mA = 1.22V x 10mA = 12.3mW.
RSOUT Current IOL x VOL Only for rate-agile applications using RSIN/RSOUT.
DATA Current IOL x VOL x duty_cycle May be negligible; Depends on bus speed, pull-up current, and
bus activity .
RXLOS Current IOL x VOL Worst case is VDD2/RPULLUP; RPULLUP is 4.7kΩ min. per SFP MSA
3.3V2/4.7kΩ = 2.32mW.
Micrel, Inc.
MIC3001
August 2004 75 M9999-082404-A
hbwhelp@micrel.com or (408) 955-1690
measurement of the remote diode’s DVBE, it is
impor tant to ade quatel y clea n the PC boar d after
sold er i ng to pre ve n t cur r e nt l eak a ge. Th is is m os t
likely to show up as an issue in situations where
water-soluble soldering fluxes are used.
5. In general, wider traces for the ground and T1
lines will help reduce susceptibility to radiated
nois e (wi der traces are less i nducti ve). Use tr ace
widths and spac ing of 10 m ils wher ever possible
and provide a ground plane under the MIC3001
and under the connections from the MIC3001 to
the remote diode. This will help guard against
stray noise pi ckup.
Figure 35. Guard Traces and Kelvin Return
for Remote Thermal Diode
Layout Cons iderations
Small Form-Factor Pluggable (SFP) Transceivers
The pinout of the MIC3001 digital control and status
signals was optimized for use in small form-factor
pluggable (SFP MSP) optical transceivers. If the
MIC3001 is mounted on the bottom of the PC board with
the correct rotation, the control and status I/O can be
rout ed to t he hos t co nnec tor without changing the order.
This i s show n i n Fi gu re 36 .
Figure 36. Typical SFP Control and Status I/O
Signal Routing (not to sca le)
Power Supplies
The MIC3001 has separate power supply and ground
pins f or bo th the ana log and digita l s uppl ies. T h is he lps
prevent digital switching noise from corrupting the
analog functions. The individual supply and ground pins
are not isolated from one another inside the IC.
Separate analog and digital power and ground planes
are NOT required on the PCB. Having one of each
plane (power and ground) is certainly good practice,
howe ver. If ded icated po wer and gr ound la yers are no t
available, care should be taken to route the digital
suppl y and return currents back to the supply separate
from the analog supply connections. A schematic of
this approach is shown in Figure 37. Each supply
shoul d be b ypassed as close to t he IC as possib le with
0.01µF capacitor (Low ESR capacitors such as
ceramics are preferred.) as shown. This assumes that
bulk capacitance is already present upstream. If no
other filter capacitance is present nearby, a 1µF filter
capacitor should be added in parallel to the 0.01µF
capacitor.
Figure 37. Power Supply Routing and Bypassing
Using the MIC3001 In a 5V System
It is fairly straightforward to use the MIC3001 in a
system powered from a 5V rail. In these systems, the
laser diode driver IC will usually be powered from the
5V rail. A small linear regulator, such as Micrel’s
MIC5213, can be used to generate a 3.3V power
supply rail if one does not otherwise exist in the system.
All of the MIC3 001’s d igit al I /O’s excep t for RSO UT are
5V tol erant and m ay be p ulled up to 5.5 V reg ardless of
the MIC3001’s supply voltage. The y can be connected
directly to a 5V host. The MIC5213 is ideal, as it is
capable of supplying up to 80mA, is in a tiny SC-70
package, and is stable with small ceramic output
capacitors.
The laser diode driver interface will be unchanged in
mos t cas es. Ground r efer re d volt ages and cur rents ca n
be generated the same way as with 3.3V-powerd
drivers. T he ex ception is dr i vers th at are con tr o ll ed by a
voltage referenced to VDD such as the SY89307. The
MIC30 01’s VBIAS or VMOD ou tput will be r efer enc ed to i ts
own 3.3V power supply whereas the driver’s input will
be ref erenced t o its 5V p ower supp ly. The s olution is a
simple level-shifting circuit that converts the VBIAS/VMOD
output into a current and then into a VDD-referenced
voltage.
Micrel, Inc.
MIC3001
August 2004 76 M9999-082404-A
hbwhelp@micrel.com or (408) 955-1690
Package Information
24-Pin QFN
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/ww w .micrel.com
The inf orm ati on furnis hed by Micrel in this data sheet is believed to be accurate and reliable. However, no respons i bility
is assumed by Micrel for
its use. Micrel reserves the right to change circuitry and specif ications at any time without notific at i on to the customer.
Micrel Products are not designed or authorized for use as components in life support applianc es, devices or systems where malfunction of a
product can reasonably be expected to result in personal i nj ury. Lif e support devices or systems are devices or systems that (a) are intended for
surgical implant int o the body or (b) support or sustain life, and whose fail ure to perform can be reasonably expected to res ult in a significant
injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk
and Purchaser agrees to fully indem nify Micrel f or any damages resulting from such use or sale.
© 2004 Micrel, Incorporated.