
Applications Information
Remote-Diode Selection
The device directly measures the die temperature of CPUs
and other ICs that have on-chip temperature-sensing
diodes (see the Typical Application Circuits), or it can
measure the temperature of a discrete diode-connected
transistor.
Discrete Remote Diodes
When the remote-sensing diode is a discrete transistor,
its collector and base must be connected together; PNP
or npn discrete transistors can be used. Table 16 lists
examples of discrete transistors that are appropriate for
use with this device. The transistor must be a small-signal
type with a relatively high forward voltage; otherwise, the
A/D input voltage range can be violated. The forward
voltage at the highest expected temperature must be
greater than 0.25V at 10µA; at the lowest expected tem-
perature, the forward voltage must be less than 0.95V at
100µA. Large power transistors must not be used. Also,
ensurethatthebaseresistanceislessthan100Ω.Tight
specificationsforforward-currentgain(e.g.,50<β<150)
indicate that the manufacturer has good process controls
and that the devices have consistent VBE characteristics.
Manufacturers of discrete transistors do not normally
specify or guarantee ideality factor. This normally is not
a problem since good-quality discrete transistors tend
to have ideality factors that fall within a relatively narrow
range. Variations in remote temperature readings of less
than ±2°C with a variety of discrete transistors have been
observed. However, it is good design practice to verify
good consistency of temperature readings with several
discrete transistors from any supplier under consideration.
Unused Diode Channels
If one or more of the remote-diode channels is not needed,
disconnect the DXP_ and DXN_ inputs for that channel, or
connect the DXP_ to the corresponding DXN_. The status
register indicates a diode “fault” for this channel and the
channel is ignored during the temperature-measurement
sequence. It is also good practice to mask any unused
channels immediately upon power-up by setting the
appropriate bits in the THERM Mask register. This pre-
vents unused channels from causing THERM to assert.
Thermal Mass and Self-Heating
When sensing local temperature, the device measures
the temperature of the PCB to which it is soldered.
The leads provide a good thermal path between the PCB
traces and the die. As with all IC temperature sensors,
thermal conductivity between the die and the ambient air
is poor by comparison, making air-temperature measure-
ments impractical. Since the thermal mass of the PCB
is far greater than that of the device, the device follows
temperature changes on the PCB with little or no perceiv-
able delay. When measuring the temperature of a CPU,
or other IC with an on-chip sense junction, thermal mass
has virtually no effect; the measured temperature of the
junction tracks the actual temperature within a conversion
cycle. When measuring temperature with discrete remote
transistors, the best thermal-response times are obtained
with transistors in small packages (i.e., SOT23 or SC70).
Take care to account for thermal gradients between
the heat source and the sensor, and ensure that stray
air currents across the sensor package do not interfere
with measurement accuracy. Self-heating does not sig-
nificantly affect measurement accuracy. Remote-sensor
self-heating due to the diode current source is negligible.
Table 16. Remote Sensors Transistor
Suppliers
SUPPLIER PNP MODEL NUMBER
Central Semiconductor Corp.
(USA)
CMPT3906
2N3906
Fairchild Semiconductor
(USA)
MMBT3906
2N3906
Inneon(Germany) SMBT3906
ON Semiconductor
(USA)
MMBT3906
2N3906
ROHMSemiconductor(USA) SST3906
Samsung (Korea) KST3906-TF
Siemens(Germany) SMBT3906
Zetex (England) FMMT3906CT-ND
MAX31730 3-Channel Remote Temperature Sensor
www.maximintegrated.com Maxim Integrated
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