The Allegro A1205 Hall-effect bipolar switch is a next-
generation replacement and extension of the popular Allegro
A3134 bipolar switch. The A1205 has identical specifications
as the A1201 but is recommended for applications that require
pulsing VCC to conserve power. For standard applications,
where VCC is constant, please refer to the A1201 through
A1204 devices.
Overall, the A120x family, produced with BiCMOS technology,
consists of continuous-time devices that feature fast power-on
time and low-noise operation. Device programming is performed
after packaging to ensure increased switchpoint accuracy by
eliminating offsets that can be induced by package stress.
Unique Hall element geometries and low-offset amplifiers
help to minimize noise and to reduce the residual offset
voltage normally caused by device overmolding, temperature
excursions, and thermal stress.
The A120x Hall-effect bipolar switches include the following on
a single silicon chip: voltage regulator, Hall-voltage generator,
small-signal amplifier, Schmitt trigger, and NMOS output
transistor. The integrated voltage regulator permits operation
from 3.8 to 24 V. The extensive on-board protection circuitry
makes possible a ±30 V absolute maximum voltage rating for
superior protection in automotive and motor commutation
applications, without adding external components.
A12051-DS, Rev. 13
MCO-0000312
AEC-Q100 automotive qualified
Quality managed (QM), ISO 26262:2011 compliant
Ideal for applications that require pulsing VCC to
conserve power
Continuous-time operation
Fast power-on time
Low noise
Stable operation over full operating temperature range
Reverse battery protection
Solid-state reliability
Factory-programmed at end-of-line for optimum
performance
Robust EMC performance
High ESD rating
Regulator stability without a bypass capacitor
Continuous-Time Bipolar Switch
Continued on the next page…
Functional Block Diagram
A1205
FEATURES AND BENEFITS DESCRIPTION
July 2, 2019
2
-
Amp
Regulator
GND
VCC
VOUT
OffsetGain
Trim
Control
To all subcircuits
PACKAGES:
Not to scale
3-pin SOT23W
(suffix LH)
3-pin SIP,
matrix HD style
(suffix UA)
3-pin SIP,
chopper style
(suffix UA)
NOT FOR
NEW DESIGN
Continuous-Time Bipolar Switch
A1205
2
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
SELECTION GUIDE
Part Number Packing [1] Mounting Ambient, TABRP (Min) BOP (Max)
A1205LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to 150°C –50 G 50 GA1205LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1205LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
[1] Contact Allegro for additional packing options.
[2] The chopper-style UA package is not for new design; the matrix HD style UA package is recommended for new designs.
DESCRIPTION (continued)
ABSOLUTE MAXIMUM RATINGS
Characteristic Symbol Notes Rating Units
Supply Voltage [3] VCC 30 V
Reverse Supply Voltage [3] VRCC –30 V
Output Off Voltage [3] VOUT 30 V
Reverse Output Voltage [3] VROUT –0.5 V
Output Current Sink IOUTSINK 25 mA
Magnetic Flux Density B Unlimited G
Operating Ambient Temperature TA
Range E –40 to 85 °C
Range L –40 to 150 °C
Maximum Junction Temperature TJ(max) 165 °C
Storage Temperature Tstg –65 to 170 °C
[3] This rating does not apply to extremely short voltage transients such as Load Dump and/or ESD. Those events have individual ratings, specific to
the respective transient voltage event.
The small geometries of the BiCMOS process allow these devices
to be provided in ultrasmall packages. The package styles available
provide magnetically optimized solutions for most applications.
Package LH is a SOT23W miniature thin-profile surface-mount
package, while package UA is a three-lead ultramini SIP for
through-hole mounting. Each package is lead (Pb) free, with 100%
matte-tin-plated leadframes.
SPECIFICATIONS
RoHS
COMPLIANT
Continuous-Time Bipolar Switch
A1205
3
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Terminal List
Number Name Description
Package LH Package UA
1 1 VCC Connects power supply to chip
2 3 VOUT Output from circuit
3 2 GND Ground
1
3
2
GND
VOUT
VCC
Package UA Pin-out DiagramPackage LH Pin-out Diagram
1
2
3
GND
VOUT
VCC
PINOUT DIAGRAMS AND TERMINAL LIST
Continuous-Time Bipolar Switch
A1205
4
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
OPERATING CHARACTERISTICS: over full operating voltage and ambient temperature ranges,
unless otherwise noted
Characteristic Symbol Test Conditions Min. Typ. Max. Units
ELECTRICAL CHARACTERISTICS
Supply Voltage [1] VCC Operating, TJ < 165°C 3.8 24 V
Output Leakage Current IOUTOFF VOUT = 24 V, B < BRP 10 µA
Output On Voltage VOUT(SAT) IOUT = 20 mA, B > BOP 215 400 mV
Power-On Time [2] tPO
Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or B < BRP
– 5 G 4 µs
Output Rise Time [3] trVCC = 12 V, RLOAD = 820 Ω, CS = 12 pF 2 µs
Output Fall Time [3] tfVCC = 12 V, RLOAD = 820 Ω, CS = 12 pF 2 µs
Supply Current ICCON B > BOP 3.8 7.5 mA
ICCOFF B < BRP 3.5 7.5 mA
Reverse Battery Current IRCC VRCC = –30 V –10 mA
Supply Zener Clamp Voltage VZICC = 30 mA; TA = 25°C 32 40 V
Supply Zener Current IZVZ = 32 V; TA = 25°C 30 mA
MAGNETIC CHARACTERISTICS [4]
Operate Point BOP South pole adjacent to branded face of device –40 15 50 G
Release Point BRP North pole adjacent to branded face of device –50 –15 40 G
Hysteresis BHYS BOP – BRP 5 30 55 G
[1] Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
[2] For VCC slew rates greater than 2.5 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value.
[3] CS =oscilloscope probe capacitance.
[4] Magnetic ux density, B, is indicated as a negative value for north-polarity magnetic elds, and as a positive value for south-polarity magnetic elds. This so-called
algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the eld is indicated by the absolute value of B, and
the sign indicates the polarity of the eld (for example, a –100 G eld and a 100 G eld have equivalent strength, but opposite polarity). Reference to the magnetic eld
polarity is with respect to the beveled face of the device.
DEVICE QUALIFICATION PROGRAM
Contact Allegro for information.
EMC (ELECTROMAGNETIC COMPATABILITY) REQUIREMENTS
Contact Allegro for information.
Continuous-Time Bipolar Switch
A1205
5
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic Symbol Test Conditions* Value Units
Package Thermal Resistance RθJA
Package LH, 1-layer PCB with copper limited to solder pads 228 °C/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each side
connected by thermal vias 110 °C/W
Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W
*Additional thermal information available on Allegro website.
6
7
8
9
2
3
4
5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
20 40 60 80 100 120 140 160 180
Maximum Allowable V
CC
(V)
TJ(max) = 165ºC; ICC = ICC(max)
Power Derating Curve
(R
JA
= 228 ºC/W)
Package LH, 1-layer PCB
(R
JA
= 110 ºC/W)
Package LH, 2-layer PCB
(R
JA
= 165 ºC/W)
Package UA, 1-layer PCB
V
CC(min)
V
CC(max)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
20 40 60 80 100 120 140 160 180
Temperature (°C)
Power Dissipation, P
D
(mW)
Power Dissipation versus Ambient Temperature
(RθJA = 165 ºC/W)
1-layer PCB, Package UA
(RθJA = 228 ºC/W)
1-layer PCB, Package LH
(RθJA = 110 ºC/W)
2-layer PCB, Package LH
Continuous-Time Bipolar Switch
A1205
6
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
CHARACTERISTIC DATA
–50 0 50 100 150
0 5 10 15 20 25
–50 0 50 100 150
0 5 10 15 20 25
0
50
100
150
200
250
300
350
–50 0 50 100 150
0 5 10 15 20 25
0
50
100
150
200
250
300
350
T
A
(°C)
Supply Current (On) versus Ambient Temperature
VCC (V)
ICCON (mA)
24
3.8
T
A
(°C)
Supply Current (Off) versus Ambient Temperature
VCC (V)
ICCOFF (mA)
24
3.8
I
LOAD
= 20 mA I
LOAD
= 20 mA
T
A
(°C)
Output Voltage (On) versus Ambient Temperature
VCC (V)
VOUT(SAT) (mV)
24
3.8
Supply Current (On) versus Supply Voltage
TA (°C)
ICCON (mA)
V
CC
(V)
–40
25
150
Supply Current (Off) versus Supply Voltage
TA (°C)
ICCOFF (mA)
V
CC
(V)
–40
25
150
Output Voltage (On) versus Supply Voltage
TA (°C)
VOUT(SAT) (mV)
V
CC
(V)
–40
25
150
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
Continuous-Time Bipolar Switch
A1205
7
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
T
A
(°C)
–40
25
150
Supply Voltage (V)
0 5 10 15 20 25 25
Hysteresis versus Supply Voltage
15
10
5
20
25
30
35
40
45
50
55
BHYS (G)
Hysteresis versus Ambient Temperature
B
HYS
(G)
T
A
(°C)
–50 0 50 100 150
55
50
45
40
35
30
25
20
15
10
5
V
CC
(V)
24
12
3.8
T
A
(°C)
–40
25
150
Supply Voltage (V)
0 5 10 15 20 25 25
Release Point versus Supply Voltage
-40
-50
-30
-20
-10
0
10
20
30
40
BRP (G)
Operate Point versus Ambient Temperature
B
OP
(G)
T
A
(°C)
–50 0 50 100 150
V
CC
(V)
24
12
3.8
Release Point versus Ambient Temperature
B
RP
(G)
T
A
(°C)
–50 0 50 100 150
40
30
20
10
0
–10
–20
–30
–40
–50
V
CC
(V)
24
12
3.8
T
A
(°C)
–40
25
150
Supply Voltage (V)
0 5 10 15 20 25 25
Operate Point versus Supply Voltage
-40
-30
-20
-10
0
10
20
30
40
50
BOP (G)
Operate Point versus Ambient Temperature
B
OP
(G)
T
A
(°C)
–50 0 50 100 150
50
40
30
20
10
0
–10
–20
–30
–40
V
CC
(V)
24
12
3.8
Continuous-Time Bipolar Switch
A1205
8
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
FUNCTIONAL DESCRIPTION
Bipolar Device Switching
The devices of the A120X family provide highly sensitive switch-
ing for applications using magnetic fields of alternating polarities,
such as ring magnets. There are three switching modes for bipolar
devices, referred to as latch, unipolar switch, and negative switch.
Mode is determined by the switchpoint characteristics of the indi-
vidual device. The characteristic hysteresis, BHYS , of the device,
is the difference in the relative magnetic strength and polarity
of the switchpoints of the device. (Note that, in the following
descriptions, a negative magnetic value indicates a north polar-
ity field, and a positive magnetic value indicates a south polarity
field. For a given value of magnetic strength, BX , the values –BX
and BX indicate two fields of equal strength, but opposite polarity.
B = 0 indicates the absence of a magnetic field.)
Bipolar devices typically behave as latches. In this mode,
magnetic fields of opposite polarity and equivalent strengths
are needed to switch the output. When the magnetic fields are
removed (B 0) the device remains in the same state until a
magnetic field of the opposite polarity and of sufficient strength
causes it to switch. The hysteresis of latch mode behavior is
shown in panel A of Figure 1.
In contrast to latching, when a device exhibits unipolar switch-
ing, it only responds to a south magnetic field. The field must be
of sufficient strength, > BOP , for the device to operate. When the
field is reduced beyond the BRP level, the device switches back to
the high state, as shown in panel B of Figure 1. Devices exhibit-
ing negative switch behavior operate in a similar but opposite
manner. A north polarity field of sufficient strength, > BRP
, (more
north than BRP) is required for operation, although the result is
that VOUT switches high, as shown in panel C. When the field is
reduced beyond the BOP level, the device switches back to the low
state.
The typical output behavior of the A120x devices is latching.
However, the A120x family is designed to attain a small hys-
teresis, and thereby provide more sensitive switching. Although
this means that true latching behavior cannot be guaranteed in all
cases, proper switching can be ensured by use of both south and
north magnetic fields, as in a ring magnet. The hysteresis of the
A120x family allows clean switching of the output, even in the
presence of external mechanical vibration and electrical noise.
Figure 1: Bipolar Device Output Switching Modes
These behaviors can be exhibited when using a circuit such as that shown in panel D. Panel A displays the hysteresis when a device exhibits
latch mode (note that the BHYS band incorporates B= 0), panel B shows unipolar switch behavior (the BHYS band is more positive than B = 0),
and panel C shows negative switch behavior (the BHYS band is more negative than B = 0). Bipolar devices, such as the 120x family, can oper-
ate in any of the three modes.
BOP
BRP
BHYS
VOUT
VOUT(SAT)
Switch to Low
Switch to High
V+
0
BOP
BRP
BHYS
VOUT
VOUT(SAT)
Switch to Low
Switch to High
V+
0
BOP
BRP
BHYS
VOUT
VOUT(SAT)
Switch to Low
Switch to High
V+
0
VCC VCC VCC
B+B– B+B– 0
0B+B– 0
(A) (B) (C)
VCC
V
S
Output
GND
VOUT
RL
A120x
(D)
Continuous-Time Bipolar Switch
A1205
9
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
2
-
Bipolar devices adopt an indeterminate output state when
powered-on in the absence of a magnetic field or in a field that
lies within the hysteresis band of the device.
For more information on Bipolar switches, refer to Application
Note 27705, Understanding Bipolar Hall Effect Sensor ICs.
Continuous-Time Benefits
Continuous-time devices, such as the A120x family, offer the fast-
est available power-on settling time and frequency response. Due
to offsets generated during the IC packaging process, continuous-
time devices typically require programming after packaging to
tighten magnetic parameter distributions. In contrast, chopper-
stabilized switches employ an offset cancellation technique on
the chip that eliminates these offsets without the need for after-
packaging programming. The tradeoff is a longer settling time
and reduced frequency response as a result of the chopper-stabili-
zation offset cancellation algorithm.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery manage-
ment is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they are
the clear choice for such applications.
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Sensing Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
Track-and-Hold Signal Demodulator.
Functional Safety
The A1205 complies with the international
standard for automotive functional safety,
ISO 26262:2011, as a Quality Managed (QM) product. The device
is classified as a SEooC (Safety Element out of Context) and can be
easily integrated into safety-critical systems requiring higher ASIL
ratings that incorporate external diagnostics or use measures such
as redundancy. Safety documentation will be provided to support
and guide the integration process. For further information, contact
your local Allegro field applications engineer or sales representa-
tive.
Additional Applications Information
Extensive applications information for Hall-effect devices is
available in:
Hall-Effect IC Applications Guide, Application Note 27701
Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead
Welding and Lead Forming, Application Note 27703.1
Soldering Methods for Allegro’s Products – SMT and Through-
Hole, Application Note 26009
All are provided on the Allegro website, www.allegromicro.com.
Figure 2: Continuous-Time Application, B < BRP
This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power. Position 1, power is applied to the
device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max). The case shown is where
the correct output state is HIGH
. Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is valid, a control unit
reads the output. Position 5, power is removed from the device.
VCC
VOUT
Output Sampled
1 5 4
2
t
t
t
PO(max)
3
Continuous-Time Bipolar Switch
A1205
10
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
POWER DERATING
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × IIN (1)
 ΔT = PD × RθJA (2)
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 4 mA, and RθJA = 140°C/W, then:
PD = VCC × ICC = 12 V × 4 mA = 48 mW
ΔT = PD × RθJA = 48 mW × 140 °C/W = 7°C
TJ = TA + ΔT = 25°C + 7°C = 32°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RθJA and TA.
Example: Reliability for VCC at TA
=
150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RθJA
=
165°C/W, TJ(max) =
165°C, VCC(max)
= 24 V, and
ICC(max) = 7.5 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
ΔTmax = TJ(max) – TA = 165°C
150
°C = 15
°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = ΔTmax ÷ RθJA = 15°C ÷ 165°C/W = 91 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 91 mW ÷ 7.5 mA = 12.1 V
The result indicates that, at TA, the application and device can dis-
sipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RθJA. If VCC(est)VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
Continuous-Time Bipolar Switch
A1205
11
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 3: Package LH, 3-Pin (SOT-23W)
A
B
C
D
C
For Reference Only Not for Tooling Use
(Reference DWG-2840)
Dimensions in millimeters –NOT TO SCALE
Dimensions exclusive of moldflash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads;
adjust as necessary to meet application process requirements and PCB layout tolerances
Active Area Depth, 0.28 mm
Hall elements, not to scale
=Temperature Code (Letter)T
Standard Branding Reference View
NNT
Branding scale and appearance at supplier discretion
Seating Plane
Gauge Plane PCB Layout Reference View
0.55 REF
0.25 BSC
0.95 BSC
0.95
1.00
0.70
2.40
2
1
B
A
Branded Face
2.90 +0.10
–0.20
4° ±4°
8X 10°
REF
0.180 +0.020
–0.053
0.05 +0.10
–0.05
0.25 MIN
1.91 +0.19
–0.06
2.98 +0.12
–0.08
1.00 ±0.13
0.40 ±0.10
D
D
D
1.49
0.96
3
= Last two digits of device part numberN
NNN
= Last three digits of device part numberN
CUSTOMER PACKAGE DRAWINGS
Continuous-Time Bipolar Switch
A1205
12
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 4: Package UA, 3-Pin SIP, Matrix Style
D
NNT
Standard Branding Reference View
= Supplier emblem
= Last two digits of device part number
=Temperature code
N
1
T
NNN
= Supplier emblem
= Last three digits of device part numberN
1
E
E
2.04
1.44 E
2 31
1.27 NOM
1.02
MAX
45°
45°
C
1.52 ±0.05
B
Gate and tie bar burr area
A
B
C
Dambar removal protrusion (6×)
A
D
Active Area Depth, 0.50 mm ±0.08
Branding scale and appearance at supplier discretion
Mold Ejector
Pin Indent
0.41 +0.03
–0.06
0.43 +0.05
–0.07
14.99 ±0.25
4.09 +0.08
–0.05
3.02 +0.08
–0.05
0.79 REF
10°
Branded
Face
For Reference Only Not for Tooling Use
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of moldflash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
(Reference DWG-0000404, Rev. 1)
EHall element, not to scale
Continuous-Time Bipolar Switch
A1205
13
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 5: Package UA, 3-Pin SIP, Chopper Style
NOT FOR
NEW DESIGN
Continuous-Time Bipolar Switch
A1205
14
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
For the latest version of this document, visit our website:
www.allegromicro.com
Revision History
Number Date Description
8 January 1, 2015 Added LX option to Selection Guide
9 July 13, 2015 Corrected LH package Active Area Depth value
10 November 4, 2016 Chopper-style UA package designated as not for new design
11 September 26, 2017 Added Functional Safety information; added footnote to Absolute Maximum Ratings table
12 June 19, 2018 Corrected matrix-style UA package drawing
13 July 2, 2019 Minor editorial updates
Copyright 2019, Allegro MicroSystems.
Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit
improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor
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