934065354115 - NXP SEMICONDUCTORS

1. Product profile

1.1 General description

The BGU7041 MMIC is a 3.3 V wideband amplifier with internal biasing. It is designed

specifically for high linearity, low-noise applications over a frequency range of 40 MHz to

1 GHz. It is especially suited for Set-Top Box applications.

The LNA is housed in a 6-pin SOT363 plastic SMD package.

1.2 Features and benefits

Voltage supply of 3.3 V

Internally biased

Gain of 10 dB

Flat gain between 40 MHz and 1 GHz

Noise figure of 3.8 dB

High linearity with an IP3O of 29 dBm

75  input and output impedance

ESD protection > 2 kV Human Body Model (HBM) and > 1.5 kV Charged Device

Model (CDM) on all pins

1.3 Applications

Terrestrial Silicon and cable Set-Top Boxes (STB)

Silicon and “Can” tuners

Personal Video Recorders (PVR) and Digital Video Recorders (DVR)

Home networking and in-house signal distribution

BGU7041

1 GHz wideband low-noise amplifier

Rev. 2 — 13 September 2011 Product data sheet

Product data sheet Rev. 2 — 13 September 20 11 2 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

1.4 Quick reference data

[1] The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2 f2f1, where

f2=f

11 MHz. Input power Pi=10 dBm.

2. Pinning information

3. Ordering information

4. Marking

Table 1. Quick reference data

Tamb = 25



C; typical values at VCC = 3.3 V; ZS=Z

L=75



; Rbias =7.5



; 40 MHz



1000 MHz.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input AC coupled 3.1 3.3 3.5 V

ICC(tot) total supply current - 38 - mA

Tamb ambient temperature 10 - +70 C

NF noise figure - 3.8 - dB

PL(1dB) output power at 1 dB gain

compression 1GHz - 12 - dBm

IP3Ooutput third-order intercept point [1] -29-dBm

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1RF_OUT

3n.c.

4n.c.

5GND

6RF_IN

132

sym141

3 2

Table 3. Ordering information

Type number Package

Name Description Version

BGU7041 - plastic surface-mounted package; 6 leads SOT363

Table 4. Marking

Type number Marking code Description

BGU7041 *VA * = p : made in Hong Kong

* = W : made in China

* = t : made in Malaysia

Product data sheet Rev. 2 — 13 September 20 11 3 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

5. Limiting values

[1] Tsp is the temperature at the solder point of the ground lead.

6. Thermal characteristics

7. Characteristics

[1] The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2 f2f1, where

f2=f

11 MHz. Input power Pi=10 dBm.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage RF input AC coupled 0.6 3.5 V

ICC(tot) total supply current configurable with external resistor - 60 mA

Ptot total power dissipation Tsp  100 C[1] - 250 mW

Piinput power single tone - 10 dBm

Tstg storage temperature 65 +150 C

Tjjunction temperature - 150 C

Tamb ambient temperature 10 +70 C

VESD electrostatic discharge

voltage Human Body Model (HBM);

according to JEDEC standard

22-A114E

2- kV

Charged Device Model (CDM);

according to JEDEC standard

22-C101B

1.5 - kV

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to solder point 240 K/W

Table 7. Characteristics

Tamb = 25



C; typical values at VCC = 3.3 V; ZS=Z

L=75



; Rbias =7.5



; 40 MHz



1000 MHz.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input AC coupled 3.1 3.3 3.5 V

ICC(tot) total supply current - 38 - mA

s212insertion po w er gain - 10 dB

SLsl slope straight line - 1- dB

FL flatness of frequency response - 0.2 - dB

NF noise figure - 3.8 - dB

RLin input return loss - 21 - dB

RLout output return loss - 12 - dB

PL(1dB) output power at 1 dB gain

compression 1GHz - 12 - dBm

IP3Ooutput third-order intercept point [1] -29-dBm

Product data sheet Rev. 2 — 13 September 20 11 4 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

8. Application information

Other applications are possible. Please contact your local sales representative for more

information. Application notes are available on the NXP website.

8.1 Application circuit

All control and supply lines must be decoupled properly. The decoupling capacitors must

be placed as close to the device as possible.

8.2 Application circuit board layout

Components are listed inTable 8.

Fig 1. BGU704 1 application circuit

001aam382

C3C4

n.c.

16 RF_OUTRF_IN

R1 = Rbias

C1X1 C2 X2

PCB material = FR4.

PCB thickness = 1.6 mm.

PCB size = 30 mm 30 mm.

r = 4.5; thickness of copper layer = 35 m.

Components are listed in Table 8

Fig 2. BGU7041 application circuit boar d layout

001aao235

X1 X2

RF_OUTRF_IN

GND

VCC

GAIN

CTRL

BP CTRL

GND

VER.2

IN OUT75 OHM

Product data sheet Rev. 2 — 13 September 20 11 5 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

[1] L1 and R1 must have a power rating of 0.1 W or higher.

Table 8. List of components

See Figure 1 and Figure 2

Component Description Value Remarks Function

C1, C2 capacitor 10 nF DC blocking

C3 capacitor 10 nF decoupling

C4 capacitor 10 F decoupling

L1 chip ferrite bead 1.5 k[1] Murata BLM18HE152SN1DF RF choke

R1 resistor 7.5 [1] Rbias bias setting

X1, X2 connector 75 F-connector, edge mount PCB

reflow type, Bomar 861V509ERG input/output

Product data sheet Rev. 2 — 13 September 20 11 6 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

9. Package outline

Fig 3. Package outline SOT363

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT363 SC-88

wBM

pin 1

index A

detail X

vMA

0 1 2 mm

scale

132

456

Plastic surface-mounted package; 6 leads SOT363

UNIT A1

max bpcDEe1HELpQywv

mm 0.1 0.30

0.20 2.2

1.8

0.25

0.10 1.35

1.15 0.65

1.3 2.2

2.0 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15 0.25

0.15

1.1

0.8

04-11-08

06-03-16

Product data sheet Rev. 2 — 13 September 20 11 7 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

10. Abbreviations

11. Revision history

Table 9. Abbreviations

Acronym Description

AC Alternating Current

DC Direct Current

ESD ElectroStatic Discharge

LNA Low-Noise Amplifier

MMIC Monolithic Microwave Integrate d Circuit

PCB Printed-Circuit Board

RF Radio Frequency

SMD Surface Mounted Device

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BGU7041 v.2 20110913 Product data sheet BGU7041 v.1

Modifications: •Noise figure value updated

BGU7041 v.1 20110629 Product data sheet - -

Product data sheet Rev. 2 — 13 September 20 11 8 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-crit ical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the appl ication or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the prod uct specification.

Product data sheet Rev. 2 — 13 September 20 11 9 of 10

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BGU7041

1 GHz wideband low-noise amplifier

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 13 September 2011

Document identifier: BGU7041

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Application information. . . . . . . . . . . . . . . . . . . 4

8.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4

8.2 Application circuit board layout. . . . . . . . . . . . . 4

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10