SN54HCT245, SN74HCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS020E – MARCH 1984 – REVISED AUGUST 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Operating Voltage Range of 4.5 V to 5.5 V
D
High-Current 3-State Outputs Drive Bus
Lines Directly or Up To 15 LSTTL Loads
D
Low Power Consumption, 80-µA Max ICC
D
Typical tpd = 14 ns
D
±6-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
D
Inputs Are TTL-Voltage Compatible
description/ordering information
These octal bus transceivers are designed for
asynchronous two-way communication between
data buses. The control-function implementation
minimizes external timing requirements.
The ’HCT245 devices allow data transmission
from the A bus to the B bus or from the B bus to the
A bus, depending upon the logic level at the
direction-control (DIR) input. The output-enable
(OE) input can be used to disable the device so
that the buses are effectively isolated.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
–40 C to 85 C
PDIP – N T ube of 20 SN74HCT245N SN74HCT245N
–40 C to 85 C
SOIC – DW
T ube of 25 SN74HCT245DW
HCT245
–40 C to 85 C
SOIC – DW
Reel of 2000 SN74HCT245DWR
HCT245
–40
°
C to 85
°
C
SOP – NS Reel of 2000 SN74HCT245NSR HCT245
–40°C to 85°C
SSOP – DB Reel of 2000 SN74HCT245DBR HT245
TSSOP – PW
T ube of 70 SN74HCT245PW
HT245
TSSOP – PW
Reel of 2000 SN74HCT245PWR
HT245
Reel of 250 SN74HCT245PWT
–55 C to 125 C
CDIP – J T ube of 20 SNJ54HCT245J SNJ54HCT245J
–55
°
C to 125
°
C
CFP – W T ube of 85 SNJ54HCT245W SNJ54HCT245W
LCCC – FK T ube of 55 SNJ54HCT245FK SNJ54HCT245FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
B1
B2
B3
B4
B5
A3
A4
A5
A6
A7
A2
A1
DIR
B7
B6 OE
A8
GND
B8 VCC
SN54HCT245 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
SN54HCT245 ...J OR W PACKAGE
SN74HCT245 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
Copyright 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HCT245, SN74HCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS020E – MARCH 1984 – REVISED AUGUST 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
OPERATION
OE DIR
OPERATION
L L B data to A bus
LH A data to B bus
H X Isolation
logic diagram (positive logic)
DIR
OE
A1
B1
1
2
18
19
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HCT245, SN74HCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS020E – MARCH 1984 – REVISED AUGUST 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HCT245 SN74HCT245
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage VCC = 4.5 V to 5.5 V 2 2 V
VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
∆t/∆vInput transition rise/fall time 500 500 ns
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HCT245 SN74HCT245
UNIT
PARAMETER
TEST CONDITIONS
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
VOH
VI = VIH or VIL
IOH = –20 µA
4.5 V
4.4 4.499 4.4 4.4
V
VOH
VI = VIH or VIL
IOH = –6 mA
4.5 V
3.98 4.3 3.7 3.84
V
VOL
VI = VIH or VIL
IOL = 20 µA
4.5 V
0.001 0.1 0.1 0.1
V
VOL
VI = VIH or VIL
IOL = 6 mA
4.5 V
0.17 0.26 0.4 0.33
V
IIDIR or OE VI = VCC or 0 5.5 V ±0.1 ±100 ±1000 ±1000 nA
IOZ A or B VO = VCC or 0 5.5 V ±0.01 ±0.5 ±10 ±5µA
ICC VI = VCC or 0, IO = 0 5.5 V 8 160 80 µA
∆ICC†One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC 5.5 V 1.4 2.4 3 2.9 mA
Ci‡DIR or OE 4.5 V
to 5.5 V 3 10 10 10 pF
†This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
‡Parameter Ci does not apply to transceiver I/O ports.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
TA = 25°C SN54HCT245 SN74HCT245
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
UNIT
tpd
A or B
B or A
4.5 V 16 22 33 28
ns
tpd
A or B
B or A
5.5 V 14 20 30 25
ns
ten
OE
A or B
4.5 V 25 46 69 58
ns
ten
OE
A or B
5.5 V 22 41 62 52
ns
tdis
OE
A or B
4.5 V 26 40 60 50
ns
tdis
OE
A or B
5.5 V 23 36 54 45
ns
tt
A or B
4.5 V 9 12 18 15
ns
tt
A or B
5.5 V 811 16 14
ns
SN54HCT245, SN74HCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS020E – MARCH 1984 – REVISED AUGUST 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
TA = 25°C SN54HCT245 SN74HCT245
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
UNIT
tpd
A or B
B or A
4.5 V 20 30 45 38
ns
tpd
A or B
B or A
5.5 V 18 27 41 34
ns
ten
OE
A or B
4.5 V 36 59 89 74
ns
ten
OE
A or B
5.5 V 30 53 80 67
ns
tt
A or B
4.5 V 17 42 63 53
ns
tt
A or B
5.5 V 14 38 57 48
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per transceiver No load 40 pF
SN54HCT245, SN74HCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS020E – MARCH 1984 – REVISED AUGUST 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL
V
CC
S1
S2
LOAD CIRCUIT
PARAMETER CL
tPZH
tpd or tt
tdis
ten tPZL
tPHZ
tPLZ
1 kΩ
1 kΩ
50 pF
or
150 pF
50 pF
Open Closed
RLS1
Closed Open
S2
Open Closed
Closed Open
50 pF
or
150 pF Open Open––
NOTES: A. CL includes probe and test-fixture capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. t
PLH
and t
PHL
are the same as t
pd
.
CL
(see Note A)
Test
Point
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
1.3 V1.3 V 0.3 V0.3 V 2.7 V 2.7 V 3 V
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
1.3 V
1.3 V1.3 V 10%10% 90% 90%
3 V
VOH
VOL
0 V
trtf
Input
In-Phase
Output
1.3 V
tPLH tPHL
1.3 V 1.3 V
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-
Phase
Output
1.3 V
10%
90%
3 V
≈VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
W aveform 1
(See Note B)
1.3 V
tPZL tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
≈0 V
1.3 V
1.3 V
tPZH tPHZ
Output
W aveform 2
(See Note B)
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8550601VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type -55 to 125 5962-8550601VR
A
SNV54HCT245J
5962-8550601VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type -55 to 125 5962-8550601VS
A
SNV54HCT245W
85506012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85506012A
SNJ54HCT
245FK
8550601RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8550601RA
SNJ54HCT245J
JM38510/65553BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65553BRA
JM38510/65553BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
65553BSA
M38510/65553BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65553BRA
M38510/65553BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
65553BSA
SN54HCT245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HCT245J
SN74HCT245DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85
SN74HCT245DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74HCT245DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HCT245N
SN74HCT245N3 OBSOLETE PDIP N 20 TBD Call TI Call TI -40 to 85
SN74HCT245NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HCT245N
SN74HCT245NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245NSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT245
SN74HCT245PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI -40 to 85
SN74HCT245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
SN74HCT245PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT245
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54HCT245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85506012A
SNJ54HCT
245FK
SNJ54HCT245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8550601RA
SNJ54HCT245J
SNJ54HCT245W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54HCT245W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 4
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HCT245, SN54HCT245-SP, SN74HCT245 :
•Catalog: SN74HCT245, SN54HCT245
•Military: SN54HCT245
•Space: SN54HCT245-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HCT245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74HCT245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74HCT245NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74HCT245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74HCT245PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jul-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HCT245DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74HCT245DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74HCT245NSR SO NS 20 2000 367.0 367.0 45.0
SN74HCT245PWR TSSOP PW 20 2000 364.0 364.0 27.0
SN74HCT245PWT TSSOP PW 20 250 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jul-2013
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated