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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
TAI-SAW TECHNOLOGY CO., LTD.
Crystal Unit SMD 3.2x2.5 26.0MHz
MODEL NO.: TZ0260A REV. NO.: 8
Revise:
Rev. Rev.
Page
Rev. Account Date Ref. No. Revised by
1
2
3
4
5
6
7
8
N/A
3
3
3
3
3
5
4
Initial release
Spec. updated
Spec. updated
Spec. updated
Spec. updated
Spec. updated
Changed T/R drawing
Add base 2 drawing
08/27/03
02/18/04
03/21/05
08/12/05
08/28/06
02/08/07
07/01/09
04/29/10
N/A
N/A
N/A
N/A
N/A
N/A
ECN-200900240
ECN-201000161
Ann Liu
Ann Liu
Ann Liu
Ann Liu
Ann Liu
Ann Liu
Ann Liu
Ann Liu
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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
TAI-SAW TECHNOLOGY CO., LTD.
Crystal Unit SMD 3.2x2.5 26.0MHz
MODEL NO.: TZ0260A REV. NO.: 8
Features:
Surface Mount Hermetic Package
Excellent Reliability Performance
Good Frequency Perturbation and Stability over temperature
Ultra Miniature Package
Description and Applications:
Surface mount 3.2mmx2.5mm crystal unit for use in wireless communications devices,
especially for a need of ultra miniature package for mobility.
Electrical Specifications:
TZ0260A Specification
Nominal Frequency 26.000000 MHz
Mode of Oscillation Fundamental
Storage Temperature Range -40°C to +85°C
Operating Temperature Range -20°C to +70°C
Frequency Stability over Operating
Temperature Range +/-10 ppm (referred to the value at 25°C)
Frequency Make Tolerance (FL) +/-10 ppm @ 25°C +/- 3°C
Equivalent Series Resistance (ESR) 60 Ω max.
Nominal Drive Level 100 Uw,200uW max.
Shunt Capacitance (Co) 3.0 pF max
Load Capacitance (CL) 12 pF
Insulation Resistance 500 MΩ min./DC 100V
Aging +/-1ppm/year
Marking Laser Marking
Unit Weight 0.017+/-0.005 g
RoHS Compliant
Lead free
Lead-free soldering
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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
Mechanical Dimensions (mm):
Base 1
Base 2
Recommended Land Pattern: (unit: mm)
Marking:
Line 1: Frequency (26.00)
Line 2: TST Logo + Crystal Product Code + Date Code
Pin Connection
#1 pin IN/OUT
#2 pin GND
#3 pin IN/OUT
#4 pin GND
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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
Product Code Table
Date Code Table
Reel Dimensions (mm):
WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13
ABCDEFGH I JKLM
WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26
NOPQRS TUVWXY Z
WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39
abcde f gh i j k lm
WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52
nopq r s t uvwxyz
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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
Tape Dimensions (mm):
[NOTE]
1 UNIT : mm.
2 UNLESS OTHERWISE SPECIFIED TOLERANCEON DIM. +/-0.1mm.
3 MATERIAL : CONDUCTIVE POLYSTYRENE.
4 COLOR : BLACK.
5 10 PITCHES CUMULATIVETOLERANCE +/-0.2mm.
Packing Quantity/Packing:
3K pcs maximum per reel
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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
Reflow Profile:
Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
2. Temperature: 217+/-5 deg C; Time: 90~100 sec
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TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
Reliability Specifications
Reference
s
t
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ar
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resistance to Temp./ Duration : 260°C /10sec ×2 times EIAJED-4701
Soldering heat Total time : 4min.(IR-reflow)
(IR reflow) -300(301)M(II)
Vibration Total peak amplitude : 1.5mm MIL-STD 202F
Vibration frequency : 10 to 55 Hz method 201A
Sweep period : 1.0 minute
Vibration directions : 3 mutually perpendicular
Duration : 2 hr / direc.
Mechanical directions : 3 impacts per axis MIL-STD 202F
Shock Acceleration : 3000g's, +20/-0 % method 213C
Duration : 0.3 ms (total 18 shocks)
Waveform : Half-sine
Solderability Solder Temperature:265±5°C MIL-STD 883G
Duration time: 5±0.5 seconds. method 2003
Thermal Shock Heat cycle conditions MIL-STD 883G
-55 ℃ (30min) ←→ 125 ℃(30min) method 1010.7
* cycle time : 10 times
Humidity test Temperature : 70 ± 2 °C MIL-STD 202F
Relative humidity : 90~95% method 103B
Duration : 96 hours
Dry heat Temperature : 125 ± 2 °C MIL-STD 883G
( Aging test ) Duration : 168 hours method 1008.2
condition C
PCT test Pressure: 2.06kg/cm2 (2.03*105 pa) EIAJED-4701-3
Temperature : 121 ± 2 °C B-123A
Relative humidity : 100%
Duration : 24 hours
Environmental characteristics
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Test name Test process / method
