1
US Headquarters
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www.chomerics.com
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Asia Pacific
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South America
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Chomerics’ CHO-FOIL tapes are
an economical EMI shielding solution
for a variety of commercial uses.
The tapes are available in copper,
aluminum, or tinned copper foil
backed with Chomerics’ highly
conductive pressure-sensitive
adhesive*. Typical properties are
shown in Table 1 on the next page,
and reliability data appears in Table
* Recognized Under the Component
Program of Underwriters Laboratories, Inc.
CHO-FAB tape is a corrosion
resistant nickel-plated cloth coated
with Chomerics’ highly conductive
pressure-sensitive adhesive*.
CHO-FAB tape is extremely strong
and lightweight, and has excellent
conformability/wrapability to enhance
shielding performance and appear-
ance. Use of corrosion resistant nickel-
plated cloth and Chomerics’ superior
metal-particle-filled conductive
adhesive technology produces a
tape used in a wide variety of EMI
shielding and grounding applications.
Typical properties are shown in Table
1 on the next page, and reliability
data appears in Table 4 on page 148.
Ordering Procedure
Refer to Tables 2 and 3. All CHO-
FOIL and CHO-FAB tapes are avail-
able in standard 36 yard (32.9 m)
rolls or die-cut custom configura-
tions. Call Chomerics’ Applications
Engineering Department for assis-
tance with a custom configuration.
4 on page 148. CHO-FOIL copper
tape is available with a non-conduc-
tive adhesive for applications requir-
ing surface conductivity only. An
embossed version of CHO-FOIL
copper tape is also available, for a
more attractive appearance up to 6
inches (152 mm) wide. Standard
length rolls and die-cut custom
shapes can be ordered.
■Provide a low impedance
connection between a braided
cable shield and the metal
connector backshell in molded
cables. An effective EMI shielded
assembly can be achieved
without soldering the tape to
the braid or backshell
■EMI radiation measurement
troubleshooting, using CHO-
FOIL tape to shield ventilation
slots or seam gaps
■Provide electrical continuity in
seams of EMI shielded rooms
and electronic enclosures
■Supply electrical contact to
surfaces that can’t be soldered
to, such as conductive plastic
or aluminum
■EMI shield for cables by
wrapping the tape around
the cable. An overlap is
recommended
■ESD shielding
■Provide corrosion-resistant
ground contact points
■Fabric tape available where
weight and flexibility are
important, such as for
wrapping cables
CHO-FOIL EMI Shielding Tape
with Conductive Adhesive
(Copper, Aluminum or Tinned Copper)
CHO-FAB EMI Shielding
Fabric Tape with
Conductive Adhesive
Typical Applications for CHO-FOIL
and CHO-FAB EMI Shielding Tapes
LAMINATES & GROUNDING PRODUCTS
CHO-FOIL®& CHO-FABTM Shielding Tapes
US Headquarters
TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 •
www.chomerics.com
Europe
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South America
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Table 2
TAPE WIDTH CODES (ZZZZ)
inch (mm)
PART NUMBER TAPE DESCRIPTION
CCH – 36 – 101 – ZZZZ Copper foil, conductive adhesive version
CCE – 36 – 101 – ZZZZ Copper foil, conductive adhesive, embossed
CCJ – 36 – 201 – ZZZZ Aluminum foil, conductive adhesive
CCK – 36 – 101 – ZZZZ Tin-plated copper foil, conductive adhesive
CCD – 36 – 101 – ZZZZ Copper foil, conductive adhesive 2 sides
CAD – 36 – 201 – ZZZZ Aluminum foil, conductive adhesive 2 sides
CFT – 36 – 101 – ZZZZ Nickel-plated fabric, conductive adhesive
0050 0100 0150 0200 0300 0400 0600 0800 1200 2400
0.5 1.0 1.5 2.0 3.0 4.0 6.0 8.0 12 24
(12.7) (25.4) (38.1) (50.8) (76.2) (102) (152) (203) (305) (610)
Table 3
Property Test Method Typical Values
Part Number Prefix –– CCH CCE CCJ CCK CCD CAD CFT
Foil/Fabric Type –– 1 oz. 1 oz. Embossed Aluminum 1 oz. Tin- 1 oz. Aluminum Nickel-Plated
RA Copper RA Copper Plated Copper RA Copper Fabric
Foil/Fabric Thickness, –– 1.4 (0.0356) 1.4 (0.0356) 2 (0.0508) 1.6 (0.0406) 1.4 (0.0356) 2 (0.0508) 5 (0.127)
mils (mm)
Adhesive Type –– Electrically Conductive, Acrylic Pressure- Sensitive
Adhesive Thickness, –– 1.5 (0.0381) 2 sides:
mils (mm) 1.5 each (0.0381 each) 1.5 (0.0381)
Total Thickness, –– 2.9 (0.0737) 4* (0.1102) 3.5 (0.0889) 3.1 (0.0787) 4.4 (0.1118) 5 (0.127) 6.5 (0.165)
mils (mm)
Temperature Range, __ –40 to 400 –40 to 180
°F (°C) (–40 to 205) (–40 to 82)
Electrical Resistance, MIL-STD-202C <0.003 (<0.0005) (<0.0005) <0.010 (<0.0016) <0.010 (<0.0016) <0.010 (<0.0016)<0.003 (<0.0005) <0.100 (<0.016)
ohms/in2 (ohms/cm2)
Flame Resistance UL Subject 510 PASS MEETS PASS PASS MEETS MEETS N/A
Adhesion to Aluminum ASTM D1000 >40 [2.5] (438)
oz./inch [ppi] (N/m)
PROPERTIES
<0.003
Table 1
Slit rolls are available through Chomerics' authorized distributors.
Please consult Chomerics’ Applications Engineering Department
for assistance with a custom application involving a need for material in other than slit roll form.
continued
Custom widths available up to 24 inches (61 cm)
*Embossing adds 1.1 mil
3
US Headquarters
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www.chomerics.com
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Test Test Method CCH CCE CCJ CCK CCD CAD CFT
Initial Surface Resistivity (SR) (milliohms)* CHO-TP-57*** <2 <2 <2 <2 N/A N/A <100
Initial Through Resistivity (TR) (milliohms)* CHO-TP-57*** <3 <3 <35 <2 <15**** <100**** <100
Initial Peel Strength in oz./inch [ppi] (N/m) ** ASTM D1000 44.8 44.8 51.2 46.4 48 70.4 44.8
[2.8] (490) [2.8] (490) [3.2] (560) [2.9] (508) [3] (525) [4.4] (710) [2.8] (490)
Initial Taber Abrasion Surface Resistivity
(SR) (milliohms) CHO-TP-57*** <6 <3 <6 <9 N/A N/A <100
Heat Aging SR (milliohms)* CHO-TP-57*** <10 <2 <20 <2 N/A N/A <100
185°F (85°C)/ TR (milliohms)* CHO-TP-57*** <16 <3 <22 <2 <7**** <60**** <150
168 hrs. Peel, oz./in. [ppi] (N/m) ** ASTM D1000 57.6 62.4 76.8 67.2 73.6 78.4 59.2
[3.6] (630) [3.9] (683) [8] (840) [4.2] (735) [4.6] (805) [4.8] (840) [3.7] (648)
Heat Aging SR (milliohms)* CHO-TP-57*** <10 <3 <20 <2 N/A N/A <100
250°F (121°C)/ TR (milliohms)* CHO-TP-57*** <70 <3 <23 <2 <3**** <10**** <150
168 hrs. Peel, oz./in. [ppi] (N/m) ** ASTM D1000 57.6 59.2 75.2 51.2 70.4 84.8 43.2
[3.6] (630) [3.7] (648) [4.7] (823) [3.2] (560) [4.4] (770) [5.3] (928) [2.7] (473)
Heat Aging with SR (milliohms)* CHO-TP-57*** N/A N/A N/A <2 N/A N/A <100
Humidity 95% RH/ TR (milliohms)* CHO-TP-57*** N/A N/A N/A <2 <115**** <150**** <150
185°F (85°C)/ Peel, oz./in. [ppi] (N/m) ** ASTM D1000 N/A N/A N/A 78.4 78.4 84.8 46.4
[4.9] (858) [4.9] (858) [5.3] (928) [2.9] (508)
Salt fog corrosion/ SR (milliohms)* CHO-TP-57*** N/A N/A N/A <2 N/A N/A <100
168 hrs. TR (milliohms)* CHO-TP-57*** N/A N/A N/A <2 <275**** <600**** <1000
Peel, oz./in. [ppi] (N/m) ** ASTM D1000 N/A N/A N/A 76.8 62.4 80 33.6
[4.8] (840) [3.9] (683) [5] (875) [2.1] (368)
Taber abrasion SR (milliohms)* CHO-TP-57*** <3 <5 <2 <6 N/A N/A <175
500 gramweight,
CS-10 wheel,
500 cycles
N/A = Not Applicable
* All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper
substrate, except for taber abrasion where a plastic substrate was used.
** 90° peel strength tests were done on an Instron at 2 inches per minute with tapes on a 2024 aluminum substrate.
*** CHO-TP-57 available from Chomerics on request.
**** Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.
RELIABILITY DATA
Table 4
NOTE:
The following table represents actual experimental test data taken according to Chomerics
internal test procedures. This data differs from Table 1 due to differences in test methods.
Contact our Applications
Engineering Department to
discuss your requirements.
CHO-FOIL® & CHO-FAB™ Tapes
continued
