R5524x Series USB HIGH-SIDE POWER SWITCH NO.EA-188-190627 OUTLINE The R5524x is a CMOS-based high-side MOSFET switch IC which conforms to the universal serial bus (USB) standard. The device is suitable for protecting a USB power source. By using an Nch MOSFET with low Onresistance (Typ. 100 m) as a switching transistor, the device can provide low dropout voltage. Internally, the device consists of an overcurrent limiting circuit, a thermal shutdown circuit, an undervoltage lockout (UVLO) circuit and a reverse current protection circuit. The device also consists of an internal delay circuit to prevent the output of false flag signals caused by inrush current. To achieve simplification of layout design, the overcurrent detection accuracy has been improved. The R5524x is offered in a 5-pin SOT-23-5 package and a 6-pin DFN(PLP)1820-6 package which achieve the smallest possible footprint solution on boards where area is limited. FEATURES N-channel MOS High-Side Switch IC Switch ON Resistance *************************************** Typ. 100 m at 5 V Input Current Limit Threshold ************************************* Min. 650 mA(1), Min. 1.25 A( 2) Overcurrent Limit********************************************** Min. 550 mA Flag Delay Time *********************************************** Typ. 20 ms Under-voltage Lockout (UVLO) Circuit Thermal Shutdown Circuit Reverse Current Protection Circuit Package ********************************************************* SOT-23-5, DFN(PLP)1820-6(3) APPLICATIONS PCs and PC Peripherals Digital Televisions (DTV) Set Top Boxes (STB) Printers PDA Game Consoles (1) Only for R5524x001A/B, R5524x002A/B (2) Only for R5524N004A (3) Only for R5524K001x, R5524K002x 1 R5524x NO.EA-188-190627 SELECTION GUIDE The overcurrent limit protection type, the current limit threshold and the auto discharge options(1) for the ICs are user-selectable options. Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free R5524N00x-TR-FE SOT-23-5 3,000 pcs Yes Yes DFN(PLP)1820-6 5,000 pcs Yes Yes R5524K00x-TR x: Specify the combination of Overcurrent Limit Protection type and Current Limit Threshold. 1: Latch-off Type, Current Limit Threshold: Min. 650 mA 2: Constant Current Type, Current Limit Threshold: Min. 650 mA 4: Cosntant Current Type, Current Limit Threshold: Min. 1.25 A(2) : Specify auto-discharge options. A: Auto-discharge included B: Auto-discharge not included (1) Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. (2) Only for R5524N004A 2 R5524x NO.EA-188-190627 BLOCK DIAGRAMS V OUT V IN GATE CONTROL EN UVLO CURRENT LIMIT FLG DELAY FLG THERMAL SHUTDOWN GND R5524xxxxA Block Diagram V IN V OUT GATE CONTROL EN UVLO CURRENT LIMIT FLG DELAY FLG THERMAL SHUTDOWN GND R5524xxxxB Block Diagram 3 R5524x NO.EA-188-190627 PIN DESCRIPTIONS Top View 5 4 Bottom View 6 5 4 4 5 6 1 2 3 3 2 1 (mark side) 1 2 3 R5524N (SOT-23-5) Pin Configuration R5524K (DFN(PLP)1820-6) Pin Configuration R5524N Pin Description Pin No. Symbol Description 1 VIN Input Pin 2 GND Ground Pin 3 EN Chip Enable Pin, Active-high 4 FLG Flag Pin, Open Drain Output 5 VOUT Output Pin R5524K Pin Description Pin No. Symbol Description 1 VOUT 2 NC No Connection 3 FLG Flag Pin, Open Drain Output 4 EN Enable Pin, Active-high 5 GND Ground Pin 6 VIN Input Pin Output Pin The exposed tab is substrate level (GND). It is recommended that the exposed tab be connected to the ground plane on the board or otherwise be left open. 4 R5524x NO.EA-188-190627 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings Symbol Item Rating Unit 6.0 V VIN Input Voltage VEN Enable Pin Input Voltage -0.3 to 6.0 V VFLG Flag Pin Voltage -0.3 to 6.0 V IFLG Flag Pin Current 14 mA VOUT Output Pin Voltage -0.3 to 6.0 V IOUT Output Current Internally Controlled PD Power Dissipation(1) SOT-23-5, JEDEC STD.51-7 660 mW DFN(PLP)1820-6, JEDEC STD.51-7 2200 mW Tj Junction Temperature Range -40 to 125 C Tstg Storage Temperature Range -55 to 125 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Rating Unit V Operating Input Voltage 2.7 to 5.5 V Ta Operating Temperature Range -40 to 85 C IN RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (2) Refer to POWER DISSIPATION for detailed information. 5 R5524x NO.EA-188-190627 ELECTRICAL CHARACTERISTICS The specifications surrounded by are guaranteed by design engineering at -40C Ta 85C. R5524xxxxA/B Electrical Characteristics Symbol VIN IDD1 IDD2 RON ton toff VUVLO VHYS ITH Item Supply Current (Active Mode) Supply Current (Standby Mode) Switch On Resistance Output Turn-on Delay Output Turn-off Delay UVLO Release Voltage UVLO Hysteresis Range Current Limit Threshold Overcurrent Limit tFD Flag Delay Time(2) TTSR IEN VEN1 VEN2 ILO VLF IFOF IREV RLOW Conditions Input Voltage ILIM TTSD (Ta = 25C) Thermal Shutdown Temperature Thermal Shutdown Released Temperature Enable Pin Input Current Enable Pin Input Voltage 1 Enable Pin Input Voltage 2 Output Leakage Current Flag "L" Output Voltage Flag Off Current Reverse Leakage Current Nch. On-resistance for Auto Discharge (R5524x00xA only) Min. Typ. 5.5 V 110 0.1 100 400 50 2.5 0.1 180 1.0 150 A A m s s V V 650 800 980 1.25 1.55 1.85 1.2 1.55 1.9 550 650 800 mA 7 20 30 ms 2.7 VOUT = OPEN, EN = "H", VIN = 5 V VOUT = OPEN, EN = "L", VIN = 5 V VIN = 5 V, IOUT = 500 mA VIN = 5 V, RL = 60 VIN = 5V, RL = 60 VIN Rising VIN Falling R5524x001A/B VIN = 5 V R5524x002A/B VIN = 5 V R5524N004A VIN = 5 V, 0C Ta 70C VIN = 5 V, After 5 ms from when VOUT = 0 V(1) VIN = 5 V, From when overcurrent detection until when FLG = "L" Max. Unit 2.3 2.7 mA A Junction Temperature 135 C Junction Temperature 120 C 0.01 VEN Rising VEN Falling 2.0 -0.3 0.1 ISINK = 1 mA VFLG = 5.5 V VIN = 0 V, VOUT = 5.5 V 0.01 450 1.0 6.0 0.8 1.0 0.4 1.0 50 A V V A V A A All test items listed under Electrical Characteristics are done under the pulse load condition (Tj Ta = 25C) except Thermal Shutdown Temperature and Thermal Shutdown Released Temperature. (1) (2) 6 Refer to "Overcurrent limit Function" in THEORY OF OPERATION for details. Flag Delay Time is dependent on Input Voltage. R5524x NO.EA-188-190627 THEORY OF OPERATION Overcurrent Limit Function The R5524x001A/001B has the built-in latch-off type over-current limit circuit. When the over-current is detected, the protection circuit becomes active and the switch-transistor is turned OFF. The latch function is released if the input voltage value is exceeded in the release threshold of the UVLO circuit value after when it became lower than the detection threshold of the UVLO circuit value; or the EN pin set to the enabling condition again after set to the disabling condition. If the over current condition occurred when the input voltage value was close to the minimum operating input voltage value. Under this condition, the voltage descends by the parasitic impedance on the power supply side, and it might fall below the detection threshold of the UVLO circuit. In this case, the switch-transistor is turned OFF and because of that the voltage drop of power line's parasitic impedance stops; the latch function is released with the UVLO and it becomes the over current condition again. The switch transistor keeps continual ON and OFF until one of the following is done; increasing the input voltage value; the setting of EN pin is disabling; or reducing the value of load current. Moreover, the supply-voltage changed by the load-current dramatically changed depends upon the parasitic impedance of the wiring on the load side or the power supply side. Due to this, decreasing the parasitic impedance by the wiring on board is recommended. The switch transistor of the R5524x001A/001B is turned OFF when the latch-off-function operates under the condition of the load of the constant current as the load device, such as the electronic load and so on, connecting with the VOUT pin of the R5524x001A/001B. Because the load device keeps the constant current, the VOUT pin voltage may become negative potential. If the VOUT pin is exceed the absolute maximum rating may cause the permanent damages to the device, please avoid using in this situation. The R5524x002A/002B and R5524N004A have the built-in over current protection circuit as the constant current type. It detects as the over-current condition, if the current flows as the ITH defined. Then operating the switch transistor to limit the output current to be the constant current defined by the ILIM. If the condition of the over-current limit caused by the VOUT pin clamped to the GND were continued the temperature of the ICs would increase drastically. The switch-transistor is turned OFF if the temperature of the ICs becomes over 135C (Typ.). And after this, the switch-transistor is turned ON again when the temperature of ICs decreased approximately 15C. The switch-transistor keeps continual ON and OFF until either the switch is turned OFF or the VOUT pin is removed from GND. 7 R5524x NO.EA-188-190627 Timing Chart R5524xxxxA/B Output On-time and Output Off-time tOFF tON 50% VEN 50% 10% 90% VOUT R5524x Timing Chart R5524x001A/B (Latch-off Type) Flag Delay Time ITH (1) ILIM (2) (4) (3) <tFD tFD IOUT 0A VIN VFLG 0V R5524x001A/001B (Latch-off Type) Timing Chart (1) When the IOUT is ITH or less, the current is not limited. (2) Once the IOUT reaches to ITH, the IOUT is limited by ILIM. (3) When the IOUT drops to ILIM or less within the tFD time, the current limit is released. The current is not limited until the IOUT exceeds ITH again. (4) When the IOUT reaches to ITH and it is limited by ILIM for tFD or more, the switch transistor turns off and VFLG becomes "Low". 8 R5524x NO.EA-188-190627 R5524x002A/BR5524N0004A (Constant Current Protection Type) Flag Delay Time ITH (1) ILIM (2) (3) <tFD tFD IOUT 0A VIN (4) VFLG 0V R5524x002A/002B and R5524N004A (Constant Current Type) Timing Chart (1) When IOUT is ITH or less, the current is not limited. (2) Once the IOUT reaches to ITH, the IOUT is limited by ILIM. (3) When the IOUT drops to ILIM or less within the tFD time, the current limit is released. The current is not limited until the IOUT exceeds ITH again. (4) When the IOUT reaches to ITH and it is limited by ILIM for tFD or more, the VFLG becomes "Low". 9 R5524x NO.EA-188-190627 APPLICATION INFORMATION VIN 10 k to 100 k VIN Over Current 4 VIN FLG(1) USB Host Controller 1 R5524x VOUT ON/OFF 3 EN GND 2 USB Client VBUS Device 5 VOUT 1F 47 F(2) 12 R5524x Typical Reference Circuit Precautions for Selecting External Components Bypass Capacitor A 0.1F to 1 F bypass capacitor between the VIN pin and the GND pin, close to the device, is recommended. This precaution reduces power supply transients that may cause ringing on the input. Pull-up Resistor of FLG Pin A 10 k to 100 k pull-up resistor is recommended for the FLG pin. R5524x001A/001B The R5524x001A/001B is equipped with a latch-off function which requires initialization before start-up. Case 1: Start-up by EN Pin Control EN pin must be enabled with the delay of 10 s or more against 90% of VIN voltage rising edge. Case 2: Start-up by EN Pin Tied to VIN Pin Slew rate of VIN must be 40 s/V or slower. (1) FLG pin is Nch. Open Drain Output. A 47 F or more output capacitor is recommended. According to a USB standard, a 120 F or more output capacitor is required. (2) 10 R5524x NO.EA-188-190627 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 2) Supply Current vs. Input Voltage 120 120 Supply Current IDD1 (A) Supply Current IDD1 (A) 1) Supply Current vs. Temperature 4.5V 5.0V 5.5V 110 100 90 80 70 60 -50 -25 0 25 50 75 -40C 25C 85C 110 100 90 80 70 60 100 2.5 3.0 3.5 Temperature Topt (C) 3) Switch ON Resistance vs. Temperature 120 Switch ON Resistance RON (m) Switch ON Resistance RON (m) 140 IOUT=300mA 100 80 60 40 -50 -40C 25C 85C 140 5.5 6.0 IOUT=300mA 100 80 60 40 -25 0 25 50 75 2.5 100 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 5) Output ON Time vs. Temperature (RL = 56 ) 6) Output ON Time vs. Input Voltage (RL = 56 ) 900 900 Output ON Time tON (s) Output ON Time tON (s) 5.0 120 Temperature Topt (C) 800 700 600 500 400 4.5V 5.0V 5.5V 300 200 100 0 -50 4.5 4) Switch ON Resistance vs. Input Voltage 160 160 4.5V 5.0V 5.5V 4.0 Input Voltage VIN (V) -40C 25C 85C 800 700 600 500 400 300 200 100 0 -25 0 25 50 75 Temperature Topt (C) 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 11 R5524x NO.EA-188-190627 7) UVLO Voltage vs. Temperature 8) Output Voltage vs. Input Voltage 2.55 Output Voltage VOUT (V) UVLO Voltage VUVLO (V) 2.60 2.50 2.45 2.40 2.35 2.30 UVLO Threshold Voltage UVLO Released Voltage 2.25 2.20 -50 -25 0 25 50 75 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 0 1 Temperature Topt (C) 9) Current Limit Threshold vs. Temperature (001x/ 002x) 3 4 1.52 850 Current Limit Treshold Ith (A) 4.5V 5.0V 5.5V 860 840 830 820 810 800 -50 -25 0 25 50 75 5 10) Current Limit Threshold vs. Temperature (004A) 870 Current Limit Threshold ITH (mA) 2 Input Voltage VIN (V) 100 Temperature Topt (C) 4.5V 5.0V 5.5V 1.5 1.48 1.46 1.44 1.42 1.4 1.38 1.36 -50 -25 0 25 50 75 100 Temperature Topt () 870 1.52 -40C 25C 85C 860 850 Current Limit Threshold Ith (A) Current Limit Threshold ITH (mA) 11) Current Limit Threshold vs. Input Voltage 12) Current Limit Threshold vs. Input Voltage (001x/ 002x) (004A) 840 830 820 810 800 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage VIN (V) 12 5.5 6.0 -40 25 85 1.50 1.48 1.46 1.44 1.42 1.40 1.38 1.36 2.5 3 3.5 4 4.5 5 Input Voltage Vin (V) 5.5 6 R5524x NO.EA-188-190627 14) Overcurrent Limit vs. Input Voltage 800 800 750 750 Over Current Limit ILIM (mA) Over Current Limit ILIM (mA) 13) Overcurrent Limit vs. Temperature 700 650 600 4.5V 5.0V 5.5V 550 500 -50 -40C 25C 85C 700 650 600 550 500 -25 0 25 50 75 2.5 100 3.0 Temperature Topt (C) 15) Flag Delay Time vs. Temperature Flag Delay Time tFD (ms) Flag Delay Time tFD (ms) 4.5 5.0 5.5 6.0 35 25 20 15 10 4.5V 5.0V 5.5V 5 30 25 20 15 10 -40C 25C 85C 5 0 -25 0 25 50 75 2.5 100 3.0 V IN=5V 1.35 1.30 1.25 1.20 1.15 1.10 VEN1 VEN2 1.05 1.00 -50 -25 0 25 50 4.0 4.5 5.0 5.5 6.0 75 Temperature Topt (C) 100 18) Enable Input Voltage vs. Input Voltage 1.40 Enable Pin Input Voltage VEN1 / VEN2 (V) 17) Enable Input Voltage vs. Temperature 1.40 3.5 Input Voltage VIN (V) Temperature Topt (C) Enable Pin Input Voltage VEN1 / VEN2 (V) 4.0 16) Flag Delay Time vs. Input Voltage 30 0 -50 3.5 Input Voltage VIN (V) V opt=25C 1.35 1.30 1.25 1.20 1.15 1.10 VEN1 1.05 VEN2 1.00 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 13 R5524x NO.EA-188-190627 19) Overcurrent Response with Ramped Load 20) Overcurrent Response with Ramped Load (R5524x001x) (R5524x002x) V IN=5V V IN=5V EN="L" V FLG (5V/div) V FLG (5V/div) IOUT (200mA/div) IOUT (200mA/div) Time (5ms/div) Time (5ms/div) 21) Overcurrent Response with Ramped Load (R5524x004A) V IN=5.0V V FLG (5V/div) EN="L" IOUT (200mA/div) Time (5md/div) 22) Overcurrent Limit Transient Response (Output short during enable "H") (Enable "H" during Output Short) V OUT V EN (5V/div) (5V/div) V IN=5V V EN=H IOUT (200mA/div) V IN=5V V OUT=GND short Time (10s/div) 14 IOUT (2A/div) Time (10s/div) R5524x NO.EA-188-190627 23) Thermal Shutdown Operation 24) Output Voltage vs. Output Current 5 V IN=5V Output Voltage VOUT (V) 4.5 V EN (5V/div) V FLG (5V/div) IOUT (500mA/div) 4 3.5 3 2.5 2 1.5 1 0.5 0 Time (50ms/div) 0 25) Output ON Time Response 0.2 0.4 0.6 0.8 Output Current IOUT (A) 1 26) Output OFF Time Response V IN=5V RL=56 V EN (5V/div) V EN (5V/div) V OUT V OUT (2V/div) (2V/div) V IN=5V RL=56 IOUT (50mA/div) Time (100s/div) IOUT (50mA/div) Time (10s/div) 27) Inrush current Characteristic V EN (5V/div) IOUT (200mA/div) V IN=5V RL=10 EN 100F 300F 10F 200F Time (1ms/div) 15 POWER DISSIPATION SOT-23-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm x 114.3 mm x 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes 0.3 mm x 7 pcs Measurement Result Item (Ta = 25C, Tjmax = 125C) Measurement Result Power Dissipation 660 mW Thermal Resistance (ja) ja = 150C/W Thermal Characterization Parameter (jt) jt = 51C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern i SOT-23-5 PACKAGE DIMENSIONS Ver. A 2.90.2 1.10.1 1.90.2 0.80.1 (0.95) 4 1 2 00.1 0.2min. +0.2 1.6-0.1 5 2.80.3 (0.95) 3 0.40.1 +0.1 0.15-0.05 SOT-23-5 Package Dimensions i POWER DISSIPATION DFN(PLP)1820-6 Ver. B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm x 114.3 mm x 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes 0.2 mm x 34 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation 2200 mW Thermal Resistance (ja) ja = 45C/W Thermal Characterization Parameter (jt) jt = 18C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 2500 2200 Power Dissipation (mW) 2000 1500 1000 500 0 0 25 50 75 85 100 125 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS DFN(PLP)1820-6 Ver. B DFN(PLP)1820-6 Package Dimensions * * The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. i 1.The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. 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