DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D186 BC618 NPN Darlington transistor Product data sheet Supersedes data of 2003 Oct 16 2004 Nov 05 NXP Semiconductors Product data sheet NPN Darlington transistor BC618 FEATURES PINNING * Low current (max. 500 mA) PIN DESCRIPTION * Low voltage (max. 55 V) 1 emitter * High DC current gain. 2 base 3 collector APPLICATIONS * General purpose low frequency * Relay drivers. handbook, halfpage 2 3 1 DESCRIPTION TR1 2 TR2 3 NPN Darlington transistor in a TO-92; SOT54 plastic package. 1 MAM302 Fig.1 Simplified outline (TO-92; SOT54) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BC618 2004 Nov 05 SC-43A DESCRIPTION plastic single-ended leaded (through hole) package; 3 leads 2 VERSION SOT54 NXP Semiconductors Product data sheet NPN Darlington transistor BC618 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter - 80 V VCES collector-emitter voltage VBE = 0 V - 55 V VEBO emitter-base voltage open collector - 12 V IC collector current (DC) - 500 mA ICM peak collector current - 800 mA IB base current (DC) - 200 mA Ptot total power dissipation - 625 mW Tstg storage temperature -65 +150 C Tj junction temperature - 150 C Tamb ambient temperature -65 +150 C Tamb 25 C; note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. 2004 Nov 05 3 VALUE UNIT 200 K/W NXP Semiconductors Product data sheet NPN Darlington transistor BC618 CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector-base cut-off current VCB = 60 V; IE = 0 A - - 50 nA ICES collector-emitter cut-off current VBE = 0 V; VCE = 60 V - - 50 A IEBO emitter-base cut-off current VEB = 10 V; IC = 0 A - - 50 nA hFE DC current gain VCE = 5 V; see Fig.2 IC = 1 mA 2 000 - - IC = 10 mA 4 000 - - IC = 200 mA 10 000 - 70 000 VCEsat collector-emitter saturation voltage IC = 200 mA; IB = 0.2 mA - - 1.1 V VBEsat base-emitter saturation voltage IC = 200 mA; IB = 0.2 mA - - 1.6 V Cc collector capacitance VCB = 30 V; IE = 0 A - 3.5 - pF fT transition frequency VCE = 5 V; IC = 500 mA; f = 100 MHz 155 - - MHz MGD837 80000 handbook, full pagewidth hFE 60000 40000 20000 0 10-1 1 10 VCE = 2 V. Fig.2 DC current gain; typical values. 2004 Nov 05 4 102 IC (mA) 103 NXP Semiconductors Product data sheet NPN Darlington transistor BC618 PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.38 4.8 4.4 1.7 1.4 4.2 3.6 e 2.54 e1 L L1(1) 1.27 14.5 12.7 2.5 max. Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 2004 Nov 05 REFERENCES IEC JEDEC JEITA TO-92 SC-43A 5 EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16 NXP Semiconductors Product data sheet NPN Darlington transistor BC618 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. 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Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2004 Nov 05 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/05/pp7 Date of release: 2004 Nov 05 Document order number: 9397 750 13573