HIN202E thru HIN213E S E M I C O N D U C T O R +/-15kV, ESD-Protected, +5V Powered, RS-232 Transmitters/Receivers December 1997 Features Description * High Speed ISDN Compatible . . . . . . . . . . . . 230kbits/s The HIN202E-HIN213E family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where 12V is not available. A redesigned transmitter circuit improves data rate and transmitter slew rate, which makes this suitable for ISDN and high speed modems. The transmitter outputs and the receiver inputs are protected to 15kV ESD (Electrostatic Discharge). They require a single +5V power supply and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The HIN203E and HIN205E require no external capacitors and are ideally suited for applications where circuit board space is critical. The family of devices offers a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). * ESD Protection for RS-232 I/O Pins to 15kV (IEC1000) * Meets All RS-232E and V.28 Specifications * HIN203E and HIN205E Require no External Capacitors * Requires Only 0.1F or Greater External Capacitors * Two Receivers Active in Shutdown Mode (HIN213E) * Requires Only Single +5V Power Supply * Onboard Voltage Doubler/Inverter * Low Power Consumption (202E Typ) . . . . . . . . . . 5mA * Low Power Shutdown Function (Typ) . . . . . . . . . . .1A * Three-State TTL/CMOS Receiver Outputs The HIN211E and HIN213E feature a low power shutdown mode to conserve energy in battery powered applications. In addition, the HIN213E provides two active receivers in shutdown mode allowing for easy "wakeup" capability. * Multiple Drivers - Output Swing for +5V lnput . . . . . . . . . . . . . . . . 10V - Power-Off Source Impedance . . . . . . . . . . . . . . .300 - Output Current Limiting - TTL/CMOS Compatible - Maximum Slew Rate . . . . . . . . . . . . . . . . . . . . . 30V/s The drivers feature true TTL/CMOS input compatibility, slew rate-limited output, and 300 power-off source impedance. The receivers can handle up to 30V input, and have a 3k to 7k input impedance. The receivers also feature hysteresis to greatly improve noise rejection. * Multiple Receivers - Input Voltage Range. . . . . . . . . . . . . . . . . . . . . . 30V - Input Impedance. . . . . . . . . . . . . . . . . . . . 3k to 7k - Hysteresis to Improve Noise Rejection . . . . . . . 0.5V Applications * Any System Requiring RS-232 Communications Port - Computers - Portables, Mainframes, Laptops - Peripherals - Printers and Terminals - Portable Instrumentation - Modems Selection Table POWER SUPPLY VOLTAGE NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS NUMBER OF 0.1F EXTERNAL COMPONENTS LOW POWER SHUTDOWN/TTL THREE-STATE NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN HIN202E +5V 2 2 4 Capacitors No/No 0 HIN203E +5V 2 2 None No/No 0 HIN205E +5V 5 5 None Yes/Yes 0 HIN206E +5V 4 3 4 Capacitors Yes/Yes 0 HIN207E +5V 5 3 4 Capacitors No/No 0 HIN208E 5V 4 4 4 Capacitors No/No 0 HIN211E +5V 4 5 4 Capacitors Yes/Yes 0 HIN213E +5V 4 5 4 Capacitors Yes/Yes 2 PART NUMBER CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) Harris Corporation 1997 1 File Number 4315.1 HIN202E thru HIN213E Ordering Information PART NO. TEMP. RANGE (oC) PACKAGE PKG. NO. PART NO. TEMP. RANGE (oC) PACKAGE PKG. NO. HIN202ECP 0 to 70 16 Ld PDIP E16.3 HIN207EIP -40 to 85 24 Ld PDIP E24.3 HIN202ECB 0 to 70 16 Ld SOIC M16.3 HIN207EIB -40 to 85 24 Ld SOIC M24.3 HIN202EIP -40 to 85 16 Ld PDIP E16.3 HIN207EIA -40 to 85 24 Ld SSOP M24.209 HIN202EIB -40 to 85 16 Ld SOIC M16.3 HIN208ECP 0 to 70 24 Ld PDIP E24.3 HIN202ECBN 0 to 70 16 Ld SOIC M16.15 HIN208ECB 0 to 70 24 Ld SOIC M24.3 HIN202EIBN -40 to 85 16 Ld SOIC M16.15 HIN208ECA 0 to 70 24 Ld SSOP M24.209 HIN203ECP 0 to 70 20 Ld PDIP E20.3 HIN208EIP -40 to 85 24 Ld PDIP E24.3 HIN203ECB 0 to 70 20 Ld SOIC M20.3 HIN208EIB -40 to 85 24 Ld SOIC M24.3 HIN205ECP 0 to 70 24 Ld PDIP E24.6 HIN208EIA -40 to 85 24 Ld SSOP M24.209 HIN206ECP 0 to 70 24 Ld PDIP E24.3 HIN211ECB 0 to 70 28 Ld SOIC M28.3 HIN206ECB 0 to 70 24 Ld SOIC (W) M24.3 HIN211ECA 0 to 70 28 Ld SSOP M28.209 HIN206ECA 0 to 70 24 Ld SSOP M24.209 HIN211EIB -40 to 85 28 Ld SOIC M28.3 HIN206EIP -40 to 85 24 Ld PDIP E24.3 HIN211EIA -40 to 85 28 Ld SSOP M28.209 HIN206EIB -40 to 85 24 Ld SOIC (W) M24.3 HIN213ECB 0 to 70 28 Ld SOIC M28.3 HIN206EIA -40 to 85 24 Ld SSOP M24.209 HIN213ECA 0 to 70 28 Ld SSOP M28.209 HIN207ECP 0 to 70 24 Ld PDIP E24.3 HIN213EIB -40 to 85 28 Ld SOIC M28.3 HIN207ECB 0 to 70 24 Ld SOIC M24.3 HIN213EIA -40 to 85 28 Ld SSOP M28.209 HIN207ECA 0 to 70 24 Ld SSOP M24.209 Pin Descriptions PIN VCC FUNCTION Power Supply Input 5V 10%. V+ Internally Generated Positive Supply (+10V Nominal). V- Internally Generated Negative Supply (-10V Nominal). GND Ground Lead. Connect to 0V. C1+ External Capacitor (+ terminal) is connected to this lead. C1- External Capacitor (- terminal) is connected to this lead. C2+ External Capacitor (+ terminal) is connected to this lead. C2- External Capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead. TOUT RIN ROUT Transmitter Outputs. These are RS-232 levels (nominally 10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5k pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. EN, EN Enable Input. This is an active low input which enables the receiver outputs. With EN = 5V, (HIN213E EN = 0V), the outputs are placed in a high impedance state. SD, SD Shutdown Input. With SD = 5V (HIN213E SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state (except R4 and R5 of HIN213E) and the transmitters are shut off. NC No Connect. No connections are made to these leads. 2 HIN202E thru HIN213E Pinouts HIN202E (PDIP, SOIC) TOP VIEW HIN204E (SOIC) TOP VIEW C1+ 1 16 VCC T1OUT 1 16 T3OUT V+ 2 15 GND T2OUT 2 15 T4OUT C1- 3 14 T1OUT T2IN 3 14 T4IN C2+ 4 13 R1IN T1IN 4 13 T3IN C2- 5 12 R1OUT GND 5 12 V- 6 11 T1IN VCC 6 11 C2- T2OUT 7 10 T2IN C1+ 7 10 C2+ V+ 8 9 C1- V- 9 R2OUT R2IN 8 +5V +5V 16 6 7 1 0.1F + 3 4 0.1F T1IN T2IN + 5 0.1F VCC C1+ C1C2+ C2- +5V TO 10V VOLTAGE INVERTER +10V TO -10V VOLTAGE INVERTER V+ 2 + V- 6 +5V 400k T1 11 +5V 400k T2 10 14 7 12 T1IN 0.1F T2IN T1OUT T2OUT T3IN R1IN T4IN 5k R1 V+ 10 C2+ + 11 C2- +10V TO -10V VOLTAGE INVERTER V- 12 R2OUT 8 T1 4 +5V 400k T2 3 13 +5V 400k T3 +5V 400k T4 14 1 2 16 15 5 R2IN 5k R2 GND 15 3 + + +5V 400k GND 9 8 +5V TO 10V VOLTAGE DOUBLER 13 R1OUT C1+ C1- 9 0.1F 0.1F + + VCC 0.1F 0.1F T1OUT T2OUT T3OUT T4OUT HIN202E thru HIN213E Pinouts (Continued) HIN203E (PDIP, SOIC) TOP VIEW HIN205E (PDIP, SOIC) TOP VIEW T4OUT 1 24 R3IN T3OUT 2 23 R3OUT T1OUT 3 22 T5IN T2OUT 4 21 SD 16 C2- R2IN 5 20 EN 15 C2+ R2OUT 6 19 T5OUT T2IN 7 18 T4IN T1IN 8 17 T3IN R1OUT 9 16 T4IN T2IN 1 T1IN 2 19 R2IN R1OUT 3 18 T2OUT R1IN T1OUT GND 20 R2OUT 17 V- 4 5 6 VCC 7 14 V+ (C1-) (V+) C1+ 8 13 C1- (C1+) GND 9 12 V- (C2+) (V-) C2- 10 R1IN 10 11 C2+ (C2-) GND 11 15 T3IN 14 R5OUT VCC 12 13 R5IN +5V +5V + 7 12 0.1F VCC T1IN T2IN 2 +5V 400k 1 +5V 400k T1IN T1 5 T1OUT T2IN T2 18 T2OUT T3IN 3 4 R1IN R1OUT R1 T4IN 5k 20 19 R2 8(13) NO CONNECT 13(14) 12(10) INTERNAL -10V SUPPLY 17 INTERNAL 14(8) +10V SUPPLY T5IN R2IN R2OUT C2+ C1C2+ V- C2- V- C2- V+ GND 6 +5V 400k 7 T2 +5V 400k T3 +5V 400k 16 T4 +5V 400k T4 15 22 + 3 4 2 1 19 9 5k C1+ +5V 400k 8 VCC T1 6 T4OUT T5OUT 5 R2IN 5k R2 16 23 24 R3IN R3OUT GND T3OUT R1IN R2OUT 10(11) T2OUT 5k R1 16 T1OUT 10 R1OUT 11(12) 0.1F 5k R3 9 17 18 R4IN R4OUT 5k R4 14 13 R5IN R5OUT 20 EN 5k R5 SD GND 11 4 21 HIN202E thru HIN213E Pinouts (Continued) HIN207E (PDIP, SOIC, SSOP) TOP VIEW HIN206E (PDIP, SOIC, SSOP) TOP VIEW T3OUT 1 24 T4OUT T1OUT 2 23 R2IN T2OUT 3 R1IN 4 R1OUT 5 T2IN 6 19 T4IN T1IN 7 18 T3IN GND 8 VCC 9 22 R2OUT 17 R3OUT 16 R3IN 15 V14 C213 C2+ C1- 12 T1OUT 2 23 R2IN T2OUT 3 22 R2OUT 19 T4IN T1IN 7 18 T3IN GND 8 17 R3OUT VCC 9 16 R3IN C1+ 10 15 V- V+ 11 14 C2- C1- 12 13 C2+ +5V 9 0.1F 0.1F T1IN T2IN T3IN T4IN 20 T5OUT T2IN 6 +5V 10 C1+ + 12 C113 C2+ + 14 C2- 21 T5IN R1OUT 5 20 EN V+ 11 24 T4OUT R1IN 4 21 SD C1+ 10 T3OUT 1 VCC 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 + 0.1F 0.1F + +5V 400k 7 T1 +5V 400k T2 6 18 +5V 400k T3 +5V 400k 19 T4 2 3 1 24 5 9 0.1F 0.1F T1OUT T1IN T2OUT T2IN T3OUT T3IN T4OUT T4IN 4 R1IN R1OUT T5IN 5k R1 10 C1+ + 12 C113 C2+ + 14 C2- VCC +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 T1 +5V 400k T2 6 18 +5V 400k T3 +5V 400k 19 T4 +5V 400k 21 T5 2 3 1 24 20 R2IN 20 5k R3 T4OUT T5OUT 5k R2 21 SD EN T3OUT R2IN R3IN R3OUT T2OUT 23 R2OUT 16 T1OUT R1IN 22 17 0.1F 5k R1 5k R2 0.1F 4 R1OUT 23 + + +5V 400k 7 5 22 R2OUT 11 17 16 R3IN R3OUT GND 5k R3 8 GND 8 5 HIN202E thru HIN213E Pinouts (Continued) HIN211E (SOIC, SSOP) TOP VIEW HIN208E (PDIP, SOIC, SSOP) TOP VIEW T2OUT 1 T1OUT 2 R2IN 3 R2OUT 4 24 T3OUT T3OUT 1 28 T4OUT 23 R3IN T1OUT 2 27 R3IN 22 R3OUT T2OUT 3 26 R3OUT 21 T4IN T1IN 5 20 T4OUT R1OUT 6 R1IN 7 25 SD R2OUT 5 24 EN 19 T3IN T2IN 6 23 R4IN 18 T2IN T1IN 7 22 R4OUT 17 R4OUT GND 8 R2IN 4 R1OUT 8 21 T4IN VCC 9 16 R4IN R1IN 9 20 T3IN C1+ 10 15 V- GND 10 19 R5OUT V+ 11 C1- 12 14 C2- VCC 11 18 R5IN 13 C2+ C1+ 12 17 V- V+ 13 16 C2- C1- 14 15 C2+ +5V +5V 11 9 0.1F 0.1F T1IN T2IN T3IN T4IN 10 C1+ + 12 C113 C2+ + 14 C2- VCC 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 + 0.1F 0.1F 0.1F + +5V 400k 5 T1 +5V 400k 18 T2 19 +5V 400k T3 +5V 400k T4 21 2 1 24 20 6 0.1F T1IN T2IN T2OUT T3IN T3OUT T4OUT T4IN R1IN R1OUT 4 3 +5V 400k T2 20 +5V 400k T3 21 +5V 400k T4 28 9 T3OUT T4OUT R1IN 27 R3IN 5k 23 R4IN 5k 5k R4 19 18 R5IN R5OUT 24 5k R5 25 SD EN GND 10 6 T2OUT R2IN 22 8 T1OUT 5k R4OUT GND 0.1F 4 R3 R4IN 0.1F 5k R3OUT 16 R4 1 8 5k 17 3 26 R3IN R4OUT 2 R2OUT 23 + + R2 R3OUT R3 V- 17 6 5k 22 +10V TO -10V VOLTAGE INVERTER 5 R2IN R2 V+ R1 R2OUT 13 +5V TO 10V VOLTAGE DOUBLER T1 5k R1 VCC +5V 400k 7 T1OUT 7 R1OUT 12 C1+ + 14 C115 C2+ + 16 C2- HIN202E thru HIN213E Pinouts (Continued) HIN213E (SOIC, SSOP) TOP VIEW T3OUT 1 28 T4OUT T1OUT 2 27 R3IN T2OUT 3 26 R3OUT R2IN 4 25 SD R2OUT 5 24 EN T2IN 6 23 R4IN T1IN 7 22 R4OUT R1OUT 8 21 T4IN R1IN 9 20 T3IN GND 10 19 R5OUT VCC 11 18 R5IN C1+ 12 17 V- V+ 13 16 C2- C1- 14 15 C2+ NOTE: R4 AND R5 ACTIVE IN SHUTDOWN +5V 11 0.1F 0.1F T1IN T2IN T3IN T4IN R1OUT 12 C1+ + 14 C115 C2+ + 16 C2- VCC 13 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 17 + + +5V 400k 7 T1 +5V 400k T2 6 20 +5V 400k T3 21 +5V 400k T4 0.1F 0.1F 2 T1OUT 3 T2OUT 1 T3OUT 28 T4OUT 9 8 R1IN 5k R1 5 4 R2IN R2OUT 5k R2 26 27 R3IN R3OUT 5k R3 22 23 R4IN R4OUT 5k R4 19 18 R5IN R5OUT 24 5k R5 25 EN GND 10 7 SD HIN202E thru HIN213E Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V) Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT. . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ROUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Classification . . . . . . . . . . . . . . . . . . . . . . . IEC1000 Compliant Thermal Resistance (Typical, Note 1) JA (oC/W) 16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 115 16 Ld SOIC (W) Package . . . . . . . . . . . . . . . . . . . . 100 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 155 20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 75 20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 100 24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . . 75 24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 60 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Maximum Storage Temperature Range . . . . . . . . . . .-40oC to 85oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC and SSOP - Lead Tips Only) Operating Conditions Maximum Operating Temperature Range HIN2XXECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC HIN2XXEIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Test Conditions: VCC = +5V 10%, (VCC = +5V 5% for HIN203E/205E/207E), C1-C4 = 0.1F (except HIN203E and HIN205E), TA = Operating Temperature Range PARAMETER TEST CONDITIONS Output Voltage Swing, TOUT Transmitter Outputs, 3k to Ground Power Supply Current, ICC No Load, TA = 25oC Shutdown Supply Current, ICC(SD) TA = 25oC MIN TYP MAX UNITS 5 9 10 V HIN202E - 8 15 mA HIN202E-208E, HIN211E-213E - 11 20 mA HIN205E, HIN206E, HIN211E - 1 10 A HIN213E - 15 50 A Input Logic Low, TIN , EN, VlL TIN , EN, SD, EN, SD - - 0.8 V Input Logic High, VlH TIN 2.0 - - V EN, SD, EN, SD 2.4 - - V - 15 200 A Logic Pullup Current, IP TIN = 0V RS-232 Input Voltage Range, VIN -30 - +30 V Receiver Input Impedance, RIN TA = 25oC, VIN = 3V 3.0 5.0 7.0 k Receiver Input Low Threshold, VIN (H-L) VCC = 5V, TA = 25oC Active Mode 0.8 1.2 - V Shutdown Mode HIN213E R4 and R5 0.6 1.5 - V Active Mode - 1.7 2.4 V Shutdown Mode HIN213E R4 and R5 - 1.5 2.4 V 0.2 0.5 1.0 V - 0.1 0.4 V Receiver Input High Threshold, VIN (L-H) VCC = 5V, TA = 25oC Receiver Input Hysteresis, VHYST VCC = 5V No Hysteresis in Shutdown Mode TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA (HIN202E-HIN203E, IOUT = 3.2mA) TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1mA 3.5 4.6 - V Output Enable Time, tEN HIN205E, HIN206E, HIN211E, HIN213E - 600 - ns Output Disable Time, tDIS HIN205E, HIN206E, HIN211E, HIN213E - 200 - ns 8 HIN202E thru HIN213E Test Conditions: VCC = +5V 10%, (VCC = +5V 5% for HIN203E/205E/207E), C1-C4 = 0.1F (except HIN203E and HIN205E), TA = Operating Temperature Range (Continued) Electrical Specifications PARAMETER MIN TYP MAX UNITS HIN213E SD = 0V, R4, R5 TEST CONDITIONS - 4.0 40 s HIN213E SD = VCC - 0.5 10 s HIN202E - HIN211E - 0.5 10 s Transition Region Slew Rate, SRT RL = 3k, CL = 2500pF Measured from +3V to -3V or -3V to +3V (Note 1) 3 20 45 V/s Propagation Delay, tPD HIN202E to HIN213E Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = 2V RS-232 Output Short Circuit Current, ISC TOUT shorted to GND TTL/CMOS Receiver Output Leakage EN = VCC , EN = 0, 0V < ROUT < VCC ESD Performance - 300 - - - 10 - mA - 0.5 10 A - - - - - ESD Protection Human Body Model +/-15 - - kV TIN, ROUT IEC1000-4-2 Contact Discharge +/-8 - - kV IEC1000-4-2 Air Gap +/-15 - - kV Human Body Model +/-2- - - kV TIN, ROUT NOTE: 1. Guaranteed by design. VOLTAGE DOUBLER S1 VOLTAGE INVERTER S2 C1+ V+ = 2VCC S5 C2+ S6 VCC GND + GND S3 C1- + C1 - + C3 VCC + C2 - GND S4 S7 C2- C4 V- = - (V+) S8 RC OSCILLATOR FIGURE 1. CHARGE PUMP Detailed Description The HIN202E thru HIN213E family of RS-232 transmitters/receivers are powered by a single +5V power supply and feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: the charge pump, transmitter, and receiver. pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200, and the output impedance of the voltage inverter section (V-) is approximately 450. A typical application uses 0.1F capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. Charge Pump An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 125kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase two, C2 is also charged to 2VCC , and then during phase one, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge During shutdown mode (HIN205E, HIN211E and HIN213E, SD = VCC , HIN213E, SD = 0V) the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10A. The transmitter outputs are disabled and the receiver outputs (except for HIN213E, R4 and R5) are placed in the high impedance state. 9 HIN202E thru HIN213E Transmitters V+ VCC The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC , or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ -0.6V). Each transmitter input has an internal 400kW pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of 5V minimum with the worst case conditions of: all transmitters driving 3k minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/s. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300 with 2V applied to the outputs and VCC = 0V. 400k TOUT GND < TXIN < VCC V- < VTOUT < V+ V- FIGURE 2. TRANSMITTER VCC RXIN ROUT -30V < RXIN < +30V GND < VROUT < VCC 5k GND FIGURE 3. RECEIVER TIN OR RIN Receivers The receiver inputs accept up to 30V while presenting the required 3k to 7k input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the 3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis (except during shutdown) to improve noise rejection. The receiver Enable line (EN, on HIN205E and HIN211E, EN on HIN213E) when unasserted, disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode (except HIN213E R4 and R5). Test Circuits 300 TXIN TOUT OR ROUT VOL VOL tPHL tPLH AVERAGE PROPAGATION DELAY = tPHL + tPLH 2 FIGURE 4. PROPAGATION DELAY DEFINITION HIN213E Operation in Shutdown The HIN213E features two receivers, R4 and R5, which remain active in shutdown mode. During normal operation the receivers propagation delay is typically 0.5s. This propagation delay increases to 4s (typical) during shutdown. When entering shut down mode, receivers R4 and R5 are not valid for 80s after SD = VIL. When exiting shutdown mode, all receiver outputs will be invalid until the charge pump circuitry reaches normal operating voltage. This is typically less than 2ms when using 0.1F capacitors. (HIN202E) +4.5V TO +5.5V INPUT 0.1F C3 0.1F C1 - 1 C1+ VCC 16 + 2 V+ GND 15 + - 0.1F + C2 - VCC 16 2 V+ GND 15 3 C1- T1OUT 14 4 C2+ R1IN 13 5 C2- - + 0.1F C4 3k 1 C1+ 6 V7 T2OUT 8 R2IN R1OUT 12 3k T1OUT 14 4 C2+ R1IN 13 5 C2- R1OUT 12 T1 OUTPUT RS-232 30V INPUT 6 V- TTL/CMOS OUTPUT T1IN 11 TTL/CMOS INPUT T2IN 10 TTL/CMOS INPUT R2OUT 9 3 C1- 7 T2OUT 8 R2IN TTL/CMOS OUTPUT ROUT = VIN /I T2 OUTPUT T1IN 11 T2IN 10 R2OUT 9 T2OUT T1OUT VIN = 2V RS-232 30V INPUT FIGURE 5. GENERAL TEST CIRCUIT A FIGURE 6. POWER-OFF SOURCE RESISTANCE CONFIGURATION 10 HIN202E thru HIN213E Application Information The HIN2XXE may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where 12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. +5V TD INPUTS OUTPUTS TTL/CMOS RTS 3 T1 5 TD RTS + T1 11 14 T2 10 7 13 12 RD CTS 9 R2 R1 8 15 RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7) FIGURE 7. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING + C2 0.1F 5 - 14 T2 10 TD (2) TRANSMIT DATA 7 RTS (4) REQUEST TO SEND 13 12 RD (3) RECEIVE DATA RD CTS 6 4 HIN202E 11 9 HIN202E C2 + 0.1F - INPUTS OUTPUTS TTL/CMOS CTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT 3 4 In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters. 1 16 1 C1 + 0.1F - A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5k resistor connected to V+. C1 + 0.1F - + R2 R1 8 CTS (5) CLEAR TO SEND 15 VCC 16 - 2 C3 + + C4 6 V- V+ 0.2F 6 - 0.2F 2 VCC 16 +5V RS-232 INPUTS AND OUTPUTS HIN202E C1 + 0.1F DTR INPUTS OUTPUTS TTL/CMOS DSRS 1 4 3 5 T1 11 14 T2 10 7 13 12 DCD R1 9 R2 R1 15 8 + C2 0.1F - DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7) FIGURE 8. COMBINING TWO HIN202Es FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS 11 HIN202E thru HIN213E Die Characteristics PASSIVATION: DIE DIMENSIONS: Type: Nitride over Silox Nitride Thickness: 8kA Silox Thickness: 7kA 139 mils x 134 mils (HIN207E) METALLIZATION: Type: Al Thickness: 10kA 1kA TRANSISTOR COUNT: 332 (HIN207E) SUBSTRATE POTENTIAL PROCESS: GND CMOS Metal Gate Metallization Mask Layout HIN207E R2OUT T5IN T5OUT T4IN T3IN R3OUT R3IN R2IN VC2T4OUT C2+ T3OUT C1T1OUT V+ C1+ T2OUT R1IN R1OUT T2IN T1IN GND 12 VCC HIN202E thru HIN213E Dual-In-Line Plastic Packages (PDIP) E16.3 (JEDEC MS-001-BB ISSUE D) E D 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE BASE PLANE A2 -C- SEATING PLANE A L D1 e B1 D1 B 0.010 (0.25) M A1 eC C A B S INCHES MILLIMETERS C L SYMBOL MIN MAX MIN MAX NOTES eA A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 13 B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8, 10 C 0.008 0.014 D 0.735 0.775 0.204 0.355 18.66 19.68 5 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC eA 0.300 BSC eB - L 0.115 N 16 2.54 BSC 7.62 BSC 0.430 - 0.150 2.93 10.92 3.81 16 6 7 4 9 Rev. 0 12/93 HIN202E thru HIN213E Dual-In-Line Plastic Packages (PDIP) E20.3 (JEDEC MS-001-AD ISSUE D) N 20 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - -B-AE D BASE PLANE A2 -C- SEATING PLANE A L D1 e B1 D1 B 0.010 (0.25) M A1 eC C A B S B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.55 1.77 8 eA C 0.008 0.014 D 0.980 1.060 24.89 D1 0.005 - E 0.300 0.325 E1 0.240 0.280 C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 14 e eA 0.300 BSC - L 0.115 20 0.355 - 26.9 5 0.13 - 5 7.62 8.25 6 6.10 7.11 5 0.100 BSC eB N 0.204 2.54 BSC - 7.62 BSC 6 0.430 - 0.150 2.93 10.92 3.81 20 7 4 9 Rev. 0 12/93 HIN202E thru HIN213E Dual-In-Line Plastic Packages (PDIP) E24.3 (JEDEC MS-001-AF ISSUE D) N 24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 N/2 INCHES -B- SYMBOL -AE D BASE PLANE A2 -C- SEATING PLANE A L D1 e B1 D1 B 0.010 (0.25) M C L eA A1 eC C A B S C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 15 MILLIMETERS MIN MAX MIN MAX - NOTES A - 0.210 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8 C 0.008 0.014 0.204 0.355 - D 1.230 1.280 31.24 D1 0.005 - 0.13 32.51 - 5 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC 6 eB - 0.430 L 0.115 0.150 N 24 2.93 24 10.92 7 3.81 4 9 Rev. 0 12/93 HIN202E thru HIN213E Dual-In-Line Plastic Packages (PDIP) E24.6 (JEDEC MS-011-AA ISSUE B) N 24 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 SYMBOL -B- A2 -C- SEATING PLANE e B1 D1 B 0.010 (0.25) M A1 eC C A B S MAX - 0.250 - - 0.39 A2 0.125 0.195 3.18 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.030 0.070 0.77 1.77 8 eA C 0.008 0.015 0.204 0.381 - C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 16 6.35 NOTES 0.015 A L D1 MIN A E BASE PLANE MAX A1 -AD MILLIMETERS MIN 29.3 - 4 4 D 1.150 1.290 D1 0.005 - 0.13 32.7 5 - 5 E 0.600 0.625 15.24 15.87 6 E1 0.485 0.580 12.32 14.73 5 e 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC 6 eB - 0.700 - 17.78 7 L 0.115 0.200 2.93 5.08 4 N 24 24 9 Rev. 0 12/93 HIN202E thru HIN213E Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M 0.10(0.004) C A M B S NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17 MAX MILLIMETERS MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e C MIN 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N 16 0o 16 8o 0o 7 8o Rev. 0 12/93 HIN202E thru HIN213E Small Outline Plastic Packages (SSOP) M16.209 (JEDEC MO-150-AC ISSUE B) N 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E GAUGE PLANE -B1 2 3 0.25 0.010 SEATING PLANE -A- A D -C- e C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.233 0.255 5.90 6.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B 0.25(0.010) M L B S 0.026 BSC H 0.292 L 0.022 N NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 18 MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 16 0o - 8.20 - 0.95 6 16 8o 0o 7 8o Rev. 2 3/95 HIN202E thru HIN213E Small Outline Plastic Packages (SOIC) M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.3977 0.4133 10.10 10.50 3 E 0.2914 0.2992 7.40 7.60 4 e B S 0.050 BSC 19 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. MILLIMETERS 16 0o 16 8o 0o 7 8o Rev. 0 12/93 HIN202E thru HIN213E Small Outline Plastic Packages (SOIC) M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.4961 0.5118 12.60 13.00 3 E 0.2914 0.2992 7.40 7.60 4 e B S 0.050 BSC 20 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. MILLIMETERS 20 0o 20 8o 0o 7 8o Rev. 0 12/93 HIN202E thru HIN213E Shrink Small Outline Plastic Packages (SSOP) M24.209 (JEDEC MO-150-AG ISSUE B) N 24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E GAUGE PLANE -B- 1 2 3 L 0.25 0.010 SEATING PLANE -A- A D MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 0.05 - - A2 0.065 0.072 1.65 1.85 - - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.312 0.334 7.90 8.50 3 E 0.197 0.220 5.00 5.60 4 -C- e e A1 B 0.25(0.010) M A2 C 0.10(0.004) C A M 0.026 BSC H 0.292 L 0.022 N B S NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 21 0.65 BSC 0.322 7.40 0.037 0.55 24 0o - 8.20 0.95 24 8o 0o 6 7 8o Rev. 1 3/95 HIN202E thru HIN213E Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e B S 0.05 BSC 22 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact MILLIMETERS 24 0o 24 8o 0o 7 8o Rev. 0 12/93 HIN202E thru HIN213E Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e 0.25(0.010) M C 0.10(0.004) C A M B S MILLIMETERS MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 8o 0o N NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. MAX A1 e A1 B MIN 28 0o 28 7 8o Rev. 0 12/93 All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris is believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries. Sales Office Headquarters For general information regarding Harris Semiconductor and its products, call 1-800-4-HARRIS NORTH AMERICA Harris Semiconductor P. O. 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