SEMICONDUCTOR
1
Features
• High Speed ISDN Compatible. . . . . . . . . . . . 230kbits/s
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC1000)
• Meets All RS-232E and V.28 Specifications
• HIN203E and HIN205E Require no External Capacitors
• Requires Only 0.1µF or Greater External Capacitors
• Two Receivers Active in Shutdown Mode (HIN213E)
• Requires Only Single +5V Power Supply
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (202E Typ) . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . .1µA
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- Output Swing for +5V lnput. . . . . . . . . . . . . . . . ±10V
- Power-Off Source Impedance . . . . . . . . . . . . . . .300Ω
- Output Current Limiting
- TTL/CMOS Compatible
- Maximum Slew Rate. . . . . . . . . . . . . . . . . . . . . 30V/µs
• Multiple Receivers
- Input Voltage Range. . . . . . . . . . . . . . . . . . . . . . ±30V
- Input Impedance. . . . . . . . . . . . . . . . . . . . 3kΩ to 7kΩ
- Hysteresis to Improve Noise Rejection . . . . . . . 0.5V
Description
The HIN202E-HIN213E f amily of RS-232 transmitters/receiv ers
interf ace circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. A redesigned transmitter circuit improves data
rate and transmitter slew rate, which makes this suitable for
ISDN and high speed modems. The transmitter outputs and the
receiver inputs are protected to ±15kV ESD (Electrostatic Dis-
charge). They require a single +5V power supply and feature
onboard charge pump voltage con v erters which gener ate +10V
and -10V supplies from the 5V supply. The HIN203E and
HIN205E require no external capacitors and are ideally suited
for applications where circuit board space is critical. The family
of devices offers a wide variety of RS-232 transmitter/receiver
combinations to accommodate various applications (see
Selection Table).
The HIN211E and HIN213E feature a low power shutdown
mode to conserve energy in battery powered applications. In
addition, the HIN213E provides two active receivers in shut-
down mode allowing for easy “wakeup” capability.
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V input, and have a 3kΩ
to 7kΩ input impedance. The receivers also feature hystere-
sis to greatly improve noise rejection.
Applications
• Any System Requiring RS-232 Communications Port
- Computers - Portables, Mainframes, Laptops
- Peripherals - Printers and Terminals
- Portable Instrumentation
- Modems
Selection Table
PART
NUMBER POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
NUMBER OF
0.1µF
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
RECEIVERS
ACTIVE IN
SHUTDOWN
HIN202E +5V 2 2 4 Capacitors No/No 0
HIN203E +5V 2 2 None No/No 0
HIN205E +5V 5 5 None Yes/Yes 0
HIN206E +5V 4 3 4 Capacitors Yes/Yes 0
HIN207E +5V 5 3 4 Capacitors No/No 0
HIN208E 5V 4 4 4 Capacitors No/No 0
HIN211E +5V 4 5 4 Capacitors Yes/Yes 0
HIN213E +5V 4 5 4 Capacitors Yes/Yes 2
December 1997
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © Harris Corporation 1997
HIN202E thru
HIN213E
+/-15kV, ESD-Protected, +5V Powered,
RS-232 Transmitters/Receivers
File Number 4315.1
2
Ordering Information
PART NO. TEMP.
RANGE (oC) PACKAGE PKG. NO.
HIN202ECP 0 to 70 16 Ld PDIP E16.3
HIN202ECB 0 to 70 16 Ld SOIC M16.3
HIN202EIP -40 to 85 16 Ld PDIP E16.3
HIN202EIB -40 to 85 16 Ld SOIC M16.3
HIN202ECBN 0 to 70 16 Ld SOIC M16.15
HIN202EIBN -40 to 85 16 Ld SOIC M16.15
HIN203ECP 0 to 70 20 Ld PDIP E20.3
HIN203ECB 0 to 70 20 Ld SOIC M20.3
HIN205ECP 0 to 70 24 Ld PDIP E24.6
HIN206ECP 0 to 70 24 Ld PDIP E24.3
HIN206ECB 0 to 70 24 Ld SOIC (W) M24.3
HIN206ECA 0 to 70 24 Ld SSOP M24.209
HIN206EIP -40 to 85 24 Ld PDIP E24.3
HIN206EIB -40 to 85 24 Ld SOIC (W) M24.3
HIN206EIA -40 to 85 24 Ld SSOP M24.209
HIN207ECP 0 to 70 24 Ld PDIP E24.3
HIN207ECB 0 to 70 24 Ld SOIC M24.3
HIN207ECA 0 to 70 24 Ld SSOP M24.209
HIN207EIP -40 to 85 24 Ld PDIP E24.3
HIN207EIB -40 to 85 24 Ld SOIC M24.3
HIN207EIA -40 to 85 24 Ld SSOP M24.209
HIN208ECP 0 to 70 24 Ld PDIP E24.3
HIN208ECB 0 to 70 24 Ld SOIC M24.3
HIN208ECA 0 to 70 24 Ld SSOP M24.209
HIN208EIP -40 to 85 24 Ld PDIP E24.3
HIN208EIB -40 to 85 24 Ld SOIC M24.3
HIN208EIA -40 to 85 24 Ld SSOP M24.209
HIN211ECB 0 to 70 28 Ld SOIC M28.3
HIN211ECA 0 to 70 28 Ld SSOP M28.209
HIN211EIB -40 to 85 28 Ld SOIC M28.3
HIN211EIA -40 to 85 28 Ld SSOP M28.209
HIN213ECB 0 to 70 28 Ld SOIC M28.3
HIN213ECA 0 to 70 28 Ld SSOP M28.209
HIN213EIB -40 to 85 28 Ld SOIC M28.3
HIN213EIA -40 to 85 28 Ld SSOP M28.209
PART NO. TEMP.
RANGE (oC) PACKAGE PKG. NO.
Pin Descriptions
PIN FUNCTION
VCC Power Supply Input 5V ±10%.
V+ Internally Generated Positive Supply (+10V Nominal).
V- Internally Generated Negative Supply (-10V Nominal).
GND Ground Lead. Connect to 0V.
C1+ External Capacitor (+ terminal) is connected to this lead.
C1- External Capacitor (- terminal) is connected to this lead.
C2+ External Capacitor (+ terminal) is connected to this lead.
C2- External Capacitor (- terminal) is connected to this lead.
TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩpull-up resistor to VCC is connected to each lead.
TOUT Transmitter Outputs. These are RS-232 levels (nominally ±10V).
RIN Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩpull-down resistor to GND is connected to each input.
ROUT Receiver Outputs. These are TTL/CMOS levels.
EN, EN Enable Input. This is an active low input which enables the receiver outputs. With EN = 5V, (HIN213E EN = 0V), the outputs
are placed in a high impedance state.
SD, SD Shutdown Input. With SD = 5V (HIN213E SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance
state (except R4 and R5 of HIN213E) and the transmitters are shut off.
NC No Connect. No connections are made to these leads.
HIN202E thru HIN213E
3
Pinouts
HIN202E (PDIP, SOIC)
TOP VIEW HIN204E (SOIC)
TOP VIEW
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
V-
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
T1OUT
T2OUT
T2IN
T1IN
GND
V+
C1+
T3OUT
T4IN
T3IN
V-
C2-
C2+
C1-
T4OUT
VCC
VCC
+5V
2
V+
16
T1OUT
T2OUT
T1IN
T2IN
T1
T2
11
10
14
7
+5V400kΩ
+5V400kΩ
R1OUT R1IN
R1
1312
5kΩ
R2OUT R2IN
R2
89
5kΩ
+10V TO -10V
VOLTAGE INVERTER 0.1µF
6
V-
C2+
C2-
+
0.1µF
4
5
+5V TO 10V
VOLTAGE INVERTER
C1+
C1-
+
0.1µF
1
3+0.1µF
+
GND
15
6
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
4
3
1
2
13 16
14 15
7
98
12
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
10
11
GND
5
HIN202E thru HIN213E
4
HIN203E (PDIP, SOIC)
TOP VIEW HIN205E (PDIP, SOIC)
TOP VIEW
Pinouts
(Continued)
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
T2IN
T1IN
R1OUT
R1IN
T1OUT
GND
(V+) C1+
VCC
GND
(V-) C2-
R2OUT
T2OUT
V-
C2-
R2IN
C2+
V+ (C1-)
C1- (C1+)
V- (C2+)
C2+ (C2-)
T4OUT
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
R3IN
T5IN
SD
EN
T5OUT
T3IN
T3IN
R5OUT
R5IN
R3OUT
T4IN
T4IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
R1OUT R1IN
R1
43
5kΩ
R2OUT R2IN
R2
1920
5kΩ
7
VCC
T1OUT
T2OUT
T1IN
T2IN
T1
T2
+5V
+0.1µF
2
1
5
18
11(12)
16
C2+
C2+
C2-
C2-
+5V400kΩ
+5V400kΩ
16
10(11)
GND
6
GND
8(13)
13(14)
C1+
C1-
V-
V-
12(10)
17 V+
14(8)
NO
CONNECT
INTERNAL
-10V
SUPPLY
INTERNAL
+10V
SUPPLY 9
12
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
8
7
3
4
15 2
16 1
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
R1OUT R1IN
R1
109
5kΩ
R2OUT R2IN
R2
56
5kΩ
R5OUT R5IN
R5
1314
5kΩ
EN 20 21 SD
GND
11
T5OUT
T5IN
T4
22 19
+5V400kΩ
VCC
R3OUT R3IN
R3
2423
5kΩ
R4OUT R4IN
R4
1817
5kΩ
HIN202E thru HIN213E
5
HIN206E (PDIP, SOIC, SSOP)
TOP VIEW
HIN207E (PDIP, SOIC, SSOP)
TOP VIEW
Pinouts
(Continued)
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
SD
EN
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
T5IN
T5OUT
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
EN 20 21 SD
GND
8
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
T5OUT
T5IN
T5
21 20
+5V400kΩ
GND
8
HIN202E thru HIN213E
6
HIN208E (PDIP, SOIC, SSOP)
TOP VIEW HIN211E (SOIC, SSOP)
TOP VIEW
Pinouts
(Continued)
T2OUT
T1OUT
R2IN
R2OUT
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T3OUT
R3OUT
T4IN
T4OUT
T3IN
R4OUT
V-
C2-
C2+
R3IN
T2IN
R4IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
5
18
2
1
19 24
21 20
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
76
5kΩ
R2OUT R2IN
R2
34
5kΩ
R3OUT R3IN
R3
2322
5kΩ
R4OUT R4IN
R4
1617
5kΩ
GND
8
11
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
20 1
12
14 13
17
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN 24
8
T4OUT
T4IN
T4
21 28
+5V400kΩ
SD
25
GND
10
HIN202E thru HIN213E
7
HIN213E (SOIC, SSOP)
TOP VIEW
Pinouts
(Continued)
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NOTE: R4 AND R5 ACTIVE IN SHUTDOWN
11
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
20 1
12
14 13
17
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN 24
8
T4OUT
T4IN
T4
21 28
+5V400kΩ
25 SD
GND
10
HIN202E thru HIN213E
8
Absolute Maximum Ratings Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(VCC -0.3V) <V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT. . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT. . . . . . . . . . . . . . . . . .(GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ROUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . IEC1000 Compliant
Operating Conditions
Maximum Operating Temperature Range
HIN2XXECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC
HIN2XXEIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note 1) θJA (oC/W)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
16 Ld SOIC (N) Package. . . . . . . . . . . . . . . . . . . . . 115
16 Ld SOIC (W) Package . . . . . . . . . . . . . . . . . . . . 100
16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 155
20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 75
20 Ld SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . 100
24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . . 75
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 60
24 Ld SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135
28 Ld SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Storage Temperature Range . . . . . . . . . . .-40oC to 85oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5% for HIN203E/205E/207E), C1-C4 = 0.1µF (except
HIN203E and HIN205E), TA = Operating Temperature Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5±9±10 V
Power Supply Current, ICC No Load,
TA = 25oC HIN202E - 8 15 mA
HIN202E-208E,
HIN211E-213E -1120mA
Shutdown Supply Current, ICC(SD) TA = 25oC HIN205E, HIN206E,
HIN211E -110µA
HIN213E - 15 50 µA
Input Logic Low, TIN, EN, VlL TIN, EN, SD, EN, SD - - 0.8 V
Input Logic High, VlH TIN 2.0 - - V
EN, SD, EN, SD 2.4 - - V
Logic Pullup Current, IPTIN = 0V - 15 200 µA
RS-232 Input Voltage Range, VIN -30 - +30 V
Receiver Input Impedance, RIN TA = 25oC, VIN = ±3V 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, VIN (H-L) VCC = 5V,
TA = 25oC Active Mode 0.8 1.2 - V
Shutdown Mode
HIN213E R4 and R5 0.6 1.5 - V
Receiver Input High Threshold, VIN (L-H) VCC = 5V,
TA = 25oC Active Mode - 1.7 2.4 V
Shutdown Mode
HIN213E R4 and R5 - 1.5 2.4 V
Receiver Input Hysteresis, VHYST VCC = 5V
No Hysteresis in Shutdown Mode 0.2 0.5 1.0 V
TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA
(HIN202E-HIN203E, IOUT = 3.2mA) - 0.1 0.4 V
TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1mA 3.5 4.6 - V
Output Enable Time, tEN HIN205E, HIN206E, HIN211E, HIN213E - 600 - ns
Output Disable Time, tDIS HIN205E, HIN206E, HIN211E, HIN213E - 200 - ns
HIN202E thru HIN213E
9
Detailed Description
The HIN202E thru HIN213E family of RS-232
transmitters/receivers are powered by a single +5V power
supply and feature low power consumption, and meet all
ElA RS-232C and V.28 specifications. The circuit is divided
into three sections: the charge pump, transmitter, and
receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the
voltage doubler and the voltage inverter. Each section is
driven by a two phase, internally generated clock to gener-
ate +10V and -10V. The nominal clock frequency is
125kHz. During phase one of the clock, capacitor C1 is
charged to VCC. During phase two, the voltage on C1 is
added to VCC, producing a signal across C3 equal to twice
VCC. During phase two, C2 is also charged to 2VCC, and
then during phase one, it is inverted with respect to ground
to produce a signal across C4 equal to -2VCC. The charge
pump accepts input voltages up to 5.5V. The output
impedance of the voltage doubler section (V+) is approxi-
mately 200Ω, and the output impedance of the voltage
inverter section (V-) is approximately 450Ω. A typical
application uses 0.1µF capacitors for C1-C4, however, the
value is not critical. Increasing the values of C1 and C2 will
lower the output impedance of the voltage doubler and
inverter, increasing the values of the reservoir capacitors,
C3 and C4, lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN205E, HIN211E and HIN213E,
SD=V
CC, HIN213E, SD = 0V) the charge pump is turned off,
V+ is pulled down to VCC, V- is pulled up to GND, and the
supply current is reduced to less than 10µA. The transmitter
outputs are disabled and the receiver outputs (except for
HIN213E, R4 and R5) are placed in the high impedance state.
Propagation Delay, tPD HIN213E SD = 0V, R4, R5 - 4.0 40 µs
HIN213E SD = VCC - 0.5 10 µs
HIN202E - HIN211E - 0.5 10 µs
Transition Region Slew Rate, SRTRL = 3kΩ,
CL = 2500pF
Measured from
+3V to -3V or
-3V to +3V
(Note 1)
HIN202E to HIN213E 3 20 45 V/µs
Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω
RS-232 Output Short Circuit Current, ISC TOUT shorted to GND - ±10 - mA
TTL/CMOS Receiver Output Leakage EN = VCC, EN = 0, 0V < ROUT < VCC - 0.5 ±10 µA
ESD Performance - - ----
ESD Protection Human Body Model +/-15 - - kV
TIN, ROUT IEC1000-4-2 Contact Discharge +/-8 - - kV
IEC1000-4-2 Air Gap +/-15 - - kV
TIN, ROUT Human Body Model +/-2- - - kV
NOTE:
1. Guaranteed by design.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5% for HIN203E/205E/207E), C1-C4 = 0.1µF (except
HIN203E and HIN205E), TA = Operating Temperature Range (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
+
-C1 +
-C3 +
-C2 +
-C4
S1 S2 S5 S6
S3 S4 S7 S8
VCC GND
RC
OSCILLATOR
VCC
GND
V+ = 2VCC GND
V- = -(V+)
C1+
C1-C2-
C2+
VOLTAGE INVERTER
VOLTAGE DOUBLER
FIGURE 1. CHARGE PUMP
HIN202E thru HIN213E
10
Transmitters
The transmitters are TTL/CMOS compatible inverters
which translate the inputs to RS-232 outputs. The input
logic threshold is about 26% of VCC, or 1.3V for VCC = 5V.
A logic 1 at the input results in a voltage of between -5V
and V- at the output, and a logic 0 results in a voltage
between +5V and (V+ -0.6V). Each transmitter input has an
internal 400kW pullup resistor so any unused input can be
left unconnected and its output remains in its low state . The
output voltage swing meets the RS-232C specifications of
5V minimum with the worst case conditions of: all transmit-
ters driving 3kΩ minimum load impedance, VCC = 4.5V,
and maximum allowable operating temperature. The trans-
mitters have an internally limited output slew rate which is
less than 30V/µs. The outputs are short circuit protected
and can be shorted to ground indefinitely. The powered
down output impedance is a minimum of 300Ω with 2V
applied to the outputs and VCC = 0V.
Receivers
The receiver inputs accept up to 30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is
off (VCC = 0V). The receivers have a typical input threshold
of 1.3V which is within the 3V limits, known as the tr ansition
region, of the RS-232 specifications. The receiver output is
0V to VCC. The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line (EN, on HIN205E and
HIN211E, EN on HIN213E) when unasser ted, disables the
receiver outputs, placing them in the high impedance
mode. The receiver outputs are also placed in the high
impedance state when in shutdown mode (except HIN213E
R4 and R5).
HIN213E Operation in Shutdown
The HIN213E features two receivers, R4 and R5, which
remain active in shutdown mode. During normal operation
the receivers propagation delay is typically 0.5µs. This prop-
agation delay increases to 4µs (typical) during shutdown.
When entering shut down mode, receivers R4 and R5 are
not valid for 80µs after SD = VIL. When exiting shutdown
mode, all receiver outputs will be invalid until the charge
pump circuitry reaches normal operating voltage. This is typ-
ically less than 2ms when using 0.1µF capacitors.
TOUT
V- < VTOUT < V+
300Ω
400kΩ
TXIN
GND < TXIN < VCC
V-
V+
VCC
FIGURE 2. TRANSMITTER
ROUT
GND < VROUT < VCC
5kΩ
RXIN
-30V < RXIN < +30V
GND
VCC
FIGURE 3. RECEIVER
TIN
VOL
VOL
tPLH
tPHL
AVERAGE PROPAGATION DELAY = tPHL + tPLH
2
OR
RIN
TOUT
OR
ROUT
FIGURE 4. PROPAGATION DELAY DEFINITION
Test Circuits
(HIN202E)
FIGURE 5. GENERAL TEST CIRCUIT FIGURE 6. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
+4.5V TO
+5.5V INPUT
3kΩ
T1 OUTPUT
RS-232 30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
0.1µF
C3
+
-
0.1µF
C1
+
-
0.1µF
C2
+
-
0.1µF C4
3kΩ
OUTPUT
RS-232
±30V INPUT
T2
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
T2OUT
T1OUT
VIN = ±2V A
ROUT = VIN/I
HIN202E thru HIN213E
11
Application Information
The HIN2XXE may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where 12V power supplies are not available for conventional
RS-232 interface circuits. The applications presented repre-
sent typical interface configurations.
A simple duplex RS-232 por t with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common res-
er voir capacitors is the elimination of two capacitors and the
reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
-
+
-
+
-
+
CTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
8
13
7
14
16
-
+
6
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN202E
C1
0.1µF
C2
0.1µF
TD
RTS
RD
CTS
SELECT
+5V
INPUTS
OUTPUTS
TTL/CMOS
FIGURE 7. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
-
+
RS-232
INPUTS AND OUTPUTS
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)15
8
13
7
14
2
-
+
4
R2 R1
T2
T1
9
12
10
11
3
1HIN202E
C1
0.1µF
DTR
DSRS
DCD
R1
+5V
INPUTS
OUTPUTS
TTL/CMOS
-
+-
+
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
8
13
7
14
15
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN202E
C1
0.1µFC2
0.1µF
TD
RTS
RD
CTS
INPUTS
OUTPUTS
TTL/CMOS
-
+
5C2
0.1µF
16
C3
0.2µF
6
26
V- V+
-
+
C4
0.2µF
16 VCC
VCC
FIGURE 8. COMBINING TWO HIN202Es FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
HIN202E thru HIN213E
12
Die Characteristics
DIE DIMENSIONS:
139 mils x 134 mils (HIN207E)
METALLIZATION:
Type: Al
Thickness: 10kű1kÅ
SUBSTRATE POTENTIAL
GND
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
TRANSISTOR COUNT:
332 (HIN207E)
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN207E
T3OUT
T1OUT
T5OUT
R2IN
C1+
V+
C1-
C2+
C2-
V-
R3IN
R3OUT
T3IN
T4IN
R2OUT T5IN
T4OUT
R1IN
T2OUT
T2IN T1IN GNDR1OUT VCC
HIN202E thru HIN213E
13
HIN202E thru HIN213E
Dual-In-Line Plastic Packages (PDIP)
C
L
E
eA
C
eB
eC
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
0.010 (0.25) C A
MBS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA-C-
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8, 10
C 0.008 0.014 0.204 0.355 -
D 0.735 0.775 18.66 19.68 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N16 169
Rev. 0 12/93
14
HIN202E thru HIN213E
Dual-In-Line Plastic Packages (PDIP)
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 1 2 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C A
MBS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpen-
dicular to datum .
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dam-
bar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) f or E8.3, E16.3, E18.3, E28.3,
E42.6 will hav e a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA-C-
E20.3 (JEDEC MS-001-AD ISSUE D)
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.55 1.77 8
C 0.008 0.014 0.204 0.355 -
D 0.980 1.060 24.89 26.9 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N20 209
Rev. 0 12/93
15
HIN202E thru HIN213E
Dual-In-Line Plastic Packages (PDIP)
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 1 2 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C A
MBS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA-C-
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8
C 0.008 0.014 0.204 0.355 -
D 1.230 1.280 31.24 32.51 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N24 249
Rev. 0 12/93
16
HIN202E thru HIN213E
Dual-In-Line Plastic Packages (PDIP)
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 1 2 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C A
MBS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA-C-
E24.6 (JEDEC MS-011-AA ISSUE B)
24 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.250 - 6.35 4
A1 0.015 - 0.39 - 4
A2 0.125 0.195 3.18 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.030 0.070 0.77 1.77 8
C 0.008 0.015 0.204 0.381 -
D 1.150 1.290 29.3 32.7 5
D1 0.005 - 0.13 - 5
E 0.600 0.625 15.24 15.87 6
E1 0.485 0.580 12.32 14.73 5
e 0.100 BSC 2.54 BSC -
eA0.600 BSC 15.24 BSC 6
eB- 0.700 - 17.78 7
L 0.115 0.200 2.93 5.08 4
N24 249
Rev. 0 12/93
17
HIN202E thru HIN213E
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H0.25(0.010) B
MM
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.3859 0.3937 9.80 10.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N16 167
α
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
18
HIN202E thru HIN213E
Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004) C
H0.25(0.010) B
MM
α
0.25
0.010
GAUGE
PLANE
A2
M16.209 (JEDEC MO-150-AC ISSUE B)
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.233 0.255 5.90 6.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N16 167
α
0
o
8
o
0
o
8
o
-
Rev. 2 3/95
19
HIN202E thru HIN213E
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H0.25(0.010) B
MM
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.3977 0.4133 10.10 10.50 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N16 167
α
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
20
HIN202E thru HIN213E
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H0.25(0.010) B
MM
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M20.3 (JEDEC MS-013-AC ISSUE C)
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.4961 0.5118 12.60 13.00 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N20 207
α
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
21
HIN202E thru HIN213E
Shrink Small Outline Plastic Packages (SSOP)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H0.25(0.010) B
MM
α
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.312 0.334 7.90 8.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N24 247
α
0
o
8
o
0
o
8
o
-
Rev. 1 3/95
22
HIN202E thru HIN213E
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H0.25(0.010) B
MM
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N24 247
α
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
23
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SEMICONDUCTOR
HIN202E thru HIN213E
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H0.25(0.010) B
MM
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.6969 0.7125 17.70 18.10 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.01 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N28 287
α
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
